Seagate ST100FX0002, ST200FX0002, ST400FX0002, ST400FX0012 User Manual

Product Manual

Pulsar® XT.2 SAS

Standard Models

ST400FX0002 ST200FX0002 ST100FX0002

Self-Encrypting Drive Models

ST400FX0012

100647497 Rev. B June 2011

Revision history

Revision Date Sheets affected or comments

Rev. A 03/16/11 Initial release. Rev. B 06/01/11 34. (7mm weight correction)

LLC in the United St ates and/o r other countries. Pulsar and SeaTools are either trademarks or regis tered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners.

No part of this publication may be reproduced in any form without written permission of Seagate Technology LLC. Call 877-PUB-TEK1 (877-782-8351) to request permission.

One gigabyte, or GB, equals one billion bytes and one terabyte, or TB, equals one trillion bytes. Your computer's operating system may use a different standard of measurement and report a lower capacity. In addition, some of the listed capacity is used for formatting and other functions, and thus will not be available for data storage. Seagate reserves the right to change, without notice, product offerings or specifications.

Contents

1.0 Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.0 Scope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3.0 Applicable standards and reference documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.1 Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.1.1 Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.1.2 Electromagnetic compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3.1.3 European Union Restriction of Hazardous Substances (RoHS) . . . . . . . . . . . . . 4

3.1.4 China Restriction of Hazardous Substances (RoHS) Directive . . . . . . . . . . . . . . 5

3.2 Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4.0 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1 Standard features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.2 Media description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.3 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.4 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.5 Formatted capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4.6 Programmable drive capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4.7 Factory-installed options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4.8 Thin Provisioning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.8.1 Logical Block Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.8.2 Thin Provisioning capabilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.8.3 UNMAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.8.4 FORMAT UNIT command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.8.5 Protection Information (PI) and Security (SED). . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.0 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.1 Internal drive characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.2 Performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.2.1 Access time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.2.2 FORMAT UNIT command execution time for 512-byte LBA’s (minutes). . . . . . 12

5.2.3 Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.3 Start/stop time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.4 Cache control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.4.1 Caching write data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.0 Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1 Error rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.1.1 Unrecoverable Errors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.1.2 Interface errors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2 Endurance Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2.1 Wear Leveling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2.2 Garbage Collection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2.3 Write Amplification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2.4 UNMAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2.5 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.2.6 Lifetime Endurance Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.3 Reliability and service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.3.1 Annualized Failure Rate (AFR) and Mean Time Between Failure (MTBF) . . . . 16

6.3.2 Preventive maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.3.3 Hot plugging the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.3.4 S.M.A.R.T. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

6.3.5 Thermal monitor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.3.6 Drive Self Test (DST). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Pulsar XT.2 SAS Product Manual, Rev. B i

6.3.7 Product warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.0 Physical/electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.1 Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.1.1 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.2 AC power requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.3 DC power requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.3.1 Conducted noise immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

7.3.2 Power sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

7.3.3 Current profiles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

7.4 Power dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7.5 Environmental limits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.5.1 Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.5.2 Relative humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.5.3 Effective altitude (sea level) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.5.4 Shock and vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.5.5 Air cleanliness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.5.6 Corrosive environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.5.7 Electromagnetic susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.6 Mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.0 About self-encrypting drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8.1 Data encryption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8.2 Controlled access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8.2.1 Admin SP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8.2.2 Locking SP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.2.3 Default password . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.3 Random number generator (RNG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.4 Drive locking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.5 Data bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.6 Cryptographic erase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

8.7 Authenticated firmware download . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

8.8 Power requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

8.9 Supported commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

8.10 RevertSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

9.0 Defect and error management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

9.1 Drive internal defects/errors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

9.2 Drive error recovery procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

9.3 SAS system errors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

9.4 Background Media Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

9.5 Auto-Reallocation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

9.6 Protection Information (PI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

9.6.1 Levels of PI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

9.6.2 Setting and determining the current Type Level. . . . . . . . . . . . . . . . . . . . . . . . . 40

9.6.3 Identifying a Protection Information drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

10.0 Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

10.1 Drive orientation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

10.2 Cooling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

10.3 Drive mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

10.4 Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

11.0 Interface requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

11.1 SAS features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

11.1.1 Task management functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

11.1.2 Task management responses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

ii Pulsar XT.2 SAS Product Manual, Rev. B

11.2 Dual port support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

11.3 SCSI commands supported. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

11.3.1 INQUIRY data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

11.3.2 MODE SENSE data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

11.4 Miscellaneous operating features and conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

11.4.1 SAS physical interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

11.4.2 Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

11.4.3 Connector requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

11.4.4 Electrical description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

11.4.5 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

11.4.6 SAS transmitters and receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

11.4.7 Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

11.5 Signal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

11.5.1 Ready LED Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

11.5.2 Differential signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

11.6 SAS-2 Specification compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

11.7 Additional information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Pulsar XT.2 SAS Product Manual, Rev. B iii

iv Pulsar XT.2 SAS Product Manual, Rev. B

List of Figures

Figure 1. Current profiles for 400GB models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 2. Current profiles for 200GB models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 3. Current profiles for 100GB models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 4. 400GB (at 6Gb) DC current and power vs. input/output operations per second . . . . . . . . . . 28

Figure 5. 200GB (at 6Gb) DC current and power vs. input/output operations per second . . . . . . . . . . 28

Figure 6. 100GB (at 6Gb) DC current and power vs. input/output operations per second . . . . . . . . . . 29

Figure 7. Temperature check point location - 15mm drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 8. Temperature check point location - 7mm drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 9. Recommended mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 10. Mounting configuration dimensions (400GB models). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 11. Mounting configuration dimensions (200 & 100GB models). . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 12. Physical interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 13. Air flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Figure 14. Physical interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Figure 15. SAS device plug dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Figure 16. SAS device plug dimensions (detail) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Figure 17. SAS transmitters and receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Pulsar XT.2 SAS Product Manual, Rev. B v

1.0 Seagate Technology support services

SEAGATE ONLINE SUPPORT and SERVICES

For information regarding products and services, visit http://www.seagate.com/www/en-us/about/contact_us/

Available services include:

Presales & Technical support Global Support Services telephone numbers & business hours Authorized Service Centers

For information regarding Warranty Support, visit

http://www.sea

For information regarding Data Recovery Services, visit http://www.i365.com For Seagate OEM & Distribution partner portal, visit https://direct.seagate.com/portal/system For Seagate reseller portal, visit http://spp.seagate.com

gate.com/www/en-us/support/warranty_&_returns_assistance

Pulsar XT.2 SAS Product Manual, Rev. B 1

2.0 Scope

This manual describes Seagate Technology® LLC, Pulsar® XT.2 SAS (Serial Attached SCSI) drives. Pulsar XT.2 drives support the SAS Protocol specifications to the extent described in this manual. The SAS

Interface Manual (part number 100293071) describes the general SAS characteristics of this and other Seagate SAS drives. The Self-Encrypting Drive Reference Manual, part number 100515636, describes the interface, general operation, and security features available on Self-Encrypting Drive models.

Product data communicated in this manual is specific only to the model numbers listed in this ma nual. The dat a listed in this manual may not be predictive of future generation specifications or requirements. If you are designing a system which will use one of the models listed or future generation products and need further assistance, please contact your Field Applications Engineer (FAE) or our global support services group as shown in Section 1.0.

Unless otherwise stated, the information in this manual applies to standard and Self-Encrypting Drive models.

Standard models Standard SED models

ST400FX0002 ST400FX0012 ST200FX0002 ST100FX0002

Note. Previous generations of Seagate Self-Encrypting Drive models were called Full Disk Encryption

(FDE) models before a differentiation between drive-based encryption and other forms of encryp tion was necessary.

Note. The Self-Encrypting Drive models indicated on the cover of this product manual have provisio ns for

“Security of Data at Rest” based on the standards defined by the Trusted Computing G roup (see www.trustedcomputinggroup.org).

2 Pulsar XT.2 SAS Product Manual, Rev. B

3.0 Applicable standards and reference documentation

The drives documented in this manual have been developed as system peripherals to the highest standards of design and construction. The drives depend on host equipment to provide adequate power and environment for optimum performance and compliance with applicable industry and governmental regulations. Special attention must be given in the areas o f safety, power distribution, shielding, audible noise control, and temperature regulation. In particular, the drives must be securely mounted to guarantee the specified performance characteristics. Mounting by bottom holes must meet the requirements of Section 10.3.

3.1 Standards

The Pulsar XT.2 family complies with Seagate standards as noted in the appropriate sections of this manual and the Seagate SAS Interface Manual, part number 100293071.

The drives are recognized in accordance with UL 60950 and CSA 60950 as tested by UL(CSA) and EN60950 as tested by TUV.

The security features of Self-Encrypting Drive models are based on the “TCG Storage Architecture Core Specification” and the “TCG Storage Workgroup Security Subsystem Class: Enterprise_A” specification with additional vendor-unique features as noted in this product manual.

3.1.1 Electromagnetic compatibility

The drive, as delivered, is designed for system integration and installation into a suitable enclosure prior to use. The drive is supplied as a subasse mbly and is not s ubject to Subpart B o f Part 15 of the F CC Rules and Regulations nor the Radio Interference Reg ula tio ns of the Canadian Department of Communications.

The design characteristics of the drive serve to minimize radiation when installed in an enclosure that provides reasonable shielding. The drive is capable of meeting the Class B limits of the FCC Rules and Regulations of the Canadian Department of Communications when properly packaged; however, it is the user’s responsibility to assure that the drive meets the appropriate EMI requirements in their system. Shielded I/O cables may be required if the enclosure does not provide adequate shielding. If the I/O cables are external to the enclosure, shielded cables should be used, with the shields grounded to the enclosure and to the host controller.

3.1.1.1 Electromagnetic susceptibility

As a component assembly, the drive is not required to meet any susceptibility performance requirements. It is the responsibility of those integrating the drive within their systems to perform those tests required and design their system to ensure that equipment operating in the same system as the drive or external to the system does not adversely affect the performance of the drive. See Tables 8 through 10, DC power r equirements.

Pulsar XT.2 SAS Product Manual, Rev. B 3

3.1.2 Electromagnetic compliance

Seagate uses an independent laboratory to confirm compliance with the directives/standards for CE Marking and C-Tick Marking. The drive was teste d in a repr esent ative system for typical applications. The selected system represents the most popular characteristics for test platforms. The system configurations include:

• Typical current use microprocessor

• Keyboard

• Monitor/display

• Printer

•Mouse Although the test system with this Seagate model complies with the directives/standards, we cannot guarantee

that all systems will comply. The computer manufacturer or system integrator shall confirm EMC compliance and provide the appropriate marking for their product.

Electromagnetic compliance for the European Union

If this model has the CE Marking it complies with the European Union requirements of the Electromagnetic Compatibility Directive 2004/108/EC as put into place on 20 July 2007.

Australian C-Tick

If this model has the C-Tick Marking it complies with the Australia/New Zealand Standard AS/NZ CISPR22 an d meets the Electromagnetic Compatibility (EMC) Framework requirements of Australia’s Spectrum Management Agency (SMA).

Korean KCC

If these drives have the Korean Communications Commission (KCC) logo, they comply with KN22 and KN61000.

Taiwanese BSMI

If this model has the Taiwanese certification mark then it complies with Chinese National S t and ard, CNS13438.

3.1.3 European Union Restriction of Hazardous Substances (RoHS)

The European Union Restriction of Hazardous Substances (RoHS) Directive restricts the presence of chemical substances, including Lead (Pb), in electronic products effective July 2006.

A number of parts and materials in Seagate products are procured from external suppliers. We rely on the representations of our suppliers regarding the presence of RoHS substances in these parts and materials. Our supplier contracts require compliance with our ch emical substance restrictions, and our suppliers document their compliance with our requirements by providing material conten t declarations for all p arts and materials for the drives documented in this publication. Current supplier declarations include disclosure of the inclusion of any RoHS-regulated substance in such parts or materials.

Seagate also has internal systems in place to ensure on going compliance with the RoHS Directive and all laws and regulations which restrict chemical content in electronic products. These systems include st andard ope rating procedures that ensure that restricted substances are not utilized in our manufacturing operations, laboratory analytical validation testing, and an internal auditing process to ensure that all standard operating procedures are complied with.

4 Pulsar XT.2 SAS Product Manual, Rev. B

3.1.4 China Restriction of Hazardous Substances (RoHS) Directive

This product has an Environmental Protection Use Period (EPUP) of 20 years. The following table contains information mandated by China's "Marking Requirements for Control of Pollution Caused by Electronic Information Products" Standard.

"O" indicates the hazardous and toxic substa nce content of the p art (at the homogenou s material level) is lower than the threshold defined by the China RoHS MCV Standard.

"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over the threshold defined by the China RoHS MCV Standard.

3.2 Reference documents

SCSI Commands Reference Manual Seagate part number: 100293068 SAS Interface Manual Seagate p ANSI SAS Documents

SFF-8223 2.5” Drive Form Factor with Serial Connector SFF-8460 HSS Backplane Design Guidelines SFF-8470 Multi Lane Copper Connector SFF-8482 SAS Plug Connector ANSI INCITS.xxx Serial Attached SCS ISO/IEC 14776-xxx SCSI Architecture Model-3 (SAM-4) Standard (T10/1683-D) ISO/IEC 14776-xxx SCSI Primary Commands-3 (SPC-4) Standard (T10/1731- D) ISO/IEC 14776-xxx SCSI Block Commands-3 (SBC-3) Standard ( T10/1799-D)

ANSI Small Computer System In

Trusted Computing Group (TCG) Documents (apply

Self-Encrypting Drives Reference M JEDEC Standards

terface (SCSI) Documents

X3.270-1996 (SCSI-3) Architecture Model

to Self-Encrypting Drive models only) TCG Storage Architecture Core Specification, Rev. 1.0 TCG Storage Security Subsystem Class Enterprise Specification, Rev. 1.0

anual Seagate part number: 100515636

JESD218 - Solid-State Drive (SSD) Requirements and Endurance Test Method JESD219 - Solid-State Drive (SSD) Endurance

art number: 100293071

I (SAS-2) Standard (T10/1760-D)

Workloads

In case of conflict between this document and any re

Pulsar XT.2 SAS Product Manual, Rev. B 5

ferenced document, this document takes precedence.

4.0 General description

Pulsar XT.2 drives provide high performance, high capacity data storage for a variety of systems with a Serial Attached SCSI (SAS) interface. The Serial Attached SCSI interface is designed to meet next-generation computing demands for performance, scalability, flexibility and high-density storage requirements.

Pulsar XT.2 drives are random access storage devices designed to support the Serial Attached SCSI Protocol as described in the ANSI specifications, this document, and the SAS Interface Manual (part number

100293071) which describes the general interface characteri stics of this drive. Pulsar XT.2 drives are classified as intelligent peripherals and provide level 2 conformance (highest level) with the ANSI SCSI-1 standard. The SAS connectors, cables and electrical interface are compatible with Serial ATA (SATA), giving future users the choice of populating their systems with either SAS or SATA drives. This allows users to continue to leverage existing investment in SCSI while gaining a 6Gb/s ser ial da ta transfer rate .

The Self-Encrypting Drive models indicated on the cover of this product manual have provisions for “Security of Data at Rest” based on the st andards defined by the Trusted Computing Group (see www.trustedcomputinggroup.org).

Note. Never disassemble and do not attempt to service items in the enclosure. Th e drive does not cont ain

user-replaceable parts. Opening for any reason voids the drive warranty.

4.1 Standard features

Pulsar XT.2 SAS drives have the following standard features:

• 1.5 / 3.0 / 6.0 Gb Serial Attached SCSI (SAS) interface

• Integrated dual port SAS controller supporting the SCSI protocol

• Support for SAS expanders and fanout adapters

• Firmware downloadable using the SAS interface

• 128 - deep task set (queue)

• Supports up to 32 initiators

• Jumperless configuration

• User-selectable logical block size (512, 520, 524, 528, 4096, 4160, 4192, or 4224 bytes per logical block)

• Industry standard SFF 2.5-inch dimensions

• ECC maximum burst correction length of 90 bits

• No preventive maintenance or adjustments required

• Self diagnostics performed when power is applied to the drive

• Vertical, horizontal, or top down mounting

• Drive Self Test (DST)

• Background Media Scan (BMS)

• Parallel flash access channels

• Power loss data protection

• Thin Provisioning with Block Unmap Support

• Silent operation

• Lifetime Endurance Management Pulsar XT.2 SAS Self-Encrypting Drive models have the following additional features:

6 Pulsar XT.2 SAS Product Manual, Rev. B

• Automatic data encryption/decryption

• Controlled access

• Random number generator

• Drive locking

• 16 independent data bands

• Cryptographic erase of user data for a drive that will be repurposed or scrapped

• Authenticated firmware download

4.2 Media description

The media used on the drive consists of Single Layer Cell (SLC) NAND Flash for improved reliability and performance.

4.3 Performance

• Programmable multi-segmentable cache buffer

• 600MB/s maximum instantaneous data transfers.

• Background processing of queue

• Non-Volatile Write Cache Note. There is no significant performance difference between Self-Encrypting Drive and standard (non-

Self-Encrypting Drive) models.

4.4 Reliability

• Annualized Failure Rate (AFR) of 0.44%

• Mean time between failures (MTBF ) of 2,00 0 ,0 00 hou rs

• Incorporates industry-standard Self-Monitoring Analysis and Reporting Technology (S.M.A.R.T.)

• 5-year warranty

Pulsar XT.2 SAS Product Manual, Rev. B 7

4.5 Formatted capacities

Standard OEM models are formatted to 512 bytes per block. The block size is selectable at format time and must be a multiple of 4 bytes. Users having the necessary equipment may modify the data block size before issuing a FORMAT UNIT command and obtain different formatted capacities than those listed.

To provide a stable target capacity environment and at the same time provide users with flexibility if they choose, Seagate recommends product planning in one of two modes:

Seagate designs specify capacity points at certain block sizes that Seagate guarantees current and future products will meet. We recommend customers use this capacity in project planning, as it ensures a stable operating point with backward and forward compatibility from generation to generation. The current guaranteed operating points for this product are shown below. The Capacity stated is identical when the drive is formatted with or without PI enabled.

Table 1: Formatted Capacity LBA Count

Capacity (LBAs)

LBA Size

512 520 524

528 4096 4160 4192 4224

Decimal Hex Decimal Hex Decimal Hex

781,422,768 2E9390B0h 390,721,968 1749F1B0h 195,371,568 BA52230h

764,871,800 2D970478h 382,435,904 16CB8240h 191,217,952 B65C120h

754,677,072 2CFB7550h 377,338,536 167DBAA8h 188,669,272 B3EDD58h

743,833,040 2C55FDD0h 371,916,520 162AFEE8h 185,958,264 B157F78h

97,677,846 5D27216h 48,840,246 2E93E36h 24,421,446 174A446h

96,153,847 5BB30F7h 48,076,924 2DD987Ch 24,038,462 16ECC3Eh

95,419,848 5AFFDC8h 47,709,924 2D7FEE4h 23,854,962 16BFF72h

94,696,970 5A4F60Ah 47,348,485 2D27B05h 23,674,243 1693D83h

400GB 200GB 100GB

4.6 Programmable drive capacity

Using the MODE SELECT command, the drive can change its capacity to something less than maximum. See the MODE SELECT (6) parameter list table in the SAS Interface Manual, part number 100293071. A value of zero in the Number of Blocks field indicates that the drive will not change the capacity it is currently formatted to have. A number other than zero and less than the maximum number of LBAs in the Number of Blocks field changes the total drive capacity to the value in the Number of Blocks field. A value greater than the maximum number of LBAs is rounded down to the maximum capacity.

4.7 Factory-installed options

OEMs may order the following items which are incorporated at the manufacturing facility during production or packaged before shipping. Some of the options available are (not an exhaustive list of possible options):

• Other capacities can be ordered depending on sparing scheme and LBA size requested.

• Single-unit shipping pack. The drive is normally shipped in bulk packaging to provide ma ximum protection against transit damage. Units shipped individually require additional protection as p rovided by the sin gle unit shipping pack. Users planning single unit distribution should specify this option.

•The Safety and Regulatory Agency Specifications, part number 75789512, is usually included with each standard OEM drive shipped, but extra copies may be ordered.

8 Pulsar XT.2 SAS Product Manual, Rev. B

4.8 Thin Provisioning

4.8.1 Logical Block Provisioning

The drive is designed with a feature called Thin Provisioning. Thin Provisioning is a technique which does not require Logical Blocks to be associated to Physical Blocks on the storage med ium un til su ch a time as neede d. The use of Thin Provisioning is a major factor in SSD products because it reduces the amount of wear leveling and garbage collection that must be performed. The result is an incre ase in the product s endur ance. For more details on Logical Block Provisioning and Thin Provisioning, Reference the SBC-3 document provided by the T-10 committee.

4.8.2 Thin Provisioning capabilities

The level of Thin Provisioning support may vary by product model. Devices that support Thin Provisioning are allowed to return a default data pattern for read re quest s made to Logical Blo cks that have not been mapped to Physical Blocks by a previous WRITE command.

In order to determine if Thin Provisioning is supported and what features of it are implemented requires th e system to send a READ CAPACITY 16 (9Eh) command to the drive. Thin Provisioning and the READ CAPACITY 16 (9Eh) command is defined in the Seagate SCSI Command Reference 100293068.

Table 2: Thin Provisioning Product Configuration

Product Configuration LBPME LBPRZ

Non-SED Supported Supported SED Supported Not Supported

A logical block provisioning management enabled (LBPME) bit set to one indicates that the logical unit implements logical block provisioning management. An LBPME bit set to zero indicates that the logical unit is fully provisioned and does not implement logical block provisioning management.

A logical block provisioning read zeros (LBPRZ) bit set to one indicates that, for an unmapped LBA specified by a read operation, the device server sends user data with all bits set to zero to the data-in buffer. An LBPRZ bit set to zero indicates that, for an unmapped LBA specified by a read operation, the device server may send user data with all bits set to any value to the data-in buffer.

4.8.3 UNMAP

The UNMAP command requests that the device server break the association of a specific Logical Block address from a Physical Block, thereby freeing up the Physical Block from use and no longer requiring it to contain user data. An unmapped block will respond to a READ command with data that is determined by the setting of the LBPRZ bit in the READ CAPACITY parameter data.

4.8.4 FORMAT UNIT command

A device which supports Thin Provisioning will be capable of performing a SCSI FORMAT UNIT command which allocates Logical Blocks Addres ses that are not linked to Physical Block Locations. A FORMAT command will cause all LBAs to become unmapped.

4.8.5 Protection Information (PI) and Security (SED)

The requirements in this section apply to any device which supports LBA unmapping. In SCSI devices, umapped LBAs are defined as part of the Thin Pro visioning model. Sup port of the Thin Pro vi-

sioning model is indicated by the LBPME bit having a value of '1' in the READ CAPACITY (16) parameter data.

Pulsar XT.2 SAS Product Manual, Rev. B 9

When a region of LBA's are erased via cryptographic erase, as part of the erase, the drive shall unmap those LBAs.

If the host attempts to access an unmapped or trimmed LBA, the drive shall r eturn scrambled da t a. For a given LBA, the data shall be identical from access to access, until that LBA is either updated with actual data from the host or that LBA is cryptographically erased. The drive shall r eport a value of '0 ' in the LBPRZ field r eturned in the READ CAPACITY (16) parameter data.

If the host attempts to access an unmapped LBA on a drive that has been formatted with Protection Information (PI), the drive shall return scrambled PI data for that LBA. Depending on the value of the RDPROTECT field in the data-access command CDB, this may result in the drive returning a standard PI error to the host.

If the host reduces the addressable capacity of the drive via a MODE SELECT command, the drive shall unmap or trim any LBA within the inaccessible region of the device.

Additionally, an UNMAP command is not permitted on a locked band.

Table 3: PI and SED Drive Configuration

Drive Configuration

Standard SED

PI Setting Disabled Enabled Disabled Enabled

PROT_EN bit 010 1

LBPME bit 111 1

LBPRZ bit 110 0

PI Check Requested N/A Yes No N/A Yes No

DATA Returned for Thin Provisioned LBA

PI Returned for Thin Provisioned LBA

PI Check Performed N/A NoNoN/A YesNo

Error reported to Host No No No No Yes No

0x00 0x00 0x00 Random None Random

None 0xFF 0xFF None None

Scrambled PI data

10 Pulsar XT.2 SAS Product Manual, Rev. B

5.0 Performance characteristics

This section provides detailed information concerning performance-related characteristics and features of Pulsar XT.2 drives.

Note. Data provided is based on format at 512-bytes.

5.1 Internal drive characteristics

ST400FX0002 ST200FX0002 ST100FX0002 ST400FX0012

Drive capacity 400 200 100 GB (formatted, rounded off value) Flash Memory Type NAND SLC Emulated LBA Size 512, 520, 524, 528, 4096, 4160, 4192, or 4224 Native Programmable Page Size 4096 User Bytes Default Transfer Alignment Offset 0

5.2 Performance characteristics

See Section 1 1.4.1, "SAS physical interface" and the SAS Interface Manual ( p ar t numbe r 1002930 71) for a dditional timing details.

5.2.1 Access time

Access measurements are taken with nominal power at 25°C ambient temperature. All times are measured using drive diagnostics. The specifications in the table below are defined as follows:

• Page-to-page access time is an average of all possible page-to-page accesses in both directions for a sequentially preconditioned drive.

• Average access time is a true statistical random average of at least 5000 measurements of accesses between programmable pages on a randomly prec onditioned drive.

Table 4: Typical Access Time (µsec)

400GB

Read Write Read Write

Average

Page to Page 268 133 207 121 Average Latency 247 188

Typical

268 133 208 121

1,2

100/200 GB

1,2

1. Execution time measured from receipt of the Command to the Response.

2. Assumes no errors.

3. Typical access times are measured under nomina l conditions of temperature, voltage, and horizontal orientation as measured on a representative sample of drives.

Note. These drives are designed to provide the highest possible performance under typical conditions.

However, due to the nature of Flash memory technologies there are many factors that can result in

values different than those stated in this specification

Pulsar XT.2 SAS Product Manual, Rev. B 11

5.2.2 FORMAT UNIT command execution time for 512-byte LBA’s (minutes)

The device may be formatted as either a Thin Provisioned

device or a Fully Provisioned device. The default format is Thin Provisioned and is recommended for most applications. Thin Provisioning provides the most flexibility for the device to manage the flash medium to maximize endurance.

Table 5:

Configuration

Non-SED Non-SED Non-SED Non-SED SED SED SED SED

Maximum FORMAT UNIT Times (minutes)

Format Mode DCRT Bit IP Bit 400GB 200GB 100GB

(Default) Thin Provisioned DCRT = 0 IP = 0 5 5 5 (Default) Thin Provisioned DCRT = 1 IP = 0 5 5 5 Fully Provisioned DCRT = 0 IP = 1 140 60 30 Fully Provisioned DCRT = 1 IP = 1 100 40 20 (Default) Thin Provisioned DCRT = 0 IP = 0 5 N/A N/A (Default) Thin Provisioned DCRT = 1 IP = 0 5 N/A N/A Fully Provisioned DCRT = 0 IP = 1 140 N/A N/A Fully Provisioned DCRT = 1 IP = 1 100 N/A N/A

5.2.3 Performance Table 6: Performance

Notes 400GB 200GB 100GB

Maximum Burst Transfer Rate 600MB/s Peak sequential 128KB read/write data transfer rate (MB/s max) [1] 360/300 Sustained sequential 128KB read/write dat Peak 4KB random read/write command rate (IOPs) [2] 48,000/22,000 Sustained 4KB random read/write command rate (IOPs) [2] 48,000/

Sustainable 4KB Random combined IOPS for 5 year Endurance (65%/35% R/W, 70% Duty Cycle)

[1] Testing performed at Queue Depth = 32, Sequentiall [2] Testing performed at Queue Depth = 32, Randomly [3] Testing performed at Queue Depth = 32, Non-Preconditioned drive, using IOMeter 2006.7.27.

a transfer rate (MB/s) [1] 300/300 300/200 300/100

,000

[3] 31,000 31,000 31,000

y Preconditioned drive, using IOMeter 2006.7.27.

Preconditioned drive, using IOMeter 2006.7.27.

48,000/ 16,000

48,000/ 8000

Note. IOMeter is available at http://www.iometer.org/ or http://sourceforge.net/projects/iometer/.

IOMeter is licensed under the Intel Open Source Licen

se and the GNU General Public License. Intel

does not endorse any IOMeter results. Peak performance is defined as the typical best case performance

that the product will be able to achieve when the product is preconditioned as mentioned and host commands are aligned on 4KB boundaries.

Sustained performance is defined as the typical worst case

performance that the product will be able to achieve when the product is precon ditioned as mentioned and host commands are aligned on 4KB boundaries. Write values also take into account the worst case performance throttling that may occur to ensure the product meets specified reliability specifications.

12 Pulsar XT.2 SAS Product Manual, Rev. B

Due to the nature of Flash memory technolo gies the re ar e many factors that can result in values different than those stated in this specification. Some discrepancies can be caused by bandwidth limitations in the host adapter, operating system, or driver limitations. It is not the inten t of this ma nua l to cover all possible causes of performance discrepancies.

When evaluating performance of SSD devices, it is recommended to measure performance of the device in a method that resembles the targeted application using real world data and workloads. Test time should also be adequately large to ensure that sustainable metrics and measures are obtained.

5.3 Start/stop time

The drive accepts the commands listed in the SAS Interface Manual less than 3 seconds after DC power has been applied.

If the drive receives a NOTIFY (ENABLE SPINUP) primitive through either port and has not received a START STOP UNIT command with the START bit equal to 0, the drive becomes ready for normal operations within 13 seconds (excluding the error recovery procedure).

If the drive receives a START STOP UNIT command with the START bit equal to 0 before receiving a NOTIFY (ENABLE SPINUP) primitive, the drive waits for a START ST OP UNIT command with the START bit equal to 1. After receiving a START STOP UNIT command with the START bit equal to 1, the drive waits for a NOTIFY (ENABLE SPINUP) primitive. After receiving a NOTIFY (ENABLE SPINUP) primitive through either port, the drive becomes ready for normal operations within 13 seconds (excluding the error recovery procedure).

If the drive receives a START STOP UNIT command with the START bit and IMMED bit equal to 1 and does not receive a NOTIFY (ENABLE SPINUP) primitive within 5 seconds, the drive fails the START STOP UNIT command.

The START STOP UNIT command may be used to command the drive to stop. Stop time is 3 seconds (maximum) from removal of DC power. SCSI stop time is 3 seconds. There is no power control switch on the drive.

5.4 Cache control

All default cache mode parameter values (Mode Page 08h) for standard OEM versions of this drive family are given in Table 17 and 18.

5.4.1 Caching write data

Write caching is a write operation by the drive that make s use of a drive b uffer storage area wher e the da ta to be written to the medium is stored while the drive performs the WRITE command.

If the number of write data logical blocks exceed the size of the segme nt being written into, when the end of the segment is reached, the data is written into the beginning of the same cache segment, overwriting the da ta that was written there at the beginning of the operation; however, the drive does not overwrite data that has not yet been written to the medium.

If write caching is enabled (WCE=1), then the drive may return Good status on a WRITE command after the data has been transferred into the cache, but before the data has been written to the medium. If an error occurs while writing the data to the medium, and Good status has already been returned, a deferred error will be generated.

Data that has not been written to the medium is protected by a back up power source which provides the ability of the data to be written to non-volatile medium in the event of an unexpected power loss.

The SYNCHRONIZE CACHE command may be used to force the drive to write all cached write data to the medium. Upon completion of a SYNCHRONIZE CACHE command, all data received from previous WRITE commands will have been written to the medium. Tables 16, 17 and 18 show the mode default settings for the drive.

Pulsar XT.2 SAS Product Manual, Rev. B 13

6.0 Reliability specifications

The following reliability specifications assume correct host and drive operational interface, including all interface timings, power supply voltages, environmental requirements and drive mounting constraints.

Read Error Rates

Unrecovered Data Less than 1 LBA in 1016 bits transferred

Miscorrected Data Less than 1 LBA in 10 Interface error rate: Less than 1 erro r in 10 Mean Time Between Failure (MTBF): 2,000,000 hours Annualized Failure Rate (AFR): 0.44% Preventive maintenance: None required Typical Data Retention with

Power removed (at 40C) Endurance Rating:

1. Error rate specified with automatic retries and data correction with ECC enabled and all flaws reallocated.

2. As NAND Flash devices age with use, the capability of the media to retain a programmed value begins to deteriorate. This deterioration is affected by the number of times a particular memory cell is programmed and subsequently erased. When a device is new, it has a powered off data retention capability of up to several years. With use the retention capability of the device is reduced. Temperature also has an effect on how long a Flash component can retain its programmed value with power removed. At high temperature the retention capabilities of the device are reduced. Data retention is not an issue with power applied to the SSD. The SSD drive contains firmware and hardware features that can monitor and refresh memory cells when power is applied.

3. Endurance rating is the expected amount of host data that can be written by product when subjected to a specified workload at a specified operating and storage temperature. For the specific workload to achieve this level of endurance, please reference JEDEC Specification JESD218. TBW is defined as 1x10^12 Bytes.

bits transferred

3 months

Method 1: Full drive writes per day 35 Method 2: TBW (per JEDEC JESD218 400GB = 24,800 TB

200GB = 12,400 TB 100GB = 6,200 TB

6.1 Error rates

The error rates stated in this manual assume the following:

• The drive is operated in accordance with this manual using DC power as defined in paragraph 7.3, "DC power requirements."

• Errors caused by host system failures are excluded from error rate computations.

• Assume random data.

• Default OEM error recovery settings are applied. This includes AWRE, ARRE, full read retries, full write retries and full retry time.

14 Pulsar XT.2 SAS Product Manual, Rev. B

6.1.1 Unrecoverable Errors

An unrecoverable data error is def ined as a failure of the d rive to recover data from the media. These errors occur due to read or write problems. Unrecoverable data errors are only detected during read operations, but not caused by the read. If an unrecoverable data error is detected, a MEDIUM ERROR (03h) in the Sense Key will be reported. Multiple unrecoverable data errors resulting from the same cause are treated as 1 error.

6.1.2 Interface errors

An interface error is defined as a failure of the receiver on a port to recover the data as transmitted by the device port connected to the receiver. The error may be detected as a running disparity error, illegal code, loss of word sync, or CRC error.

6.2 Endurance Management

Customer satisfaction with Solid State Drives can be directly related to the internal algorithms which an SSD uses to manage the limited number of Program-Erase (PE) cycles that NAND Flash can withstand. These algorithms consist of Wearleveling, Garbage Collection, Write Amplification, Unmap, Data Retention, Lifetime Endurance Management.

6.2.1 Wear Leveling

Wear Leveling is a technique used by the drive to ensure that all Flash cells are written to or exercised as evenly as possible to avoid any hot spots where some cells are used up faster than other locations. Wear Leveling is automatically managed by the drive and requires no user interaction. The Seagate algorithm is tuned to operate only when needed to ensure reliable product operation.

6.2.2 Garbage Collection

Garbage Collection is a technique used by the drive to consolidate valid user data into a common cell range freeing up unused or obsolete locations to be erased and used for future storage needs. Garbage Collection is automatically managed by the drive and requires no user interaction. The Seagate algorithm is tuned to operate only when needed to ensure reliable product operation.

6.2.3 Write Amplification

While Write Amplification is not an algorithm, it is a major characteristic of SSD's that must be accounted for by all the algorithms that the SSD implements. The Write Amplification Factor of an SSD is defined as the ratio of Host/User data requested to be written to the actual amount of data written by the SSD internal to account for the user data and the housekeeping activities such as Wear Leveling and Garbage Collection. The Write Amplification Factor of an SSD can also be directly affected by the characte ristics of the host dat a being sent to the SSD to write. The best Write Amplification Factor is achieved for data that is written in sequ ential LBA's that are aligned on 4KB boundaries. The worst case Write Amp lification Factor typically occurs for randomly written LBA's of transfer sizes that are less than 4KB and that originate on LBA's that are not on 4KB boundaries.

6.2.4 UNMAP

A new SCSI command has been added to the SSD as part of the Thin Provisioning feature set. Use of the UNMAP command reduces the Write Amplification Factor of the drive during housekeeping tasks such as Wear Leveling and Garbage Collection. This is accomplished because the drive does not need to retain data which has been classified by the host as obsolete.

Pulsar XT.2 SAS Product Manual, Rev. B 15

+ 51 hidden pages