SGS Thomson Microelectronics D22, D20, D15, D10, C20 Datasheet

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D10, D15, D20, D22, C20, C30

MICROMODULES

Memory Micromodules

General Information for D1, D2 and C Packaging

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip – Electrical contacts – Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensionsand contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered asa continuousSuper

35 mm tape. (This differsfrom the standard 35 mm tape in the spacing distance between the indexing holes.)

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card.

The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including thosechips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel.

potting side contact side

D15

D10 D20

D22

C30 C20

Table 1. Memory Card and Memory Tag Integrated Circuits

Module

D10 ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355 D15 ST14C02, ST1305B, ST1335, ST1336, ST1355 D20 ST14C02, M14C04, M14C16, M14C32 D22 M14C64, M14128, M14256 C30 M35101, M35102 C20 M35101, M35102

Please see the data briefing sheets of these products for example illustrations of these

micromodules

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MICROMODULES

Table 2. Memory Card Products

Type

ST14C02C M14C04 M14C16 M14C32 M14C64 M14128 M14256

ST1200 Memory Card IC, 256 bitOTP EPROM with Lock-Out 3.5 µm NMOS D10

ST1305B

Description (please see the individual product data

sheets for full specifications)

Memory Card IC, 2 Kbit (256 x 8) Serial I

Memory Card IC, 4 Kbit Serial I Memory Card IC, 16 Kbit Serial I Memory Card IC, 32 Kbit Serial I Memory Card IC, 64 Kbit Serial I Memory Card IC, 128 Kbit Serial I Memory Card IC, 256 Kbit Serial I

Memory Card IC, 192 bitHigh Endurance EEPROM with Secure Logic Access Control

C Bus EEPROM

C Bus EEPROM C Bus EEPROM

Process Technology Module Style

1.2 µm CMOS D15, D20

0.6 µm CMOS D20

0.6 µm CMOS D22

1.5 µm CMOS D10, D15

ST1331 ST1333 1.2 µm CMOS D10 ST1335 1.2 µm CMOS D10, D15 ST1336 1.2 µm CMOS D10, D15 M35101 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM 0.6 µm CMOS C20, C30

M35102

The assembly flows is as follows:

1. Dice sawing

2. Dice attach

3. Wire bonding

4. Potting

5. Milling (depending on product) The range of products and types of Micromodule

are summarizedin Table 1 and Table 2. For large volumes, ST is able to offer customized module tape.

DELIVERY

The Super 35mm metallized epoxy tape is delivered on reels, as shown in Figure 1. These contain all of the chips from a number of wafers, including those chips that were found to be nonfunctioning during testing. Traceability is ensured by alabel fixed on the reel.

The typical quantity is 10,000 modules per reel, with priority given to lot integrity on the reel. The maximum quantity is 15,000 per reel.

Parts which are faulty (mechanically or electrically defective) are identified by punch holes. The specification for the reject punch holes is shown in

Memory Card IC, 272 bitHigh Endurance EEPROM with Advanced Security Mechanisms

Contactless Memory Chip with 64-bit Unique ID,

13.56 MHz, 2048 bit EEPROM

Figure 4 for the D10 micromodule, in Figure 5 for the D15 micromodule, in Figure 6 for the D20 micromodule, and in Figure 7 for the D22 micromodule.

Tape joins (tape splicing) are never more than 10 per 10 metre length, as shown in Figure 2 and Figure 3.

At least 2.1 m of leader, and 2.1 m of trailer is included oneach reel. Eachis made ofPVC Super 35 mm tape, without metalisation, and is opaque to infrared and white light.

A “failure”marking of reject holes is included at the beginning and end of the tape of a minimum of 5 consecutive module pitches (double positions).

Modules should be stored within the temperature range -40 °Cto+85°C, for no more than 1 year.

Each reel ispacked in an antistatic bag, alongwith a desiccant bag, and a humidity indicator card. This cardindicates the level ofhumidity as follows:

30 - Blue: protection assured 40 - Pink: renew the desiccant bag 50 - Pink: protection no longer ensured

Three selfadhesive plastic identification labelsare attached: one to the reel, one to the antistatic bag,

1.2 µm CMOS D10

0.6 µm CMOS C20, C30

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MICROMODULES

Table 3. Manufacturing Flow and Manufacturing Facility Locations

Operation Location and Facility

Wafer Diffusion

Electrical WaferTest

Assembly Casablanca, Morocco.

Final Test

Table 4. Material Specification

Material Description

Basic material MCTS T2 or IBIDEN rough, typical thickness 120 µm Adhesive Modified epoxy, typical thickness 18 µm Laminated copper foil Typical thickness 35 µm

Adhesive strength

Tape Surface

Surface roughness Typically Rz: 3-12 µm at first accepted delivery Contact surface Nickel-gold, galvanised treatment Nickel thickness 2 µm (min.) Gold thickness contact side, 0.1 µm (min.) Totaltape thickness 160 ± 30 µm

Rousset, France.6” wafer fab. Agrate, Italy.6” wafer fab.: standard EEPROM only Rousset, France. Agrate, Italy: standard EEPROM only

Rousset, France. Casablanca, Morocco.

Tape

> 0.8 N/mm at room temperature. Monitored by the tape manufacturer using appropriate test methods

The whole epoxy adhesive surface is controlled to be free of dirt, grease,cleaning compounds and parting compounds

Control, Palmer “Special flat” diameter 3 mm, F = 1.5 N

Chip Interconnect

Dice bonding Silver epoxy Bonding wire Gold 25 µm Ring (D22 only) Bronze

Protective coating

Material UV epoxy,Black epoxy Assembly Casablanca, Morocco.

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MICROMODULES

and one to the reel box. Each label carries the following information:

– PRODUCT: sales type – LOT NUMBER: reel number – POS: total number of positions – GOOD: number of good positions – FAIL: number of fail positions – DATE: date of sealing In addition, the antistatic bag and the delivery box

carry a self adhesive plastic “ESD” warning label, 85 x38 mm in size, indicating “Electrostatic sensitive devices”.

Each reelis packed ina reel box,made ofrecycled cardboard. The size of the reel boxdepends on its origin. Several reel boxes arepacked in a delivery box, which is also made of recycled cardboard.

A delivery note is provided, listing the following information:

– Date of sealing – Reel numbers – Total number of positions, with the details of

positions per reel – Order number and customer name – Sales type – Tape type

RECOMMENDED ACCEPTANCECRITERIA

The product identity should be checked against the delivery documentation, and the quantity of good positions on the reel recorded. The product may be tested in accordance with the appropriate data sheet, the conditions depending on the product type, and the ISSUERor USER mode (for ST13xx products).

For delivery acceptance, ST recommends sampling the Micromodules from the beginning of the reel. The sampling AQL should be applied, to the ISO 2859 standard (test level II, normal test).

Table 5. Size of the Reel Box

Manufacturing Location Size of Reel Box

Rousset 370 x 390 x 80 mm Casablanca 373 x 370 x 78 mm

Table 6. AQL Levels

Defect AQL

Totaldefects - mechanical and electrical 0.65 Mechanical defects 0.65 Electrical defects 0.65

Any observed discrepancies should bereported in writing to the ST quality department. Table 6 shows the recommendedAQL levels.

The visual and mechanical test specification and test conditions are described in Table 7.

Defect Acceptance Rate

Each reel contains the stated number of defective devices, distributed so that no more than 20% of them are found in a contiguous block on the tape. ST’s own quality acceptance standard guarantees that the customer will be informed when the electrical yield is less than 90%.

The part numbers and re-ordering information will be set according to ST’s current product coding policy, as shown on the individual product data sheets, or asagreed with the customer.

Reels that do not pass inspection should be returned to ST within 15 working days after delivery.

Table 7. Visual and Mechanical Specification and Test Conditions

Test Description and Method Reject Criteria

1 Contact area

2 Chip covering

Note: 1. Test 3 and 4 are conducted in accordance with MIL-STD-833.

Die bond strength Die shear force < 10 N

Wire bonding Wire lift or broken at pull test with < 4 g

Glue or particles, scratches print, severdefects on contact area damaging the gold layer. Visual test distance 30 cm, naked eye.

Thickness and external dimension measurement exceeding total thickness, or other dimensions not complying to the drawings

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