SGS Thomson Microelectronics M36WT864TF, M36WT864BF Datasheet

64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory

and 8 Mbit (512K x16) SRAM, Multiple Memory Product

FEATURES SUMMARY

■ SUPPLY VOLTAGE

–V –V –V

■ ACCESS TIME: 70, 85, 100ns

■ LOW POWER CONSUMPTION

■ ELECTRONIC SIGNATURE

– Manufacturer Code: 20h – Top Device Code, M36WT864TF: 8810h – Bottom Device Code, M36W T864 BF : 8811h

FLASH MEMORY

■ PROGRAMMING TIME

– 8µs by Word typical for Fast Factory Program – Double/Quad ruple Word P rogram option – Enhanced Factory Pro gram options

■ MEMORY BLOCKS

– Multiple Bank Memory Array: 4 Mbit Banks – Parameter Blocks (Top or Botto m locati o n )

■ DUAL OPERATIONS

– Program Erase in one Bank while Read in

– No delay between Read and Write operations

■ BLOCK LOCKING

– All blocks locked at Power up – Any combination of blocks can be locked –WP

■ SECURITY

– 128 bit user programmable OTP cells – 64 bit unique device number – One parameter block permanent ly lockable

■ COMMON FLASH INTERFACE (CFI)

■ 100,000 PROGRAM/ERASE CYCL ES per

BLOCK

= 1.65V to 2.2V

DDF

= V

DDS

= 12V for Fast Program (optional)

PPF

= 2.7V to 3.3V

DDQF

others

for Block Lock-Down

M36WT864TF

M36WT864BF

PRODUCT PREVIEW

SRAM

■ 8 Mbit (512K x 16 bit)

■ EQUAL CYCLE and ACCESS TIMES: 70ns

■ LOW STANDBY CURRENT

■ LOW V

■ TRI-STATE COMMON I/O

■ AUTOMATIC POWER DOWN

Figure 1. Packages

DATA RETENTION: 1.5V

DDS

FBGA

Stacked LFBGA96 (ZA)

8 x 14mm

July 2002

This is preliminary information on a new product now in development. Details are subject to change without notice.

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TABLE OF CONTENTS

SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 3. LFBGA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Address Inputs (A0-A18). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Address Inputs (A19-A21). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Data Input/Output (DQ0-DQ15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Chip Enable (EF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Output Enable (GF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Write Enable (WF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Write Protect (WPF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Reset (RPF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Latch Enable (LF).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Clock (KF).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Flash Wait (WAITF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SRAM Chip Enable (E1S, E2S). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SRAM Write Enable (WS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SRAM Output Enable (GS).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SRAM Upper Byte Enable (UBS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SRAM Lower Byte Enable (LBS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

DDF

and V

DDQF

Program Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

PPF

SSF ,VSSQF

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

DDS

and V

Grounds.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SSS

FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 4. Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 2. Main Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Flash Memory Componen t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

SRAM Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 3. Flash Bank Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4

Figure 5. Flash Block Add re sse s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

FLASH BUS OPERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Address Latch.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

FLASH COMMAND INTERFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

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Table 4. Command Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

COMMAND INTERFACE - STANDARD COMMANDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Array Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Status Register Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Read Electronic Signature Comma nd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read CFI Query Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7

Clear Status Regist e r Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Block Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7

Bank Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 8

Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Program/Erase Suspend Comm and . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Program/Eras e Resume Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Protection Regi ste r Pr o g ra m Comman d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Set Configuratio n Regi ste r Comman d. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Block Lock Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Block Unlock Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Block Lock-Down Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 5. Flash Standard Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 6. Electronic Signature Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figu r e 6 . Flash Security Bl o c k and Pr o tection Re g ister M e mory M a p . . . . . . . . . . . . . . . . . . . . . . 22

COMMAND INTERFACE - FACTORY PROGRAM COMMANDS. . . . . . . . . . . . . . . . . . . . . . . . . 23

Double Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Quadruple Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Enhanced Factory Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Setup Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Program Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Verify Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Exit Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Quadruple Enhanced Factory Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Setup Phase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Load Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Program and Verify Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Exit Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 7. Flash Facto ry Pr o g ra m Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

FLASH STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Program/Erase Controller Status Bit (SR7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Erase Suspend Status Bit (SR6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Erase Status Bit (SR5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Program Status Bit (SR4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Status Bit (SR3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

PPF

Program Suspend Status Bit (SR2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

Block Protection Status Bit (SR1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8

Bank Write/Multiple Word Program Status Bit (SR0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 8. Flash Status Register Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

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FLASH CONFIGURATION REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Read Select Bit (CR15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

X-Latency Bits (CR13- CR1 1 ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Wait Polarity Bit (CR10). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Data Output Configura tion Bit (CR9). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Wait Configurat ion Bit (CR8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Burst Type Bit (CR7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Valid Clock Edge Bit (CR6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Wrap Burst Bit (CR3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Burst length Bits ( CR2- CR0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Table 9. Flash Confi g u ra tion Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Table 10. Burs t Type Def ini tion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 7. X-Latency and Dat a Outpu t Confi g u ra tion Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 8. Wait Configura tion Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

FLASH READ MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Asynchronous Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Synchronous Burst Read Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Single Synchronous Read Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

FLASH DUAL OPERATIONS AND MULTIPLE BANK ARCHITECTURE. . . . . . . . . . . . . . . . . . . . . . 36

Table 11. Dual Oper at ions Allowed In Other Bank s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Table 12. Dual Operations Allowed In Same Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

FLASH BLOCK LOCKING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Reading a Block’s Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Locked State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Unlocked State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Lock-Down State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Locking Operatio n s Durin g Erase Su sp e nd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 13. Flash Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

FLASH PROGRAM AND ERASE TIMES AND ENDURANCE CYCLES. . . . . . . . . . . . . . . . . . . . . . . 39

Table 14. Flash Program, Erase Times and Endurance Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

SRAM OPERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Standby/Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Table 15. Absolu te Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

4/92

M36WT864TF, M36WT864BF

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 16. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Figure 9. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Figure 10. AC Measure men t L o ad Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 17. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 18. Flas h DC Characteristics - Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Table 19. Flash DC Characteristics - Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Table 20. SRAM DC Character istics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Figure 11. Flash Asynchronous Random Access Read AC Waveforms. . . . . . . . . . . . . . . . . . . . . 45

Figure 12. Flash Asynchronous Page Read AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Table 21. Flash Asynchronous Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Figure 13. Flash Synchronous Burst Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 14. Flash Single Synchronous Read AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Figure 15. Flash Clock input AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Table 22. Flash Synchronous Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Figure 16. Fla sh Wri te AC Wavefo r ms, Wri te Enabl e Contro lled . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table 23. Flas h Write AC Charac te r i stics, Write Enable Contro l led . . . . . . . . . . . . . . . . . . . . . . . . 52

Figure 17. Flash Write AC Waveforms, Chip Enable Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Table 24. Flash Write AC Characteristics, Chip Enable Controlled. . . . . . . . . . . . . . . . . . . . . . . . . 54

Figure 18. Fla sh Reset and Po we r- u p AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Table 25. Flas h Reset and Power-up AC Characteristi c s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Figure 19. SRAM Address Controlled, Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

Figure 20. SRAM Chip Enable or Output Enable Controlled, Read AC Waveforms. . . . . . . . . . . . 56

Figure 21. SRAM Chip Enable or UBS/LBS Controlled, Standby AC Waveforms . . . . . . . . . . . . . 57

Table 26. SRAM Read and Standby AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Figure 22. SRAM Write AC Waveforms, Write Enable Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . 58

Figure 23. SRAM Write AC Waveforms, Chip Enable Contro l led . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Figure 24. SRAM Write AC Waveforms, UB/LB Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Table 27. SRAM Write AC Chara cte ristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Figure 25. SRAM Low VDD Data Retention AC Waveform s, E1S Control l e d. . . . . . . . . . . . . . . . . 61

Figure 26. SRAM Low VDD Data Retention AC Waveform s, E2 S Control led. . . . . . . . . . . . . . . . . 61

Table 28. SRAM Low VDD Data Retention Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Figure 27. Stacked LFBGA96 - 8x14mm, 8x10ball array, 0.8mm pitch, Bottom View Package Outline 62

Table 29. Stacked LFBGA96 - 8x14mm, 8x10 ball array, 0.8mm pitch, Package Mechanical Data62

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Table 30. Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Table 31. Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64

APPENDIX A. FLASH BLOCK ADDRESS TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

5/92

M36WT864TF, M36WT864BF

Table 32. Flash Top Boot Block Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Table 33. Flash Bottom Boot Block Addresses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

APPENDIX B. FLASH COMMON FLASH INTERFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Table 34. Query Stru cture Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69

Table 35. CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69

Table 36. CFI Query System Interface Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Table 37. Device Geome try Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70

Table 38. Primary Algorithm-Specific Extended Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Table 39. Protection Register Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72

Table 40. Burst Read Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Table 41. Bank and Erase Block Region Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Table 42. Bank and Erase Block Region 1 Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

Table 43. Bank and Erase Block Region 2 Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

APPENDIX C. FLASH FLOWCHARTS AND PSEUDO CODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Figure 28. Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Figure 29. Double Word Program Flowchart and Pseudo code . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Figure 30. Quadruple Word Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . 78

Figure 31. Program Suspend & Resume Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . 79

Figure 32. Block Erase Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Figure 33. Erase Suspend & Resume Flowchart and Pseudo Code. . . . . . . . . . . . . . . . . . . . . . . . 81

Figure 34. Locking Operations Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Figure 35. Protection Register Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . 83

Figure 36. Enhanced Factory Program Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Enhanced Factory Program Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Figure 37. Quadruple Enhanced Factory Program Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Quadruple Enhanced Factory Program Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87

APPENDIX D. FLASH COMMAND INTERFACE STATE TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Table 44. Command Inte rface States - Modify Tab l e , Next Sta te. . . . . . . . . . . . . . . . . . . . . . . . . . 88

Table 45. Command Interface States - Modify Tab l e , Next Outpu t. . . . . . . . . . . . . . . . . . . . . . . . . 89

Table 46. Command Inte rface States - Lock Table, Next State . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Table 47. Command Interface States - Lock Table, Next Output . . . . . . . . . . . . . . . . . . . . . . . . . . 91

6/92

SUMMARY DESCRIPTION

The M36WT864 is a low voltage M ultiple Me mory Product which combines two memory devices ; a 64 Mbit Multiple Bank Flash memory and an 8 Mbit SRAM. Recommended operating conditions do not allow both the F lash and the S RAM t o be active at the same time.

The memory is offered in a Stacked LFBGA96 (8 x 14mm, 0.8 mm pitch) package and is supplied with all the bits erased (set to ‘1’).

M36WT864TF, M36WT864BF

Table 1. Signal Names

A0-A18 Address Inputs A19-A21 Address Inputs for Flash Chip only DQ0-DQ15 Data Input/Output V V

DDF

DDQF

Flash Power Supply Flash Power Supply for I/O Buffers

Figure 2. Logic Diagram

DDQF

DDF

A0-A21

RPF

WPF

E1S E2S

UBS

LBS

M36WT864TF M36WT864BF

PPF

DDS

DQ0-DQ15

WAITF

PPF

SSF

SSQF

DDS

SSS

NC Not Connected Internally DU Do Not Use as Internally Connected

Flash control functions

LF EF GF WF RPF WPF KF Flash Burst Clock WAITF Wait Data in Burst Mode

SRAM control function s

Flash Optional Supply Voltage for Fast Program & Erase

Flash Ground Flash Ground for I/O Buffers SRAM Power Supply SRAM Ground

Latch Enable input Chip Enable input Output Enable input Write Enable input Reset input Write Protect input

SSF

SSQF

SSS

AI06270

, E2S Chip Enable inputs

E1S GS WS UBS LBS

Output Enable input Write Enable input Upper Byte Enable input Lower Byte Enable input

7/92

M36WT864TF, M36WT864BF

Figure 3. LFBGA Connections (Top view through package)

87654321

NCNC

A21KF

NCV

A9V

A10A20

A14A8

WAITF

E2SV

DDF

LFWPFNCA7

WFRPUBSA6

DQ5DQ10DQ2DQ8

DDS

SSF

DQ13

A19A18

NCLBS

NCA17

SSS

PPF

A11

A12

A13

A15

A16

8/92

E1S

SSS

SSQF

DQ1DQ0

DUDU

DDQF

DQ3

DDS

DDF

DQ12

DQ4DQ11DQ9GF

DDS

SSS

SSQF

DQ7DQ14

DQ15DQ6

DDQF

SSF

SSS

AI06271

SIGNAL DESCRIPTIONS

See Figure 2 Logic Diagram and T able 1,Signal Names, for a brief overview of the signals connected to this de vice.

Address Inputs (A0-A18). Addresses A0-A18 are common inputs for the Flash an d the SRAM components. The Address Inputs select the cells in the memory array to access during Bu s Read operations. During Bus Write operations they control the commands sent to the Command Interface of the internal state machine. The Flash memory is accessed through the Chip Enable ( Enable (WF

) signals, while the SRAM is accessed through two Chip Enable signals (E1S and the Write Enable signal (WS

EF) and Write

and E2S)

Address Inputs (A19-A21). Addresses A19-A21 are inputs for the Flash component only. The Flash memory is acc essed through the Chip E nable (EF

) and Write Enable (WF) signals.

Data Input/Output (DQ0-DQ15). The Data I/O outputs the data stored at the selected address during a Bus Read operation or inputs a command or the data to be programmed durin g a Write Bus operation.

Flash Chip Enable (EF

). The Chip Enable input

activates the memory control logic, input buffers, decoders and sense amplifiers. When Chip Enable is at V tive mode. When Chip Enable is at V

andReset is at VIH the device is in ac-

the memory is deselected, the outputs are high impedance and the power consumption is reduced to the stand-b y l e v el.

Flash Output Enable (GF

). The Output Enable

controls data outputs during the Bus Read operati on of the memo ry.

Flash Write Enable (

WF). The Write Enable

controls the Bus Write operation of the memory’s Command Interface. The data and address inputs are latched on the rising ed ge of Chip Enable or Write Enable whichever occurs first.

Flash Write Protect (WPF

). Write Protect is an

input that gives an additional hardware protection for each block. When Write Protect is at V

, the Lock-Down is enabled and the protection status of the Locked-Down blocks cannot be changed. When Write Protect is at V

, the Lock-Down is

disabled and the Locked-Down blocks can be locked or unlocked. (refer to Table 13, Lock Status).

Flash Reset (RPF

). The Reset input provides a

hardware reset of the memory. When Re set is at V

, the memory is in reset mode: the outputs are

high impedance and the current consumption is reduced to the Reset Supply Current I

. Refer to

DD2

Table 2, DC Characteristics - Currents for the value of I

After Reset all blocks are in the Locked

DD2.

state and the Configuration Register is reset.

M36WT864TF, M36WT864BF

When Reset is at V eration. Exiting reset mode the device enters asynchronous read mod e, but a negative transition of Chip Enable or Lat ch E nable is required to ensure valid data outputs.

The Reset pin can be interfaced with 3V logic without any additional circuitry . It can be t ied to V (refer to Table 19, DC Characteristics).

Flash Latc h En abl e (LF

the address bits on its rising edge. The address latch is transparent when Latch Enable is at V and it is inhibited when Latch Enable is at VIH. Latch Enable can be kept Low (also at board level) when the Latch Enable function is not required or supported.

Flash Clock (KF). The clock input synchronizes the Flash memory to the microcontroller during synchronous read operations; the address is latched on a Clock edge (rising or falling, acc ording to the configuration settings) when L atch Enable is at VIL. Clock is don't care during asynchronous read and in write operations.

Flash Wait ( WAITF). Wait is a Flash output signal used during synchronous read to indicate whether the data on the output bus are valid. This output is high impedance when Flash Chip Enable is at V or Flash Reset is at VIL. It can be configured to be active during the wait cycle or one clock cycle in advance. The WAITF signal is not gated by Output Enable.

SRAM Chip Enable (E1S

able inputs activate the SRAM memory control logic, input buffers and decoders. E1S E2S at V

deselects the memory and reduces the

power consumption to the standby level. E1S E2S can also be used to control writing to the SRAM memory array, while WS is not allowed to set EF

at the same time.

at V

SRAM Write Enable (WS

put controls writing to the SRA M memory array. WS

is active low.

SRAM Output Enable (GS)

gates the outputs through the data buffers during a read operation of t he S RAM mem ory. GS tive low.

SRAM Upper Byte Enable (UBS)

Byte Enable input enables the upper byte for SRAM (D Q8-D Q15). U BS

SRAM Lower Byte Enable (LBS

Byte Enable input enables the lower byte for SRAM (DQ0- D Q 7). L BS

Supply Voltage. V

DDF

supply to the internal core of the Flash memory de-

, the device is in normal op-

). Latch Enable latches

, E2S). The Chip En-

at VIH or

remains at V

at V

E1S at VIL and E2S

IL,

). The Write Enable in-

. The Output Ena ble

is ac-

. The Upper

is active low .

). The Lower

is active low.

provides the power

DDF

RPH

and

IL.

9/92

M36WT864TF, M36WT864BF

vice. It is the main power supply for all Flash operations (Read, Program and Erase).

DDQF

and V

Supply Voltage. V

DDS

DDQF

provides the power supply for the Flash mem ory I/O pins and V

provides the power supply for the

DDS

SRAM control and I/O pins. This allows all Outputs to be powered independently from t he Flash core power supply, V

DDF

. V

can be tied to V

DDQF

DDS

it can use a separate supply.

Program Supp ly Vol tage. V

PPF

is both a

PPF

Flash control input and a Flash power supply pin. The two functions are selected by the voltage range applied to the pin.

is kept in a low voltage range (0V to V

If V

PPF

is seen as a control input. In this case a volt-

PPF

age lower than V

gives an absolute protec-

PPLKF

tion against program or erase, while V

PPF

> V

DDQF

PP1F

enables these functions (s ee Tables 18 and 19, DC Characteristics for the relevant values). V

PPF

is only sampled at the b eginning of a program or erase; a change in its value after the operation has started does not have any effect and program or erase operations continue.

If V

is in the range of V

PPF

supply pin. In this condition V

it acts as a power

PPHF

must be stable

PPF

until the Program/Erase algorithm is completed.

SSF ,VSSQF

and V

SSS

and V

are the ground references for all voltage

Grounds. V

SSS

SSF

measurements in the Flash (core and I/O Buffers) and SRAM chips, respectively.

Note: Each device in a system should have

and V

DDF

capacitor close to the pin (high frequency, in-

)

decoupled with a 0.1µF ceramic

PPF

herently low inductance ca pacitors should b e as close as possible to the package). See Figure 10, AC Measurement Load Circuit. The PCB trace widths shou ld be sufficien t to ca rry the required V

program and erase currents.

PPF

, V

SSQF

10/92

FUNCTIONAL DESCRIPTION

The Flash and SRAM components have separate power supplies and grounds and are distinguished by three chip enable inputs: EF ory and, E1S

and E2S for the SRAM.

for the Flash mem-

Recommended operating conditions do not allow both the Flash and the SRAM to be in active mode at the same time. The most common example is

Figure 4. Func ti onal Block Di a gram

M36WT864TF, M36WT864BF

simultaneous read operations on the Flash and the SRAM which would resul t in a data bus contention. Therefore it is recommended to put the SRAM in the h igh impedance state whe n reading the Flash and vice versa (see Table 2 Main Operation Modes for details).

RPF

WPF

WAITF

A19-A21

A0-A18

E1S E2S

UBS

LBS

DDF

Flash Memory

64 Mbit (x16)

DDS

8 Mbit (x 16)

DDQF

SRAM

SSQF

PPF

SSF

DQ0-DQ15

SSS

AI06272

11/92

M36WT864TF, M36WT864BF

Table 2. Main Operation Modes

Operation Mode EF GF WF LF RPF WAITF E1S E2S GS WS UBS, LBS DQ15-DQ0

Bus Read Bus Write Address

Latch

ILVILVIH

ILVIHVIL V

(2)

SRAM must be disabled Data Output SRAM must be disabled Data Input

SRAM must be disabled

Data Output

or Hi-Z

(3)

Output Disable

Flash Memory

Standby

ILVIHVIH

XX X

Reset X X X X

Hi-Z Any SRAM mode is allowed Hi-Z Hi-Z Any SRAM mode is allowed Hi-Z

Read Flash must be disabled

Write Flash must be disabled

Standby/ Power Down

SRAM

Data

Any Flash mode is allowable

Retention Output

Disable

Note: 1. X = Don' t care.

can be tied to VIH if the valid address has been previously latched.

2. L

3. Depends on G

4. WAIT signal pol arity is conf i gured using t he Set Confi guration Register command.

Any Flash mode is allowable

SRAM must be disabled Hi-Z

VIHVILV

X X X X Hi-Z

X X X Hi-Z

XXXX

X X X Hi-Z

VIHVIHV

X Hi-Z

Data out

Word Read

Data in

Word Write

Hi-Z

12/92

M36WT864TF, M36WT864BF

Flash Memory Component

The Flash memory is a 64 Mbit (4Mbit x16) nonvolatile Flash memory that may be erased electrically at block level and programmed in-system on a Word-by-Word basis using a 1.65V to 2.2V V supply for the circuitry and a 1.65V to 3.3V V

DDQ

supply for the Input/Output pins. An optional 12V V

power supply is provided to s peed up cus-

PPF

tomer programming. The device features an asymmetr ical block archi-

tecture with an array of 135 blo cks divided into 4 Mbit banks. There are 15 banks each containing 8 main blocks of 32 KWords, and one parameter bank containing 8 parameter blocks of 4 KWords and 7 main blocks of 32 KWords. The Multiple Bank Architecture allows Dual Operations, while programming or erasing in one bank, Read operations are possible in other banks. Only one bank at a time is allowed to be in Program or Erase mode. It is possible to perform burst reads that cross bank boundaries. The bank architecture is summarized in Table 3, and the memory maps are shown in Figure 5. The Parameter Blocks are located at the top of t he m em ory ad dres s s pace f or the M36WT864TF, and at the bottom for the M36WT864BF.

Each block can be erased separately. Erase can be suspended, in order to perform program in any other block, and then resum ed. Program can be suspended to read data in any other block and then resumed. Each block can be programmed and erased over 100,000 cycles using the supply voltage V

. There are two Enhanced Factory

programming commands available to speed up programming.

Program and Erase command s are written to the Command Interface of the memory. An internal Program/Erase Controller takes care of the timings necessary for program and erase operations. The end of a program or erase operation can be detected and any error conditions identified in the Status Register. The command set required to control the memory is consistent with JEDEC standards.

The device supports synchronous burst read and asynchronous read from all blocks of the me mory array; at power-up the device is configured for asynchronous read. In synchronous burst mode, data is output on each clock cycle at frequencies of up to 54MHz.

The device features an Aut oma tic Standby m ode. During asynchronous read operations, after a bus inactivity of 150ns, the device automatically switches to the Automatic Standby m ode. In this condition the power consumption is reduced to the standby value I

and the outputs are still driven.

DD4

The Flash memory features an instant, individual block locking scheme that allows any block to be locked or unlocked with no latency, enabling instant code and data protection. All blocks have three levels of protection. They can be locked and locked-down individually preventing any accidental programming or erasure. There is an additional hardware protection against program and erase. When V

PPF

≤ V

all blocks are protected

PPLK

against program or erase. All blocks are locked at Power- Up.

The device includes a Protection Re gister and a Security Block to increase the protectio n of a s ystem’s design. The Protection Register is divided into two segments: a 64 bit segment c ontaining a unique device number written by ST, and a 128 bit segment One-Time-Programmable (OTP) by the user. The user programmable segment can be permanently protected. The Security Block, parameter block 0, can be permanently protected by the user. Figure 6, shows the Security Block and Protection Register Memory Map.

SRAM Comp onent

The SRAM is an 8 Mbit (512Kb x16) asynchronous random access memory which features a super low voltage operation and low current consumption with an access time of 70ns. The memory operations can be performed using a single low voltage supply, 2.7V to 3.3V.

13/92

M36WT864TF, M36WT864BF

Table 3. Flash Bank Architecture

Number Bank Size Parameter Blocks Main Blocks

Parameter Bank 4 Mbits 8 blocks of 4 KWords 7 blocks of 32 KWords

Bank 0 4 Mbits - 8 blocks of 32 KWords Bank 1 4 Mbits - 8 blocks of 32 KWords Bank 2 4 Mbits - 8 blocks of 32 KWords

----

Bank 13 4 Mbits - 8 blocks of 32 KWords Bank 14 4 Mbits - 8 blocks of 32 KWords

Figure 5. Flash Block Addresses

Top Boot Block

Address lines A21-A0

Bank 14

Bank 2

Bank 1

Bank 0

Parameter

Bank

000000h

007FFFh

038000h

03FFFFh

300000h

307FFFh

338000h

33FFFFh

340000h

377FFFh

378000h

37FFFFh

380000h

387FFFh

3D8000h

3BFFFFh

3C0000h

3C7FFFh

3F0000h 3F7FFFh 3F8000h

3F8FFFh

3FF000h

3FFFFFh

32 KWord

4 KWord

----

8 Main Blocks

7 Main Blocks

8 Parameter

Blocks

Parameter

Bank

Bank 0

Bank 1

Bank 2

Bank 14

----

000000h

000FFFh

007000h

007FFFh

008000h

00FFFFh

038000h

03FFFFh

040000h

047FFFh

078000h

07FFFFh

080000h

087FFFh

0B8000h

0BFFFFh

0C0000h

0C7FFFh

0F8000h

0FFFFFh

3C0000h

3C7FFFh

3F8000h

3FFFFFh

Bottom Boot Block

Address lines A21-A0

4 KWord

4KWord

32 KWord

----

8 Parameter

Blocks

7 Main Blocks

8 Main Blocks

14/92

AI06273

FLASH BUS OPERATIONS

There are six standard bus operations that control the Flash device. These are Bus Read, Bus Write, Address Latch, Ou tput Disable, Standby and Reset. See Table 2, Main Operating Modes, for a summary.

Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the memory and do not affect Bus Write operations.

Bus Read. Bus Read operations are used to output the contents of the Memory Array, the Electronic Signature, the Status Register and the Common Flash Interface. Both Chip Enable and Output Enable must be at V

in order to perform a

read operation. The Chip Enable input should be used to enable the device. Out put Enable should be used to gate data onto the output. The data read depends on the previous command written to the memory (see Command Interface section). See Figures 11, 12, 13 and 14 Read AC Waveforms, and Tables 21 and 22 Read AC Characteristics, for details of when the output becomes valid.

Bus Write. Bus Write operations write Commands to the memory or latch Input Data to be programmed. A bus write operation is initiated when Chip Enable and Write Enable are at V Output Enable at V

. Commands, Input Data and

with

Addresses are latched on the rising edge of Write Enable or Chip Enable, whichever occurs first. The addresses can also be latched prior to the write operation by toggling Latch E nable. In this case

M36WT864TF, M36WT864BF

the Latch Enable shoul d be t ied to V bus write operation.

See Figures 16 and 17, Write AC Waveforms, and Tables 23 and 24, Write AC Characteristics, for details of the timing requirements.

Address Latch. Address latch operations input valid addresses. Both Chip enable and Latch Enable must be at V

during address latch opera-

tions. The addresses are latched on the rising edge of Latch Enable.

Output Disa bl e . The outputs are high impedance when the Output Enable is at V

Standby. Standby di sables most of the internal circuitry allowing a substantial reduction of the current consumption. The memory is in stand-by when Chip Enable and Reset are at V er consumption is reduced to the stand-by level and the outputs are s et to high impedan ce, independently from the Output Enable or Write Enable inputs. If Chip Enable switches to V gram or erase operation, the device enters Standby mode when finished.

Reset. During Reset mode the memory is deselected and the outputs are high impedance. The memory is in Reset mode when Reset is at V The power consumption is reduced to the Standby level, independently from the Chip Enable, Output Enable or Write Enable inputs. If Reset is pulled to V

during a Program or Erase, this operation is

aborted and the memory content is no longer valid.

during the

. The pow-

during a pro-

15/92

M36WT864TF, M36WT864BF

FLASH COMMAND INTERFACE

All Bus Write operations t o the me mory are in terpreted by the Command Interface. Commands consist of one or more sequential Bus Write operations. An internal Program/Erase Controller handles all timings and verifies the correct execution of the Program and Erase commands. The Program/Erase Controller provides a Status Regi ster whose output may be read at any ti me to monitor the progress or the result of the operation.

The Command Interface is reset to read mode when power is first applied, when exiting from Reset or whenever V mand sequences must be followed exactly. Any invalid combination of commands will reset the device to read mode.

Refer to Table 4, Command C odes and Appendix D, Tables 44, 45, 46 and 47, Command I nterface States - Modify and Lock Tables, for a summary of the Command Interface.

The Command Interface is split into two type s of commands: Standard commands and Factory Program commands. The following sections explain in detail how to perform each command.

is lower than V

LKO

. Com-

Table 4. Command Codes

Hex Code Command

01h Block Lock Confirm 03h Set Configuration Register Confirm 10h Alternative Program Setup 20h Block Erase Setup 2Fh Block Lock-Down Confirm 30h Enhanced Factory Program Setup 35h Double Word Program Setup 40h Program Setup 50h Clear Status Register 56h Quadruple Word Program Setup

Block Lock Setup, Block Unlock Setup,

60h

70h Read Status Register

75h

80h Bank Erase Setup 90h Read Electronic Signature

Block Lock Down Setup and Set Configuration Register Setup

Quadruple Enhanced Factory Program Setup

98h Read CFI Query B0h Program/Erase Suspend C0h Protection Register Program

Program/Erase Resume, Block Erase

D0h

FFh Read Array

Confirm, Bank Erase Confirm, Block Unlock Confirm or Enhanced Factory Program Confirm

16/92

COMMAND INTERFACE - STANDARD COMMANDS

The following commands are the basic commands used to read, write to and configure the device. Refer to Table 5, Standard Commands, in conjunction with the following text descriptions.

Read Array Command

The Read Array command re turns the addressed bank to Read Array mode. One Bus Write cycle is required to issue the Read Array command and return the addressed bank to Read Array mode. Subsequent read operations will read the addressed location and output t he data. A Read Array command can be issued in one bank while programming or erasing in another bank. However if a Read Array command is issued to a bank currently executing a Program or Erase operation the command will be e xecuted but the output da ta is not guaranteed.

Read Status Register Command

The Status Register indi cates when a Program or Erase operation is complete and the success or failure of operation itself. Issue a Read Status Register command to read the Status Register content. The Read Status Register com man d c an be issued at any time, even during Program or Erase operations.

The following read operations output the content of the Status Register of the addressed bank. The Status Register is latched on the falling edge of E or G signals, and c an b e read until E or G returns to V

. Either E or G must be toggled to update the

latched data. See Table 8 for the description of the Status Register Bits. This mode supports asynchronous or single synchronous reads only.

Read Electronic Signature Command

The Read Electronic Signature command reads the Manufacturer and Device Codes, the Block Locking Status, the Protection Register, and the Configuration Register.

The Read Electronic Signature command consists of one write cycle to an address within one o f the banks. A subsequent Read ope ra tion in the sam e bank will output the Manufacturer Code, the Device Code, the protection Status of the blocks in the targeted bank, the Protection Register, or the Configuration Register (see Table 6).

If a Read Electronic Signature command is issued in a bank that is executing a Program or Erase operation the bank will go into Read Electronic Signature mode, subsequent Bus Read cycles will output the Electronic Sign ature data an d the Program/Erase controller will continue t o program or erase in the background. This mode supports asynchronous or single synchronous reads only, it does not support page mode or synchronous burst reads.

M36WT864TF, M36WT864BF

Read CFI Query Command

The Read CFI Query command is used to read data from the Common Flash Interface (CFI). The Read CFI Query Command consists of one Bus Write cycle, to an address within one of the banks. Once the command is issued subsequent Bus Read operations in the sam e bank read from the Common Flash Interface.

If a Read CFI Query command is issued in a bank that is executing a Program or Erase operation the bank will go into Read CFI Query mo de, subsequent Bus Read cycles will output the CFI data and the Program/Erase con troller will continue to Program or Erase in the background. This m ode supports asynchronous or single synchronous reads only, it does not support page mode or synchronous burst reads.

The status of the other banks is not affected by the command (see Table 11). After issuing a Read CFI Query command, a Read Array command should be issued to t he address ed bank to return the bank to Read Array mode.

See Appendix C, Common Flash Interface, Tables 34, 35, 36, 37, 38, 40, 41, 42 and 43 for details on the information contained in the Common Flash Interface memory area.

Clear Status Register Command

The Clear Status Register comm and can be used to reset (set to ‘0’) error bits 1, 3, 4 and 5 in the Status Register. One bus write cycle is required to issue the Clear Status Register command. After the Clear Status Register command the bank returns to read mode.

The error bits in the Status Regi ster do not automatically return to ‘0’ when a new command is issued. The error bits in the Status Register should be cleared before attempting a new Program or Erase command.

Block Erase Command

The Block Erase com mand can be used to erase a block. It sets all the bits within the selected block to ’1’. All previous data in the b lock is lost. If the block is protected then the Erase operation will abort, the data in the block will not be changed and the Status Register will output the error. The Block Erase command can be issued at any moment, regardless of whether the block has been programmed or not.

Two Bus Write cycles are required to issue the command.

■ The first bus cycle sets up the Erase command.

■ The second latches the block address in the

internal state machine and starts the Program/ Erase Controller.

17/92

M36WT864TF, M36WT864BF

If the second bus cycle is not Write Erase Confirm (D0h), Status Register bits 4 and 5 are set and the command aborts. Erase aborts if Reset turns to

. As data integrity cannot be guaranteed when

the Erase operation is aborted, the block m ust be erased again.

Once the command is issued the device outputs the Status Register data when any address within the bank is read. At the end o f the operation the bank will remain in Read Status Register mode until a Read Array, Read CFI Query or Read Electronic Signature command is issued.

During Erase operations the bank containing the block being erased will only accept the Read Array, Read Status Register, Read Electronic Signature, Read CFI Query and the Program/Erase Suspend command, all other commands will be ignored. Refer to Dual Operations section for detailed information about simultaneous operations allowed in banks not being e rased. Typical Erase times are given in Table 14, Program, Erase Times and Program/Erase Endurance Cycles.

See Appendix C, Figure 32, Block Erase Flowchart and Pseudo Code, for a suggested flowchart for using the Block Erase command.

Bank Erase Command

The Bank Erase command can be used to erase a bank. It sets all the bits within the selected bank to ’1’. All previous data in the bank is lost. The B ank Erase command will igno re any protected blocks within the bank. If all blocks in the bank are protected then the Bank Erase operation will abort and the data in the bank wi ll not b e changed. The Status Register will not output any error.

Two Bus Write cycles are required to issue the command.

■ The first bus cycle sets up the Bank Erase

command.

■ The second latches the bank address in the

internal state machine and starts the Program/ Erase Controller.

If the second bus cycle is not Write Bank Erase Confirm (D0h), Status Register bits SR4 and S R5 are set and the command aborts. Erase aborts if Reset turns to V

. As data integrity cannot be

guaranteed when the Erase operation is aborted, the bank must be erased again.

Once the command is issued the device outputs the Status Register data when any address within the bank is read. At the end o f the operation the bank will remain in Read Status Register mode until a Read A rray, Read CFI Query o r Read Electronic Signature command is issued.

During Bank Erase operations the bank being erased will only accept the Read Array, Read Status Register, Read Electronic Signature and Read

CFI Query command, all other commands will be ignored. A Bank Erase operation ca nnot be suspended.

Refer to Dual Operations section for detailed information about simultaneous operations allowed in banks not being erased. Typical Erase times are given in Table 14, Program, Erase Times and Program/Erase Endurance Cycles.

Program Command

The memory array can be programmed word-byword. Only one Word in one bank can be programmed at any one time. Two bus write cycles are required to issue the Program Command.

■ The first bus cycle sets up the Program

command.

■ The second latches the Address and the Data to

be written and starts the Program/Erase Controller.

After programming has started, read operations in the bank being programmed output the Status Register content.

During Program operations the bank being programmed will only accept the Read Array, Read Status Register, Read Electronic Signature, Read CFI Query and the Program/Erase Suspen d command. Refer to Dual Operations section for detailed information about simultaneous operations allowed in banks not bei ng programmed. Typical Program times are given in Table 14, Program, Erase Times and Program/Erase Endurance Cycles .

Programming aborts if Reset goes to V

. As data

integrity cannot be guaranteed when the program operation is aborted, the memory location must be reprogrammed.

See Appendix C, Figure 28, Program Flowchart and Pseudo Code, for the f lowchart for using the Program command.

Program/Erase Suspend Command

The Program/Erase Suspend command is used to pause a Program or Block Erase operation. A Bank Erase operation cannot be suspended.

One bus write cycle is required to issue the P rogram/Erase command. O nce the Program/Erase Controller has paused bits SR7, SR6 and/ or SR2 of the Statu s Regist er will be s et to ‘1’. Th e command can be addressed to any bank.

During Program/Erase Suspend the Command Interface will accept the Program/Erase Resume, Read Array (cannot read the suspended block), Read Status Register, Read Electronic S ignature and Read CFI Q uery commands. Additionally, if the suspend operation was Erase then the Clear status Register, Program, Block Lock, Block LockDown or Block Unlock commands will also be accepted. The block being erased may be protected

18/92

M36WT864TF, M36WT864BF

by issuing the Block Lock, Block Lock-Down or Protection Register Program commands. Only the blocks not being erased may be read or programmed correctly. When the Program/Erase Resume command is issued the operation will complete. Refer to the Dual Operations section for detailed information about simultaneous operations allowed during Program/Erase Suspend.

During a Program/Erase Suspend, the device can be placed in standby mode by taking Chip Enable

. Program/Erase is aborted if Reset turns to

to V

See Appendix C, Figure 31 , Program Suspend & Resume Flowchart and Pseudo Code, and Figure 33, Erase Suspend & Resume Flowchart and Pseudo Code for flowcharts for using the Program/ Erase Suspend command.

Program/Erase Resume Command

The Program/Erase Resume command can be used to restart the Program/Erase Controller after a Program/Erase Suspen d command has paused it. One Bus Write cycle is required to issue the command. The command can be written to any address.

The Program/Erase R esume command d oes not change the read m ode of the banks. If the s uspended bank was in Read Status Register, Read Electronic signature or Read CFI Query mode the bank remains in that m ode and outputs the corresponding data. If the bank was in Read Array mode subsequent read operations will output invalid data.

If a Program command is issued during a Block Erase Suspend, then the erase cannot be resumed until the programming operation has completed. It is possible to accumulate suspend operations. For example: suspend an eras e operation, start a programming operation, suspend the programming operation then read the array. See Appendix C, Figure 31, Program Susp end & Resume Flowchart and Pseudo Code, and Figure 33, Erase Suspend & Resume Flowchart and Pseudo Code for flowcharts for using the Program/Erase Resume command.

Prot e ction R e gister P rogram C om m and

The Protection Register Program command is used to Program the 128 bit user O ne-Time-Programmable (OTP) segment of the Protection Register and the Protection Register Lock. The segment is programmed 16 bits at a time. When shipped all bits in the segment are set to ‘1’. The user can only program the bits to ‘0’.

Two write cycles are required to issue the Protection Register Program command.

■ The first bus cycle sets up the Protection

■ The second latches the Address and the Data to

be written to the Protection Register and starts the Program/Erase Controller.

Read operations output the Status Register content after the programming has started.

The segment can be protected by programming bit 1 of the Protection Lock Register. Bit 1 of the Protection Lock Register also protects bit 2 of the Protection Lock Register. Programming bit 2 of the Protection Lock Register will result in a permanent protection of Parameter B lock #0 (see Figure 6, Security Block and Protection Register Memory Map). Attempting to program a previously protected Protection Register will result in a Status Register error. The protection of the Protection Register and/or the Security Block is not reversible.

The Protection Register Program cannot be suspended. See Appendix C, Figure 35, Protection Register Program Flowchart and Pseudo Code, for a flowchart for using the Protection Register Program command.

Set Configuration Regi s te r C om m and.

The Set Configuration Register command is used to write a new value to the Burst Configuration Control Register which defines the burst length, type, X latency, Synchronous/Asynchronous Read mode and the valid Clock edge configuration.

Two Bus Writ e cycle s are required to issue th e Se t Configuration Register command.

■ The first cycle writes the setup command and

the address corresponding to the Configuration Register content.

■ The second cycle writes the Configuration

Once the command is issued the memory returns to Read mode.

The value for the Configuration Register is always presented on A0-A15. CR0 is on A0, C R1 on A1, etc.; the other address bits are ignored.

Block Lock Command

The Block Lock command is used to lock a block and prevent Program or Erase operations from changing the data in it. All blocks are locked at power-up or reset.

Two Bus Write cycles are required to issue the Block Lock command.

■ The first bus cycle sets up the Block Lock

command.

■ The second Bus Write cycle latc hes the blo ck

address.

The lock status can be monitored for each block using the Read Electronic Signature command. Table. 13 shows the Lock Status after issuing a Block Lock command.

19/92

M36WT864TF, M36WT864BF

The Block Lock bits are volatile, once set they remain set until a hardware reset or power-down/ power-up. They are cleared by a Block Unlock command. Refer to the section, Block Locking, for a detailed explanation. See Appendix C, Figure 34, Locking Operations Flowchart and Pseudo Code, for a flowchart for using the Lock command.

Block Unlock Command

The Block Unlock command is used to unlock a block, allowing the block to be programmed or erased. Two Bus Write cycles are requ ired to issue the Block Unlock command.

■ The first bus cycle sets up the Block Unlock

command.

■ The second Bus Write cycle latc hes the blo ck

address.

The lock status can be monitored for each block using the Read Electronic Signature command. Table 13 shows the protection status after issuing a Block Unlock command. Refer to the section, Block Locking, for a detailed expla nation and A ppendix C, Figure 34, Locking Operations Flowchart and Pseudo Code, f or a flowchart for using the Unlock command.

Block Lock-Down Command

A locked or unlocked block can be locked-down by issuing the Block Lock-Down command. A lockeddown block cannot be programm ed or erased, or have its protection status changed when WP low, V

. When WP is high, V

the Lock-Down

IH,

function is disabled and the lock ed blocks can be individually unlocked by the Block Unlock command.

Two Bus Write cycles are required to issue the Block Lock-Down command.

■ The first bus cycle sets up the Block Lock

command.

■ The second Bus Write cycle latc hes the blo ck

address.

The lock status can be monitored for each block using the Read Electronic Signature command. Locked-Down blocks revert to the locked (and not locked-down) state when the device is reset on power-down. Table. 13 shows the Lo ck Statu s after issuing a Block Lock-Down command. Refer to the section, Block Locking, for a detailed explanation and Appendix C, Fi gure 34, Locking Operations Flowchart and Pseudo Code, for a flowchart for using the Lock-Down command.

20/92

Table 5. Flash Standard Commands

M36WT864TF, M36WT864BF

Bus Operations

Commands

Cycles

Read Array 1+ Write BKA FFh Read St atus Register 1+ Write BKA 70h Read Read Electro nic Signature 1+ Write BKA 90h Read Read CFI Query 1+ Write BKA 98h Read Clear Status Register 1 Write BKA 50h

Block Erase 2 Write BKA 20h Write BA D0h Bank Erase 2 Write BKA 80h Write BKA D0h Program 2 Write BKA 40h or 10h Write WA PD Program/Erase Suspend 1 Write X B0h Program/Erase Resume 1 Write X D0h Protection Register Program 2 Write PRA C0h Write Set Configuration Register 2 Write CRD 60h Write Block Lock 2 Write BKA 60h Write Block Unlock 2 Write BKA 60h Write Block Lock-Down 2 Write BKA 60h Write

Note: 1. X = Don't Care, WA=Word Address in targeted bank, RD=Read Data, SRD=Status Register Data, ESD=Electronic Signature Data,

QD=Query Dat a, BA=Bl ock Address, BK A= Ban k Address , PD= Program Data, PR A=Prot ectio n Regist er Addre ss, PRD =Prote ction Register Dat a, CRD=Configurat ion Regist er Data.

2. Must be same bank as in the first cycle. The signatur e addresses are listed in Table 6.

Op. Add Data Op. Add Data

1st Cycle 2nd Cycle

Read

WA RD

(2)

BKA

(2)

BKA

(2)

BKA

PRA

CRD 03h

BA 01h BA BA

SRD ESD

PRD

D0h 2Fh

21/92

M36WT864TF, M36WT864BF

Table 6. Electronic Signature Codes

Code Address (h) Data (h)

Manufacturer Code Bank Address + 00 0020

Device Code

Top Bank Address + 01 8810 Bottom Bank Address + 01 8811 Lock

0001

Unlocked 0000

Block Protection

Block Address + 02

Locked and Locked-Down 0003

Unlocked and Locked-Down 0002 Reserved Bank Address + 03 Reserved Configuration Register Bank Address + 05 CR

ST Factory Default

0006

Security Block Permanently Locked 0002 Protection Register Lock

OTP Area Permanently Locked 0004

Security Block and OTP Area Permanently

Locked

Bank Address + 80

Bank Address + 81 Bank Address + 84

0000

Unique Device

Number

Protection Register

Bank Address + 85 Bank Address + 8C

Note: CR=Con figuration Register.

OTP Area

Figure 6. Flash Security Block and Protection Register Memo ry Ma p

22/92

SECURITY BLOCK

Parameter Block # 0

8Ch

85h 84h

81h 80h

PROTECTION REGISTER

User Programmable OTP

Unique device number

Protection Register Lock 2 1 0

AI06181

COMMAND INTERFACE - FACTORY PROGRAM COMMANDS

The Factory Program commands are used to speed up programming. They require V V

. Refer to Table 7, Factory Program Com-

PPH

PPF

to be at

mands, in conjunction with the following text descrip tion s.

Double Word Program Command

The Double Word Program command improves the programming throughput by writing a page of two adjacent words in parallel. The two words must differ only for the address A0.

Programming should not be attempted when V is not at V V

is below V

PPF

. The command can be executed if

PPH

but the result is not guaran-

PPH

PPF

teed . Three bus write cycles are necessary to issue the

Double Word Program command.

■ The first bus cycle sets up the Double Word

Program Command.

■ The second bus cycle latches the Address and

the Data of the first word to be written.

■ The third bus cycle latches the Address and the

Data of the second word to be written and starts the Program/Erase Controller.

Read operations in the bank bei ng programmed output the Status Register content after the programming has started.

During Double Word Program operations the bank being programmed will only ac cept the Read Array, Read Status Register, Read Electronic Signature and Read CFI Query command, all other commands will be ignored. Dual operations are not supported during Double Word Program operations and it is not recommended to suspend a Double Word Program operation. Typical Program times are given in Table 14, Program, Erase Times and Program/Erase Endurance Cycles.

Programming aborts if Reset goe s to V

. As data

integrity cannot be guaranteed when the program operation is aborted, the memory locations mu st be reprogrammed.

See Appendix C, Figure 29, Double Word Program Flowchart and Pseudo Code, for the flowchart for using the Double Word Program command.

Quadruple Word Program Command

The Quadruple Word Program command improves the programming throughput by writing a page of four adjacent words in parallel. The four words must differ only for the addresses A0 and A1.

Programming should not be attempted when V is not at V V

is below V

PPF

. The command can be executed if

PPH

but the result is not guaran-

PPH

PPF

teed .

Five bus write cycles are necessary to issue the Quadruple Word Program command.

■ The first bus cycle sets up the Double Word

Program Command.

■ The second bus cycle latches the Address and

the Data of the first word to be written.

■ The third bus cycle latches the Address and the

Data of the second word to be written.

■ The fourth bus cycle latches the Address and

the Data of the third word to be written.

■ The fifth bus cycle latches the Ad dr es s and th e

Data of the fourth word to be written and starts the Program/Erase Controller.

Read operations to the bank being programmed output the Status Register content after the programming has started.

Programming aborts if Reset goes to V integrity cannot be guaranteed when the program operation is aborted, the memory locations m ust be reprogrammed.

During Quadruple Word Program operations the bank being programmed will only accept the Read Array, Read Status Register, Read Electronic Signature and Read CFI Query command, all other commands will be ignored.

Dual operations are not supported during Quadruple Word Program operations and it is not recommended to suspend a Quadrupl e Word Program operation. Typical Program times are given in Table 14, Program, Erase Times and Program/Erase Endurance Cycles.

See Appendix C, Figure 30, Quadruple Word Program Flowchart and Pseudo Code, for the flowchart for using the Quadruple Word Program command.

Enhanced Factory Program Command

The Enhanced Factory Program command can be used to program large streams of dat a within any one block. It greatly reduces the total programming time when a large number of Words are written to a block at any one time.

The use of the Enha nced Factory Program command requires certain operating conditions.

■ V

■ Ambient temperature, T

■ The targeted block must be unlocked

must be set to V

PPF

must be within operating range

Dual operations are not s upported during the Enhanced Factory Program operation an d the command cannot be suspended.

For optimum performance the Enhanc ed Factory Program commands should be limited to a maximum of 10 program/erase cycles per block. If this

M36WT864TF, M36WT864BF

. As data

PPH

must be 25°C ± 5°C

23/92

M36WT864TF, M36WT864BF

limit is exceeded the in ternal algorithm will cont inue to work properly but some degradation in performance is possible. Typical Program times are given in Table 14.

The Enhanced Factory Program command has four phases: the Setup Phase, the Program Phase to program the data to the memory, the Verify Phase to check that the data has been correctly programmed and reprogram if necessary a nd the Exit Phase. Refer to Table 7, Enhanced Factory Program Command and Figure 36, Enhanced Factory Program Flowchart.

Setup Phase. The Enhanced Factory Program command requires two Bus Write operations to initiate the command.

■ The first bus cycle sets up the Enhanced

Factory Program command.

■ The second bus cycle confirms the command.

The Status Register P/E.C. Bit 7 should be read to check that the P/E.C. is ready. After the confirm command is issued, read operations output the Status Register data. The read Status Register command must not be issued as it will be interpreted as data to program.

Program Phase. The Program Phase requires n+1 cycles, wh ere n is the n umber of Words (refer to Table 7, Enhanced Factory Program Command and Figure 36, Enhanced Factory Program Flowchar t).

Three successive steps are required to issue and execute the Program Phase of the command.

1. Use one Bus Write operation to latch the Start Address and the first Word to be programmed. The Status Register Bank Write Status bit SR0 should be read to check that the P/E.C. is ready for the next Word.

2. Each subsequent Word to be programmed is latched with a new Bus Write operation. The address can either remain the Start Address, in which case the P/E.C. increments the address location or the address can be incremented in which case the P/E.C. jumps to the new address. If any address that is not in the same block as the Start Address is given with data FFFFh, the Program Phase terminates and the Verify Phase begins. The Status Register bit SR0 should be read between each Bus Write cycle to check that the P/E.C. is ready for the next Word.

3. Finally, after all Words have been programmed, write one Bus Write operation with data FFFFh to any address outside the bloc k contain ing the Start Address, to terminate the programming phase. If the data is not FFFFh, the command is ignored.

The memory is now set to enter the Verify Phase.

Verify Phase. Th e Verify Phase is sim ilar to the Program Phase in that all Words must be resent to the memory for them to be che cked against the programmed data. The Program/Erase Controller checks the stream of da ta with the data that was programmed in the Program Phase and reprograms the memory location if necessary.

Three successive steps are required to execute the Verify Phase of the command.

1. Use one Bus Write operation to latch the Start Address and the first Word, to be verified. The Status Register bit SR0 should be read to check that the Program/Erase Controller is ready for the next Word.

2. Each subsequent Word to be verified is latched with a new Bus Write operation. The Words must be written in the same order as in the Program Phase. The address can remain the Start Address or be incremented. If any address that is not in the same block as the Start Address is given, the Verify Phase terminates. Status Register bit SR0 should be read to check that the P/E.C. is ready for the next Word.

3. Finally, after all Words have been verified, write one Bus Write operation with data FFFFh to any address outside the block containing the Start Address, to terminate the Verify Phase.

If the Verify Phase is successfully completed the memory returns to the Read mode. If the Pr ogram/ Erase Controller fails to reprogram a given location, the error will be signaled in the Status Register.

Exit Phase. Status Register P/E.C. bit SR7 set to ‘1’ indicates that the device has ret urned to Read mode. A full Status Register check should be done to ensure that the block has been successfully programmed. See the s ect ion on the Status Register for more details.

Quadruple Enhanced Factory Program Command

The Quadruple Enhanced Factory Program command can be used to program one or more pages of four adjacent words in parallel. The four words must differ only for the addresses A0 and A1. V must be set to V

during Quadruple Enhanced

PPH

PPF

Factory Program. It has four phases: the Setup Phase, the Load

Phase where the data is loaded into the buffer, the combined Program and Verify Phase where the loaded data is programmed to the memory and then automatically checked and reprogrammed if necessary and the Exit Phase. Unlike the Enhanced Factory Program it is not necess ary to resubmit the data for the Verify Phase. The Load Phase and the Program and Verify Phas e can be repeated to program any number of pag es within the block.

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M36WT864TF, M36WT864BF

Setup Phase. The Q uadruple Enhan ced F actory

Program command requires one Bus Write operation to initiate the load phase. After the setup command is issued, read operations output the Status Register data. Th e Read Status Register command must not be issued as it will be interpreted as data to program.

Load Phase. The Loa d Phase requires 4 cycles to load the data (refer to Table 7, Factory Program Commands and Figure 37, Qu adruple Enhanced Factory Program Flowchart). Once the first Word of each Page is written it is impossible to exit the Load phase until all four Words have been written.

Two successive steps are required to issue and execute the Load Phase of the Quadruple Enhanced Factory Program command.

1. Use one Bus Write operation to latch the Start Address and the first Word of the first Page to be programmed. For subsequent Pages the first Word address can remain the Start Address (in which case the next Page is programmed) or can be any address in the same block. If any address is given that is not in the same block as the Start Address, the device enters the Exit Phase. For the first Load Phase Status Register bit SR7 should be read after the first Word has been issued to check that the command has been accepted (bit 7 set to ‘0’). This check is not required for subsequent Load Phases. Status Register bit SR0 should be read to check that the P/E.C. is ready for the next Word.

2. Each subsequent Word to be programmed is latched with a new Bus Write operation. The address is only checked for the first Word of each Page as the order of the Words to be programmed is fixed. The Status Register bit SR0 should be read between each Bus Write

cycle to check that the P/E.C. is ready for the next Word.

The memory is now set to enter the Program and Verify Phas e .

Program and Verify Phase. In the Program and Verify Phase the four Words that were loaded in the Load Phase are programmed in the memory array and then verified by the Program/Erase Controller. If any errors are found the Program/Erase Controller reprograms the location. During this phase the Status Register shows that the Program/Erase Controller is busy, Status Register bit SR7 set to ‘0’, and that the device is not waiting for new data, Status Register bit SR0 set to ‘1’. When Status Register bit SR0 is set t o ‘0’ the Program and Verify phase has terminated.

Once the Verify Phase has successfully completed subsequent pages i n the same block can be loaded and programmed. The device returns to the beginning of the Load Phase by issuing one Bus Write operation to latch the Addres s and the first of the four new Words to be programmed.

Exit Phase. Finally, after all the pages have been programmed, write one Bus Write operation with data FFFFh to any address outside the block containing the Start Address, to terminate the Load and Program and Verify Phases.

If the Program and Verify Phase has successfully completed the memory returns to Read m ode. If the P/E.C. fails to program and reprogram a given location, the error will be signaled in the Status Register.

Status Register bit SR7 set to ‘1’ and bit 0 set to ‘0’ indicate that the device has returned to Read mode. A full Status Register check should be done to ensure that the block has been successfully programmed. See the s ect ion on the Status Register for more details.

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M36WT864TF, M36WT864BF

Table 7. Flash Factory Program Comman ds

Bus Write Operations

Command Phase

Cycles

(4)

Double Word Program Quadruple Word

Program

(5)

Enhanced

Factory

Setup, Program

3 BKA 35h WA1 PD1 WA2 PD2

+n+1BKA 30h BA D0h

Program

(6)

Verify, Exit

Setup, first Load

First

Quadruple

Enhanced

Factory

Program

(5,6)

Program & Verify

Subsequent Loads

Subsequent Program &

Automatic

Verify

Exit 1

Note: 1. WA=Word Addres s in t arget ed bank, BKA= Bank A d dress, P D=Pro gram Data , B A =Block Address .

2. WA1 is the Start Address. NOT WA1 is any address that is not in the sam e bl ock as W A1.

3. Address ca n remain Start i ng Address WA1 or be incremented.

4. Word Addresses 1 and 2 mus t be consecuti ve Addresses differing only for A0.

5. Word Addresses 1,2,3 and 4 m ust be consecutive Addresses dif fe ri ng only for A0 and A1.

6. A Bus Read m ust b e d one bet we en eac h Wr ite cyc le where t he da t a is p rog ra mmed or verif ied to rea d the St atus Reg ist er an d check that the memory is ready to accept the next data. n = number of Wo rds, i = number of Pages to be programmed .

7. Address is o nly che ck ed for the fir st Wo rd o f each Page a s the o rder t o pro gram the Wo rds i n each pag e is fixe d so subs equent Words in each Page can be written to any address.

1st 2nd 3rd Final -1 Final

Add Data Add Data Add Data Add Data Add D ata

BKA 56h WA1 PD1 WA2 PD2 WA3 PD3 WA4 PD4

NOT

WA1

NOT

WA1

WA4

WA4i

(7)

(2)

WA1

BKA 75h

WA1i

(2)

PD1

PD1i

WA2

WA1

WA2i

(7)

(3)

(2)

PD2

PD1

PD2i

WA1

WA3

WA2

WA3i

(7)

(2)

(3)

(7)

PD1

PD3

PD2

PD3i

WAn

WA3

(3)

(7)

PAn

PD3

NOT WA1

FFFFh

(2)

(7)

FFFFh

PD4

PD4i

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FLASH STATUS REGISTER

The Flash memory contains a Status Register which provides information on the current or previous Program or Erase operations. Issue a Read Status Register command to read the contents of the Status Register, refer to Read Status Register Command section for more details. To output the contents, the Status Register is latched and updated on the falling edge of the Chip Enable or Output Enable signals and can be read until Chip Enable or Output Enable returns t o V

. The Status Reg-

ister can only be read using single asynchronous or single synchronous reads. Bus Read operations from any address within the bank, always read the Status Register during Program and Erase operations.

The various bits convey information about the status and any errors of the operation. Bits SR7, SR6, SR2 and SR0 give information on the status of the device and are set and reset by the device. Bits SR5, SR4, SR3 and SR1 give inform ation on errors, they are set by the device but must be reset by issuing a Clear Status Register command or a hardware reset. If an error bit is set to ‘1’ the Status Register should be reset before issuing another command. SR7 to SR1 refer to the status of the device while SR0 refers to the status of the addressed bank.

The bits in the Status Register are summarized in Table 8, Status Register Bits. Refer to Table 8 in conjunction with the following text descriptions.

Program/Erase Controller Status Bit (SR7).

The Program/Erase Controller Status bit indicates whether the Program/Erase Con troller is active or inactive in any bank. When the Program/Erase Controller Status bit is Low (set to ‘0’), the Program/Erase Controller is active; when the bit is High (set to ‘1’), the Program/Erase Controller is inactive, and the device is ready to process a new command.

The Program/Erase Controller Status is Low immediately after a Program/Erase Suspend command is issued until the Program/Erase Controller pauses. After the Program/Erase Controller pauses the bit is High.

During Program, Erase, operations the Program/ Erase Controller Status bit can be polled to find the end of the operation. Other bits in the Status Register should not be tested until the Program/Erase Controller completes the operation and the bit is High.

After the Program/Erase Cont roller completes its operation the Erase Status, Program Status, V

PPF

Status and Block Lock Status bits should be tested for errors.

Erase Suspend Status Bit (SR6). The Erase Suspend Status bit indicates that an Erase opera-

M36WT864TF, M36WT864BF

tion has been suspended or is going to be suspended in the addressed block. When the Eras e Suspend Status bit is High (set to ‘1’), a Program/ Erase Suspend command has been issued and the memory is waiting for a Program/Erase Resume command.

The Erase Suspend Status should only be considered valid when the Program/Erase Controller Status bit is High (Program/Erase Controller inactive). SR7 is set within the Erase Suspend Latency time of the Program/Erase Suspend command being issued therefore the memory may still complete the operation rather than entering the Suspend mode.

When a Program/Erase Re sume command is issued the Erase Suspend Status bit returns Low.

Erase Status Bit (SR5). The Erase Status bit can be used to identify if the memory has failed to verify that the block or bank has erased correctly. When the Erase Status b it is High (set to ‘1’), the Program/Erase Controller has applied the maximum number of pulses to the block or bank and still failed to verify that it has erased correctly. The Erase Status bit should be read once the Program/ Erase Controller Status bit is High (Program/Erase Controller inactive).

Once set High, the Erase Status bit can only be reset Low by a Clear Status Register command or a hardware reset. If set High it should be reset before a new Program or Erase command is issued, otherwise the new command will appear to fail.

Program Status Bit (SR4). The Program Status bit is used to identify a Program f ailure. Wh en t he Program Status bit is High (set to ‘1’), the Program/Erase Controller has applied the maximum number of pulses to the byte and still failed to verify that it has programmed correctly. The Program Status bit should be read once the Program/Erase Controller Status bit is High (Program/Erase Controller inactive).

Once set High, the Program Status bit can only be reset Low by a Clear Status Register command or a hardware reset. If set High it should be reset before a new command is issued, otherwise the new command will appear to fail.

Status Bit (SR3). The V

PPF

be used to identify an invalid voltage o n the V pin during Program and Erase operations. The V

pin is only sampled at the beginning of a Pro-

PPF

gram or Erase operation. Indeterminate results can occur if V

becomes invalid during an oper-

PPF

ation. When the V

voltage on the V voltage; when the V ‘1’), the V

Status bit is Low (set to ‘0’), the

PPF

pin has a voltage that is below the

PPF

pin was sampled at a valid

PPF

Status bit is High (set to

PPF

Status bit can

PPF

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M36WT864TF, M36WT864BF

Lockout Voltage, V

PPF

tected and Program and Erase operations cannot be performed.

Once set High, the V

PPF

set Low by a Clear Status Register command or a hardware reset. If set High it should be reset before a new Program or Erase command is issued, otherwise the new command will appear to fail.

Program Suspend Status Bit (SR2). The Program Suspend Status bit indicates that a Program operation has been suspended in the addressed block. When the Program Suspend Status bit is High (set to ‘1’), a Program/Erase Suspend command has been issued and the memory is waiting for a Program/Erase Resume command. The Program Suspend Status should only be considered valid when the Program/Erase Controller Status bit is High (Program/Erase Controller inactive). SR2 is set within the Program Suspend Latency time of the Program/Erase Suspend command being issued therefore the memory may still complete the operation rather than entering the Suspend mode.

When a Program/Erase Re sume command is issued the Program Suspend Status bit returns Low.

Block Protection Status Bit (SR1). The Block Protection Status bit can be used to identify if a Program or Block Erase operation has tried to modify the contents of a locked block.

When the Block Protection S tatus bit is High (set to ‘1’), a Program or Erase operation has been attempted on a locked block.

, the memory is pro-

PPLK

Status bit can only be re-

Once set High, the Block Protection Status bit can only be reset Low by a Clear Status Register command or a hardware reset. If set High it should be reset before a new command is issued, otherwise the new command will appear to fail.

Bank Wri te/Multiple Wor d Program Sta tus Bit (SR0). The Bank Write Status bit indicates wheth-

er the addressed bank is programming or erasing. In Enhanced Factory Program m ode the Multiple Word Program bit shows if a Word has finished programming or verifying depending on the phase. The Bank Write Status bit should only be considered valid when the Pro gr a m/Erase Controller Status SR7 is Low (set to ‘0’).

When both the Pro gra m/Erase Controller Status bit and the Bank Write Status bit are Low (set to ‘0’), the addressed bank is executing a Program or Erase operation. When the Program/Erase Controller Status bit is Low (set to ‘0’) and the Bank Write Status bit is High (set to ‘1’), a Program or Erase operation is being executed in a bank other than the one being addressed.

In Enhanced Factory Program mode if Multiple Word Program Status bit is Low (set to ‘0’), the device is ready for the next Word, if the Multiple Word Program Status bit is High (set to ‘1’) the device is not ready for the next Word.

Note: Refer to Appendix C, Flowcharts and Ps eudo Codes, for using the Status Register.

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+ 64 hidden pages

SGS Thomson Microelectronics M36WT864TF, M36WT864BF Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual