Samsung SGH-E760 Service Manual

GSM TELEPHONE

SGH-E760

GSM TELEPHONE

CONTENTS

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams

7. Flow Chart of Troubleshooting

This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.

ⓒ

Samsung Electronics Co.,Ltd. September. 2005
Printed in Korea.

Code No.: GH68-08106A
BASIC.

1. Specification

1-1. GSM General Specification

GSM900

Phase 1

Freq. Band[MHz]

Uplink/Downlink

ARFCN range 1~124

Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz

Mod. Bit rate

/BitPeriod

Time Slot Period

/FramePeriod

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

890~915
935~960

270.833kbps

3.692us

576.9us

4.615ms

EGSM 900

Phase 2

880~915
925~960

0~124 &

975~1023

270.833kbps

3.692us

576.9us

4.615ms

DCS1800

Phase 1

1710~1785
1805~1880

512~885 512~810

270.833kbps

3.692us

576.9us

4.615ms

PCS1900

1850~1910
1930~1990

270.833kbps

3.692us

576.9us

4.615ms

Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl

Sensitivity -102dBm -102dBm -100dBm -100dBm

TDMA Mux 8 8 8 8

Cell Radius 35Km 35Km 2Km -

1-1

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Specification

1-2. GSM TX power class

TX Power

control level

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

GSM900

TX Power

control level

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

DCS1800

TX Power

control level

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

PCS1900

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

1-2

15 0±5 dBm

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2. Circuit Description

2-1. SGH-E760 RF Circuit Description

2-1-1. RX PART

- FEM(MODULE100)→Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling.

- FEM Control Logic (MODULE100)→Truth Table
VC1 VC2 VC3

Tx Mode (GSM900) H L L
Tx Mode (DCS1800/1900) L H L(H)
Rx Mode (GSM900) L L L
Rx Mode (DCS1800) L L L
Rx Mode (PCS1900) L L H

- VC-TCXO-2146C6(26MHz) (OSC100)

This module generates the 26MHz reference clock to drive the logic and RF.
It is turned on when the supply voltage is applied.
After buffering a reference clock of 26MHz is supplied to the other parts of the system through the transceiver pin
VCXOOUT1.

- Transceiver (U100)

This chip is a RF transceiver IC for GSM850/900, DCS1800, and PCS1900 Quad band cellular system, and incorporates
GPRS transceiver capability, and integrates most of the low power silicon functions of a transceiver.
It incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated
programmable gain amplifier with baseband filter for IQ chains, RF synthesizer, a I/Q modulator, offset PLL, IF
synthesizer, and the circuits which are needed polar loop architecture for the transmitter.

2-1-2. TX PART

Transmitter of the transceiver is capable of GMSK and 8-PSK modulation, providing support for conventional GSM and
GPRS. The modulated signal out of the transceiver is fed into Power Amplifer Module(U101). PAM output signal is
radiated to the air through FEM(MODULE1) and antenna.

2-1

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Circuit Description

2-2. Baseband Circuit description of SGH-E760

2-2-1.. PCF5603 (U405)

―

Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories.

Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing
both board area and system complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

―

Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET to
modulate the intensity of a series of LED’ s or to control a DC/DC converter that drives LCD backlight.

―

Clock Generator

The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD Connector

LCD is consisted of main MAIN LCD, SUB LCD
Chip select signals in the U305, LCD_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD. These
signal is from U400.
16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal
is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output
state to LCD, is required. But this system is not necessary this signal. So "L_WR" signal is used to write data or
commands to LCD. Power signals for LCD are "VDD_IO_HIGH".

2-2-3. Key

This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5213EL1. These signals compose the
matrix. Result of matrix informs the key status to key interface in the PCF5213EL1. Power on/off key is seperated from
the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white
LEDs for sub key and eight white LEDs for main key.

Main and Sub key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED.

2-2

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Circuit Description

2-2-4. EMI ESD Filter

This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.

2-2-5. IF connetor

It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,
AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.

2-2-6. Battery Charge Management

A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.
If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.

2-2-7. Audio

HFR_P and HFR_N from PCF5213EL1 are connected to the main speaker via analog switches. MIC_P and MIC_N
are connected to the main MIC as well. YMU765 is a synthesizer LSI for mobile phones. This LSI has a built-in speaker
amplifier for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are
replayed by a synthesizer.

There is Stereophonic analog output for Headphone.

2-2-8. Memory

This system uses Samsung's memory,
Memory whichcombines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 1Gbit NAND

Flash and 128Mbit Synchronous Burst U tRAM.
It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,
HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.
In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose

different memories.

KBJ10KB00A

.The

KBJ10KB00A

. is a Multi Chip Package

2-2-9. PCF5213EL1

The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn

DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,
32k*16 XYRAM and 63k*16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced
High-performance Bus) bus interface with a write buffer.
HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)
and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap
loader in the ARM core.

2-3

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Circuit Description

HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate.
MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. TOH2600DGI4KRA(26MHz)

This system uses the 26MHz TCXO, VC-TCXO-214C6.AFC control signal form PCF5213EL1 controls requency from
26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU765 and

MV3315DOQ.

2-2-11. Camera DSP(MV3315DOQ)

MV3315DOQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as hardware based real-time JPEG compression and decompression. MV3315DOQ directly transmits and
previews the RGB data to the LCD graphic memory by processing the sensor output data according to the
handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the
host processor to download with scalable sized compressed data.

It utilizes 16 bit data bus for communication with the main processor, including bus interface types.

2-2-12. KXP74

KXP74 is Tri-axis Orthogonal accelerometers and inclinometers.

The KXP74 utilizes an onboard Serial Peripheral Interface (SPI) for digital communication.

PCF5213EL1 apply KXP74 for G- button and game

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3. Exploded View and Parts List

3-1. Exploded View

QFU01

QCA01

QLC01

QMO01

QHI01

QFL01

QSC05

QMW02

QLC02

QAR01

QCR06
QSC07

QVK01

QME01

QRF03
QVO02

QFR01

QKP01

QCA02
QMP01

QAN02

QRE01

QCK02

QIF01

3-1

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QRF01

QCR06

QBA01

Exploded view and Part List

3-2. Parts List

Location No Description Sec Code

QAN02
QAR01
QBA01
QCA01
QCA02
QCK02
QCR06
QFR01
QFU01

QIF01
QKP01
QLC01
QLC02

QME01

QMO01

QMP01

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INTENNA-SGHE760;390-OY359,SGH-E760,8 GH42-00638A
AUDIO-RECEIVER;32ohm,110dB±2dB,10X3 3009-001124
BATTERY-800MAH,BLA,ENG,M;BST5208BE,S GH43-02028A
UNIT-CAMERA;SGH-E760,AU-61C,-,RUSS,2 GH59-02218A
UNIT-CAMERA;SGH-E760,-,-,SER,12V,10m GH59-02229A
PMO-SIDE KEY CAMERA;SGH-E760,ABS+URE GH72-22978A
SCREW-MACHINE;PH(PI2.5),+,M1.4,L3.5, 6001-001155
MEC-FRONT COVER;SGH-E760,EU,-,-,-,-, GH75-07395A
MEC-FOLDER UPPER;SGH-E760,EU,-,-,-,- GH75-07396A
PMO-IF COVER V1;SGH-E760,PC+URETHANE GH72-22976A
MEC-KEY PAD;SGH-E760,EU,-,-,-,-,SIL, GH75-07398A
LCD-SGH-E760-MAIN;LTS180QC-F02,SGH-E GH07-00737A
LCD-SGH-SUB-MODULE;PM09EC015A,SGH-E7 GH07-00741A
UNIT-METAL DOME;SGH-E760,-,-,EU,12V, GH59-02227A
MOTOR DC-SCHX460;DMJBRK32M,SCH-X460, GH31-00036A
PBA MAIN-SGHE760;SGH-E760,XET,EU,PBA GH92-02239A

QMW02

QRE01

QRF01
QRF03

QSC05
QSC07
QVK01
QVO02

QFL01

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QHI01 MEC-HINGE ASSY;SGH-E760,EU,-,-,-,-,S GH75-07551A

PCT-MAIN WINDOW;SGH-E760,ACRYL,TRP,- GH72-22981A
MEC-REAR COVER;SGH-E760,EU,-,-,-,-,B GH75-07399A
MPR-TAPE RF CAP;SGH-E760,PC SHEET,5. GH74-15696A
PMO-EAR COVER V2;SGH-E760,PC,BLK,-,- GH72-23993A
RMO-SCREW CAP L;SGH-E760,URETHANE,3. GH73-04940A
RMO-SCREW CAP R;SGH-E760,URETHANE,3. GH73-04941A
UNIT-VOLUME KEY;SGH-E760,-,-,SER,12V GH59-02228A
PMO-SIDE KEY VOLUME;SGH-E760,ABS+URE GH72-22977A
MEC-FOLDER LOWER;SGH-E760,EU,-,-,-,- GH75-07397A

3-2

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Exploded view and Part List

Description Sec Code

BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634
CBF INTERFACE-DATA LINK CABLE;SGH-D5 GH39-00371A
ADAPTOR-SGHD500 BLK;TAD137EBE,SGH-D5 GH44-00954A
S/W CD-PC LINK CD;SGH-D500,SGH-D500, GH46-00127A
UNIT-EARPHONE;SGH-C230,EM-SS550E-STB GH59-02166A
SPRING ETC-LOCKER;SGH-T108,KSD3509,0 GH61-00028A
LABEL(P)-WATER SOAK;COMM,NORGE,100G, GH68-02026A
MANUAL-WEEE CARD;COMM,SEC,ENGLISH,UN GH68-07013A
MANUAL-USER;SGH-E760,XEG,GERMAN,GERM GH68-07680A
LABEL(R)-MAIN(EU);SGH-E760,EU,POLYES GH68-07758A
CUSHION-CASE MAIN;SGH-E750,PULP,T0.5 GH69-03134A
BOX(P)-UNIT(EU);SGH-E760,SC350+SC350 GH69-03138A
PMO-BATT LOCKER;SGH-E760,PC(K2261),B GH72-22975A
RMO-PBA-MCP-RUBBER;SGH-E760,CR RUBBE GH73-05327A
MPR-BOHO VINYL IF;SGH-E720,#950,85X1 GH74-13606A
MPR-TAPE FPCB HOLE;SGH-E760,PC SHEET GH74-16158A
MPR-TAPE INS KEY TOP;SGH-E760,3M 851 GH74-17312A
MPR-TAPE EMI MAIN KEY;SGH-E760,DTF10 GH74-17453A
MPR-TAPE J/TAG BOHO;SGH-E760,DTF100, GH74-17540A
MPR-TAPE CAMERA KEY;SGH-E760,3M-851, GH74-17546A
MPR-TAPE VOLUME KEY;SGH-E760,3M-851, GH74-17547A
MPR-BOHO VINYL SUB WIN;SGH-E760,PVC, GH74-17759A

3-3

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Exploded view and Part List

3-3. Test Jig (GH80-03306A)

3-3-1. RF Test Cable

(GH39-00283A)

3-3-2. Test Cable

(GH39-00337A)

3-3-4. Power Supply Cable 3-3-5. DATA CABLE

(GH39-00219A)

3-3-3. Serial Cable

3-3-6. TA

(GH44-00954A)

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4. Electrical Parts List

SEC CODE Description Design LOC

ANT102 ANT-CHIP 4202-001064
BAT400 BATT ERY 4302-001177

BTC500 CONNECTOR-HEADER 3711-005829

C100,C102,C103,C111 C-CERAMIC,CHIP 2203-000812

C104 INDUCTOR-SMD 2703-002170

C106,C107,C115 C-CERAMIC,CHIP 2203-002668

C108,C112 C-CERAMIC,CHIP 2203-001259

C116 C-TA,CHIP 2404-001348
C117 C-CERAMIC,CHIP 2203-006190

C118,C119,C131,C133 C-CERAMIC,CHIP 2203-005482

C120,C204,C210 C-CERAMIC,CHIP 2203-000812

C121,U703 C-CERAMIC,CHIP 2203-000654

C122,C126 C-TA,CHIP 2404-001374
C123,C127,C132,C147 C-CERAMIC,CHIP 2203-000628
C124,C128,C135,C201 C-CERAMIC,CHIP 2203-000254

C125,C420 C-CERAMIC,CHIP 2203-000585

C134,C136,C303 C-CERAMIC,CHIP 2203-000438
C137,C140,C407 C-CERAMIC,CHIP 2203-000233

C142,C618 C-CERAMIC,CHIP 2203-000679
C143,C202,C203,C205 C-CERAMIC,CHIP 2203-005482

C144 C-CERAMIC,CHIP 2203-000870

C146 C-CERAMIC,CHIP 2203-006399
C148,C402,C406,C408 C-CERAMIC,CHIP 2203-000628
C200,C306,C400,C401 C-CERAMIC,CHIP 2203-006208
C206,C207,C208,C211 C-CERAMIC,CHIP 2203-005482
C212,C213,C214,C216 C-CERAMIC,CHIP 2203-005482

C300,C626 C-CERAMIC,CHIP 2203-000254

C301,C302,C305,C307 C-CERAMIC,CHIP 2203-005482

C304 C-CERAMIC,CHIP 2203-000725
C308,C311,C312,C315 C-CERAMIC,CHIP 2203-005482

C309 C-CERAMIC,CHIP 2203-000550
C317,C320,C329,C404 C-CERAMIC,CHIP 2203-005482
C321,C412,C501,C507 C-CERAMIC,CHIP 2203-006093

C326,C327,C328 C-CERAMIC,CHIP 2203-005481

C403 C-CERAMIC,CHIP 2203-006090
C405,C414,C415,C423 C-CERAMIC,CHIP 2203-006257

C409,C504,C508 C-TA,CHIP 2404-001268
C411,C413,C416,C421 C-CERAMIC,CHIP 2203-006208
C417,C503,C509,C603 C-CERAMIC,CHIP 2203-005482

C422,C700 C-CERAMIC,CHIP 2203-006208

C424 C-CERAMIC,CHIP 2203-006257

C502 C-CERAMIC,CHIP 2203-000854
C505,C506 C-CERAMIC,CHIP 2203-006562
C600,C615 C-TA,CHIP 2404-001375

C601,C602,C606,C610 C-CERAMIC,CHIP 2203-000278

C604 C-TA,CHIP 2404-001352

C605,C608,C617,C621 C-CERAMIC,CHIP 2203-005482
C607,C619,C627,C628 C-CERAMIC,CHIP 2203-000995
C609,C611,C613,C614 C-CERAMIC,CHIP 2203-006585
C612,C616,C620,C624 C-CERAMIC,CHIP 2203-000278

4-1

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Electrical Parts List

SEC CODE Description Design LOC

C622,C623 C-CERAMIC,CHIP 2203-005057

C625 C-CERAMIC,CHIP 2203-006137
C629,C630 C-CERAMIC,CHIP 2203-000995

C701 C-CERAMIC,CHIP 2203-002443
C702,U713 C-CERAMIC,CHIP 2203-005482

C704 C-CERAMIC,CHIP 2203-006053
C705,C706 C-CERAMIC,CHIP 2203-006093

CN501 CONNECTOR-SOCKET 3710-001994
CN601 JACK-PHONE [phone]

CON1 CONNECTOR-COAXIAL 3705-001358

F101 FILTER-EMI SMD 2901-001254

F104,F105 FILTER-EMI SMD 2901-001347

HEA702 CONNECTOR-HEADER 3711-005873

L103 INDUCTOR-SMD 2703-002314

L104,L105,L109,L110 INDUCTOR-SMD 2703-002365

L107 INDUCTOR-SMD 2703-002596
L119 INDUCTOR-SMD 2703-001752

L123,L124 INDUCTOR-SMD 2703-002208

L400 CORE-FERRITE BEAD 3301-001120
L401 INDUCTOR-SMD 2703-002840

L600,L601,L602,L603 INDUCTOR-SMD 2703-001259

L700 CORE-FERRITE BEAD 3301-001534
LED600,LED601,LED602 LED 0601-002055
LED603,LED604,LED605 LED 0601-002055
LED606,LED607,LED608 LED 0601-002055
LED609,LED610,LED611 LED 0601-002055
LED612,LED613,LED614 LED 0601-002055
LED615,LED616,LED617 LED 0601-002055

MIC600 MIC-CONDENSOR 3003-001107

MODULE1FILTER 2911-000007

OSC100 OSCILLATOR-VCTCXO 2809-001281
OSC400 CRYSTAL-UNIT 2801-004373

Q100,Q101,Q102,Q103 TR-DIGITAL 0504-001151

R100,R101,R102,R104 R-CHIP 2007-000162

R105 R-CHIP 2007-000173
R108,R200,R307,R504 R-CHIP 2007-000148
R110,R118,R120,R127 R-CHIP 2007-000171

R121,R125 R-CHIP 2007-007014

R122,R124,R128,R131 R-CHIP 2007-000170

R123 R-CHIP 2007-001303
R130,R132,R134,R201 R-CHIP 2007-000171

R133,R608,R615,U709 R-CHIP 2007-000138

R203,R204,R600,R603 R-CHIP 2007-000242

R205 R-NETWORK 2011-001394

R206 R-CHIP 2007-000143
R208,R209,R213,R308 R-CHIP 2007-000171

R302 R-CHIP 2007-001325
R303,R306,R404,R501 R-CHIP 2007-000162
R312,R316,R317,R618 R-CHIP 2007-000171

R400 R-CHIP 2007-007592

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Electrical Parts List

SEC CODE Description Design LOC

R401,R512 R-CHIP 2007-007334

R402 R-CHIP 2007-007100

R409,R607,R612 R-CHIP 2007-002796

R500,R502 R-CHIP 2007-000758

R503,R509,R613,R700 R-CHIP 2007-000162

R505,R506 R-CHIP 2007-000170

R507 R-CHIP 2007-000152

R510,R616 R-CHIP 2007-007573

R511 R-CHIP 2007-000137

R513 R-CHIP 2007-008275

R514 R-CHIP 2007-007875

R515,R516 R-CHIP 2007-008531
R517,R518 R-CHIP 2007-008542
R601,R610 R-CHIP 2007-000148

R602,R604,R605,R606 R-CHIP 2007-000151

R609,R611 R-CHIP 2007-000242

R614 R-CHIP 2007-001339

R617 R-CHIP 2007-007480
R701,R702,R703,R704 R-CHIP 2007-002970
R705,R706,R707,R708 R-CHIP 2007-002970
R709,R710,R711,R712 R-CHIP 2007-002970

R720 R-CHIP 2007-000162
R721,R722,R723,R724 R-CHIP 2007-002970

R725,R726 R-CHIP 2007-002970

SIM400 CONNECTOR-CARDEDGE 3709-001384

U100 IC 1205-002709

U101 IC-RF 1201-002223

U103,U303 IC 0801-002237

U200 IC 1205-002647

U300 IC-IMAGE GH13-00030A

U301 IC 1204-002138

U302 MEMORY 1108-000022

U306 IC 1209-001618

U307 IC 0801-002882

U400 IC 1203-003568

U401 IC 1203-002837

U500 DIODE-TVS 0406-001188

U501 FILTER-EMI SMD 2901-001315

U502 TR-DIGITAL 0504-001151

U503 IC 1203-003742

U504 IC 1203-003737

U602,U605,U606 IC 1001-001231

U603 IC 1202-001068

U700 IC 1203-003754

U701 IC 1009-001010

U702 FET-SILICON 0505-001469

U711 RF-MODULE 4709-001374

U712 IC 1201-002241

V300,V301,V302,V400 VARISTOR 1405-001082

V401,V703 VARISTOR 1405-001133

4-3

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Electrical Parts List

SEC CODE Description Design LOC

V500 THERMISTOR 1404-001221

V601,V602,V702,V705 VARISTOR 1405-001082

ZD500 DIODE-ZENER 0403-001547

ZD501 DIODE-ZENER 0403-001427
ZD502,ZD600,ZD602 DIODE-TVS 0406-001203
ZD601,ZD700,ZD701 DIODE-TVS 0406-001208

4-4

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5. Block Diagrams

5-1. RF Solution Block Diagram

5-1

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