SGS Thomson Microelectronics M29W400B, M29W400T Datasheet

4 Mbit (512Kb x8 or 256Kb x16, Boot Block)

Low Voltage Single Supply Flash Memory

M29W400Tand M29W400Bare replaced respectivelyby theM29W400BT and M29W400BB

2.7Vto 3.6V SUPPLYVOLTAGE for PROGRAM,ERASE and READ OPERATIONS

FASTACCESSTIME:90ns FASTPROGRAMMINGTIME –10µs by Byte /16µs by Word typical PROGRAM/ERASECONTROLLER(P/E.C.) – Program Byte-by-Byte or Word-by-Word – Status Register bits andReady/BusyOutput MEMORYBLOCKS – Boot Block(Top or Bottom location) – Parameter and Main blocks BLOCK,MULTI-BLOCK and CHIP ERASE MULTI BLOCKPROTECTION/TEMPORARY

UNPROTECTION MODES ERASESUSPENDand RESUME MODES – Read and Programanother Block during

EraseSuspend LOWPOWER CONSUMPTION – Stand-by and AutomaticStand-by 100,000PROGRAM/ERASECYCLES per

BLOCK 20YEARSDATARETENTION – Defectivity below 1ppm/year ELECTRONICSIGNATURE – ManufacturerCode: 0020h – Device Code, M29W400T:00EEh – Device Code, M29W400B: 00EFh

DESCRIPTION

The M29W400 is a non-volatilememory that may be erasedelectricallyat theblock or chipleveland programmedin-systemon a Byte-by-ByteorWordby-Wordbasisusing onlya single2.7Vto3.6V V supply. For Program and Erase operations the necessary high voltages are generated internally. The device can also be programmed in standard programmers.

The arraymatrixorganisationallowseach block to be erased and reprogrammed without affecting other blocks. Blockscan be protectedagainstprograming and erase on programming equipment,

12 x 20 mm

BGA

FBGA48 (ZA)

8 x 6 solder balls

Figure 1. LogicDiagram

A0-A17

M29W400T M29W400B

M29W400T

M29W400B

NOT FOR NEW DESIGN

SO44 (M)TSOP48 (N)

DQ0-DQ14

DQ15A–1 BYTE RB

AI02065

November 1999 1/34

This isinformationona product stillin productionbut not recommendedfor newdesigns.

M29W400T, M29W400B

Figure 2A. TSOP Pin Connections

A15

1 A14 A13 A12 A11 A10 DQ14

A8 NC NC

RP NC NC

RB NC

A17

A7 A6 A5 A4 A3 A2 A1

M29W400T

M29W400B

(Normal)

24 25

37 36

AI02066

A16 BYTE V

DQ15A–1 DQ7

DQ6 DQ13 DQ5 DQ12 DQ4 V

DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 G V

E A0

Figure 2B. TSOP ReversePin Connections

A16

BYTE

DQ15A–1

DQ7

DQ14

DQ6

DQ13

DQ5

DQ12

DQ4 V

DQ11

DQ3

DQ10

DQ2 DQ9 DQ1 DQ8 DQ0

M29W400T

M29W400B

(Reverse)

24 25

AI02067

37 36

A15 A14 A13 A12 A11 A10 A9 A8 NC NC W RP NC NC RB NC A17 A7 A6 A5 A4 A3 A2 A1

Warning: NC = Not Connected. Warning: NC = Not Connected.

Figure 2C. SO Pin Connections

Table1. Signal Names

A0-A17 Address Inputs

NC RP

1 2 3

A17 A8

4 5

A5 A4

M29W400T M29W400B

12 13 14 15 16 17DQ1 18 19 20 21

DQ0 DQ8

DQ9

DQ10

DQ3

DQ11

44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 2322

AI02068

WRB

A9 A10 A11 A12 A13 A14 A15 A16 BYTE V

DQ15A–1 DQ7 DQ14 DQ6 DQ13 DQ5DQ2 DQ12 DQ4 V

DQ0-DQ7 Data Input/Outputs,Command Inputs DQ8-DQ14 Data Input/Outputs DQ15A–1 Data Input/Outputor Address Input E Chip Enable G Output Enable W Write Enable RP Reset /Block TemporaryUnprotect RB Ready/Busy Output BYTE Byte/Word Organisation V

Supply Voltage Ground

Warning: NC = Not Connected.

2/34

Figure 2D. FBGA Package Ball Out (Top View)

M29W400T, M29W400B

87654321

A4A3

Warning: NC = Not Connected.

Table2. AbsoluteMaximumRatings

A15A14A12A13

A11 DQ7

A2 V

(1)

A16

DQ2

BYTE

DQ12DQ5NCNCRPW

DQ15

A–1

GEA0

DQ6DQ13DQ14A10A8A9

DQ4V

DQ3DQ11DQ10NCNCRB

DQ1DQ9DQ8DQ0A6A17A7

AI00912

Symbol Parameter Value Unit

BIAS

STG

(2)

(A9, E, G, RP)

Notes: 1. Except for the rating ”Operating TemperatureRange”, stresses above those listedin theTable ”Absolute Maximum Ratings”

may cause permanent damage to the device. These are stress ratings only and operationof the device atthese or any other conditions above those indicated in the Operating sections of this specification is notimplied. Exposure to AbsoluteMaximum Rating conditions for extended periods may affect device reliability. Referalso to the STMicroelectronics SURE Program and other relevant qualitydocuments.

2. Minimum Voltagemay undershootto–2V duringtransition and for less than 20ns.

3. Depends on range.

Ambient Operating Temperature TemperatureUnder Bias –50 to125 °C Storage Temperature –65 to150 °C Input or OutputVoltages –0.6 to 5 V Supply Voltage –0.6 to 5 V

(2)

A9, E, G, RP Voltage –0.6to 13.5 V

DESCRIPTION(Cont’d) and temporarily unprotected to make changes in

the application. Each block can be programmed and erasedover 100,000 cycles.

Instructions for Read/Reset,Auto Selectfor reading the Electronic Signature or Block Protection

(3)

–40 to85 °C

Suspend and Resumeare writtento the devicein cyclesofcommandstoa CommandInterfaceusing standardmicroprocessor write timings.

The device is offered in TSOP48 (12 x 20mm), SO44 and FBGA48 (8 x 6 balls, 0.8mm pitch) packages. Both normal and reverse pinouts are availablefor the TSOP48 package.

status,Programming,BlockandChipErase,Erase

3/34

M29W400T, M29W400B

Figure 3. MemoryMap and Block Address Table(x8)

7FFFFh 7C000h

7BFFFh

7A000h

79FFFh

78000h

77FFFh

70000h

6FFFFh

60000h

5FFFFh

50000h

4FFFFh

40000h

3FFFFh

30000h

2FFFFh

20000h

1FFFFh

10000h

0FFFFh

00000h

M29W400T

16K BOOT BLOCK

8K PARAMETER BLOCK

32K MAIN BLOCK

64K MAIN BLOCK

7FFFFh

70000h

6FFFFh

60000h

5FFFFh

50000h

4FFFFh

40000h

3FFFFh

30000h

2FFFFh

20000h

1FFFFh

10000h

0FFFFh

08000h

07FFFh

06000h

05FFFh

04000h

03FFFh

00000h

M29W400B

64K MAIN BLOCK

32K MAIN BLOCK

8K PARAMETER BLOCK

16K BOOT BLOCK

AI02090

Organisation

The M29W400 is organised as 512K x8 or 256K x16 bits selectable by the BYTE signal. When BYTE is Low the Byte-wide x8 organisation is selected and the address lines are DQ15A–1 and A0-A17. The Data Input/Output signal DQ15A–1 actsasaddresslineA–1 whichselectstheloweror upper Byte of the memory word for output on DQ0-DQ7,DQ8-DQ14remainat High impedance. When BYTEis Highthe memory usestheaddress inputs A0-A17 and the Data Input/Outputs DQ0DQ15.Memorycontrol is provided by ChipEnable E, Output Enable G andWrite Enable W inputs.

AReset/BlockTemporaryUnprotection RPtri-level input providesa hardware reset when pulled Low, andwhenheld High(atV

) temporarily unprotects

blocks previously protected allowing them to be programedanderased.Erase andProgramoperations are controlled by an internal Program/Erase Controller(P/E.C.).StatusRegisterdataoutput on DQ7 providesa DataPolling signal,and DQ6and DQ2 provideTogglesignalstoindicatethe state of the P/E.C operations. A Ready/Busy RB output indicatesthe completion of the internalalgorithms.

4/34

MemoryBlocks

The devices featureasymmetrically blockedarchitectureprovidingsystem memoryintegration.Both M29W400Tand M29W400Bdeviceshaveanarray of 11 blocks, one Boot Block of 16 KBytes or 8 KWords, two Parameter Blocks of 8 KBytes or 4 KWords, one Main Block of 32 KBytes or 16 KWordsand sevenMainBlocksof64KBytesor32 KWords.TheM29W400Thasthe BootBlockatthe top of the memory ad dress spa ce and the M29W400B locates the Boot Block startingat the bottom. The memory maps are showed in Figure

3. Each block can beerased separately,any combination of blocks can be specifiedfor multi-block eraseor the entirechip may be erased. The Erase operations are managed automatically by the P/E.C. The block erase operation can be suspended in order to read from or program to any blocknot beingersased, and then resumed.

Block protection provides additional data security. Each block can be separatelyprotected or unprotected against Program or Eraseon programming equipment. All previously protected blocks can be temporarilyunprotected in theapplication.

M29W400T, M29W400B

Table3A. M29W400TBlock Address Table

Address Range (x8) Address Range(x16) A17 A16 A15 A14 A13 A12

00000h-0FFFFh 00000h-07FFFh 0 0 0 X X X 10000h-1FFFFh 08000h-0FFFFh 0 0 1 X X X 20000h-2FFFFh 10000h-17FFFh 0 1 0 X X X 30000h-3FFFFh 18000h-1FFFFh 0 1 1 X X X 40000h-4FFFFh 20000h-27FFFh 1 0 0 X X X 50000h-5FFFFh 28000h-2FFFFh 1 0 1 X X X 60000h-6FFFFh 30000h-37FFFh 1 1 0 X X X

70000h-77FFFh 38000h-3BFFFh 1110XX

78000h-79FFFh 3C000h-3CFFFh 111100 7A000h-7BFFFh 3D000h-3DFFFh 111101 7C000h-7FFFFh 3E000h-3FFFFh 11111X

Table3B. M29W400BBlock AddressTable

Address Range (x8) Address Range(x16) A17 A16 A15 A14 A13 A12

00000h-03FFFh 00000h-01FFFh 00000X

04000h-05FFFh 02000h-02FFFh 000010

06000h-07FFFh 03000h-03FFFh 000011

08000h-0FFFFh 04000h-07FFFh 0001XX 10000h-1FFFFh 08000h-0FFFFh 0 0 1 X X X 20000h-2FFFFh 10000h-17FFFh 0 1 0 X X X 30000h-3FFFFh 18000h-1FFFFh 0 1 1 X X X 40000h-4FFFFh 20000h-27FFFh 1 0 0 X X X 50000h-5FFFFh 28000h-2FFFFh 1 0 1 X X X 60000h-6FFFFh 30000h-37FFFh 1 1 0 X X X 70000h-7FFFFh 38000h-3FFFFh 1 1 1 X X X

Bus Operations

The following operations can be performed using the appropriatebuscycles:Read (Array, Electronic Signature, Block Protection Status), Write com-

mand,Output Disable, Standby,Reset, BlockProtection, Unprotection, Protection Verify, Unprotection VerifyandBlockTemporaryUnprotection.See Tables4 and 5.

5/34

M29W400T, M29W400B

Command Interface

Instructions,made up of commandswritten in cycles, canbe giventotheProgram/EraseController through a Command Interface (C.I.). For added data protection,program or eraseexecutionstarts after4or6cycles.Thefirst,second,fourthandfifth cycles are used to input Coded cycles to the C.I. This Coded sequence is the same for all Program/Erase Controller instructions. The ’Command’itself and its confirmation,when applicable, are givenon the third,fourth or sixth cycles. Any incorrectcommand orany improper command sequence will reset the device to ReadArray mode.

Instructions

Seven instructions are defined to perform Read Array,AutoSelect(toreadtheElectronicSignature or BlockProtectionStatus),Program, BlockErase, Chip Erase, Erase Suspend and Erase Resume. The internal P/E.C. automaticallyhandles all timing and verification of the Program and Erase operations.The Status RegisterData Polling,Toggle, Error bits and the RB output may be read at any time, duringprogrammingor erase,tomonitor the progress of the operation.

Instructionsare composed of upto sixcycles. The first two cycles input a Coded sequence to the CommandInterfacewhichis commontoallinstructions (see Table 8). The third cycle inputs the instruction set-up command. Subsequent cycles output theaddressed data,ElectronicSignatureor Block Protection Status for Read operations. In ordertogiveadditionaldataprotection,the instructions for Program and Block or Chip Erase require furthercommandinputs.ForaPrograminstruction, the fourth command cycle inputs the address and data to be programmed. For an Erase instruction (Block or Chip), the fourth and fifth cycles input a further Coded sequence before the Eraseconfirm commandon thesixthcycle. Erasureof a memory blockmaybe suspended,in ordertoreaddatafrom another block or to programdata in another block, and thenresumed.

When power is first applied or if V

, the command interface is reset to Read

LKO

falls below

Array.

SIGNALDESCRIPTIONS

See Figure 1 andTable1. AddressInputs (A0-A17). The addressinputs for

the memoryarrayare latchedduringawriteoperation on the falling edge of Chip Enable E or Write Enable W. InWord-wide organisationthe address lines are A0-A17, in Byte-wide organisation DQ15A–1acts as an additional LSB addressline. WhenA9 is raised to V

, either a ReadElectronic

Signature Manufacturer or Device Code, Block Protection Status or a Write Block Protection or Block Unprotection is enabled depending on the combinationoflevelson A0,A1, A6, A12 andA15.

Data Input/Outputs (DQ0-DQ7). These Inputs/Outputsare used in the Byte-wideand Wordwide organisations. The input is data to be programmed in the memory array or a command to be written to the C.I. Both are latched on the rising edge of Chip Enable E or Write Enable W. The output is data from the Memory Array, the Electronic Signature Manufacturer or Device codes, the Block Protection Status or the Status registerData Pollingbit DQ7,the Toggle Bits DQ6 and DQ2, the Errorbit DQ5or the EraseTimer bit DQ3. Outputs are valid when Chip Enable E and Output Enable G are active. The output is high impedance when the chip is deselected or the outputsaredisabledandwhen RPisat aLowlevel.

Data Input/Outputs (DQ8-DQ14 and DQ15A–1).

These Inputs/Outputsare additionallyused in the Word-wideorganisation.WhenBYTEisHighDQ8DQ14 and DQ15A–1 act as the MSB of the Data Inputor Output, functioningas describedfor DQ0DQ7 above, and DQ8-DQ15 are ’don’t care’ for commandinputsor status outputs.When BYTEis Low,DQ8-DQ14are highimpedance,DQ15A–1is the AddressA–1 input.

Chip Enable (E). The Chip Enableinput activates the memory control logic, input buffers, decoders andsenseamplifiers.EHighdeselectsthememory andreducesthepowerconsumptiontothestandby level. E can also be used to controlwriting to the commandregister and to thememory array, while Wremainsata lowlevel.TheChipEnablemust be forcedto V

duringthe BlockUnprotectionopera-

tion.

6/34

M29W400T, M29W400B

Output Enable (G). The Output Enable gates the

outputs through the data buffers during a read operation. When G is High the outputs are High impedance. G must be forced to V

level during

Block Protection andUnprotectionoperations. WriteEnable(W). Thisinput controlswriting tothe

CommandRegisterandAddressandDatalatches. Byte/Word Organization Select (BYTE). The

BYTEinputselects theoutput configurationforthe device: Byte-wide (x8) mode or Word-wide (x16) mode. When BYTEis Low,the Byte-widemode is selectedand the data is read and programmedon DQ0-DQ7. In this mode, DQ8-DQ14 are at high impedance and DQ15A–1 is the LSB address. When BYTE is High, the Word-wide mode is selected and the data is read and programmed on DQ0-DQ15.

Ready/Busy Output (RB). Ready/Busy is an open-drainoutputandgivestheinternalstateofthe P/E.C. of the device. When RB is Low, the device is Busy with a Programor Erase operation and it will not accept any additional program or erase instructionsexcept the Erase Suspendinstruction. WhenRB isHigh,thedeviceisreadyforanyRead, Program or Erase operation. The RB will also be High when the memoryis putin EraseSuspendor Standby modes.

Reset/Block Temporary Unprotect Input (RP).

The RP Input provides hardware reset and protected block(s) temporary unprotection functions. Reset of the memory is acheivedby pulling RPto

for atleastt

.When thereset pulseis given,

PLPX

if the memory is in Read or Standby modes, it will be available for new operations in t

PHEL

after the rising edgeofRP.Ifthememoryis in Erase,Erase Suspend or Program modes the reset will take

duringwhichtheRB signal will beheldatVIL.

PLYH

The end of the memory reset will be indicated by the rising edge of RB. Ahardwareresetduring an Erase or Program operation will corrupt the data being programmed or the sector(s) being erased (see Table14 andFigure9).

Temporary block unprotectionis made by holding RP at V

. In this condition previously protected

blocks can be programmedor erased.The transitionof RPfromV When RP is returned from V

toVIDmustslower thant

to VIHall blocks

PHPHH

temporarily unprotected will be again protected. See Table15 andFigure9.

Supply Voltage. The power supply for all

operations (Read,Programand Erase).

Ground. VSSis the reference for all voltage

measurements.

DEVICEOPERATIONS

See Tables 4, 5and 6. Read. Read operations are used to output the

contents of the MemoryArray, the ElectronicSignature,the StatusRegister orthe BlockProtection Status. Both Chip Enable E and Output Enable G must be low in order to read the output of the memory.

Write.Writeoperationsareused togiveInstruction Commandsto thememory orto latchinputdatato beprogrammed.Awriteoperationis initiatedwhen Chip Enable E is Lowand Write Enable W is Low withOutput EnableGHigh.Addressesare latched onthefallingedgeof Wor E whicheveroccurslast. CommandsandInputDataarelatchedontherising edge of W orE whichever occursfirst.

OutputDisable. Thedata outputsare highimpedance whenthe OutputEnable G isHigh with Write EnableW High.

Standby. The memory is in standby when Chip EnableEis Highand theP/E.C. is idle.The power consumption is reduced to the standby level and the outputs are high impedance, independentof the Output Enable G or Write EnableWinputs.

Automatic Standby. After 150ns of bus inactivity and whenCMOSlevels are driving theaddresses, the chip automatically enters a pseudo-standby modewhere consumptionisreducedto the CMOS standbyvalue, whileoutputs still drivethe bus.

Electronic Signature. Two codes identifyingthe manufacturer andthedevicecanberead fromthe memory. The manufacturer’s code for STMicroelectronics is 20h, the device code is EEh for the M29W400T (Top Boot) and EFh for the M29W400B(BottomBoot).Thesecodesallowprogramming equipment or applications to automaticallymatch their interfaceto thecharacteristicsof the M29W400. The ElectronicSignature is output by a Read operationwhen the voltage applied to A9 is at V

and address inputs A1 is Low. The

manufacturer code is output when the Address input A0 is Low and the device code when this input is High. Other Address inputs are ignored. The codesare output on DQ0-DQ7.

TheElectronicSignaturecan also beread,without raisingA9toV

, by givingthe memorythe Instruc-

tion AS. If the Byte-wide configuration is selected thecodesareoutputon DQ0-DQ7withDQ8-DQ14 at High impedance; if the Word-wideconfiguration is selectedthe codes are outputon DQ0-DQ7with DQ8-DQ15at 00h.

7/34

M29W400T, M29W400B

Table4. User Bus Operations

(1)

Operation E G W RP BYTE A0 A1 A6 A9 A12 A15

Read Word V

Read Byte V

Write Word V

Write Byte V OutputDisable V

Standby V

ILVIL

ILVIH

XXVIHX X X X X X X Hi-Z Hi-Z Hi-Z

Reset X X X V Block

Protection Blocks

Unprotection Block

Protection Verify

Block Unprotection Verify

Block Temporary Unprotection

Notes: 1. X = V

(2,4)

(2,4) V

ILVIDVIL

VIDVIDVILPulse V

(4)

VILV

Pulse V

XX X V

orV

2. Block Address must be given on A12-A17 bits.

3. See Table 6.

A0 A1 A6 A9 A12 A15

A0 A1 A6 A9 A12 A15 Data Input Data Input

A0 A1 A6 A9 A12 A15

X X X X X X X Hi-Z Hi-Z Hi-Z

X X X X X X X Hi-Z Hi-Z Hi-Z XXXXVIDXX X X X

XXXXVIDVIHV

XVILVIHVILVIDA12 A15 X X

XVILVIHVIHVIDA12 A15 X X

X XXXXXX X X X

4. Operation performed on programming equipment.

DQ15

A–1

Data

Output

Address

Input

Address

Input

DQ8-

DQ14

Data

Output

Hi-Z

DQ0-DQ7

Data

Output

Data

Output

Data Input

XXX

Block

Protect

Status

Block

Protect

Status

(3)

Table5. Read Electronic Signature(following AS instruction or with A9 = VID)

Org. Code Device E G W BYTE A0 A1

Word-

wide

Manufact.

Code

Device

Code

Manufact.

Code

M29W400T V M29W400B V

VILV

VILVILDon’t Care 0 00h 20h

Byte-

wide

Device

M29W400T V

VILV

Code

M29W400B V

VILV

Other

Addresses

VILDon’t Care 0 00h EEh VILDon’t Care 0 00h EFh

VILDon’t Care

DQ15

A–1

Don’t

Care

Don’t

Care

Don’t

Care

Table6. Read Block Protectionwith AS Instruction

Code E G W A0 A1 A12-A17

Protected Block V Unprotected Block V

Block Address Don’t Care 01h Block Address Don’t Care 00h

Addresses

Other

DQ8-

DQ14

DQ0-

DQ7

Hi-Z 20h

Hi-Z EEh

Hi-Z EFh

DQ0-DQ7

8/34

M29W400T, M29W400B

Table7. Commands

Hex Code Command

00h Invalid/Reserved 10h Chip Erase Confirm 20h Reserved 30h Block Erase Resume/Confirm 80h Set-up Erase

90h

A0h Program B0h Erase Suspend F0h Read Array/Reset

Read Electronic Signature/ Block Protection Status

Block Protection. Each block can be separately protected against Program or Erase on programming equipment. Block protection provides additional data security, as it disables all program or eraseoperations.Thismodeis activatedwhenboth A9 and G are raised to V

and anaddress in the

block is applied on A12-A17.The Block Protection algorithmis showninFigure14. Blockprotectionis initiated on theedge of W falling to V a delayof 100µs, the edge ofW risingto V

. Then after

ends the protectionoperations.Block protectionverifyis achievedby bringingG, E, A0andA6to V toV

, whileW is at VIHandA9 atVID. Underthese

andA1

conditions,reading thedata output will yield 01h if the block defined by the inputs on A12-A17 is protected.Any attempt to program or erase aprotected block will be ignoredby the device.

Block Temporary Unprotection. Any previously protected block canbe temporarilyunprotectedin ordertochangestoreddata.Thetemporaryunprotection mode is activated by bringing RP to V

During the temporary unprotectionmode the previously protected blocks are unprotected. A block can be selected and data can be modified by executingtheEraseorPrograminstructionwiththe

RP signalheldat V

. When RP is returnedto VIH,

all the previously protected blocks are again protected.

Block Unprotection. All protected blocks can be unprotected on programming equipment to allow updating of bit contents. All blocks must first be protectedbefore the unprotectionoperation.Block unprotectionis activatedwhen A9, G and E areat

and A12,A15 at VIH. The Block Unprotection

algorithm is shown in Figure 15. Unprotection is initiatedbythe edgeof Wfallingto V

.Aftera delay

of 10ms, the unprotectionoperation will end. Unprotectionverifyis achievedby bringingG and E to

whileA0 is atVIL, A6 andA1are at VIHandA9

remains at V

. In these conditions, reading the

outputdatawillyield00h if theblockdefinedbythe inputsA12-A17has beensuccesfullyunprotected. Eachblockmustbe separatelyverifiedbygivingits address in order to ensurethatit has been unprotected.

INSTRUCTIONS AND COMMANDS

The Command Interface latches commands written to the memory. Instructions are made up from one or morecommands to performRead Memory Array,Read ElectronicSignature,Read Block Protection, Program, Block Erase, Chip Erase, Erase Suspend and Erase Resume. Commands are made of address and data sequences. The instructionsrequirefrom 1to6 cycles,the firstor first threeof whichare alwayswrite operations used to initiatethe instruction. They are followedby either furtherwrite cyclesto confirmthe firstcommandor executethe commandimmediately.Command sequencing must be followed exactly. Any invalid combinationof commands will reset the device to Read Array. The increased number of cycles has been chosen to assure maximum data security.

Instructionsare initialised by two initial Coded cycleswhich unlockthe CommandInterface.In addition, for Erase, instruction confirmation is again precededby the two Coded cycles.

9/34

M29W400T, M29W400B

Table8. Instructions

Mne. Instr. Cyc. 1st Cyc. 2nd Cyc. 3rd Cyc. 4th Cyc. 5th Cyc. 6th Cyc. 7th Cyc.

(2,4) Read/Reset

Notes:

Memory Array

(4)

Auto Select 3+

PG Program 4

BE Block Erase 6

CE Chip Erase 6

(10) Erase

Suspend

Erase

Resume

1. Commands not interpreted in this tablewill default to read array mode.

2. Await of t before startingany new operation (see Table14 andFigure 9).

3. X = Don’tCare.

4. The first cycles of the RD orAS instructions are followed by read operations. Any number of read cycles can occur after the commandcycles.

5. SignatureAddress bits A0,A1 at V Device code.

6. Block Protection Address: A0 atV

7. For Codedcycles address inputs A15-A17are don’t care.

8. Optional, additional Blocks addresses must be enteredwithin the erase timeout delay after last write entry, timeoutstatus can beverified through DQ3 value (see Erase TimerBit DQ3 description). Whenfull commandis entered, read Data Polling or Togglebit until Erase is completed or suspended.

9. Read DataPolling, Toggle bits or RB until Erase completes.

10.During Erase Suspend,Read and Data Program functions are allowed in blocks not being erased.

PLYH

(1)

(3,7)

Addr.

Data F0h

Byte AAAAh 5555h AAAAh

(3,7)

Addr.

Data AAh 55h F0h

Addr.

Data AAh 55h 90h

Addr.

Data AAh 55h A0h

Addr.

Data AAh 55h 80h AAh 55h 30h 30h

Addr.

Data AAh 55h 80h AAh 55h 10h Addr.

Data B0h Addr.

Data 30h

is necessary after a Read/Resetcommand if the memorywas in an Erase or Program mode

Word 5555h 2AAAh 5555h

Byte AAAAh 5555h AAAAh

(3,7)

Word 5555h 2AAAh 5555h

Byte AAAAh 5555h AAAAh

(3,7)

Word 5555h 2AAAh 5555h

Byte AAAAh 5555h AAAAh AAAAh 5555h

(3,7)

Word 5555h 2AAAh 5555h 5555h 2AAAh

Byte AAAAh 5555h AAAAh AAAAh 5555h AAAAh

(3,7)

Word 5555h 2AAAh 5555h 5555h 2AAAh 5555h

(3,7)

will output Manufacturercode (20h). Address bits A0 at VIHandA1 at VILwill output

,A1atVIHand A12-A17 within the Block will output theBlock Protectionstatus.

Read Memory Array untila new write cycle is initiated.

Read Memory Array until a new write cycle is initiated.

Read ElectronicSignatureor Block Protection Statusuntil a new writecycle is initiated. See Note 5 and 6.

Program

Address

Program

Read until Toggle stops, then read all the data needed from any Block(s) not being erased then Resume Erase.

Read Data Polling or ToggleBits until Erase completes or Eraseis suspended another time

Read Data Polling or ToggleBit until Program completes.

Data

Block

Address

Additional

Block

Note 9

(8)

Status Register Bits

P/E.C.statusis indicatedduringexecutionbyData Polling on DQ7, detection of Toggle on DQ6 and DQ2, orError on DQ5and EraseTimer DQ3 bits. Any read attempt during Program or Erase commandexecutionwillautomaticallyoutputthese five StatusRegister bits.TheP/E.C.automaticallysets bits DQ2, DQ3, DQ5, DQ6 and DQ7. Other bits

10/34

(DQ0, DQ1 and DQ4) are reserved for future use and should be masked. See Tables 9 and 10.

Data Polling Bit (DQ7). When Programming operations are in progress,this bit outputs the complement of the bit being programmed on DQ7. DuringEraseoperation,it outputsa ’0’. Aftercompletionof theoperation,DQ7willoutput the bit last programmed or a ’1’after erasing. Data Polling is valid and only effective during P/E.C. operation,

M29W400T, M29W400B

Table9. Status Register Bits

DQ Name Logic Level Definition Note

Erase Complete or erase block in Erase Suspend

Program Complete or data of non erase block during Erase Suspend

Erase Complete or Erase Suspend on currently addressed block

Indicates theP/E.C. status, check during Program or Erase,and on completion before checkingbits DQ5 for Programor Erase Success.

data onDQ6 whileProgramming or Erase operations are on-going.DQ6 remains at constant level when P/E.C. operations are completed or EraseSuspend is acknowledged.

Data

Polling

6 ToggleBit

’1’

’0’ Erase On-going

DQ Program On-going

’-1-0-1-0-1-0-1-’ Erase or Program On-going Successive reads outputcomplementary

DQ Program Complete

’-1-1-1-1-1-1-1-’

5 Error Bit

4 Reserved

Erase

TimeBit

2 ToggleBit

1 Reserved 0 Reserved

Notes: Logic level ’1’ is High, ’0’ is Low. -0-1-0-0-0-1-1-1-0- represent bit value in successive Readoperations.

’1’ Program or Erase Error ’0’ Program or Erase On-going

’1’ Erase TimeoutPeriod Expired

’0’

’-1-0-1-0-1-0-1-’

Erase Timeout Period On-going

Chip Erase, Erase or Erase Suspend on the currently addressed block. Erase Error due to the currently addressed block (when DQ5 = ’1’).

Program on-going, Erase on-going on another block or Erase Complete

Erase Suspend read on non Erase Suspend block

This bit is setto ’1’in the case of Programming orErase failure.

P/E.C. Erase operationhas started. Only possible command entryis Erase Suspend (ES).

An additional block to beerased in parallel can beentered to the P/E.C.

Indicates theerase status and allows to identify theerased block

that is after the fourthWpulseforprogrammingor after the sixth W pulse for erase. It must be performed at the address being programmedor atan address within the block being erased. If all the blocksselectedforerasureare protected,DQ7will be set to ’0’for about 100µs, andthenreturnto the previous addressed memory data value. See Figure 11for the DataPollingflowchartandFigure 10 for the Data Polling waveforms.DQ7 will also flag the Erase Suspend mode by switchingfrom ’0’ to

’1’ at the start of the Erase Suspend. In order to monitor DQ7 in the Erase Suspend mode an address within a block being erased must be provided. For a Read Operation in Erase Suspend mode, DQ7 will output ’1’ if the read is attempted onablockbeingerasedandthedatavalueonother blocks. During Program operation in Erase SuspendMode, DQ7 will have the same behaviouras in the normal program execution outside of the suspend mode.

11/34

+ 23 hidden pages