SANYO LC78626E Datasheet

Overview
The LC78626E is a monolithic compact disk player signal processing and servo control CMOS IC equipped with an internal anti-shock control function. Designed for total functionality including support for EFM-PLL, and one-bit D/A converter, and containing analog low-pass filter, the LC78626E provides optimal cost-performance for low-end CD players that provide anti-shock systems. The basic functions provided by this IC include modulation of the EFM signal from the optical pick-up, deinterleaving, detection and correction of signal errors, prevention of a maximum of approximately 10 seconds of skipping, signal processing such as digital filtering (which is useful in reducing the cost of the player), and processing of a variety of servo-related commands from the microprocessor.
Functions
• When an HF signal is input, it is sliced to precise levels and converted to an EFM signal. The phase is compared with the internal VCO and a PLL clock is reproduced at an average frequency of 4.3218 MHz.
• Precise timing for a variety of required internal timing needs (including the generation of the reference clock) is produced by the attachment of an external 16.9344 MHz crystal oscillator.
• The speed of revolution of the disk motor is controlled by the frame phase difference signal generated by the playback clock and the reference clock.
• The frame synchronizing signal is detected, stored, and interpolated to insure stable data read back.
• The EFM signal is demodulated and converted to 8-bit symbolic data.
• The demodulated EFM signal is divided into subcodes and output to the external microprocessor. (Three general I/O ports are shared [exclusively] for this purpose.)
• After the subcode Q signal passes the CRC check, it is output to the microprocessor through a serial transmission (LSB first).
• The demodulated EFM signal is buffered in the internal RAM, which is able to absorb ± 4 frame's worth of jitter resulting from variations in the disk rotation speed.
• The demodulated EFM signal is unscrambled to a specific sequence, and deinterleaving is performed.
• Error detection and correction is performed, as is a flag process. (C1: two error/C2: two error correction method.)
• The C2 flag is set after referencing the C1 flag and the results of the C2 check, where the signal from the C2 flag is interpolated or held at its previous level. The interpolation circuit uses double interpolation. When there are two or more C2 flags in a row, the previous value is held.
Package Dimensions
unit: mm
3151-QFP100E (FLP100)
CMOS LSI
13098HA(OT) No. 5692-1/32
SANYO: QIP100E (FLP100)
[LC78626E]
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-0005 JAPAN
DSP for Compact Disk Players
LC78626E
Ordering number : EN5692
Continued on next page.
No. 5692-2/32
LC78626E
Continued from preceding page.
• Command (such as track jump, start focus, disk motor start/stop, muting on/off, track count, etc.) is are executed after they are entered from the microprocessor. (An 8-bit serial input is used.)
• The digital output is equipped internally.
• High speed access is supported through discretionary track counting.
• Using the 4× oversampling digital filter, D/A converter
signals with improved continuity of output data are produced.
• A ∆∑-type D/A converter using a 3-order noise shaper is equipped internally. (An analog low-pass filter is equipped internally.)
• Internal digital attenuator (8-bit-[ALPHA]; 239 steps.)
• Internal digital deemphasis.
• Uses 0 cross mute.
• Bilingual compatibility.
• General I/O ports: 4. (Three of these are shared, exclusively, with the subcode output function.)
• Up to ten seconds of skip prevention (when using 4M of DRAM) through ADPCM compression/decompression processing. 1M/4M bit DRAM can be selected.
• Memory overflow detection output.
• Free memory output.
Features
• 100-pin QFP
• A single 3.2 V/5 V power supply
Equivalent Circuit Block Diagram
No. 5692-3/32
LC78626E
Digital out
RAM address
generator
Interpolation mute
Shock
detector
Contact
detector
ADPCM
encoder
Data width
changer
2K × 8-bit RAM
Digital
attenuator
4 × oversampling digital filter
C1, C2 error detection and
correction flag process
VCO clock production
clock control
Slice level control
Sync detect
EFM
demodulation
CLV digital servo
Subcode partition
QCRC
Microprocessor
interface
Servo commands
General ports
Disable
Crystal oscillator-system
timing generator
One-bit DAC
Low-pass
filter
ADPCM
decoder
DRAM control
Overflow process
initiation control
Pin Assignment
No. 5692-4/32
LC78626E
Top view
No. 5692-5/32
LC78626E
Parameter Symbol Conditions Ratings Unit
Maximum power supply voltage V
DD
max VSS–0.3 to VSS+7.0 V
Input voltage V
IN
VSS–0.3 to VDD+0.3 V
Output voltage V
OUT
VSS–0.3 to VDD+0.3 V Allowable power dissipation Pd max 400 mW Operating temperature range Topr –20 to +75 °C Storage temperature range Tstg –40 to +125 °C
Specifications
Absolute Maximum Ratings at Ta = 25°C, VSS= 0V
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
DD
1
V
DD
, XVDD, LVDD, RVDD, VVDD:
3.0 5.5 V
Power supply voltage
ATT/DF/DAC to the normal speed
V
DD
2
V
DD
, XVDD, LVDD, RVDD, VVDD:
3.6 5.5 V
All functions guaranteed to 2× speed
V
IH
1
I/O and input pins with the exception of
0.7V
DD
V
DD
V
Input high level voltage
EFMI and DRAM0 to DRAM3
V
IH
2 EFMI 0.6V
DD
V
DD
V
V
IH
3 DRAM0 to DRAM3 0.45V
DD
V
DD
V
V
IL
1
I/O and input pins with the exception of
0 0.3V
DD
V
Input low level voltage
EFMI and DRAM0 to DRAM3
V
IL
2 EFMI 0 0.4V
DD
V
V
IL
2 DRAM0 to DRAM3 0 0.2V
DD
V
Data setup time t
SU
COIN, RWC: Figure 1 400 ns
Data hold time t
HD
COIN, RWC: Figure 1 400 ns
High level clock pulse width t
WH
SBCK, CQCK: Figures 1 to 3 400 ns
Low level clock pulse width t
WL
SBCK, CQCK: Figures 1 to 3 400 ns
Data read access time t
RAC
SQOUT, PW: Figures 2 and 3 0 400 ns
Command transfer time t
RWC
RWC: Figure 1 1000 ns
Subcode Q read enable time t
SQE
WRQ: Figure 2, no RWC signal 11.2 ms
Subcode ready cycle time t
SC
SFSY: Figure 3 136 µs
Subcode read enable time t
SE
SFSY: Figure 3 400 µs
Port input data setup time t
CSU
CONT2 to CONT5, RWC: Figure 4 400 ns
Port input data hold time t
CHD
CONT2 to CONT5, RWC: Figure 4 400 ns
Port input clock setup time t
RCQ
RWC, CQCK: Figure 4 100 ns
Port output data delay time t
CDD
CONT2 TO CONT5, RWC: Figure 5 1200 ns
Input level
V
IN
1 EFMI: slice level control, VDD= 3.0 V 0.8 Vp-p
V
IN
2 XIN: C coupling input 1.0 Vp-p
Range of operating frequencies f
OP
EFMI 10 MHz
Crystal oscillator frequency f
X
XIN, XOUT 16.9344 MHz
Allowable Operating Range at Ta = 25°C, VSS= 0V
Parameter Symbol Conditions
Ratings
Unit
min typ max
Consumption current I
DD
VDD, XVDD, LVDD, RVDD, VVDD:
14 20 mA
V
DD
= 3.0 to 3.4 V with normal playback
DEFI, EFMI, HFL, TES, RWC, COIN, CQCK,
I
IH
1
FMT, MR1, RES, TESD, WOK, PAUSE IN,
5 µA
SHOCK, TESCLK, TESA, TESB, TESC,
Input high level current.
TESGB, TEST1: V
IN
= V
DD
IIH2
TAI, TEST2 to TEST5, CS, TESE:
15 55 µA
V
IN
= VDD= 3.4 V
Electrical Characteristics at Ta = 25°C, VDD= 3.2 V VSS= 0V
Continued on next page.
No. 5692-6/32
LC78626E
Continued from preceding page.
Parameter Symbol Conditions
Ratings
Unit
min typ max
DEFI, EFMI, HFL, TES, RWC, COIN, CQCK, FMT, MR1, RES, TESE, TESD, WOK,
Input low level current I
IL
PAUSE IN, SHOCK, TESCLK, TESA, TESB, –5 µA TESC, TESGB, TAI, TEST1 to TEST5, CS : V
IN
= 0 V
EFMO, CLV
+
, CLV–, V/P, TOFF, TGL, JP+,
V
OH
1 JP–, PCK, FSEQ, EFLG, FSX, EMPH : 2.56 V
I
OH
= –1 mA
CONT2 to CONT5, SBSY, MUTEL, MUTER,
Output high level current
VOH2 C2F, WRQ, SQOUT, 16M, 4.2M, EMPP, 2.56 V
OVF, CNTOK, NGJ : I
OH
= –0.5 mA
V
OH
3 DOUT : IOH= –12 mA 2.72 V
V
OH
4
OE, WE, CAS, RAS, AD9 to AD0, 256 V DRAM3 to DRAM0 : I
OH
= –0.5 mA
V
OH
5 MMC0 to MMC3 : IOH= –2 mA 2.24 V
V
OL
1
EFMO, CLV
+
, CLV–, V/P, TOFF, JP+, JP–,
0.64 V
PCK, FSEQ, EFLG, FSX, EMPH : I
OL
= 1 mA
CONT2 to CONT5, SBSY, MUTEL, MUTER,
V
OL
2 C2F, WRQ, SQOUT, 16M, 4.2M, EMPP, 0.32 V
Output low level current
OVF, CNTOK, NGJ : I
OL
= 2 mA
V
OL
3 DOUT : IOL= 12 mA 0.48 V
V
OL
4
OE, WE, CAS, RAS, AD9 to AD0,
0.44 V
DRAM3 to DRAM0 : I
OL
= 0.5 mA
V
OL
5 MMC0 to MMC3 : IOL= 2 mA 0.96 V
PDO, CLV
+
, CLV–, JP+, JP–,
I
OFF
1 CONT2 to CONT5, DRAM0 to DRAM3, 5 µA
Output off leakage current
ASRES : V
OUT
= V
DD
PDO, CLV+, CLV–, JP+, JP–,
I
OFF
2 CONT2 to CONT5, DRAM0 to DRAM3, –5 µA
ASRES : V
OUT
= 0 V
Charge pump output current
I
PDOH
PDO : RISET = 68 k 30 42 54 µA
I
PDOL
PDO : RISET = 68 k –54 –42 –30 µA
Parameter Symbol Conditions
Ratings
Unit
min typ max
Total harmonic distortion rate TRD+N
LCHO, RCHO; 1 kHz: Uses the 0 dB data
0.015 0.018 %
input and the 20 kHz-LPF (in the AD725D). LCHO, RCHO; 1 kHz: Uses the -60 dB data
Dynamic range DR input, the 20 kHz-LPF (in the AD725D), and 85 90 dB
the A filter. LCHO, RCHO; 1 kHz: Uses the –0 dB data
Signal to noise ratio S/N input, the 20 kHz-LPF (in the AD725D), and 87 92 dB
the A filter.
Cross talk CT
LCHO, RCHO; 1 kHz: Uses the 0 dB data
79 82 dB
input and the 20 kHz-LPF (in the AD725D).
One-bit D/A Converter Analog Characteristics at
Ta = 25°C, VDD= LVDD= RVDD= 3.2 V, VSS= L/RVSS= 0 V
Analog output
Note: Measured with the normal-speed playback mode in the Sanyo one-bit D/A converter block reference digital attenuator circuit.
Figure 1 Command Input
Figure 2 Subcode Q Output
Figure 3 Subcode Output
No. 5692-7/32
LC78626E
No. 5692-8/32
LC78626E
Figure 4 General Port Input Timing
Figure 5 General Port Output Timing
No. 5692-9/32
LC78626E
Description of Pins
Pin Pin
I/O Function
No. Name
1 DEFI I Defect detection signal (DEF) input. When not used, must be connected to 0 V. 2 TAI I Test input. Equipped with internal pull-down resistor. Must be connected to 0V. 3 PDO O External VCO control phase comparator output. 4 VV
SS
P
For the PLL
Internal VCO ground. Must be connected to 0 V. 5 ISET AI PDO output current adjustment resistor connection. 6 VV
DD
P Internal VCO power supply. 7 FR AI VCO frequency range adjustment 8 V
SS
P Digital system ground. Must be connected to 0 V. 9 TESCLK I Test clock input. Must be connected to VDD.
10 TESA I Test operation mode control input. Must be connected to VDD. 11 TESB I Test operation mode control input. Must be connected to VDD. 12 TESC I Test operation mode control input. Must be connected to VDD. 13 TESGB I Test operation mode control input. Must be connected to VDD. 14 TEST5 I Test input. Equipped with internal pull-down resistor. Must be connected to 0 V. 15 CS I Chip select input. Equipped with internal pull-down resistor. When not controlled, must be connected to 0 V. 16 TEST1 I Test input. Must be connected to 0 V. 17 EFMO O For slice EFM signal output. 18 EFMI I level control. EFM signal input. 19 TEST2 I Test input. Equipped with internal pull-down resistor. Must be connected to 0 V. 20 CLV
+
O
Disk motor control output. Can have a 3-state output depending on the command.
21 CLV
O
22 V/P O
Rough servo/phase control automatic switching monitor output. If a high level then rough servo mode. If a low level then
phase control mode. 23 HFL I Track detect signal input. Schmidt input. 24 TES I Tracking error signal input. Schmidt input. 25 TOFF O Tracking off output. 26 TGL O Tracking gain switch output. Gain is increased with low level. 27 JP
+
O
Track jump control output. Can be 3-state output depending on the command. 28 JP
O
29 PCK O EFM data playback clock monitor. 4.3218 MHz during phase lock. 30 FSEQ O
Sync signal detect output. A high level when the sync signal detected from the EFM signal matches the internally
generated sync signal. 31 V
DD
P Digital system power supply.
Reset signal input for initializing only the anti-shock control part (i.e. excluding the DSP part). Resets when this
pin is low level, and release the reset when this pin is high level. Tie this pin to the low level (i.e., connected to 0 V) if
when using software control on the anti-shock part alone through the anti-shock part only reset disable/release 32 ASRES I(I/O) command ($F4) or the anti-shock only reset enable/inrush command ($F5).
Note: This pin is assigned as the least significant bit of the general I/O port however, use as a general I/O
pin is disabled. When the port I/O set command ($DB) is executed, the least significant bit is always “0,” and the
output driver is not turned ON. 33 CONT2 I/O
General I/O pin 2. This controls the commands from the microcontroller. When not used, either set this as an input
port and connect to 0 V, or set this as an output port and leave it open.
Continued on next page.
No. 5692-10/32
LC78626E
Continued from preceding page.
Pin Pin
I/O Description
No. Name
General I/O pin 3. This controls the commands from the microcontroller. This pin is shared exclusively with 34 CONT3/SBCK I/O the subcode read clock input (SBCK). When not used, either set this as an input port and connect to 0 V, or set
this as an output port and leave it open.
General I/O pin 4. This controls the commands from the microcontroller. This pin is shared exclusively with 35 CONT4/SFSY I/O the subcode frame sync signal output (SFSY). When not used, either set this as an input port and connect to 0
V, or set this as an output port and leave it open.
General I/O pin 5. This controls the commands from the microcontroller. This pin is shared, exclusively, with 36 CONT5/PW I/O the subcode P, Q, R, S, T, U, V, W output (PW). When not used, either set this as an input port and connect to
0 V, or set this as an output port and leave it open. 37 SBSY O Subcode block sync signal output. 38 TEST3 I Test input. Equipped with an internal pull-down resistor. Must be connected to 0 V. 39 DOUT O Digital output. EIAJ format. 40 TEST4 I Test input. Equipped with an internal pull-down resistor. Must be connected to 0 V. 41 16M O 16.9344 MHz output. 42 4.2M O 4.2336 MHz output. 43 EFLG O C1, C2, one error, two error error correction monitor output 44 FSX O 7.35 kHz sync signal output (frequency divided from the crystal oscillator). 45 EMPH O Deemphasis monitor output. When high level, a deemphasis disk is being played back. 46 C2F O C2 flag output. 47 TOUT O Test output. Under normal operation, this should be left open. 48 MR1 I DRAM switch: high : 1M, low : 4M 49 TESE I Test input. Must be connected to 0V. 50 TESD I Test input. Must be connected to 0V. 51 MUTESL O L channel mute output. 52 LV
DD
P L channel power supply. 53 LCHO AO L channel output. 54 L/RV
SS
P
For the one-bit D/A
L/R channel ground. Must be connected to 0 V.
55 RCHO AO
converter
R channel output.
56 RV
DD
P R channel power supply. 57 MUTER O R channel mute output. 58 XVDD P Crystal oscillator power supply. 59 XOUT O
16.9344 MHz crystal oscillator connection.
60 XIN I 61 XVSS P Crystal oscillator ground. Must be connected to 0 V. 62 RWC I Read/write control input. Schmidt input. 63 COIN I Microcontroller command input. 64 CQCK I Input pin for the command input latch clock and the subcode readout clock. Schmitt input. 65 SQOUT O Subcode Q output. 66 WRQ O Subcode Q output standby output. 67 FMT I Operating mode switch: high: shock proof, low: through. 68 EMPP O DRAM empty (an RZP pulse is output when the DRAM is empty). 69 RES I External reset input: low reset (all internal blocks are reinitialized).
Continued on next page.
Loading...
+ 22 hidden pages