Silicon Low Leakage Diode Array BAV 170
● Low leakage applications
● Medium speed switching times
● Common cathode
Type Ordering Code
Marking
Pin Configuration
Package
(tape and reel)
BAV 170 Q62702-A920JXs SOT-23
Maximum Ratings
Parameter Symbol Values Unit
Reverse voltage V
R 70 V
Peak reverse voltage VRM 70
Forward current IF 200 mA
Surge forward current, t= 1
Total power dissipation, T
µs IFS 4.5 A
S =35˚C Ptot 250 mW
Junction temperature Tj 150 ˚C
Storage temperature range T
stg – 65 … + 150
1)
Thermal Resistance
Junction - ambient
2)
Rth JA ≤ 600 K/W
Junction - soldering point Rth JS ≤ 460
1)
For detailed information see chapter Package Outlines.
2)
Package mounted on epoxy pcb 40 mm × 40 mm × 1.5 mm/6 cm2 Cu.
Semiconductor Group 1
5.91
Electrical Characteristics per Diode
A = 25 ˚C, unless otherwise specified.
at T
DC characteristics
BAV 170
UnitValuesParameter Symbol
min. typ. max.
(BR) = 100 µA
F = 1mA
F = 10 mA
F = 50 mA
F = 150 mA
R = 70 V
V
R = 70 V, TA = 150 ˚C
V
AC characteristics
R = 0 V, f = 1 MHz
V
F = 10 mA, IR = 10 mA, RL = 100 Ω
measured at I
R = 1 mA
V
(BR) 70 – –
V
F
–
–
–
–
R
I
–
–
C
D –2–
rr – 0.5 3
t
–
–
–
–
–
–
900
1000
1100
1250
5
80
VBreakdown voltage
mVForward voltage
nAReverse current
pFDiode capacitance
µsReverse recovery time
Test circuit for reverse recovery time
Pulse generator: t
Semiconductor Group 2
p = 5 µs, D = 0.05 Oscillograph: R = 50 Ω
r = 0.6 ns, Rj = 50 Ω tr = 0.35 ns
t
≤ 1pF
C