TheTDA2003 hasimprovedperformancewith the
samepin configurationas the TDA2002.
The additional features of TDA 2002, very low
numberofexternalcomponents,easeof assembly,
spaceand cost saving,are maintained.
Thedeviceprovidesahighoutputcurrentcapability
(up to 3.5A) very low harmonic and cross-over
distortion.
Completely safe operation is guaranteed due to
ORDERING NUMBERS : TDA 2003H
protectionagainst DCandACshort circuitbetween
allpins andground,thermal over-range,loaddump
voltage surge up to 40V and fortuitous open
ground.
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
S
V
S
V
S
I
O
I
O
PtotPowerdissipation at Tcase = 90°C20W
T
stg,Tj
Peak supply voltage (50ms)40V
DC supply voltage28V
Operating supply voltage18V
Output peak current (repetitive)3.5A
Output peak current (non repetitive)4.5A
Storage and junction temeperature-40 to 150°C
PENTAWATT
TDA 2003V
TESTCIRCUIT
October 1998
1/10
TDA2003
PIN CONNECTION
(top view)
SCHEMATICDIAGRAM
THERMAL DATA
SymbolParameterValueUnit
2/10
R
th-j-case
Thermal resistancejunction-casemax3°
C/W
DCTESTCIRCUITACTESTCIRCUIT
TDA2003
ELECTRICAL CHARACTERISTICS (Vs= 14.4V,T
=25°C unlessotherwise specified)
amb
SymbolParameterTest conditionsMin.Typ.Max.Unit
DC CHARACTERISTICS
V
V
I
Supply voltage818V
s
Quiescent output voltage(pin 4)6.16.97.7V
o
Quiescent drain current (pin 5)4450mA
d
(Referto DC test circuit)
ACCHARACTERISTICS (Refer to AC test circuit, Gv = 40 dB)
Figure 1. Quiescent output
voltagevs. supply voltage
4/10
Figure 2. Quiescent dra in
currentvs. supplyvoltage
Figure 3. Output power vs.
supply voltage
TDA2003
Figure 4. Output power vs.
load resistanceR
L
Figure 7. Dist ortion vs.
output power
Figure 5. Gain vs. inp ut
sensivity
Figure 8. Distortion vs.
frequency
Figure 6 . Gain vs . input
sensivity
Figure 9. Supply voltage
rejectionvs.voltage gain
Figure 10. Supply voltage
rejectionvs. frequency
Figure 11. Power dissipation andefficiencyvs.output
power(R
=4Ω)
L
Figure 12. Power dissipationand efficiencyvs.output
power(R
=2Ω)
L
5/10
TDA2003
Figure 13. Maximum power
dissipation vs. supply voltage
(sine wave operation)
APPLICATION INFORMATION
Figu re 16 . Typica l a ppl i cation
circuit
Figure14. Maximumallowable
power dissipation vs. ambient
temperature
Figure 15. Typical values of
capacitor (C
) for differe n t
X
values of frequency reponse
(B)
Figure 17. P.C. board and component layout for the circuit of
fig.16 (1 : 1 scale)
BUILT-IN PROTECTIONSYSTEMS
Load dumpvoltage surge
The TDA 2003 has a circuit which enables it to
withstanda voltagepulse train,on pin5,of thetype
shownin fig. 19.
If the supply voltagepeaks to more than 40V,then
an LC filter must be inserted between the supply
and pin 5, in order to assure that the pulses at pin
5 will be held within the limits shownin fig.18.
6/10
A suggested LC network is shown in fig. 19. With
this network,a trainof pulseswith amplitudeup to
120V and width of 2 ms can be applied at point A.
This type of protection is ON when the supply
voltage(pulsedor DC)exceeds18V.Forthisreason
the maximumoperating supply voltage is 18V.
Figure 18.Figure 19.
TDA2003
Short-circuit(AC and DC conditions)
The TDA 2003 can withstand a permanent shortcircuiton theoutput for a supplyvoltageup to 16V.
Polarityinversion
High current (up to 5A) can be handled by the
devicewithno damagefor a longerperiod thanthe
blow-out time of a quick 1A fuse (normally connectedin series with the supply).
This featureis added to avoiddestructionif,during
fittingto thecar,a mistakeon the connectionof the
supplyis made.
Open ground
When the radio is in the ON condition and the
ground is accidentally opened, a standard audio
amplifier will be damaged.On the TDA 2003 protectiondiodes are included to avoidany damage.
Inductive load
A protectiondiodeis providedbetweenpin 4 and 5
(see the internal schematicdiagram) to allow use
of the TDA2003 with inductiveloads.
Figure 20. Output power and
drain curren t vs. case
temperature(R
=4Ω)
L
In particular, the TDA 2003 can drive a coupling
transformerfor audio modulation.
DC voltage
The maximum operating DC voltage on the TDA
2003is 18V.
Howeverthe devicecan withstanda DCvoltageup
to 28V with no damage. This could occur during
winter if two batteries were series connected to
crankthe engine.
Thermalshut-down
Thepresenceof a thermal limitingcircuit offers the
following advantages:
1) an overload on the output (even if it is permanent),oranexcessiveambienttemperaturecan
be easily withstood.
2) the heat-sink can have a smaller factor comparedwith thatof a conventionalcircuit.
There is no device damage in the case of excessive junction temperature: all that happens
isthatP
(andthereforeP
o
)andIdarereduced.
tot
Figure 21. Output power and
drain current vs. case
temperature(RL=2Ω)
7/10
TDA2003
PRATICALCONSIDERATION
Printedcircuitboard
The layout shown in fig. 17 is recommended. If
different layouts are used, the ground points of
input 1 and input 2 must be well decoupled from
thegroundoftheoutputthroughwhicha ratherhigh
currentflows.
Assemblysuggestion
Noelectrical insulationisrequire dbetweenthe
packageand theheat-sink.Pinlengthshouldbeas
short as possible.The soldering temperature must
not exceed260°C for 12 seconds.
Applicationsuggestions
The recommended component values are those
shownin the applicationcircuitsof fig.16.
Differentvaluescan be used.The followingtableis
intended to aid thecar-radio designer.
Component
C1
C2
C3
C41000µFOutput coupling to loadHigher low frequency
C5
C
X
R1
R2
R3
R
X
Recommmended
value
2.2 µF
470µF
0.1µF
0.1 µF
1
≅
2πBR1
-1) • R2
(G
v
2.2
Ω
1
ΩFrequency stabilityDanger of oscillation at
≅ 20 R2
Purpose
Input DC
decoupling
Ripple rejectionDegradation of SVR
Supply bypassingDanger of oscillation
Frequency stabilityDanger of oscillation at
Upper frequency cutoffLower bandwidthLarger bandwidth
Setting of gainIncrease of drain current
Setting of gain
Information furnished is believedto be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics.Specificationmentioned in this publication are subjectto
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registeredtrademark of STMicroelectronics
1998 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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10/10
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