SHARP PC 3H4J00000F Datasheet

■ Features

Mini-flat Half Pitch Package,
AC Input Photocoupler

1. 4-pin Mini-flat Half pitch package (Lead pitch :

1.27mm)

2. Double transfer mold package (Ideal for Flow
Soldering)

3. AC input type

4. High collector-emitter voltage (VCE : 80V)

5. Isolation voltage between input and output (V

iso(rms)

:

2.5kV)

6. Lead-free and RoHS directive compliant

■ Description

PC3H4J00000F Series contains an IRED optically

coupled to a phototransistor.

It is packaged in a 4-pin Mini-flat, half pitch type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V and CTR is 20% to

400% at input current of ±1mA.

1

Sheet No.: D2-A01502EN

Date Jun. 30. 2005

© SHARP Corporation

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC3H4)

2. Approved by VDE, DIN EN60747-5-2

(*)

(as an

option), file No. 40009162 (as model No. PC3H4)

3. Package resin : UL flammability grade (94V-0)

(*)

DIN EN60747-5-2 : successor standard of DIN VDE0884

■ Agency approvals/Compliance

PC3H4J00000F
Series

*

4-channel package type is also available.

(model No. PC3Q64QJ000F)

PC3H4J00000F Series

1. Programmable controllers

■ Applications

■ Internal Connection Diagram

Anode / Cathode
Cathode / Anode
Emitter
Collector

1

1

2

3

4

2

4

3

2

Sheet No.: D2-A01502EN

PC3H4J00000F Series

1

SHARP mark "S" Rank mark

Date code

2.6

±0.3

1.27

±0.25

2

3H4

4

3

4.4

±0.2

0.4

±0.1

5.3

±0.3

(1.7)

0.2

±0.05

7.0

+0.2

−0.7

0.5

+0.4

−0.2

0.1

±0.1

2.0

±0.2

Epoxy resin

Primary side mark

■ Outline Dimensions

(Unit : mm)

Product mass : approx. 0.05gProduct mass : approx. 0.05g

Plating material : SnCu (Cu : TYP. 2%)

*( ) : Reference Dimensions *( ) : Reference Dimensions

1

Primary side mark

SHARP mark "S"

Date code

2.6

±0.3

1.27

±0.25

2

3H4

4

3

4.4

±0.2

0.4

±0.1

5.3

±0.3

(1.7)

0.2

±0.05

7.0

+0.2

−0.7

0.5

+0.4

−0.2

0.1

±0.1

2.0

±0.2

Epoxy resin

4

VDE
Indenfication mark

Rank mark

VDE option

Date code (2 digit)

A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001

Mark

A
B
C
D
E

F

H

J
K
L

M

N

Mark

P
R
S

T
U
V

W

X
A
B
C

Mark

1
2
3
4
5
6
7
8

9
O
N
D

Month

January

February

March

April

May
June

July

August

September

October

November

December

A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012

·

·

·

·

·

·

2nd digit

Month of production

1st digit

Year of production

3

repeats in a 20 year cycle

Sheet No.: D2-A01502EN

Rank mark

Refer to the Model Line-up table

Country of origin

Japan

PC3H4J00000F Series

Sheet No.: D2-A01502EN

■ Electro-optical Characteristics

Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current

Transfer

charac­teristics

Emitter-collector breakdown voltage
Collector current

Collector-emitter breakdown voltage

Collector-emitter saturation voltage
Isolation resistance
Floating capacitance

MIN.

−

−

−

6

0.2

−

5×10

10

−

−

−

TYP.

1.2
30

−

−

−

−

0.1

1×10

11

0.6

4
3

MAX.

1.4
250
100

−

−

4.0

0.2

−

1.0

18
18

Unit

V

V

pF

nA

V

mA

V

Ω

pF

µs
µs

Symbol

V

F

C

t

I

CEO

BV

CEO

BV

ECO

I

C

V

CE (sat)

C

f

t

r

t

f

R

ISO

Response time

Rise time

Fall time

Input

Output

IF=±20mA

V=0, f=1kHz

V

CE

=50V, IF=0

I

C

=0.1mA, IF=0

I

E

=10µA, IF=0

I

F

=±1mA, VCE=5V

DC500V, 40 to 60%RH

V

CE

=2V, IC=2mA, RL=100Ω

V=0, f=1MHz

I

F

=±20mA, IC=1mA

80

(T

a

=25˚C)

■ Absolute Maximum Ratings

(Ta=25˚C)

Parameter Symbol Unit

Input

Forward current mA

*1

Peak forward current A
Power dissipation mW

Output

Collector-emitter voltage

V

Emitter-collector voltage

V
Collector current mA
Collector power dissipation

mW

Total power dissipation mW

*2

Isolation voltage

Operating temperature ˚C
Storage temperature ˚C

*3

Soldering temperature

I

F

I

FM

P

V

CEO

V

ECO

I

C

P

C

P

tot

V

iso (rms)

T

opr

T

stg

T

sol

˚C

*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute
*3 For 10s

Rating

±50

±1

70
80

6

50
150
170

−30 to +100

−40 to +125

260

2.5 kV

4

PC3H4J00000F Series

Sheet No.: D2-A01502EN

■ Model Line-up

IC [mA]

(IF=±1mA, VCE=5V, Ta=25˚C)

Taping

3 000pcs/reel

with or without

A

0.2 to 4.0

0.5 to 1.5

Package

DIN

EN60747-5-2

Model No.

Rank mark

PC3H4J00000F

PC3H4AJ0000F

PC3H4YJ0000F

-

Approved

PC3H4Y1J000F

5

Please contact a local SHARP sales representative to inquire about production status.

PC3H4J00000F Series

Sheet No.: D2-A01502EN

Total power dissipation P

tot

(mW)

0

50

100

150

200

250

170

−30 0 25 50 75 100 125

Ambient temperature T

a

(˚C)

Fig.4 Total Power Dissipation vs. Ambient

Temperature

Forward current I

F

(mA)

0

10

20

30

40

50

−30 0 25 75 100 1255550

Ambient temperature T

a

(˚C)

Fig.1 Forward Current vs. Ambient

Temperature

0

20

40

60

70

80

100

−30 0 25 75 100 1255550

Ambient temperature T

a

(˚C)

Diode power dissipation P (mW)

Fig.2 Diode Power Dissipation vs. Ambient

Temperature

Collector power dissipation P

C

(mW)

0

200

150

100

50

−30 0 25 50 75 100 125

Ambient temperature T

a

(˚C)

Fig.3 Collector Power Dissipation vs.

Ambient Temperature

6

Forward voltage VF (V)

75˚C

25˚C

0˚C

0 0.5 1 1.5 2

1

0.1

10

100

−30˚C

100˚C

Ta=50˚C

Forward current I

F

(mA)

Fig.6 Forward Current vs. Forward Voltage

Pulse width≤100µs

T

a

=25˚C

Peak forward current I

FM

(mA)

10 000

1 000

100

10

10

−3

10

−2

10

−1

1

Duty ratio

Fig.5 Peak Forward Current vs. Duty Ratio

PC3H4J00000F Series

Sheet No.: D2-A01502EN

Relative current transfer ratio (%)

0

150

100

50

−40

0−20 20 40 60

80 100

Ambient temperature T

a

(˚C)

IF=1mA,VCE=5V

IF=5mA,VCE=5V

Fig.9 Relative Current Transfer Ratio vs.

Ambient Temperature

Collector-emitter saturation

voltage V

CE

(sat) (V)

0

0.16

0.14

0.12

0.1

0.08

0.06

0.04

0.02

−30 0 20 40 60 80 100

Ambient temperature T

a

(˚C)

I

F

=20mA

I

C

=1mA

Fig.10 Collector - emitter Saturation Voltage

vs. Ambient Temperature

7

Collector current I

C

(mA)

0

50

40

30

20

10

0246810

Collector-emitter voltage V

CE

(V)

1mA

5mA

10mA

20mA

I

F

=30mA

P

C

(MAX.)

T

a

=25˚C

Fig.8 Collector Current vs. Collector-emitter

Voltage

Current transfer ratio CTR (%)

0

500

400

300

200

100

0.1 1 10 100

Forward current I

F

(mA)

V

CE

=5V

T

a

=25˚C

Fig.7 Current Transfer Ratio vs. Forward

Current

Collector dark current I

CEO

(A)

Ambient temperature Ta (˚C)

806040200−30 100

10

−5

10

−6

10

−7

10

−8

10

−9

10

−10

10

−11

VCE=50V

Fig.11 Collector Dark Current vs. Ambient

Temperature

Response time (µs)

0.1

100

1 000

10

1

0.01 0.1 1 10 100

t

r

t

d

t

f

t

s

Load resistance RL (kΩ)

V

CE

=2V

I

C

=2mA

T

a

=25˚C

Fig.12 Response Time vs. Load Resistance

PC3H4J00000F Series

Sheet No.: D2-A01502EN

8

10%

Input

Output

Input

Output

90%

t

s

t

d

V

CC

R

D

R

L

t

f

t

r

Please refer to the conditions in Fig.12.

V

CE

Fig.13 Test Circuit for Response Time

0

10

8

6

4

2

0246810

Forward current I

F

(mA)

7mA

5mA

3mA

1mA

Collector-emitter saturation voltage

V

CE

(sat) (V)

Ta=25˚C

I

C

=0.5mA

Fig.14 Collector-emitter Saturation Voltage

vs. Forward Current

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

PC3H4J00000F Series

Sheet No.: D2-A01502EN

■ Design Considerations

While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.

This product is not designed against irradiation and incorporates non-coherent IRED.

● Degradation

In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.

● Recommended Foot Print (reference)

✩

For additional design assistance, please review our corresponding Optoelectronic Application Notes.

9

1.5

1.27

0.8

6.3

(Unit : mm)

● Design guide

PC3H4J00000F Series

Sheet No.: D2-A01502EN

■ Manufacturing Guidelines

Reflow Soldering:

Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.

● Soldering Method

Flow Soldering :

Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.

Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.

Hand soldering

Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.

Other notices

Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.

10

1234

300

200

100

0

0

(˚C)

Terminal : 260˚C peak
( package surface : 250˚C peak)

Preheat
150 to 180˚C, 120s or less

Reflow
220˚C or more, 60s or less

(min)

PC3H4J00000F Series

Sheet No.: D2-A01502EN

Solvent cleaning:

Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less

Ultrasonic cleaning:

The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.

Recommended solvent materials:

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.

● Cleaning instructions

This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).

● Presence of ODC

11

PC3H4J00000F Series

Sheet No.: D2-A01502EN

12

■ Package specification

● Tape and Reel package

Package materials

Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS

Carrier tape structure and Dimensions

F

K

E

I

D

J

G

L

B

H

A

C

H

5˚

MAX.

A

12.0

±0.3

B

5.5

±0.1

C

1.75

±0.1

D

8.0

±0.1

E

2.0

±0.1

H

7.5

±0.1

I

0.3

±0.05

J

2.3

±0.1

K

3.1

±0.1

F

4.0

±0.1

G

φ1.5

+0.1

−0

L

φ1.6

+0.1

−0

Dimensions List (Unit : mm)

a

c

e

g

f

b

d

a

330

b

13.5

±1.5

c

100

±1.0

d

13

±0.5

e

23

±1.0

f

2.0

±0.5

g

2.0

±0.5

Dimensions List (Unit : mm)

Pull-out direction

[Packing : 3 000pcs/reel]

Reel structure and Dimensions

Direction of product insertion

PC3H4J00000F Series

13

Sheet No.: D2-A01502EN

· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela­ted to any intellectual property right of a third party re­sulting from the use of SHARP's devices.

· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec­ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac­turing locations are also subject to change without no­tice.

· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection

with equipment that requires higher reliability such as:

--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec­tion with equipment that requires an extremely high lev­el of reliability and safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.,
scuba).

· If the SHARP devices listed in this publication fall with­in the scope of strategic products described in the For­eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de­vices.

· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro­duced or transmitted in any form or by any means, elec­tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.

· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub­lication.

■ Important Notices

PC3H4J00000F Series

[E213]