SGS Thomson Microelectronics M36W432TG, M36W432BG Datasheet

32 Mbit (2Mb x16, Boot Block) Flash Memory

and 4 Mbit (256Kb x16) SRAM, Multiple Memory Product

FEATURES SUMMARY

■ MULTIPLE MEMORY PRODUCT

– 32 Mbit (2Mb x 16), Boot Block, Flash Memory
– 4 Mbit (256Kb x 16) SRAM Memory

■ SUPPLY VOLTAGE

–V
–V
–V

■ ACCESS TIME: 70ns, 85ns

■ LOW POWER CONSUMPTION

■ ELECTRONIC SIGNATURE

– Manufacturer Code: 20h
– Top Device Code, M36W432TG: 88BAh
– Bottom Device Code, M36W432BG: 88BBh

FLASH MEMORY

■ MEMORY BLOCKS

– Parameter Blocks (Top or Bottom Location)
– Main Blocks

■ PROGRAMMING TIME

– 10µs typical
– Double Word Programming Option
– Quadruple Word Programming Option

■ BLOCK LOCKING

– All blocks locked at Power up
– Any combination of blocks can be locked
–WP

■ AUTOMATIC STANDBY MODE

■ PROGRAM and ERASE SUSPEND

■ 100,000 PROGRAM/ERASE CYCLES per

BLOCK

■ COMMON FLASH INTERFACE

■ SECURITY

– 128 bit user programmable OTP cells
– 64 bit unique device identifier

= 2.7V to 3.3V

DDF

= V

DDS

= 12V for Fast Program (optional)

PPF

for Block Lock-Down

F

= 2.7V to 3.3V

DDQF

M36W432TG

M36W432BG

PRELIMINARY DATA

SRAM

■ 4 Mbit (256Kb x 16)

■ ACCESS TIME: 70ns

■ LOW V

■ POWER DOWN FEATURES USING TWO

CHIP ENABLE INPUTS

Figure 1. Package

DATA RETENTION: 1.5V

DDS

FBGA

Stacked LFBGA66 (ZA)

12 x 8 mm

November 2002

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.

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TABLE OF CONTENTS

SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3. LFBGA Connections (Top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Address Inputs (A0-A17). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Address Inputs (A18-A20). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Data Input/Output (DQ0-DQ15). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Flash Chip Enable (EF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Flash Output Enable (GF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Flash Write Enable (WF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Flash Write Protect (WPF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Flash Reset (RPF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SRAM Chip Enable (E1S, E2S). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SRAM Write Enable (WS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SRAM Output Enable (GS).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SRAM Upper Byte Enable (UBS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SRAM Lower Byte Enable (LBS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

V

Supply Voltage (2.7V to 3.3V).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

DDF

and V

V

DDQF

V

Program Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

PPF

V

and V

SSF

Supply Voltage (2.7V to 3.3V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

DDS

Ground.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SSS

FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 4. Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0

Table 2. Main Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 3. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 4. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 5. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 6. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 5. Device Capaci ta n ce. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 6. DC Character i stics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6

Figure 7. Stacked LFBGA66 12x8mm , 8x8 ball array, 0.8mm pitch, Bottom View Package Out line16
Table 7. Stacked LFBGA66 12x8mm, 8x8 ball array, 0.8mm pitch, Package Mecha nical Dat a . . . 16
Figure 8. Stacked LFBGA66 Daisy Chain - Package Connections (Top view through package) . . 17
Figure 9. Stac k ed LFBGA6 6 Daisy C hain - PC B Connect ions proposal (Top view through package).18

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PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 8. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 9. Daisy Chain Orde r ing Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

FLASH DEVICE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 0

FLASH SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 10. Flash Block Ad d re sse s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 11. Protect ion Regi ster Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

FLASH BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Read.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Write.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Output Disable.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Automatic Standby.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2

FLASH COMMAND INTERFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Read Memory Array Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Read Status Register Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Read Electronic Signature Comma nd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Read CFI Query Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Block Erase Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Double Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Clear Status Regist e r Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Program/Erase Suspend Comm and . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Program/Eras e Resume Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Protection Regi ste r Pr o g ra m Comman d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Block Lock Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Block Unlock Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Block Lock-Down Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 10. Flash Command Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 12. Flash Read Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 13. Flash Read Block Lock Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 14. Flash Read Protection Register and Lock Register . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 15. Flash Program, Erase Times and Program/Erase Endurance Cycles . . . . . . . . . . . 28

FLASH BLOCK LOCKING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

Reading a Block’s Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Locked State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Unlocked State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 9

Lock-Down State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Locking Operatio n s Durin g Erase Su sp e nd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table 16. Flash Block Lock Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Table 17. Flash Protection Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

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FLASH STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Program/Erase Controller Status (Bit 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Erase Suspend Status (Bit 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Erase Status (Bit 5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1

Program Status (Bit 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

V

Status (Bit 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1

PPF

Program Suspend Status (Bit 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Block Protection Status (Bit 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Reserved (Bit 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2

Table 18. Flash Status Register Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Figure 12. Flash Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 19. Flash Read AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 13. Flash Write AC Wavefo r ms, Write Enable Control l e d . . . . . . . . . . . . . . . . . . . . . . . 34

Table 20. Flash Write AC Chara cte ristics, Write En a ble Controlled. . . . . . . . . . . . . . . . . . . . . 35

Figure 14. Flash Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . 36

Table 21. Flash Write AC Characteristics, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . 37

Figu r e 1 5 . Flash Power -Up an d R e set AC W a veforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Table 22. Flash Power-Up and Reset AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

SRAM DEVICE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

SRAM SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Figure 16. SRAM Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

SRAM OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 0

Standby/Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 17. SRAM Read Mode AC Waveforms, Address Controlled. . . . . . . . . . . . . . . . . . . . . 41

Figure 18. SRAM Read AC Waveforms, GS Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 19. SRAM Standby AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Table 23. SRAM Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Figure 20. SRAM Write AC Waveforms, WS Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Figu r e 2 1 . SRAM Write A C Wav e forms, E1S Con trolle d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Figure 22. SRAM Write AC Waveforms, WS Controlled with GS Low . . . . . . . . . . . . . . . . . . . 45

Figure 23. SRAM Write Cycle Waveform, UBS and LBS Controlled, GS Low . . . . . . . . . . . . . 45

Table 24. SRAM Write AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 24. SRAM Low V
Table 25. SRAM Low V

Data Retention AC Waveforms, E1S or UBS / LBS Controlled . . 47

DDS

Data Retention Characte r i stic. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

DDS

APPENDIX A. FLASH BLOCK ADDRESS TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table 26. Top Boot Block Addresses, M36W432TG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table 27. Botto m Boo t Bl oc k Addre sse s, M36W432BG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

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APPENDIX B. COMMON FLASH INTERFACE (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Table 28. Query Stru cture Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

Table 29. CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

Table 30. CFI Query System Interface Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table 31. Device Geome try Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Table 32. Primary Algorithm-Specific Extended Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Table 33. Security Code Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

APPENDIX C. FLASH FLOWCHARTS AND PSEUDO CODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Figure 25. Flash Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Figure 26. Double Word Program Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Figure 28. Program Suspend & Resume Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . 58

Figure 29. Erase Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Figure 30. Erase Suspend & Resume Flowchart and Pseudo Code. . . . . . . . . . . . . . . . . . . . . . . . 60

Figure 31. Locking Operations Flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

APPENDIX D. FLASH COMMAND INTERFACE AND PROGRAM/ERASE CONTROLLER STATE. 63

Table 34. Write State Machine Current/Next, sheet 1 of 2.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Table 35. Write State Machine Current/Next, sheet 2 of 2.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Table 36. Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65

5/66

M36W432TG, M36W432BG

SUMMARY DESCRIPTION

The M36W432TG is a low voltage Multiple Memo­ry Product which combines two me mory devices;
a 32 Mbit boot block F lash memory and a 4 Mbit
SRAM. Recommended operating conditions do
not allow both the Flash an d S RA M d ev ices to be
active at the same time.

The memory is offered in a Stacked LFBGA66
(12x8mm, 8x8 active ball array, 0.8 mm pitch)
package and is supplied with all the bits erased
(set to ‘1’).

Table 1. Signal Names

A0-A17

A18-A20 Address Inputs for Flash Chip only
DQ0-DQ15 Data Input/Output
V

DDF

V

DDQF

Address Inputs common to the Flash
and SRAM chips

Flash Power Supply
Flash Power Supply for I/O Buffers

Figure 2. Logi c D iagram

V

DDQF

V

M36W432TG
M36W432BG

A0-A20

E
G

W

RP

WP

E1
E2

G

W

UB

LB

V

DDF

21

F
F
F
F
F

S
S
S
S
S
S

PPF

V

DDS

16

DQ0-DQ15

V

V
V
V

PPF

SSF

DDS

SSS

Flash Optional Supply V oltage for Fast
Program & Erase

Flash Ground
SRAM Power Supply
SRAM Ground

NC Not Connected Internally

Flash control functions

E

F

G
W
RP
WP

F

F

F

F

Chip Enable input
Output Enable input
Write Enable input
Reset input
Write Protect input

SRAM control functions

E1
G
W

, E2

S

S

S

S

Chip Enable inputs
Output Enable input
Write Enable input

6/66

V

SSF

V

SSS

AI07925

UB
LB

S

S

Upper Byte Enable input
Lower Byte Enable input

Figure 3. LFBGA Connections (Top view through package)

#4#387

NCNC

M36W432TG, M36W432BG

AI90162

NC

NCNCGF

654321#2#1

DDQF

V

SSF

V

A12

A13A11A20NCNC

A15 A14

DQ7

DQ14

WS

DQ15A9A16

A8 A10

DQ5

DQ4

DQ6DQ13NCWF

DDF

V

DDS

V

E2SDQ12V

RPF

SSS

DQ3DQ2

DQ10

DQ11A19WPF

PPF

V

DQ1DQ0

DQ8DQ9GSLBS

UBS

E1SA1

A2A3A6A7A18

A17

SSF

EFA0A4NCNC

A5

NC V

A

B

C

D

E

F

G

H

7/66

M36W432TG, M36W432BG

SIGNAL DESCRIPTION

See Figure 2 Logic Diagram and T able 1,Signal
Names, for a brief overview of the signals connect­ed to this de vice.

Address Inputs (A0-A17). Addresses A0-A17
are common inputs for the Flash an d the SRAM
components. The Address Inputs select the cells
in the memory array to access during Bu s Read
operations. During Bus Write operations they con­trol the commands sent to the Command Interface
of the internal state machine. The Flash memory is
accessed through the Chip Enable (
Enable (W

) signals, while the SRAM is accessed

F

through two Chip Enable signals (E1
and the Write Enable signal (W

Address Inputs (A18-A20). Addresses A18-A20
are inputs for the Flash component only. The
Flash memory is acc essed through the Chip E n­able (E

) and Write Enable (WF) signals

F

Data Input/Output (DQ0-DQ15). The Data I/O
outputs the data stored at the selected address
during a Bus Read operation or inputs a command
or the data to be programmed durin g a Write Bus
operation.

Flash Chip Enable (E

). The Chip Enable input

F

activates the memory control logic, input buffers,
decoders and sense amplifiers. When Chip En­able is at V

andReset is at VIH the device is in ac-

IL

tive mode. When Chip Enable is at V
memory is deselected, the outputs are high imped­ance and the power consumption is reduced to the
stand-b y l e v el.

Flash Output Enable (G

). The Output Enable

F

controls data outputs during the Bus Read opera­ti on of the memo ry.

W

Flash Write Enable (

). The Write Enable

F

controls the Bus Write operation of the Flash
memory’s Command Inte rface. The data and ad­dress inputs are latched on the rising edge of Chip
Enable, E

, or Write Enable, WF, whichever oc-

F

curs first.

Flash Write Protect (WP

). Write Protect is an

F

input that gives an additional hardware protection
for each block. When Write Protect is at V
Lock-Down is enabled and the protection status of
the block cannot be changed. When Write Protect
is at V

, the Lock-Down is disabled and the block

IH

can be locked or unlocked. (refer to T able 6, Read
Protection Register and Protection Register Lock).

Flash Reset (RP

). The Reset input provides a

F

hardware reset of the Flash memory. When Reset
is at V

, the memory is in reset mode: the outputs

IL

are high impedance and the current c onsumption
is minimized. After Reset all blocks are in the
Locked state. When Reset is at V
in normal operation. Exiting reset mode the device
enters read array mode, but a negative t ransition

E

) and Write

F

S

).

S

, the device is

IH

and E2S)

the

IH

, the

IL

of Chip Enable or a change of the address is re­quired to ensure valid data outputs.

SRAM Chip Enable (E1

, E2S). The Chip En-

S

able inputs activate the SRAM memory control
logic, input buffers and decoders. E1
E2

at VIL deselects the memory and reduces the

S

power consumption to t he standby level. E 1

can also be used to control writing to the

E2

S

SRAM memory array, while W
is not allowed to set E
at V

at the same time.

IH

SRAM Write Enable (W

at V

F

S

rema in s at V

S

E1S at VIL and E2

IL,

). The Write Enable in-

at VIH or

S

and

S

IL.

It

put controls writing to the SRA M memory array.

is active low .

W

S

SRAM Output E nable (G

). The Output Enable

S

gates the outputs through the data buffers during
a read operation of the SRAM m emory. G

is ac-

S

tive low.

SRAM Upper Byte Enable (UB

). The Upper

S

Byte Enable enables the upper bytes for SRAM
(DQ8-DQ15). UB

SRAM Lower Byte Enable (LB

is acti v e low.

S

). The Lower

S

Byte Enable enables the lower bytes for SRAM
(DQ0-DQ7). LB

Supply Voltage (2.7V to 3.3V). V

V

DDF

is active low.

S

DDF

pro­vides the power supply to the internal core of the
Flash Memory device. It is the main power s upply
for all operations (Read, Program and Erase).

and V

V

DDQF

provides the power supply for the Flash

V

DDQF

memory I/O pins and V

Supply Voltage (2.7V to 3.3V).

DDS

provides the power

DDS

supply for the SRAM control pins . This allows all
Outputs to be powered independently of the Flash
core power supply, V

.

V

DDS

Program Supp ly Vol tage. V

V

PPF

DDF

. V

can be tied to

DDQF

PPF

is both a
control input and a power suppl y pin for t he F lash
memory. The two functions are selected by the
voltage range applied to the pin. The Supply Volt­age V

and the Program Supply Vol tage V

DDF

PPF

can be applied in any order.
If V

V
age lower than V
against program or erase, while V

is kept in a low voltage range (0V t o 3.6V)

PPF

is seen as a control input. In this case a volt-

PPF

gives an absolute protection

PPLK

PPF

> V

PP1

en­ables these functions (see Table 6, DC Character­istics for the relevant values). V

is only

PPF

sampled at the beginning of a program or erase; a
change in its value after the operation has started
does not have any effect on Program or Erase,
however for Double or Q uadruple Word Program
the results are uncertain.

If V
power supply pin. In this condition V

is in the range 11.4V to 12.6V it acts as a

PPF

PPF

must be

S

8/66

M36W432TG, M36W432BG

stable until the Program/Erase algorithm i s com­pleted (see Table 20 and 21).

V

SSF

and V

Ground. V

SSS

SSF

and V

SSS

are the
ground references for all voltage measurements in
the Flash and SRAM chips, respectively.

Note: Each device in a system should have V

DF

, V

DDQF

and V

decoupled with a 0.1µF ca-

PPF

D-

pacitor close to the pin. See Figure 9, AC
Measurement Load Circuit. The PCB trace
widths should be sufficient to carry the re­quired V

program and erase currents.

PPF

9/66

M36W432TG, M36W432BG

FUNCTIONAL DESCRIPTION

The Flash and SRAM components have separate
power supplies and grounds and are distinguished
by three chip enable inputs: E
ory and, E1

and E2S for the SRAM.

S

Recommended operating conditions do not allow
both the Flash and the SRAM to be in active mode
at the same time. The most common example is

Figure 4. Func ti onal Block Di a gram

for the Flash mem-

F

simultaneous read operations on the Flash and
the SRAM which would resul t in a data bus con­tention. Therefore it is recommended to put the
SRAM in the h igh impedance state whe n reading
the Flash and vice versa (see Table 2 Main Oper­ation Modes for details).

E

G

W

RP

WP

A18-A20

A0-A17

E1
E2

G

W

UB

LB

V

DDF

F
F
F
F
F

V

DDS

S
S
S
S
S
S

V

DDQF

Flash Memory

32 Mbit (x16)

SRAM

4 Mbit (x16)

V

V

PPF

SSF

DQ0-DQ15

10/66

V

SSS

AI07926

Table 2. Main Operation Modes

Operation

Mode

Read

Write

Block
Locking

Standby

Flash Memory

Reset X X X
Output

Disable

E

FGFWF

V

ILVILVIHVIH

V

ILVIHVILVIH

V

XX

IL

V

XX

IH

V

ILVIHVIHVIH

Read Flash must be disabled
Read Flash must be disabled
Read Flash must be disabled
Write Flash must be disabled
Write Flash must be disabled
Write Flash must be disabled
Standby/

Power
Down

SRAM

Data
Retention

Output
Disable

Output
Disable

Output
Disable

Note: 1. X = Don’t Care = VIL or VIH, V

2. If UBS

and LBS are tied t ogether the bus is at 16 bit. Fo r an 8 bit bus conf i guration use UBS and LBS separately.

Any Flash mode is allowable

Any Flash mode is allowable

Any Flash mode is allowable

Any Flash mode is allowable

Any Flash mode is allowable

RPFWP

V

IH

V

IH

V

IL

PPFH

M36W432TG, M36W432BG

V

F

X Don’t care SRAM must be disabled Data Output

V

X

V

DDF

V

PPFH

Don’t care SRAM must be disabled X

IL

X Don’t care Any SRAM mode is allowed Hi-Z
X Don’t care Any SRAM mode is allowed Hi-Z

X Don’t care Any SRAM mode is allowed Hi-Z

= 12V ± 5%.

E1SE2SGSWSUBSLB

PPF

or

SRAM must be disabled Data Input

V

ILVIHVILVIHVIL

V

ILVIHVILVIHVIL

V

ILVIHVILVIHVIH

V

ILVIH

V

ILVIH

V

ILVIH

V

IHVIL

X
X
X
X X X X Hi-Z

XXXX

V

IHVIL

X X X X Hi-Z

XXXX

V

ILVIHVIHVIHVIL

V

ILVIHVIHVIHVIL

V

ILVIHVIHVIHVIH

V

ILVIL

V

ILVIH

V

ILVIL

V

IH

V

IH

DQ15-DQ8 DQ7-DQ0

S

V

Data out Word Read

IL

V

Data out Hi-Z

IH

V

IL

V

IL

V

IL

V

IH

V

IH

V

IH

V

IL

V

IH

V

IL

Hi-Z Data out

Data in Word Write

Data in Hi-Z

Hi-Z Data in

Hi-Z

Hi-Z

Hi-Z

Hi-Z

Hi-Z

11/66

M36W432TG, M36W432BG

MAXIMUM RATIN G

Stressing the device above the rating l isted in the
Absolute Maximum Ratings table m ay cause per­manent damage to the device. These are stress
ratings only and operation of the device at t hese or
any other conditions ab ove those i ndicated in t he
Operating sections of this specificat ion is not im-

Table 3. Absolute Maximum Ratings

Symbol Parameter

T

A

T

BIAS

T

STG

V

IO

V

, V

DDF

DDQF

V

PPF

V

DDS

Note: 1. Depends on range.

Ambient Operating Temperature
Temperature Under Bias –40 125 °C
Storage Temperature –55 150 °C
Input or Output Voltage –0.5
Flash Supply Voltage –0.6 3.8 V
Program Voltage –0.6 13 V
SRAM Supply Voltage –0.5 3.8 V

(1)

plied. Exposure to Absolute Maximum Rating con­ditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu­ments.

Value

Min Max

–40 85 °C

V

+0.3

DDQF

Unit

V

12/66

DC AND AC PARAMETERS

This section summarizes the operat ing and mea­surement conditions, and the DC and AC charac­teristics of the device. The parameters in the DC
and AC characteristics Tables that follow, are de­rived from tests performed under the Measure-

Table 4. Operating and AC Measurement Conditions

M36W432TG, M36W432BG

ment Conditions summarized in Table 4,
Operating and AC Measurem ent Conditions. De­signers should check that the operating conditions
in their circuit match the measurement conditions
when relying on the quoted parameters.

SRAM Flash Memory

Parameter

Min Max Min Max

V

Supply Voltage

DDF

V

DDQF = VDDS

Supply Voltage

– – 2.7 3.3 V

2.7 3.3 2.7 3.3 V
Ambient Operating Temperature – 40 85 – 40 85 °C
Load Capacitance (C

)

L

30 50 pF
Input Rise and Fall Times 1V/ns 5ns
Input Pulse Voltages
Input and Output Timing Ref. Voltages

Figure 5. AC Measurement I/O Waveform

V

DDQ

V

0V

AI90166

Note: V

DDQ

means V

DDQF

= V

DDS

DDQ

0 to V

DDQF

V

/2 V

DDQF

Figure 6. AC Me asureme nt Load Circuit

/2

V

DDQF

V

DDF

0 to V

DDQF

DEVICE

UNDER

TEST

DDQF

/2

V

DDQF

25kΩ

Units70 70/85

V
V

0.1µF

0.1µF

CL includes JIG capacitance

C

Table 5. Device Capacitance

Symbol Parameter Test Condition Typ Max Unit

V

C

IN

C

OUT

Note: Sampled o nl y, not 100% test ed.

Input Capacitance
Output Capacitance

= 0V, f=1 MHz

IN

V

= 0V, f=1 MHz

OUT

12 12 pF
20 15 pF

L

25kΩ

AI90167

13/66

M36W432TG, M36W432BG

Table 6. DC Characteristics

Symbol Parameter Device Test Condition Min Typ Max Unit

I

I

DDS

I

Input Leakage Current

LI

Output Leakage Current

LO

VDDStandby Current

Flash &

SRAM

Flash

SRAM

Flash

SRAM

0V≤ V

0V ≤V
0V≤V

SRAM Outputs Hi-Z

E

= V

F

RP

= V

F

E1

S

V

V

≥

IN

DDS

f = fmax (A0-A17 and DQ0-

DQ15 only)

f = 0 (G

V

IN

, WS, UBS and LBS)

S

E1

S

V

≥

DDS

V

≤

IN

DDQF

V

≤

OUT

V

≤

OUT

± 0.2V

DDQF

± 0.2V

DDQF

V

≥

– 0.2V

DDS

– 0.2V or V

V

≥

– 0.2V

DDS

– 0.2V or V

f = 0

DDQF

DDQF,

IN

IN

≤

≤

0.2V

0.2V,

±1 µA

±10 µA

±1 µA

15 50 µA

715µA

715µA

I

DDD

I

DD

I

DDR

I

DDW

I

DDE

I

DDWES

I

PPS

I

PPR

I

PPW

I

PPE

Supply Current (Reset) Flash

Supply Current SRAM

Supply Current (Read) Flash

Supply Current (Program)

Flash

Supply Current (Erase) Flash

Supply Current

(Program/Erase Suspend)

Program Current

(Read or Standby)

Flash

Flash

Program Current (Reset) Flash

Program Current
(Program)

Flash

Program Current (Erase) Flash

RP

= V

F

SSF

f = fmax = 1/

0.2V, I

V

≤

IN

f = 1MHz,

0.2V, I

≤

V

IN

E

= VIL, G

F

=

F

Program in progress

= 12V ± 5%

V

PPF

Program in progress

= V

V

PPF

Erase in progress

= 12V ± 5%

V

PPF

Erase in progress

= V

V

PPF

EF = V

DDQF

Erase suspended

≤

V

PPF

V

> V

PPF

RP

= V

F

SSF

Program in progress

= 12V ± 5%

V

PPF

Program in progress

= V

V

PPF

Erase in progress
V

= 12V ± 5%

PPF

Erase in progress

= V

V

PPF

± 0.2V

OUT

OUT

V

IH,

DDF

DDF

± 0.2V,

V

DDF

DDF

± 0.2V

DDF

DDF

,

AVAV

= 0 mA

= 0 mA

f = 5MHz

15 50 µA

5.5 12 mA

1.5 3 mA

918mA

510mA

10 20 mA

520mA

10 20 mA

15 50 µA

15µA

400 µA

15µA

110mA

15µA

310mA

15µA

14/66

M36W432TG, M36W432BG

Symbol Parameter Device Test Condition Min Typ Max Unit

V

V

V

V

V

V

V

IL

V

IH

OL

OH

PPL

PPH

PPLK

LKO

Input Low Voltage

Input High Voltage

Output Low Voltage

Output High Voltage

Program Voltage
(Program or Erase
operations)

Program Voltage
(Program or Erase
operations)

Program Voltage
(Program and Erase lock­out)

V

Supply Voltage

DDF

(Program and Erase lock­out)

Flash &

SRAM

Flash &

SRAM

Flash and

SRAM

Flash &

SRAM

V

DDQF

V

DDQF

V

DDQF

V

DDQF

= V

I

= V

I

OH

= V

= V

OL

DDS

= 100µA

DDS

= –100µA

Flash 1.65 3.6 V

Flash 11.4 12.6 V

Flash 1 V

Flash 2 V

≥

DDS

≥

DDS

= VDDmin

= VDDmin

2.7V

2.7V

–0.3 0.8 V

V

0.7

DDQF

V

DDQF

+0.3

0.1 V

V

DDQF

–0.1

V

V

15/66

M36W432TG, M36W432BG

PACKAGE MECHANICAL

Figure 7. Stacked LFBGA66 12x8mm, 8x8 ball array, 0.8mm pitch, Bottom View Package Outline

D
D2
D1

E

E1

BALL "A1"

Note: Drawing is not to scale.

SE

A

FDFE

SD

e

b

e

ddd

A2

A1

BGA-Z12

Table 7. Stacked LFBGA66 12x8mm , 8x8 ball array, 0.8mm pitch, Package M echan ical Data

Symbol

A 1.400 0.0551
A1 0.300 0.0118
A2 1.100 0.0433

b 0.400 0.300 0.500 0.0157 0.0118 0.0197

D 12.000 – – 0.47 24 – –

D1 5.600 – – 0.2205 – –
D2 8.800 – – 0.3465 – –

ddd 0.100 0.0039

E 8.000 – – 0.3150 – –

E1 5.600 – – 0.2205 – –

e 0.800 – – 0.0315 – –

FD 1.600 – – 0.0630 – –
FE 1.200 – – 0.0472 – –

SD 0.400 – – 0.0157 – –

SE 0.400 – – 0.0157 – –

Typ Min Ma x Typ Min Max

millimeters inches

16/66

M36W432TG, M36W432BG

Figure 8. Stacked LFBGA66 Daisy Chain - Package Connections (Top view through package)

AI90172

#4#3

8761

5

4

32#1 #2

A

B

C

D

E

F

G

H

17/66

M36W432TG, M36W432BG

Figure 9. Stacked LFBGA66 Daisy Chain - PCB Connections proposal (Top view through package)

#4#3

AI90173

END

POINT

POINT

START

87615

4

32#2

18/66

#1

A

B

C

D

E

F

G

H

M36W432TG, M36W432BG

PART NUMBERING
Table 8. Ordering Information Scheme

Example: M36 W 4 32T G 70 ZA 6 T

Device Type

M36 = MMP (Flash + SRAM)

Operating Voltage

W = V

SRAM Chip Size & Organization

4 = 4 Mbit (256Kb x 16)

Flash Device Size & Organization

32 = 32 Mbit (x16), Boot Block, Flash memory

Array Matrix

T = Top Boot
B = Bottom Boot

SRAM Device

G = 4Mb, 0.16µm, 70ns, 3V

= 2.7V to 3.3V, V

DDF

DDS

= V

= 2.7V to 3.3V

DDQF

Speed

70 = 70ns
85 = 85ns

Package

ZA = LFBGA66: 12 x 8mm, 0.8mm pitch

Temperature Range

1 = 0 to 70°C
6 = –40 to 85°C

Option

T = Tape & Reel packing

Devices are shipped from the factory with the memory content bits erased to ’1’.

Table 9. Daisy Chain Ordering Scheme

Example: M36W432TG -ZA T

Device Type

M36W432TG

Daisy Chain

-ZA = LFBGA66: 12 x 8mm, 0.8mm pitch

Option

T = Tape & Reel Packing

For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device,
please contact the STMicroelectronics Sales Office nearest to you.

19/66

M36W432TG, M36W432BG

FLASH DEVICE

The M36W432TG contains one 32 Mbit Flash
memory. This section describes how to use the

FLASH SUMMARY DESCRIPTION

The Flash Memory is a 32 Mbit (2 Mbit x 16) device
that can be erased electrically at block level and
programmed in-system on a Word-by-Word basis.
These operations can be performed using a single
low voltage (2.7 to 3.6V) supply. V
drive the I/O pin down to 1.65V. An optional 12V

power supply is provided to speed up cus-

V

PPF

tomer programming.
The device features an asymmetrical blocked ar-

chitecture with an array of 71 blocks: 8 Parameter
Blocks of 4 KWords and 63 Main Blocks of 32
KWords. The M36W432TG has the Parameter
Blocks at the top of the memory address space
while the M36W432BG locates the Parameter
Blocks starting from the bottom. The memory
maps are shown in Figure 10, Block Addresses.

The Flash Memory features an instant, individual
block locking scheme that allows any block to be
locked or unlocked with no latency, enabling in­stant code and data protection. All blocks have
three levels of protection. They can be locked and
locked-down individually preventing any acciden­tal programming or erasure. There is an additional
hardware protection against program and erase.
When V

PPF

≤ V

all blocks are protected

PPLK

DDQF

allows to

Flash device and all signals refer to the Flash de­vice .

against program or erase. All blocks are locked at
Power Up.

Each block can be erased separately. Erase can
be suspended in order to perform either read or
program in any other block and then resumed.
Program can be suspended to read data in any
other block and then resumed. Each block can be
programmed and erased over 100,000 cycles.

The device includes a Protection Register to in­crease the p rotecti on of a syst em desi gn. The Pro­tection Register is divided into t wo se gments, the
first is a 64 bit area which contains a unique device
number written by ST, while the second is a 128 bit
area, one-time-programmable by the user. The
user programmable segment can be permanent ly
protected. Figure 11, shows the Protection Regis­ter Memo ry Map.

Program and Erase command s are written to the
Command Interface of the memory. An on-chip
Program/Erase Controller takes care of the tim­ings necessary for program and erase operations.
The end of a program or erase operation can be
detected and any error conditions identified. The
command set required to control the memory is
consistent with JEDEC standards.

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