samsung SM-J710F Specification

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Page 1

2. Specification

2-1. GSM General Specification

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Freq.

Band[MHz]

Uplink/

Downlink

ARFCN

range

Tx/Rx

spacing

Mod. Bit

Bit Period

Time Slot

Period/

Frame Period

rate/

GSM850 EGSM 900 DCS1800 PCS1900

824~849 869~894

128~251

45MHz 45MHz 95MHz 80MHz 190MHz 80MHz 45MHz 45MHz

270.833kbps

3.692us

576.9us

4.615ms

880~915 925~960

0~124

& 975~1023

270.833kbps

3.692us

576.9us

4.615ms

1710~1785 1805~1880

512~885 512~810

270.833kbps

3.692us

576.9us

4.615ms

1850~1910 1930~1990

270.833kbps

3.692us

576.9us

4.615ms

WCDMA

2100

1922~1977 2112~2167

UL:

9612~9888

DL:

10562~10838

3.84Mcps 3.84Mcps 3.84Mcps 3.84Mcps

FrameLength:

10ms

Slotlength:

0.667ms

WCDMA

1900

1852~1907 1932~1987

UL:

9262~9538

DL:

9662~9938

FrameLength:

10ms

Slotlength:

0.667ms

WCDMA

900

880~915 925~960

UL:

2712~2863

DL:

2937~3088

FrameLength:

10ms

Slotlength:

0.667ms

WCMDA

824~849 869~894

4132~4233 4357~4458

FrameLength:

Slotlength:

0.667ms

850

UL: DL:

10ms

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK QPSKHQPSK QPSKHQPSK QPSKHQPSK QPSKHQPSK

MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

Power

Class

Sensitivity -102dBm -102dBm -100dBm -100dBm -106.7dBm -106.7dBm -106.7dBm -106.7dBm

TDMA Mux 8 8 8 8

Cell

Radius

5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl 3(max+24dBm) 3(max+24dBm) 3(max+24dBm) 3(max+24dBm)

35Km 35Km 2Km 2Km 2Km 2Km 2Km 2Km

24dBm~

-50dBm

24dBm~

-50dBm

8 8 8

24dBm~

-50dBm

24dBm~

-50dBm

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Page 2

2. Specification

2-2. GSM Tx Power Class

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TX Power

control level

6 31±2 dBm 6 31±2 dBm 1 28±3 dBm 1 28±3 dBm

7 29±2 dBm 7 29±2 dBm 2 26±3 dBm 2 26±3 dBm

8 27±2 dBm 8 27±2 dBm 3 24±3 dBm 3 24±3 dBm

9 25±2 dBm 9 25±2 dBm 4 22±3 dBm 4 22±3 dBm

10 23±2 dBm 10 23±2 dBm 5 20± 3 dBm 5 20±3 dBm

11 21±2 dBm 11 21±2 dBm 6 18± 3 dBm 6 18±3 dBm

12 19±2 dBm 12 19±2 dBm 7 16± 3 dBm 7 16±3 dBm

GSM850

33±2 dBm 5 33±2 dBm 0 30±3 dBm 0 30±3 dBm

TX Power

control level

EGSM900

TX Power

control level

DCS1800

TX Power

control level

PCS1900

13 17±2 dBm 13 17±2 dBm 8 14± 3 dBm 8 14±3 dBm

14 15±2 dBm 14 15±2 dBm 9 12± 4 dBm 9 12±4 dBm

15 13±2 dBm 15 13±2 dBm 10 10±4 dBm 10 10±4 dBm

16 11±3 dBm 16 11±3 dBm 11 8±4 dBm 11 8±4 dBm

17 9±3dBm 17 9±3dBm 12 6±4 dBm 12 6±4 dBm

18 7±3 dBm 18 7±3 dBm 13 4±4 dBm 13 4±4 dBm

19 5±3 dBm 19 5±3 dBm 14 2±5 dBm 14 2±5 dBm

15 0±5 dBm 15 0±5 dBm

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Page 3

2. Specification

2-3. LTE General Specification

LTE Band1 LTE Band3 LTE Band5 LTE Band7 LTE Band8 LTE Band 20 LTE Band 40

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Freq.

Band[MHz]

Uplink/

Downlink

ARFCN

range

Tx/Rx

spacing

Channel

Bandwidth

Modulation QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QA

MS Power

(MPR)

Sensitivit

(QPSK)

(BW

10MHz)

1920~1980 2110~2170

UL:

18000~18599

DL:

0~599

190MHz 95MHz 45MHz 120MHz 45MHz 41MHz -

60 MHz 75 MHz 25 MHz 70 MHz 35 MHz

-35~25.7 dBm -35~25.7 dBm -35~25.7 dBm -35~25.7 dBm -35~25.7 dBm -35~25.7 dBm -35~25.7 dBm

-94 dBm -92 dBm -92 dBm -95dBm -95dBm -95dBm -95dBm

1710~1785 1805~1880

UL:

19200~19950

DL:

1805~1880

824~849 869~894

UL:

20400~20649

DL:

2400~2649

2500~2570 1805~1880

UL:

20750~21449

DL:

2750~3449

2500~2570 1805~1880

UL:

21450~21799

DL:

3450~3799

704~716 734~746

UL:

24150~24449

DL:

6150~6449

30 MHz

2300~2400

UL, DL :

2300~2400

5/10/15/20

MHz

Cell

Radius

>5Km >5Km >5Km >5Km >5Km >5Km >5Km

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Page 4

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3. Operation Instruction and Installation

Main Function

Item Description

OS Android V6.0. 1 (Marshmallow)

RF LTE Cat.4 (150/50Mbps)

Battery 3,300mAh

Base Band 1.6GHz Quad

Other RF A-GPS, Glonass, BT4.1 + LE , USB 2.0, WIFI 802.11 b/g/n, NFC

Camera 16MP Main CAM, 5MP VT CAM

LCD 5.5" HD OCTA, 720 x 1280

RAM 2GB RAM + 16GB eMMC

Sensor Accelerometer, Proxy sensor

Charger: 5V/1.5A

Accessory

Data cable: 2.7pi, 1.2m Ear phone: 3.5pi, 4pin

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Page 5

9. Reference Abbreviate

Reference Abbreviate

― AAC: Advanced Audio Coding. ― AVC : Advanced Video Coding. ― BER : Bit Error Rate ― BPSK: Binary Phase Shift Keying ― CA : Conditional Access ― CDM : Code Division Multiplexing ― C/I : Carrier to Interference ― DMB : Digital Multimedia Broadcasting ― EN : European Standard ― ES : Elementary Stream ― ETSI: European Telecommunications Standards Institute ― MPEG: Moving Picture Experts Group ― PN : Pseudo-random Noise ― PS : Pilot Symbol ― QPSK: Quadrature Phase Shift Keying ― RS : Reed-Solomon ― SI : Service Information ― TDM : Time Division Multiplexing ― TS : Transport Stream

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1.Safety Precautions

1-1. Repair Precaution

Before attempting any repair or detailed tuning, shield the device from RF noise or static electricity discharges.

Use only demagnetized tools that are specifically designed for small electronic repairs, as most electronic parts are sensitive to electromagnetic forces.

Use only high quality screwdrivers when servicing products. Low quality screwdrivers can easily damage the heads of screws.

Use only conductor wire of the properly gauge and insulation for low resistance, because of the low margin of error of most testing equipment. We recommend 22-gauge twisted copper wire.

Hand-soldering is not recommended, because printed circuit boards (PCBs) can be easily damaged, even with relatively low heat. Never use a soldering iron with a power rating of more than 100 watts and use only lead-free solder with a melting point below 250°C (482°F).

Prior to disassembling the battery charger for repair, ensure that the AC power is disconnected.

Always use the replacement parts that are registered in the SEC system. Third-party replacement parts may not function properly.

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1.Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution

Many semiconductors and ESDs in electronic devices are particularly sensitive to static discharge and can be easily damaged by it. We recommend protecting these components with conductive anti-static bags when you store or transport them.

Always use an anti-static strap or wristband and remove electrostatic buildup or dissipate static electricity from your body before repairing ESDs.

Ensure that soldering irons have AC adapter with ground wires and that the ground wires are properly connected.

Use only desoldering tools with plastic tips to prevent static discharge.

Properly shield the work environment from accidental electrostatic discharge before opening packages containing ESDs.

The potential for static electricity discharge may be increased in low humidity environments, such as air-conditioned rooms. Increase the airflow to the working area to decrease the chance of accidental static electricity discharges.

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Page 8

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6. Level 1 Repair

6-1. S/W Download

6-1-1. Prepare for S/W Downloading

- Diagram of connection

6-2-2. How to download S/W

1) Downloading Binary Files

• Binary file for downloading SM-J710FN

– AP_XXXX.tar.md5 – BL_XXXX.tar.md5

(file size is about 2.2GB)

2) Prepare for Downloading

• Downloader Program (Odin3 v3.10.exe)

• SM-J710FN Mobile Phone

• Data Cable

• Binary files

3) Boot the mobile phone by pressing ‘Home + Vol Down + Power key at the same time, If you do properly, you can see the following message on the main LCD as the following.

– CP_XXXX.tar.md5 – CSC_XXXX.tar.md5

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6. Level 1 Repair

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) Press the Vol Up Key again, and you will see below message on Main LCD.

“

Downloading...

) Load the binary download program.

”

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Page 10

6. Level 1 Repair

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6. Level 1 Repair

7) Slect the file as above:

– AP_XXXX.tar.md5 – BL_XXXX.tar.md5

– CP_XXXX.tar.md5 – CSC_XXXX.tar.md5

8) Connect mobile and computer. The program show as follow.

9) Now press the button "Start".

10) Now it's time to take a rest and finish the downloading.

11) After finished downloading of phone binary, the mobile phone will restart automatically.

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6. Level 1 Repair

12) Once the device boots up, you can check the version of the binary file or name by pressing the following code in sequence; *#1234#

You can perform Factory Reset by Settings → Accounts → Backup and reset

Caution. Never disconnect during the S/W downloading.

※

6-2 IMEI writing

6-2-1 Preparation

- New IMEI writing Program has been released.

- Supported Model : Models which CAB files are uploaded on HHPsvc INI File

category, instead of ini file.

- Refer to below IMEI writing procedure.

- H/W

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6. Level 1 Repair

- S/W

① Library Install

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To use Daseul, library files should be installed. Refer to SVC Bulletin

“(11-82) Daseul (New IMEI writing Program) Library Install guide_rev1.0”

②Launcher

③ Runtime File

④Model File

DASEUL_SVC_Launcher_v3_0_25 orhighe

-Uploaded on HHPsvc Notice

1. DASEUL_IMEI_ALL_Runtime_3.1.136_r00183 .CAB or higher

-Uploaded on HHPsvc Notice

2. Make ‘ModelName’ folder at the same position with launcher & Runtime file.

Copy Model File underthe ‘Model Name’ folde

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6. Level 1 Repair

6-2-2 IMEI writing Process

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1. Run DASEUL_SVC_Launcher_v3_0_25

2. Select Service Mode

3. Click and Select folder where the Launcher exists

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6. Level 1 Repair

4. Select Model

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5. Check IMEI and click ‘System Setting’

※Once you setup the setting, you don’t have to do it again, unless there is

change. From second run of the IMEI program, check IMEI and click ‘Extract & Run’.

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Page 16

6. Level 1 Repair

6. Check ‘IMEI Write / IMEI Check’, and click ‘IMEI SVC & Repair Option’

①

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②

7. Check ‘SVC , User Ticket No’ and click OK

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Page 17

6. Level 1 Repair

8. Click ‘Hardware Config’

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9. Click ‘Port Setting’

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6. Level 1 Repair

10. Select Port Number and SAVE

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11.Click OK to proceed

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Page 19

6. Level 1 Repair

12. Click Model Info and OK when pop-up shows

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13. Click OK

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Page 20

6. Level 1 Repair

14. Input SKU_CODE, then click OK button. ※ Refer to HHPsvc→IMEI Review to check SKU Code and buyer

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Page 21

6. Level 1 Repair

15. Input IMEI Number and clickApply

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16. Click Start ALL

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Page 22

6. Level 1 Repair

17. Connect the phone to Anyway JIG ※ When you connect the phone, the phone should be turned off. After connecting the phone, the phone will be booted automatically.

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18. IMEI Writing Proceeding

19. IMEI Writing Success

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Page 23

6. Level 1 Repair

6-3. RF Calibration

6-3-1. Required items in order to calibrate RF

Installation program: RF Calibration Program



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- Daseul_Launcher_vx.x.xx.exe

- Daseul_CAL_ALL_Runtime_x.x.xxx.x.CAB

- Model File (

SM-J710F_OPEN_CALIBRATION_Ver_3.1.188.1.CAB

※ It is required to use the latest program.

SM-J710FN



 R&S CMW500  IF Cable (GH81-13326A)

 E3632A PowerSupply

 JIG BOX (GH81-11888A)

 Adapter (GH81-11888K)

Mobile Phone

Table of test cables



GH81-10631A GH81-10952A GH81-11171A

IF Cable

11 pin

7 pin (New)

GH81-11962D GH81-11962G GH81-11962C GH81-11962F

1.35T, Short

1.35T, Long

RF Cable

(Manual)

)

 GPIB Cable (2ea)

 UART Serial Cable

 1.35Φ RF Cable (GH81-11962G 1ea)

7 pin (Old)

1.6T, Short

1.6T, Long

GH81-11962A GH81-11962B GH81-11962E

4 Port Divider

Use / No use

Divider Cable

50Ω terminator

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Page 24

6. Level 1 Repair

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6. Level 1 Repair

6-3-2. RF Calibration Program

1. Run the RF Calibration Program Launcher, 'DASEUL_Launcher_vx.x.xx.exe'.

2. Check the 'Calibration' menu, and select 'Extract & Run'.

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6. Level 1 Repair

3. Check the 'CAL' and, then select 'Start' button.

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6. Level 1 Repair

4. Change the Line Type to 'Block Cell' and disable 'Smart Cloud Cell'.

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6. Level 1 Repair

5. Set the GPIB address of MSTS(CMW500) and Power Supply(E3632A) to enter

'Hardware Config' and 'Save'.

(Check the GPIB address of equipments in advance)

①

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6. Level 1 Repair

②

③

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④

⑤

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6. Level 1 Repair

6. Press 'OK' to start RF Calibration after completing all settings.

①

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