Datasheet C2955 Datasheet (HAMAMATSU)

INFRARED IC INTERNAL

TENTATIVE DATA SHEET

INSPECTION SYSTEM
C2955

From the backside of the chip, you can see through the silicon
substrate to the patterns of the chip by means of an infrared light.
A newly developed infrared CCD camera is used to inspect pattern
images more clearly and easily than ever before.

The C2955 is an IC internal inspection system incor­porating an infrared microscope and an infrared CCD
camera. Use of a newly developed infrared CCD
camera enables a high sensitivity approximately ten
times that of conventional systems (in comparisons by
HAMAMATSU), at a wavelength of 1.0 µm, making it
possible to obtain sharp, clear images with high
resolution. Using an infrared light which is transmitted
through the silicon substrate enables observation of
the interconnect lines in the IC, the wire bonding
status, and the die bonding conditions, along with the
diffusion zone conditions, without damaging the part
under observation. Observation can be done from the
back side, when the sample is prepared by scraping
away the molding on the side opposite the surface of
the silicon substrate. Because the metal wiring is
never touched in the inspection process, precise
testing can be carried out under optimum conditions,
making it possible to inspect the condition of the
diffusion zones, the multilayer interconnect lines, the
Al-Si nodules wire bonding interfaces, and die bonding
details.

● Best suited for flip-chip

evaluation

● No damage to part under

observation

● High sensitivity, high

resolution

● Built-in contrast

enhancement function

● Shading correction function

SPECIFICATIONS

●Infrared CCD Camera (camera head, camera control unit)

Imaging device..............................................2/3-inch infrared CCD

Spectral response.........................................400 nm to 1200 nm

No. of pixels..................................................380,000

Effective photocathode size.........................6.3 × 4.7 mm

Power consumption.....................................20 VA

●Video Monitor

CRT...............................................................12-inch/Black and white, high-resolution model

Resolution (horizontal center)......................900 TV lines min.

Power consumption.....................................38 VA

●Infrared Microscope

Optical path switching..................................100 : 0 / 0 : 100 (eyepiece/camera)

Stage travel area..........................................153 × 153 mm

Epi-illuminated light source..........................12 V, 100 W halogen lamp

Revolver........................................................5 holes

Infrared objectives........................................10 ×, 20 ×, 50 × (optional: 5 ×, 100 × 1)

●Environmental Conditions

Ambient operating temperature range.........0 to +40°C

Ambient storage temperature range............-10 to +50°C

Ambient operating/storage humidity............90% max. (with no condensation)

Line voltage...................................................100 VAC ± 10%, 50/60 Hz

COMPONENTS

•Infrared CCD camera

OPTIONS

•C7103 IC Backside Polishing System

•Camera control unit

•Video monitor

•Infrared microscope (including light source

dimmer transformer*)

IMAGE EXAMPLE

•Cables: 1 set

* Specify the line voltage at ordering.

APPLICATIONS

•Inspection of flip-chip and other packaged IC

devices

•Testing for abnormalities (defects, failures) in

metal and polysilicon wiring

•Observation of wire bonding

•Observation of various types of die bonding zones

•Simultaneous inspection of Al-Si nodules and

multiple patterns

•Observation of pattern diffusion into substrate

•Identification of ESD failure locations

•Subject to local technical requirements and regulations, availability of products included in this promotional material may vary.

Please consult with our sales office.

•Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies

or omissions. Specifications and external appearance are subject to change without notice.

© 1999 Hamamatsu Photonics K.K.

ISO 9001/ISO 13485

EN 46001

Certificate: 09 105 79045

HAMAMATSU PHOTONICS K.K., Systems Division
812 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: [phone], Fax: [phone], E-mail:[email protected]

U.S.A. and Canada:
Germany:
France:
United Kingdom:
North Europe:
Italy:

Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E 20020 Arese (Milano), Italy, Telephone: [phone], Fax: [phone]

Hamamatsu Photonic Systems: 360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: [phone], Fax: [phone]

Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: [phone], Fax: [phone]

Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: [phone], Fax: [phone]

Hamamatsu Photonics UK Limited: Lough Point, 2 Gladbeck Way, Windmill Hill, Enfield, Middlesex EN2 7JA, United Kingdom, Telephone: [phone], Fax: [phone]

Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171-41 Solna, Sweden, Telephone: [phone], Fax: [phone]

Homepage Address http://www.hamamatsu.com

Cat. No. SSIS 1025E02
JUL/99 CR
Created in Japan (PDF)