Samsung SF 4700 Service Manual

SAMSUNG FACSIMILE

SF-4700

SERVICE

Manual

FACSIMILE CONTENTS

1. Precautions

2. Specifications

3. Installations

4. Disassembly

5. List of Abbreviations

6. Circuit Descriptions

7. Troubleshooting

8. Exploded Views & Parts List

9. Electrical Parts List

10. Connection Diagrams

11. Pcb Diagrams

12. Schematic Diagrams

ELECTRONICS

© Samsung Electronics Co.,Ltd. JUNE 2000
Printed in Korea.
VERSION NO. : 2.00 P/N.: JB-0002A

1. Precautions

1-1 Safety Precautions

1. Be sure that all built-in protective devices are in
place. Restore any missing protective shields.

2. Make sure there are no cabinet openings through
which people- particularly children- might insert
fingers or objects and contact dangerous
voltages.

3. When re-installing chassis and assemblies, be sure
to restore all protective devices, including control
knobs and compartment covers.

4. Design Alteration Warning:
Never alter or add to the mechanical or electrical
design of this equipment, such as auxiliary
connectors, etc. Such alterations and
modifications will void the manufacturer’s
warranty.

5. Components, parts, and wiring that appear to
have overheated or are otherwise damaged should
be replaced with parts which meet the original
specifications. Always determine the cause of
damage or overheating, and correct any potential
hazards.

6. Observe the original lead dress, especially
near sharp edges, AC, and high voltage power
supplies. Always inspect for pinched,
out-of-place, or frayed wiring. Do not change
the spacing between components and the
printed circuit board.

7. Product Safety Notice:
Some electrical and mechanical parts have
special safety-related characteristics which might
not be obvious from visual inspection. These safe­ty features and the protection they provide could
be lost if a replacement component differs from
the original. This holds true, even though the
replacement may be rated for higher voltage,
wattage, etc.

Components critical for safety are indicated in the
parts list with symbols . Use only replace-

ment components that have the same
ratings, especially for flame resistance and dielec­tric specifications. Areplacement part that does
not have the same safety characteristics as the
original may create shock, fire, or other
safety hazards.

1-1

Follow these safety, ESD, and servicing precautions to prevent personal injury and equipment damage.

Samsung Electronics

1-2 ESD Precautions

Certain semiconductor devices can be easily
damaged by static electricity. Such components are
commonly called “Electrostatically Sensitive (ES)
Devices”, or ESDs. Examples of typical ESDs are: inte­grated circuits, some field effect transistors, and semi­conductor “chip” components.
The techniques outlined below should be followed to
help reduce the incidence of component damage
caused by static electricity.

CAUTION: Be sure no power is applied to the chas-

sis or circuit, and observe all other safety
precautions.

1. Immediately before handling a semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
employ a commercially available wrist strap
device, which should be removed for your person­al safety reasons prior to applying power to the
unit under test.

2. After removing an electrical assembly equipped
with ESDs, place the assembly on a conductive
surface, such as aluminum or copper foil, or
conductive foam, to prevent electrostatic charge
buildup in the vicinity of the assembly.

3. Use only a grounded tip soldering iron to solder or
desolder ESDs.

4. Use only an “anti-static” solder removal device
Some solder removal devices not classified as
“anti-static” can generate electrical charges
sufficient to damage ESDs.

5. Do not use Freon-propelled chemicals. When
sprayed, these can generate electrical charges suffi­cient to damage ESDs.

6. Do not remove a replacement ESD from its
protective packaging until immediately before
installing it. Most replacement ESDs are
packaged with all leads shorted together by
conductive foam, aluminum foil, or a
comparable conductive material.

7. Immediately before removing the protective short­ing material from the leads of a
replacement ESD, touch the protective material to
the chassis or circuit assembly into which the
device will be installed.

8. Maintain continuous electrical contact between the
ESD and the assembly into which it will be
installed, until completely plugged or soldered
into the circuit.

9. Minimize bodily motions when handling unpack­aged replacement ESDs. Normal motions, such as
the brushing together of
clothing fabric and lifting one’s foot from a
carpeted floor, can generate static electricity
sufficient to damage an ESD.

1-2

Precautions

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2-1

2. Specifications

2-1 Printer Engine

2-2 Head

Technology

Speed Color

Mono

Resolution

Color
Mono

Printing Width

Feeding Method

Automatic

Manual Tray
Emulation
Printer Driver
Inter Face

Thermal Inkjet
2-pen & Print Head Swapping Type

4.5ppm at Draft Mode
9ppm at Draft Mode
600 x 600 dpi (1200 x 1200 dpi Addressable)
600

x 600 dpi (1200 x1200 dpi Addressable)

203mm
150 Sheets of 20lb cut sheets ( Max 15.5mm )
Yes
Host Based Printing (GDI)
Windows 98/2000 Driver
IEEE1284

Babbage mono standard Birch color
Print Head 208 nozzles 192 nozzles
Ink type Pigment Dye
Ink Color Black Color
Ink Yield about 600 sh. about 200 sh.

Samsung Electronics

2-2

2-3 Facsimile

Specifications

(*3) Monochromatic CCITT NO. 1 CHART can be saved by 80 sheets per 1.0M Byte.

Compatibility
Scan method
Scan width
Scan Resolution
Scan Speed
Feeding method
ADF
Guide
Stacker
Paper Tray
Modem Speed
Coding Method
LCD

Resolution & Type

Contrast
Capacity (*3)
Back-up Time
Confidential
Forced Memory Tx.
Memory Rx.

ITU-G3
CIS
Max. 216mm, Effective: 210mm
300

x 300 dpi

9 sec
Front input Front output(C-path)
30 sheets of 20lbs
Document Input Guide
Document Output Stacker/Paper Stacker
Paper out Tray

14.4 Kbps
MH, MR, MMR
2 Lines Each of 16 Characters

- Standard : 203

x 98 dpi

- Fine : 203 x196 dpi (Default)

- Superfine : 300 x 300 dpi
Darkest/Darken/Normal/Lighten/Lightest

0.5 Mbyte user memory
15 sec (Continuous Power Failure)
No
Yes
Automatic reception when paper empty.

GENERAL

SCANNING

MEMORY

Samsung Electronics

2-3

2-3 Facsimile (continued)

Specifications

Speed Dial
Chain Dial
On-hook Dial
Last Number Redial
Auto Redial
Hold & Mute
Pause
Ringer Volume
Tone/pulse Select
DRPD
TX/RX Journal
Image TCR
System Data
Tel Number List
Self Test
Multipage Copy
Gray Scale
Reduction &

Enlargement
Answering I/F
Ext. Phone
Sensors
Real Time Clock
RTI

50 Locations
No
Yes, 1-Key
Yes, 1-Key
Yes
No
Yes, Use Redial/Pause Key
S/W Option Setting (4Steps)
Tone only
US : Yes, Other Country : No
Yes
Yes, Reduction of First Page Sent by Memory Tx
Yes
Yes
Yes
Upto 99 Pages
256 Levels
25%~200%

(Reference is the top center of Document)
Yes
1-jack, Extension Phone Transfer
Paper Jam
Yes
Yes

TELEPHONE

REPORT &
LIST

COPY

TEL I/F

OTHERS

Samsung Electronics

2-4

2-4 Scanner

Specifications

Compatibility TWAIN
Technology Platen CIS
Light Source for Color CIS RGB LEDs (Line Order Control)

2-5 Power & Size

2-6 Accessaries

Power Source 110V~240V/50Hz~60Hz,
Dimensions (W T D T H) 439 X 360 X 235 mm
Weight 6.9Kg

Tel Line
Power Cord
FAX Driver
Ink Cartridge
Manual
Carrier Sheet

1EA
1EA
1 CD - ROM
INK-M50 (MONO) 1EA, INK-C60 (COLOR) 1EA
Yes
Yes (with Tick Mark : A5 Size)

Samsung Electronics

3-1

3. Installations

1. Pull the document tray upward. 2. Fold out the extender on the document tray.

3-1 Document Tray

3-2 Document Exit Tray

1. Insert the two tabs on the document exit tray into
the slots on the front of your machine.

2. Fold out the extender, if necessary.

ocument exit tray

Extender

3-3 Telephone Line

Plug one end of the telephone line cord into the TEL
LINE jack and the other end into a standard phone
wall jack.

Samsung Electronics

3-2

Installations

3-4 Extension Phone (Optional)

Plug one end of the modular cord into the EXT.TEL
jack on the back of your machine.

Plug the other end of the cord into a modular
jack on a telephone answering device or a regular
telephone to use as an extension.

3-5 AC Power Cord

Plug one end of the cord into the back of the
machine and the other end into a standard,
grounded 3-prong AC power outlet.

The machine turns on. All lamps on the control
panel light up and the LCD displays ‘SYSTEM
INITIAL’ then ‘PAPER OUT’. Load the paper as
described on page 3-4.

If you want to turn it off, unplug the power cord.
Note : If documents are deleted from memory due

to a power failure, the machine automatically
prints out a Power failure report after power is
supplied.

Samsung Electronics

3-4

3-7-1 Print Cartridge

1. When you install a new print cartridges.
Press SETUP,MENU & START button.
Lift the control panel 1 with your hand and open
the cartridge compartment cover 2.

2. If you are replacing used cartridges, remove the old
cartridges.
Press SETUP,MENU & START button.
Pull the print cartridges handle toward you until
you hear a click, then remove the print cartridges.

3. Remove the new print cartridges from its packag­ing. Hold the print cartridges by the black areas or
colored top only. Do not touch the copper area.

4. Carefully remove the tape covering the printhead.
Be sure to remove all the tape.

5. Insert the print cartridges in the carrier.

3-7 Installing Print Cartridge

Installations

Cartriidge compartment cover

Control panel

Cartridge handle

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4-1

4. Disassembly

4-1 General Precautions on Disassembly

When you disassemble and reassemble components, you must use extreme caution. The close proximity of cables
to moving parts makes proper routing a must. If components are removed or replaced, any cables
disturbed by the procedure must be replaced as close as possible to their original positions. Before removing any
component from the machine, note the cable routing that will be affected.

Whenever servicing the machine, you must perform as follows:

1. Check to verify that documents are not stored in memory.

2. Move the printer cartridge to far right to cap the nozzle.

3. Unplug the power cord.

4. Use a flat and clean surface.

5. Replace only with authorized components.

6. Do not force plastic-material components.

7. Make sure all components are in their proper position.

1. Lift the control panel using hand.

2. Push the bushing on both ends of the roller
slightly inward, then rotate it until it reaches the
slot as shown below. Then lift the roller out.

Note : Check the roller for any dirt. If dirty, wipe it

off with soft cloth dampened with water. If
the roller is heavily worn, replace it with a
new one.

4-2 White Roller Ass’y

Bushing

White roller

Control panel

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4-2

Disassembly

4-3 Top Cover Ass’y

1. Lift the control panel and open the print cartridge compartment cover. Remove the white roller ass’y. Remove
the six screws shown below.

2. Remove the three screws shown below.

Cartridge compartment cover

Control panel

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4-3

Disassembly

3. Open the outer guide.

4. Take out the top cover ass’y.

5. Remove the two screws securing the speaker.

Outer guide

Top cover ass’y

Outer guide

Top cover ass’y

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4-4

Disassembly

4-4 ASF Frame Ass’y

4-4-1 Rollers (ADF Roller, Drive Roller, Exit

Shaft)

1. Before you disassemble the rollers, you should
remove:

– Top Cover Ass’y (see page 4-3)

2. Take out the rollers from the ASF Frame ass’y.

Note : Clean the surface of the rollers with ethyl alco-

hol. After wiping them, you must dry them
completely.

4-4-2 CIS (Contact Image Sensor)

1. Before you disassemble the CIS, you should
remove:

– Top Cover Ass’y (see page 4-3)

2. Remove the drive roller as described in ‘4-4-1
Rollers’.

3. Remove the one screw securing the CIS ass’y and
unplug the CIS harness. Take out the CIS ass’y.

4. Turn the CIS ass’y over. Remove the one screw to
release the CIS from the bracket.

Note: Be careful not to lose the springs.

Note : Check the glassy surface of the CIS for any

stain or scratch. If stained, wipe off with ethyl
alcohol. If it is heavily stained or scratched,
replace it with a new one.

Exit shaft

Drive roller

ADF roller

CIS

Bracket

Spring

CIS harness

Drive roller

CIS ass’y

Drive roller

Exit shaft

ADF roller

CIS harness

Drive roller

CIS ass’y

CIS

Bracket

Spring

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4-5

Disassembly

4-4-3 Scan Motor

1. Before you disassemble the Scan Motor, you should
remove:
– Top Cover Ass’y (see page 4-3)

2. Unplug the motor connector from the main PBA.
Make sure the harness is released from one hooks
securing the harness as shown below.

3. Remove the two screws as shown below and take
out the scan motor ass’y.

4. Remove the two screws securing the motor to the
motor bracket.

Main PBA

Motor harness

Hook

Scan motor ass’y

Motor bracket

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4-6

Disassembly

4-4-4 SMPS

1. Before you disassemble the SMPS, you should
remove:

– Top Cover Ass’y (see page 4-3)

2. Unplug the SMPS connector from the Main PBA.
Make sure the harness is released from the hook as
shown below.

3. Remove the one screw securing the ground wires to
the parallel unit as shown.

4. Pushing down the hooks on both ends, pull out
the SMPS.

SMPS connector

SMPS ground wire

LIU ground wire

Hook

SMPS

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4-7

Disassembly

4-4-5 LIU PBA

1. Before you disassemble the LIU PBA, you should
remove:
– Top Cover Ass’y (see page 4-3)

2. Remove the one screw securing the ground wires
to the parallel unit.

3. Unplug the LIU connector from the Main PBA.

4. Unplug all the connectors from the LIU PBA.

5. Pulling the snap fits locking the PBA outward,
push up the LIU PBA.

SMPS ground wire

LIU ground wire

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4-8

Disassembly

4-4-6 Scan Lawer Frame

1. Before you disassemble the SMPS, you should
remove:

– Top Cover Ass’y (see page 4-3)
– OPE Unit (see page 4-11)

2. Unplug the all connector(CIS, Scan Motor)from

the Main PBA.

3. Remove the two screws as shown below and take

out the Scan Lawer Frame.

4-4-7 Parallel Unit

1. Before you disassemble the SMPS, you should
remove:
– Top Cover Ass’y (see page 4-3)

2. Unplug the one connector and remove two screw
shown below, and take out the Parallel Unit.

Scan lawer frame

Parallel unit

Parallel harness

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4-9

Disassembly

4-4-8 SMPS Frame

1. Before you disassemble the LIU PBA, you should
remove:
– Top Cover Ass’y (see page 4-3)
– SMPS (see page 4-6)
– LIU PBA (see page 4-7)
– Parallel Unit (see page 4-8)

2. Remove the two screws as shown below and take
out the SMPS Frame.

4-4-9 ASF Cassette Ass’y

1. Pull out the ASF Cassette ass’y.

SMPS frame

ASF cassette ass’y

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4-10

4-5-1 ADF Rubber Pad

1. Open the OPE unit.

2. Insert a flat blade screw driver into the slot as
shown below, and release the latches. Take out the
rubber holder, sheet ADF and the rubber pad.

Notes:

• When you reassemble the rubber pad, be sure that
the rubber pad, sheet ADF and holder fit into the
guide boss and the holder latches fit into the
corresponding hole. Then push firmly until it clicks.

• Clean the surface of the rubber pad with ethyl alco­hol. After wiping it, be sure to dry it.
Check the rubber wear. If the wear reaches 1/2
its original thickness, replace it with a new one.

Rubber holder

OPE unit

Rubber pad

Guide boss

Disassembly

4-5 OPE Ass’y

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4-11

Disassembly

4-5-2 OPE Unit

1. Before you disassemble the OPE unit, you should
remove:

– Top Cover Ass’y (see page 4-3)

2. Turn the tie stopper 90 degrees as shown below and
take out the OPE unit.

4-5-3 Roll Pinch

1. Before you disassemble the OPE unit, you should
remove:

– OPE Unit (see page 4-10)

2. Remove the four screw securing the OPE Unit.

3. Turn the upper scan frame of the OPE Unit over.

4. Remove the three screws and take out the spring

pinch. Then take out the roll pinch.

Tie stopper

OPE unit

Spring pinch

Roll pinch

Upper scan frame

Samsung Electronics

4-12

Disassembly

4-5-4 OPE PBA

1. Before you disassemble the OPE PBA, you should
remove:
– OPE Unit (see page 4-11)

2. Remove the four screws securing the OPE unit.

3. Remove the nine screw and take out the PBA with
LCD.

Notes:

• Do not turn the OPE unit upside down after you

remove the screws securing the PBA. Keys and rub­ber contacts may be separated and easily lost.

• When you reassemble the OPE unit, make sure the

keys are in correct position.

• When you reassemble the PBA, secure the screws

according in the order of the number printed on the
PBA.

• After reassembling, operate the machine to make

sure it works properly.

• After reassembling, make sure the LCD is not

blocked.

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4-13

Disassembly

4-6-1 Mechanism Unit

1. Before you disassemble the Mechanism unit, you
should remove:
– Top Cover Ass’y (see page 4-3)

3. Remove the three screws securing the printer unit,
and unplug the eleven connectors from the Main
PBA. Take out the Mechanism unit.

Note: When you reassemble the unit, do not pinch or

short the wire harness.

4-6-2 Main PBA

1. Before you disassemble the Main PBA, you should
remove:
– Top Cover Ass’y (see page 4-3)

2. Remove the two screw securing the Main PBA.

3. Unplug all connectors from the Main PBA.

4. Pull the sensor lever towards you and take out the
Main PBA.

Main PBA

Print Head

SMPS

Parallel Unit

CR
Motor

TX
Motor

Paper
Sensor

LF
Motor

Door open
Sensor

CIS

Speaker

USB
OPE

LIU

4-6 Mechanism Ass’y

Main PBA

Sensor lever

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4-14

Disassembly

4-6-3 Home Ass’y

1. Before you disassemble the home ass’y, you should
remove:
– Mechanism Unit (see page 4-13)

2. Pushing the both ends of the home ass’y, take out
the ass’y in the direction of arrow.

4-6-4 Carriage Ass’y

1. Before you disassemble the carrier ass’y, you
should remove:

– Mechanism Unit (see page 4-13)

2. Take out FRC cable from the main PBA, take out 2
CR springs that fix CR shaft, and then separate
carriage Assembly.

Home ass’y

CR shaft

FPC cable

Carriage ass’y

Samsung Electronics

4-15

Disassembly

4-6-5 Base Frame Ass’y

1. Before you disassemble the home ass’y, you should
remove:
– Mechanism Unit (see page 4-13)
– Home Ass’y (see page 4-14)
– Carriage Ass’y (see page 4-14)

2. Remove the friction ass’y, then take out the
actuator feed.

3. Remove the holder roller.

4. Pull out the base frame ass’y.

Friction ass’y

Actuator feed

Holder roller

Base frame ass’y

Samsung Electronics

4-6-6 Feed Roller Ass’y

1. Before you disassemble the feeder roller ass’y, you
should remove:
– Mechanism Unit (see page 4-13)
– Base Frame Ass’y (see page 4-15)

2. Remove the bearing feed from the main frame. Pull
the feeder roller in the direction of arrow and take
it out.

4-6-7 Line Feeder Bracket Ass’y

1. Before you disassemble the line feeder bracket
ass’y, you should remove:
– Mechanism Unit (see page 4-13)
– Feed Roller Ass’y (see page 4-16)

2. Remove the two screws and take out the LF brack­et ass’y.

LF bracket ass’y

Feed roller

Bearing feed

4-16

Disassembly

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Samsung Electronics

5-1

5. List Abbreviations

Acrynym Definition

MFP MULTI FUNCTION Peripheral
I/F INTERFACE
UART Universal Asynchronous Receiver/Transmitter
ECP Extended Capabilities Port
CR CARRIAGE RETURN
LF LINE FEED
SCANIP SCAN IMAGE PROCESSOR
CIS CONTACT IMAGE SENSOR
A/D ANALOG TO DIGITAL
D/A DIGIT ALTO ANALOG
LIU Line Interface Unit
TIT Transformer Input from Transformer
ROT Receive Output Transformer
LI Line Input

Samsung Electronics

6-1

6. Circuit

6-1 SF-4750C Main PBA

6-1-1 Summary

The main circuit that consists of CPU, MFP
controller (built-in 32bit RISC processor core:
ARM7TDMI) including various I/O device
drivers, system memory, scanner,printer,

motor driver, PC I/F, and FAX transceiver controls
the whole system. The entire structure of the main
circuit is as follows:

Fig.6-1-1. Entire Structure of Main Circuit for Each Key Signal

OPE-TXD

MA0~MA14

/WE

/OE
MD0~MD7

TMIA1

TMIA0
TMIB0

TMIB1

OK2PRINT
/P_EXIT
/RING_DET

/HOOK_OFF

CIS_CLK
CIS_SH

/SPK_CTL

PREHEAT

_M

PREHEAT

_C

CIS-SIG

VREFADC
VREFDAC

VOL0
VOL1
VOL2

CML_ON

/DRAM_EN

ICML1

GLED
RLED
BLED

OPE-RXD

MCLK(38MHz)
/POR

/ROMCS

/RD, /WR

D0~D15

D0~D15

D0~D7

A0~A17

A0~A9

A0~A4

/MODEM-RST

/USB-RST

/USB-CS

/USB-XDDCK

/USB-XDREQ

/USB-INT

/MCS

/MIRQ

/RD, /WR

/RASO

/WR

/UCAS,

/LCAS

/F-POR

MORK(38MHz)

/XDACK
/XDREQ

/IP-CS

/RD, /WR

D0~D15

A0~A5

/TX-INT

LFPHA

MFP

CONTROLLER

(KS32C6400)

LFPHB

LFIA0
LFIA1
LFIB0
LFIB1

DIR

PWM

CHX
CHY

/HEAD-EN

/HGA1~/HGA13

HOE1~HOE16

/FAULT-TEST

BIASOFF

/RST-OUT

/RST-OUT

FLASH

MEMORY

(4M bit)

DRAM

(16M bit)

MODEM

SCAN

IMAGE

PROCESSOR

LF MOTOR

DRIVER

SRAM

CIS

CR MOTOR

DRIVER

CR

EN CORDER

PRINT HEAD

DRIVER &

PRINT

CONTROL/

CIRCUIT

OPE

TX MOTOR

DRIVER

/OPE-RST

C_HEAD DATA

Backup

Power

USB

Controller

VBUS
USBDP
USBDM

PULLUP

VB

48MHz CLK

Samsung Electronics

6-2

6-1-2 MFP Controller (KS32C6400 : U26

MFP Controller consists of CPU(ARM7TDMI RISC
processor), 4K-byte cache, data and address buses,
serial communication part with OPE(OPERATION
PANEL) print head controller, USB interface, external
DMA part to receive data from external color image
processor (SCANIP), LF/CR motor diver
controller and I/O controller.

6-1-2-1. SYSTEM CLOCK

The internal clock frequency is 38MHz. 38MHz
system clock (MCLK) supplied from the outside is
used without being divided inside.

6-1-2-2. DATA & ADDRESS BUS CONTROL

• /RD & /WR
/RD & /WR signals are synchronized with
MCLK(38MHz) and become LOW ACTIVE.
These signals are strobe signals used to read and
write data when each CHIP SELECT is connected

with /RD and /WR pin of RAM, ROM, USB,
MODEM and the outside devices and becomes
active.

• CHIP SELECT (/IP_CS, /ROMCS, /USB_CS,
/MCS)

- /IP-CS : SCANIP(U29) CHIP SELECT (LOW

ACTIVE)

- /ROMCS : ROM/FLASH MEMORY(U31) CHIP

SELECT (LOW ACTIVE)

- /USB_CS : USB (U43) CHIP SELECT (LOW

ACTIVE)

- /MCS : MODEM(U37) CHIP SELECT (LOW

ACTIVE)
When each CHIP SELECT is low, data can be read or
written.

• D0 - D15

- 16bit data bus

• A0 - A17

- ADDRESS BUS (A18 - A21 are reserved.)

Circuit

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6-3

6-1-2-3. OPE Serial Communication Part

UART (Universal Asynchronous
Receiver/Transmitter) at KS32C6400 enables the main
and OPE to transmit serial

data. The block diagram of UART is as follows: (Fig.6­1-2) KS32C6400 has 2 UART channels. The baud rate
is 9600bps.

Circuit

TxD

TxD

RxD

IRS

RE

IR Tx

Encoder

IR Rx

Decoder

0

0

1

1

RxD

UART

Block

Fig.6-1-2. UART BLOCK DIAGRAM

TXD :

START D0 D1 D2 D3 D4 D5 D6 D7 STOP

RXD :

START D0 D1 D2 D3 D4 D5 D6 D7 STOP

Fig.6-1-3 UART DATAFORMAT

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6-4

6-1-2-4. EXTERNAL DMA BLOCK

It brings data from external devices (SCANIP:U29 ,
USB:U43) using DMA channel 0,1. DMA REQUEST
sent from an external device to KS32C6400 activates
DMAACKNOWLEDGE signal and drives DMA
channel 0 to produce CHIP SELECT and READ
STROBE (/RD) at the external

device and bring data from it. It generates address of
destination memory, CHIP SELECT and WRITE
STROBE (/WR) in order to move this data into
destination memory, and then stores the data.

Circuit

MCLK

/XDREQ

/XDACK

D[15:0]

/RD

/WR

Fig.6-1-4 EXTERNAL DMATIMING DIAGRAM

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6-5

6-1-2-5. DRAM CONTROLLER

As KS32C6400 has DRAM controller in it, DRAM can
be connected with external memory.
The control mode of DRAM controller enabling
EARLY WRITE, NORMAL READ, PAGE MODE, and
BYTE/HALF WORD ACCESS supports EDO DRAM
as well as normal DRAM. DRAM READ/WRITE sig­nals are /RD and /WRsignals used to control system

buses. It supports CAS BEFORE RAS for DRAM
REFRESH and self-refresh mode for DRAM backup.
Connected with common /LCAS, /UCASand RAS
[1:0], it consists of 2 banks. Though each may be con­nected with up to 1M - 4M halfword, two (2) of 512
Kbytes are
connected for this product.

Circuit

Samsung Electronics

6-6

6-1-2-6. INKJET HEAD CONTROLLER

This part produces major control signals used to drive
INKJET head. It consists of signals to drive head noz­zles, /HGA[13:1], HOE[16:1], /FAULT-TEST, /HEAD­EN, and BIASOFF, and consists of signals to check the
status of the head, HEAD-DATA.

It has double height print head, system 208 nozzles
for mono and 192 nozzles for color, and uses
/HGA[13:1], HOE[16:1] signals and /HEAD-EN to
drive these nozzles. Fig.5-1-8 is timing diagram of
each signal.

/HGA

Signal

HOE

Signal

Fire Enable Timer

Pre-Heat Pulse Width

Front End Delay Back End DelayPr-Heat Delay Width

Fire Pulse Width

t

p (PD)

Fig.6-1-5 Timing Diagram to Drive Head

Circuit

Samsung Electronics

6-7

Circuit

The above control signals are sent to head driver and
the head driver converts these signals to the level
(+11.75V) to drive head nozzles.

6-1-2-7. PRINTER MOTOR CONTROLLER (CRPHA,

CRPHB, CRIA0, 1, CRIB0, 1, LFPHA, LFPHB,
LFIA0, 1, LFIB0, 1)

MFP Controller (KS32C6400:U26) supports both DC
motor and stepper motor. It controls CR (Carriage
Return) motor used to print documents and LF (Line
Feed) motor used to feed and eject paper.
CR motor controller can support 75, 150, 200, 300,
600, or 1200dpi according to resolution, while LF

motor controller supports uni-polar and bi-polar
according to the kind of motors. Though full step, half
step and software control are possible for both, CR
motor is controlled DC control block and LF motor is
controlled half step and quarter step here.

/HEAD-EN

/HGA1
/HGA2

/HGA3
/HGA4
/HGA5

/HGA6
/HGA7
/HGA8

/HGA9
/HGA10
/HGA11

/HGA12
/HGA13

(Tp)

HOE1-

HOE16

Fig.6-1-6. Timing Diagram for Each Nozzle

Samsung Electronics

6-8

6-1-2-8. I/O PORT FOR KS32C6400

PIN NAME

PIN NO

I/O PORT NAME

DESCRIPTION FOR STATE

GOP0/TXD1
GOP1/TXD2
GOP2/nEDACK
GOP3/TONE
GOP4/nRST0
GOP5/nIOWR1
GOP6/nIOWR2
GOP7/nIORD1
GOP8/DRV–SDO
GOP9/CLKOUT
GOP10/FIRE­PULSE
GOP1 1/nHSC
GOP12/nEDACK
2
GOP13/nECS3
GIP0/nRXD1
GIP1/nRXD2
GIP2/nEINT1
GIP3/nEINT2
GIP4/nEDREQ
GIP5/UCLK
GIP6/nEWT3
GIOP0/TCK
GIOP1/TMS
GIOP2/TDI
GIOP3/nTRST
GIOP4/TDO
GIOP5
GIOP6
GIOP7/nWAIT

121
123
138
148
149
133
154
155
152
151
150
153
128

42
122
124
135
136
137
127

41
126
125
120
116
115
103

38

31
145
146

DP

OPE_TXD

/XDACK

KEYCLICK

WATCHDOG

/FAULT_TEST

/OPE_RST

BIASOFF

/RST_OUT

CLK_OUT

TONE_CTL
/C_HEAD_EN
/USB_XDACK

RESERVED
RESERVED

OPE_RXD

/MIRQ

TX_INT

/XDREQ

/USB_XDREQ

/USB_INT

TCK
TMS

TDI

/TRST

TDO

/MODEM_RST

RECALL

/M_HEAD_EN

/USB_RST

RX_CTL

DIAL PULSE ON

DIAL PULSE OFF:IDLE STAT

SERIAL DATAFROM KS32C6400 TO OPE MICOM

–

DMAACKNOWLEDGE TO SCAN IP

KEYCLICK TONE

WATCHDOG RESET OFF WATCHDOG RESET

– TEST PRINT HEAD FAULT

OPE RESET OFF OPE RESET

PRINT HEAD BIAS OFF PRINT HEAD BIAS ON

RESET OFF RESET ON

OUTPUT WITH 38.00053MHz

LINE MONITORING KEYCLICK

DISABLE COLOR PRINT HEAD ENABLE COLOR PRINT HEAD

IDLE

DMAACKNOWLEDGE TO USB IC
NC NC
NC NC

SERIAL DATAFROM OPE MICOM TO KS32C6400

MODEM INTERRUPT INACTIVE MODEM INTERRUPT ACTIVE

IDLE TX MOTOR INTERUPT
IDLE

DMA REQUEST FROM SCAN IP
IDLE DMAREQUEST FROM USB IC
IDLE INTERUPT SIGNAL FROM USB IC

RESERVED TEST PIN for ICE(JTAG)
RESERVED TEST PIN for ICE(JTAG)
RESERVED TEST PIN for ICE(JTAG)
RESERVED TEST PIN for ICE(JTAG)

RESERVED TEST PIN for ICE(JTAG)
RESET OFF RESET ON
RECALL ON RECALL OFF:IDLE STATE

DISABLE MONO PRINT HEAD ENABLE MONO PRINT HEAD

RESET OFF:IDLE STATE RESET ON

RX LINE TX LINE OR REMOTE

O
O
O
O
O
O
O
O
O
O
O
O
O
O

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O
O
O
O
O
O

H L

Circuit

Samsung Electronics

6-9

Circuit

6-1-2-9. RESET CIRCUIT

As for this product, there are 2 power resets of prima­ry reset(/F-POR) and secondary reset(/POR) and also
reset by watchdog timer (/RSTO). Primary reset is
used to initialize flash memory when the system is
turned on, while secondary reset is used to initialize
the whole system by initializing MFP controller
(KS32C6400) after primary

reset. Primary reset makes flash memory wait in
READ mode to fetch program
codes, and secondary reset makes the main
controller (KS32C6400) wake up and initialize
external peripherals to operate the system.
Fig.5-1-10 is Power Reset Timing Diagram.

• POWER MONITOR (U220: XC61FN4512)
If +5V supplied to XC61FN4512 is so unstable as to
reach +4.65V - +4.35V (typically 4.5V), it will
recognize it as power failure. Then XC61FN4512
output terminal becomes low (0V) and the voltage is
impressed to flash memory and KS32C6400, run­ning RESET (LOW ACTIVE). Flash memory and

KS32C6400 are reset first. Thereafter modem,USB,
print control parts and SCANIP(Color Image
Processor) linked to /RSTOUT terminal of
KS32C6400 are reset as well. XC61FN4512 output
terminal of open drain structure is pulled up 1MΩ
and put out.

supply

Voltage

/F-POR

/POR

PnRST

Internal Reset

256 MCLK

Reset filter

65 MCLK

ROM Access

(internal)

Reset

Fig.6-1-7 POWER RESET TIMING DIAGRAM

Samsung Electronics

6-10

6-1-3 System Memory

System memory consists of 4M bit flash memory, and
16M bit DRAM, Flash memory, DRAM are selected by
each CHIP SELECT (/ROMCS, /RAS0, /RAS1,
/LCAS, /UCAS), and data is accessed half word
(16bits) by half word.

DRAM structure is designed to add additional 2MB to
the basic 2MB as buyers can make their options.
In addition, the backup circuit built in for DRAM
15seconds keeps data in user memory during at least
power failure. Capacitor (1000µF)
(1F) is used as a backup element. Flash memory holds
telephone numbers and journal information.

6-1-4 Scanner

6-1-4-1. SUMMARY
This sheet-fed type device to read manuscripts has

300dpi CIS as an image sensor. The design is focused
on 15-sheet ADF.

6-1-4-2. SCAN RESOLUTION
– Normal : 1/3.85mm, 1/8mm (98 u 203dpi)

– Fine : minor scanning 1/7/7mm, main

scanning 1/8mm (196 u 203dpi)

– Super Fine : minor scanning 1/300inch, main

scanning 1/300inch(300 u 3000dpi)

6-1-4-3. CIS : Contact Image Sensor improves
productivity and is designed to be replaced easily.

A1000 model uses color CIS.

– Minimum Scan Line Time for one color : 2.5mS
– Color Separation : RGB LED transfer mode
– Light Source Power : 5V
– Maximum Pixel frequency : 2MHz
– Effective Sensor Element : 2552
– Bright Output : MIN 0.3V

CCD

Module

CIP-1A

A/D

Converter

Scanner

Controller

MFP

Controller

Image

Processor

Data

Memory

Analog

Data

CCD

Control

Pixel
Data

Digitized

Data

DMA

Control

System

Data BUS

Data

Timing

IP

Control

+

Formatted Data for DMA

SCANIP Control Data

Processed

Data

A/D

Sample

Clock

Fig.6-1-8 SCANIP Block Diagram

CIS

CIS
Control

Circuit

Samsung Electronics

6-11

Circuit

6-1-4-4. IMAGE PROCESSING

1) Image signal input: CIS output signals are offset at

0~1.3V .
So OP AMP is used to design
interface circuit of SCANIP.

2) Image processing : The scanner reads pixel data

value of image sensor CIS(Contact Image Sensor)
300dpi lines by 300dpi lines, and stores it in scan
buffer through TIP algorithm if Normal is
selected for Image Processor SCANIP, through
Error Diffusion algorithm if medium, or through
DMA without algorithm if PC Scan mode.
Commonly for all the three modes, it is processed
after shading correction and gamma correction. 5u5
Window Processing begins after data is stored in
32K Byte external SRAM (U34).

Image Processor SCANIP has the following
specifications:

a Package: 128 Pin QFP
b Operating Frequency: 25 - 40MHz
c Minimum Scan Line Time: 1.5mS
d Scan Resolution: Max. 300DPI
e Scan Width: B4
f Major functions

– Internal 8bit ADC
– Black/White shading correction for each color

R.G.B
– Gamma correction for each color R.G.B
– Mono CIS (Canon, Dyna) interface
– Color CIS (Canon, Dyna, Toshiba) interface
– Automatic Motor Control
– Image Processing Mode : TIP, Ordered dither,

Error diffusion
– 256 Gray Scale
– AGC function
– PC Gray Scan function

g External SRAM: 32Kbyte, 15Ns Access Time

3) CIS LED Driver: LED in CIS is on with +5V. TR cir­cuit is built in to drive this LED.

– Maximum LED current: 300mA

4) PC Scan function

– Resolution(VuH) : 300u300/75u75dpi

(Pre-scanning mode)
196u203/98u203dpi

– Mono Bit Depth : 8bits Gray Scan/1bit Text

Scan/1bit Halftone Scan
– Color Bit Depth : 24bits (8bits/R.G.B.)
– PC Interface: USB
– TWAIN Driver: 1CD-ROM title provided along

with Bundle S/W.

5) Additional Spec.
– Scan Line Time : 2.5mS/line
– Contrast Control : 5 Step
– Enlargement & Reduction : 25 ~ 200%

Samsung Electronics

6-12

GIP 0
GIP 1
GIP 2
GIP 3
GIP 4
GIP 5
GIP 6
GIP 7
GOP 0
GOP 1
GOP 2
GOP 3
GOP 4
GOP 5
GOP 6
GOP 7
GIOP 0
GIOP 1
GIOP 2
GIOP 3
GIOP 4
GIOP 5
GIOP 6
GIOP 7
GIOP 8
GIOP 9
GIOP 10
GIOP 11
GIOP 12
GIOP 13
GIOP 14
GIOP 15

23
28
37
43
48
84
92

113

26
31
40
46
51

87
103
116

24

25

29

30

38

39

44

45

49

50

85

86

93

95
114
115

OK2PRINT
RESERVED
RESERVED
/P_EXIT

–

/RINGDET
/HOOK_OFF
RESERVED
CIS_SH
RESERVED
BLED
RLED
GLED
PREHEA T_C
RESERVED
PREHEA T_M
/DRAM_EN
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
CML_ON
VOL2
VOL1
VOLO
C_HEADDA TA
/SPK_CTL
AMB_TEMP
M_HEADDA TA

NO FAULT IN PRINT HEAD FAULT IN PRINT HEAD

N.C N.C
N.C N.C

–

DETEC INCOMING PAPER FROM ASF

––
–

RING DETECTION FROM TEL LINE

EXTERNAL PHONE HOOK ON EXTERNAL PHONE HOOK OFF

N.C N.C

CIS SHADING ON CIS SHADING OFF

N.C N.C

BLUE LED ON BLUE LED OFF

RED LED ON RED LED OFF

GREEN LED ON GREEN LED OFF

PREHEATING COLOR PRINT HEAD

–

N.C N.C

PREHEATING COLOR PRINT HEAD

–

Disable DRAM to idle state Enable DRAM to read state

N.C N.C
N.C N.C
N.C N.C
N.C N.C
N.C N.C
N.C N.C
N.C N.C

FAX CONNECTED TEL LINE OR EXT. PHONE

COLOR PRINTHEAD ID DATA : SERIAL HEX CODE : 08H

AUDIO AMP. OFF AUDIO AMP. ON
BI-DIRECTION DATATRANSFER TO FROM DIGITAL THERMOMETER
MONO PRINTHEAD ID DATA : SERIAL HEX CODE : 07H

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O
O
O
O
O
O
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O

I/O
I/O
I/O
I/O
I/O
I/O
I/O

O
O
O
O

I
O

I/O

I

6-1-4-5 I/O PORT FOR SCANIP

PIN

NAME

PIN

NO.

I/O

CIRCUIT

NAME

H L

DESCRIPTION

VOL 2 VOL1 VOL 0 4051 OUTPUT

H H H VOLUME LEVEL7 : RING VOLUME MAX
H H H VOLUME LEVEL6 : RING VOLUME
H L H VOLUME LEVEL5 : RING VOLUME MIN
H L L VOLUME LEVEL4 : RING VOLUME OFF

L H H VOLUME LEVEL3 : LINE MONITORING VOLUME MAX
L H L VOLUME LEVEL2 : LINE MONITORING VOLUME
L L H VOLUME LEVEL1 : LINE MONITORING VOLUME
L L L VOLUME LEVEL0 : LINE MONITORING VOLUME MIN

Circuit

Samsung Electronics

6-13

Circuit

6-1-5 Printer

6-1-5-1. GENERAL

It drives inkjet head to print printing data received
from the computer or fax data coming through the
line. It roughly consists of head driver, head
controller, and the ambient temperature sensor. Fig.6­1-11. Block Diagram of Printer shows the entire struc­ture.

6-1-5-2. HEAD DRIVER (U18,U19,U14,U21)

This part drives and inks inkjet head. Color inkjet
head drives 192 nozzles, while mono inkjet head dri­ves 208 nozzles. Mono inkjet head is composed of 16
groups of 13 nozzles. As to the driver that composes
each nozzle, 13 row 7-bit driver (U18,U19) selects
head address and 16 column 8-bit
driver (U14,U21) sends head data. Head driver
converts control signals from MFP controller to
+11.75V, the level to be able to drive the head, and
provides them for the inkjet head.

• Row Driver Circuit (HD7:U18,U19)
This is a 13-line signal impressed to row drive IC
through the output port of MFP controller(/HGA1 ­/HGA13), used as an address to drive the head in
ink cartridge. Pulse period differs according to head
driving
frequency. In 1200dpi (in case of Head: 12KHz)
mode, timing period is 2.6usec (1/1200÷16 groups).
The signal put in each driver(window time) is active
“L”, with the biggest driver current max 100mA and
output voltage +11.75V.

• Column Driver Circuit (HD8:U14,U21)
It is the fire enable pulse of real head. 16 lines are
put out as head driving data lines through the out­put port of MFP controller (HOE1 - HOE16). Enable
pulse impressed to the head is put out within win­dow time (Low). It has the function to move it for­ward or backward by the register in MFP controller.
Besides the output signal may
differ in accordance with the type of head (mono or
color). If there is data, printing image is put out at
“H”. If not, it is put out at “L”. In case of Babbage
head, pulse width is always 1.3use regardless of the
type of the head, with the
maximum driving current 400mA and output volt­age +11.75V.

Samsung Electronics

6-14

6-1-5-3. HEAD CONTROLLER

This part consists of +22V Power Controller to
control head driver, Fault Test, Head Detection,
Substrate Heating

It checks and controls head driver and ink cartridge.

KS32C6400

(U26)

Ink

Cartridge

Mono

and

Color

MFP

CONTROLLER

SCANIP (U29)

IMAGE

PROCESSOR

/FAULT-TEST

/HGA1

/HGA13

HOE1

HOE16

/FAULT-TEST

OK2PRINT

BIASOFF

HEAD-DATA

/M_HEAD_EN, /C_HEAD_EN)

PRE-HEAT

BH1 (CH1)

HSC,HSM

BS1 (CS1)

BP1 (CP1)

BA13 (CA13)

BA1 (CA1)

BP16 (CP16)

/FAULT

HEAD-DATA

Driver

Row
(7bit)

+22V Power

Controller

Driver

Column

(8bit)

Fault (Short)

Test

Head

Detection

Head

Selector

Substrate

Heat

HEAD-ADDRESS

Fig.6-1-9 Block Diagram of Printer

Circuit

Samsung Electronics

6-15

Circuit

• +22V Power Controller
If you insert power cords, the main board will be
supplied with power. /POR signal put out through
reset circuit activates MFP controller
(K32C6400:U26) and MFP controller puts out exter­nal circuit reset signal /RST-OUT. This /
RST-OUT signal and Vrefx (+2.5V) divided through
+30V are impressed to the input
terminal of the comparator, putting out +22V if the
output of the comparator is “high” or getting turned
off if “low”.(in case of /FAULT-TEST
signal: HIGH) While +22V is being impressed after
/RST-OUT is “High”, comparator output gets “low”
and turns off +22V driving TR(TIP112) if /FAULT­TEST signal is put out at “low” when you check a
short of the head driver and the ink cartridge
(head).

• FAULT TEST CIRCUIT
This is a signal to detect whether the head
receiving the output of head column driver is in a
short. After /FAULT-TEST signal is put out at “low”
and +22V is turned “off”, “OK2PRINT”
signal is entered. The port of KS32C6400(U26)
shows normal condition if “H” and a short if “L”. If
you make FAULT-TEST output “L” to detect fault of
the head, +22V gets off. If the head is in a short
(LOW), when the level of “/FAULT-TEST” signal

goes “L” and final “OK2PRINT” output goes “L”.
KS32C6400(U26) reads this signal and checks
whether the head input receiving the
driver output is in a short. Diode cathode is
attached to each output transistor collector in the
column driver. 8 anode terminals of diode become
common as one and put out /FAULT signal, which
is pulled up by bias circuit controlled by /FAULT­TEST and shows the condition by OK2PRINT
through the comparator.

• SUBSTRATE HEAT CIRCUIT
Mono ink cartridge of Babbage head is 600dpi head
that uses pigment ink. It is very sensitive to the
temperature in and around the cartridge. In
particular, the viscosity of ink affects print quality as
it is inversely proportional to temperature by an
exponential function. This signal used to
compensate it helps you get equal inking quality by
warming the ink chamber in the cartridge with alu­minum pattern heater before starting to print if the
surrounding temperature is lower than
standard (below 35°…).(Refer to Timing Chart.) It
sends PRE-HEAT signal through I/O port of
SCANIP(Color Image Processor:U29) and supplies
+11.75V.

Mono Head

Fig.6-1-10. Temperature around Mono Head

Pre-Heat if below 35°c

70°C

35°C

Samsung Electronics

6-16

• HEAD DETECTION CIRCUIT
Babbage ink cartridge has 8-bit mask ROM I.D. to
check the type of cartridge. In order to detect the
head, HSM signal is used as ENABLE signal and
BA3 signal as START & STOP BIT, and BA1 and
BA2 as clock signal of each bit, and ID signal in the

cartridge is put in HEAD-DATA port of KS32C6400
through BSF line. With each bit
controlled, 8bit I.D data is read and STOP bit is put
out of BA3(LOAD) port. Then it finishes.
If data is mono, it is 07H. If color, 08H.

Color Head

Fig.6-1-11. Temperature around Color Head

70°C

HSC or HSM

(Pwr)

BA3

(Load)

BA1

(Clock1)

BA2

(Clock2)

C_HEADDATA or

M_HEAD DATA

bit7

Min 500ns Clock Delay(Min 500ns)

bit6 bit5 bit4 bit3 bit2 bit1 bit0

Head I.D read : HEAD-DATA (Clock 1,2=50~500KHz).

Mono : 07H
Color : ICH
Photo : 09H

Fig.6-1-12. HEAD DETECTION TIMING DIAGRAM

Circuit

Samsung Electronics

6-17

Circuit

6-1-5-4. HEAD DRIVING TIMING

Control signal from MFP controller (KS32C6400:U26)
enters the head drivers and it becomes the level to be
able to drive the head nozzles (+11.75V). It is depicted
in the following diagram.

BA

Signal

t

p(PD)

BP

Signal

Pre-Heat Pulse Width Fire Pulse Width

Fire Enable Timer

Pre-Heat Delay Width

Front End Delay

Back End Delay

Fig.6-1-13. HEAD DRIVING TIMING DIAGRAM

Samsung Electronics

6-18

HSC or HSM

BA1
BA2

BA3
BA4
BA5

BA6
BA7
BA8

BA9
BA10
BA11

BA12
BA13

(Tp)

BP1-

BP16

Fig.6-1-14. TIMING DIAGRAM FOR EACH NOZZLE

Circuit

Samsung Electronics

6-19

Circuit

6-1-5-5. INK CARTRIDGE

• PIN ARRAY OF MONO INK CARTRIDGE
There are 208 heater chips in mono ink cartridge.

Column

Address (BA1_ ~ BA13_)

Data(BPx)

12345 678910111213

1 1 21 15 9 3 23 17 11 5 25 19 13 7
2 20 14 8 2 22 16 10 4 24 18 12 6 26
3 27474135294943373152453933
4 46403428494236305044383252
5 53736761557569635777716559
6 72666054746862567670645878
7 79 99 93 87 81 101 95 89 83 103 97 91 85
8 98 92 86 80 100 94 88 82 102 96 90 84 104

9 105 125 119 113 107 127 121 115 109 129 123 117 1 11
10 124 118 112 106 126 120 114 108 128 122 116 110 130
1 1 131 151 145 139 133 153 147 141 135 155 149 143 137
12 150 144 138 132 152 146 140 134 154 148 142 136 156
13 157 177 171 165 159 179 173 167 161 181 175 169 163
14 176 170 164 158 178 172 166 160 180 174 168 162 182
15 183 203 197 191 185 205 199 193 187 207 201 195 189
16 202 196 190 184 204 198 192 186 206 200 194 188 208

Samsung Electronics

6-20

• PIN ARRAY OF COLOR INK CARTRIDGE
There are 192 heater chips in mono ink cartridge. One cartridge has 64 Cyan, 64 Magenta, 64 Yellow heaters
and (64 x 3 colors) 192 nozzles.

Column

Address (BA1_ ~ BA13_)

Data(BPx)

12345 678910111213

1 - 19 13 7 11 21 15 9 3 23 17 11 5
2 15126 -2014 8 2 221610424
3 25453933274741352949433731
4 44383226464034284842363050
5 51716559537367615575696357
6 70645852726660547468625676
7 77 97 91 85 79 99 93 87 81 101 95 89 83
8 96 90 84 78 98 92 86 80 100 94 88 82 102

9 103 123 117 11 1 105 125 1 19 113 107 127 121 115 109
10 122 166 110 104 124 118 112 106 126 120 114 108 128
1 1 129 149 143 137 131 151 145 139 133 153 147 141 135
12 148 142 136 130 150 144 138 132 152 146 140 134 154
13 155 175 169 163 157 177 171 165 159 179 173 167 161
14 174 168 162 156 176 170 164 158 178 172 166 160 180
15 181 - - 189 183 - - 191 185 - - - 187
16 - - 188 182 - - 190 184 - - 192 186 -

Circuit

Samsung Electronics

6-21

Circuit

6-1-6 Motor Driver

6-1-6-1. GENERAL

This product use 1 dc motor and 2 stepper motors, i.e.
CR(Cartridge Return) motor and LF(Line Feed) motor,
TX (Transmission) motor.
CR motor moves left and right all-in-one carriage of
inkjet head. It helps the printer print accurately on the
paper. LF motor is driven to feed and eject paper for
printing and to feed and eject documents to read for
scanning. CR dc motor is controlled dc control block,
while LF motor half step and quarter step at maxi­mum 6ips.

6-1-6-2. CR(CARRIAGE RETURN) MOTOR

DRIVING CIRCUIT

CR motor moves the carriage left and right when ink
cartridge prints something on paper.

- Motor Type : PMDC Motor.

- Driving Voltage : +30V

- Winding Resistance : 12Ω ±2Ω

- Driving IC : TEA3718SFP 51

As shown in the above table, current in each mode is
adjusted by voltage of driver(U13) PIN 12 input. If the
PWM signal controlled by MFP controller(U26) is
“high”, TR(Q4) will be turned on and the voltage put
in to PIN 12 of driver (U13) with 0V.

It becomes the standard of the driver, resulting in high
current drive mode. If PWM is “low”, TR(Q4) will be
turned off and the voltage put in to PIN12 will go up
(+5.0V), resulting in no current in the motor.

RI and U16A control the current chopping level of U1
through TR(Q3, Q6).
Q6 and Q3 supplies necessary logic level to put CR
Driver IC(U4) into maximum (100%) current drive
mode. If pin 9 and 11 of U4 are both “high”, no cur­rent will be driven, but if pin 9 and 11 are both “low”
U4 will be in a maximum current drive mode.

Motor

DIR PWM

CURRENT

OPERA TION REMARK

Driver DIRECTION

OFF L L X STOP

ON L H B › A RIGHT DIRECTION

OFF H L X STOP

ON H H A › B LEFT DIRECTION

Samsung Electronics

6-22

6-1-6-3. LF(LINE FEED) MOTOR DRIVING CIRCUIT

LF motor is driven to feed and eject documents and paper.

- Motor Type: stepper motor, bi-polar

- Driving Voltage : +30V

- Winding Resistance : 12Ω ± 10%

- Driving IC : PBL3717A u 2

6-1-6-4. TX(TRANSMISSION) MOTOR DRIVING CIRCUIT

TX Motor is driven at maximum 1200pps when feeding or ejecting sheets.

- Motor Type: unipolar skepper

- Driving Voltage : +30V

- Winding Resistance : 80Ω ± 10%

- Step Degree : 7.5 deg/step

- Driving IC : ULN2003A

LFIA1 LFIA0 CURRENT(mA) OPERA TION REMARK

L L 670 When feeding document/paper
L H 400 When ejecting document/paper
X H 0 No current

TXIA1 TXIA0 PHASE OPERATION LINE TIME REMARK

Fine 2–2 phase 400pps 2.5mS Mono Binary

Super Fine 2–2 phase 400pps 2.5mS Mono Binary
Gray Scale 1–2 phase 159pps 12.6mS Color

1–2 phase 196pps 10.2mS Mono n

Driving speed for each mode

Circuit

Samsung Electronics

6-23

Circuit

6-1-7 FAX Transceiver

6-1-7-1. GENERAL

This circuit processes transmission signals of modem
and between LIU and modem.

6-1-7-2. MODEM (U37)

KS16117 is a single chip fax modem. It has functions
of DTMF detection and DTMF signal production
as well as functions of modem. TX OUT is
transmission output port and RX IN is received data
input port. /POR signal controlled by MFP
controller (U26:KS32C6400) can initialize
modem(/MODEM_RST) without turning off the
system.
D0 - D7 are 8-bit data buses. RS0 - RS4 signals to select
the register in modem decide the mode. /CS is a
signal to select modem chips. /RD and /WR signals
control READ and WRITE respectively. /IRQ is a sig­nal for modem interrupt.
Transmission speed of KS16117 is supported up to

14.4k.

6-1-7-3. TRANSMITTER

This circuit processes transmission output, analog sig­nal of modem(KS16117).
Output signal in each mode goes out of modem
(TXOUT:U37-44). After D/A signals are smoothed and
filtered through active filter (U40-1,2), they are
put out to LINE through LIU board.

6-1-7-4. RECEIVER

In the receiving mode, analog signals coming in
through LIU board are transmitted to input terminal
of modem (RXIN:U23-45) through smoothing filter
(U40-6,7).

Fig.6-1-15. FAX TRANSCEIVER

FAX TRANSMISSION

U40

U40

FAX RECEPTION

MODEM
KS161 17

(U23)

LIU

Samsung Electronics

6-24

6-2-1. SUMMARY

OPE Board is separated functionally from the main
board and operated by the micom in the board. OPE
and the main use UART (universal asynchronous
receiver/transmitter) channel to exchange informa­tion. OPE reset can be controlled by the main. OPE
micom controls key-scanning and LCD and LED dis­play, detects documents and
senses SCAN position. If there occurs an event in OPE
(such as key touch and sensor level change), it sends
specific codes to the main to respond to the situation
and the main analyzes these codes and operates the
system. For example, if the main is to display mes­sages in OPE, the main transmits data through UART
line to OPE according to the
designated format and OPE displays this on LCD,
LED. OPE’s sensing is also transmitted to the main
through UART line and then the main drives
necessary operation.

6-2-2

OPE PBA consists of MICOM, LCD, key matrix,
SCAN position sensor and the document detect sen­sor. Refer to OPE Schematic Diagram and Wiring
Diagram sections of this manual.

• Signals from the key matrix are delivered to U1X/Y
input pin group (P1-x).

• U1 pin 48 (TX DATA) is the UART code sent to
MAIN PBA.

• Display from the controller is received at U1 pin
47(RX DATA).

• LCD drive signals are sent from U1 pin 8~10, 15~18,

30~33.

• Document detect sensor output is received at U1
pin 1.

• Scan position sensor output is received at U1 pin 7.

Scan
Position
Sensor

Document
Detect
Sensor

Connector

MICOM

HT48R50

RESONATOR

7.37 MHz

LCD
16 u 2 lines

Key Matrix

8Y

7

11

UART 2

Reset

X

Fig.6-2-1. OPE BLOCK DIAGRAM

6-2. OPE PBA

Circuit

Samsung Electronics

6-25

Circuit

6-3 LIU PBA

6-3-1 Summary

LIU(Line Interface Unit) circuit is controlled by the
main circuit.
It monitors telephone line and helps interface between
the system and the telephone line. It uses transformers
(T1,T2)and photo couplers(U1,U6,U7,U2)to control the
whole LIU, MODEM/LINE INTERFACE, RING SIG­NAL DETECTOR, DIALER,and LINE CURRENT
DETECTOR,

6-3-2 Modem/Line Interface

This is the path through which transmitted and
received data of modem is put in and out.

• CML1 Relay: It divides telephone line into
external telephone and fax.

• T2 trans former : This component receives and

transmits fax image signal from the line to a inodem
and a modem to the line.

• AC impedance: Normal operation range of LIU

is from 15mA to 100mA. DC
characteristics depend on the voltage at Q1 and
R20.
Basic AC impedance is 600Ω but it can be adjusted
by changing the value of C2, C3, C4.

6-3-3 Ring Signal Detector

• U3-28(MO) terminals are ring signal output
terminals. Q4 and Q5 put out ring signals and drive
Piezzo. It has only the functions related to ring
detection such as driving the photocoupler of U4
and delivering ring signals to MFP
controller of the main.

6-3-4 Dialer

6-3-4-1. MF DIAL

• Default mode it is set in MF. You can change it to
DP mode by control of MFP controller.

• MF signal is generated and controled by a inodem
in a main board.

• MF signal can be measured at FLT1 or FLT2.

6-3-4-2. DP DIAL

• DP signal is made by a controller.
This signal turns on/off U6.
The signal made at that time turns on/off Q2,
which interrupts DC
current on telephone line and puts out pulse
signal on telephone line.

Samsung Electronics

6-26

6-3-7 MAJOR FUNCTIONS OF PARTS

1) U6 : PC817C

- It relays dial pulse control signal to primary
circuit part.

- Insulation between primary and secondary
circuit part.

2) U1 : PC817

- It senses and delivers ring signal to the main
board.

- Insulation between primary and secondary
circuit part.

3) U2 : PC814

- It senses hook-off (Line connection) of the
external telephone and delivers it to the main
board.

- Insulation between primary and secondary
circuit part.

4) BD1 : BRIDGE DIODE

- Regardless of the polarity of DC power from

telephone line, the voltage put out on Pin.1
has always + polarity against pin Pin.2. So
DC loop forms always in the same direction
regardless of the polarity of the telephone
line.

5) T1,T2 : TRANSFORMER

- It delivers signals from the telephone line
to modem or signals from modem to the
telephone
line.

- Insulation between primary and
secondary circuit part.

Circuit

Samsung Electronics

6-27

Circuit

6-4 SMPS

6-4-1 Block Diagram of Power Circuit

Refer to the following block diagram.

INLET

INPUT

FILTER

SNUBBER

CIRCUIT

START-UP

CIRCUIT

HALF WAVE

RECTIFIER

HALF WAVE

RECTIFIER

HALF WAVE

RECTIFIER

VOLTAGE

DETECTION

OVER

VOLTAGE

PROTECTION

3-TERMINAL

REGULATOR

CH1
+5V
RED

#1

GND

BLACK

#2

CH3

+30V

GREEN

#6

CH2

+11.75V

YELLOW

#3

GND

BLACK

#4,#5

SWITCHING

DEVICE

PHOTO

COUPLER

Nb1

Nb1

Ns2

Ns2

Ns1

ERROR

AMPLIFIER

PWM

CONTROL

CIRCUIT

OVER

CURRENT

DETECTION

FULL WAVE

RECTIFIER

AC250V2A

AC220-240V2A

N

a

b

a

b

* , See Below Table

POWER SUPPLY

6-4-2 Specifications of Power Circuit

6-4-2-1. INPUT CONDITIONS

1 Input Rated Voltage AC110–240Vac (a)
2 Input Voltage Turning Range AC90–270Vac (b)
3 Rated Grequency 50–60Hz
4 Frequency Range 47–63Hz
5 Input Current 0.5Arms

Free Voltage

Samsung Electronics

6-28

6-4-2-2. OUTPUT CONDITIONS

6-4-3 Power Circuit

6-4-3-1 INPUT

This product is equipped with a three-wire
grounding-type power inlet. Insulation is class 1.
When a power device part breaks down or some trou­ble in this circuit causes a short, excess current runs
through a fuse and blows it to protect power devices
and the system from excess current and
prevent a fire.
Input filter of power input terminal removes line
noise flown in from outside and reduces noise which
is made in power circuit and logic part and conducted
or radiated through power cords.
AC input voltage is rectified by bridge diode of full
wave rectifier, is converted to DC voltage by smooth­ing circuit, and switches the power device of this volt­age.

As switching is in RCC(Ringing Choke Converter)
mode, switching frequency changes from about
50KHz to 100KHz.
PWM(Pulse Width Modulation) Control Circuit
adjusts the duty of the switching device by sensing
the change of output voltage, and protects this
product from excess current by receiving signals from
excess current detecting circuit.

6-4-3-2 DRIVING CIRCUIT (START-UP CIRCUIT)

If you insert a power plug into AC outlet, full-wave
rectified DC output voltage is generated at input elec­trolysis condenser and supplied to the gate of a
switching device through driving resistance. This volt­age drives the switching device. Once it is
driven, it continues to switch via PWM control
circuit with power supplied by auxiliary coil Nb.

6-4-3-3 SWITCHING CIRCUIT

(VOLTAGE STABILIZATION)

11.75V of 2nd voltage is detected by voltage detector
and feeds back through photo coupler to 1st PWM
Control Circuit signals compared by error amplifier.
PWM Control Circuit controls the gate of power tran­sistor according to the feedback voltage so as to sup­ply load with stable output voltage.

NO ITEM CH1 CH2 CH3

1 RATED OUTPUT VOLTAGE +5.0V +11.75V +30V
2 RATED OUTPUT CURRENT 0.5A 0.8A 0.5A
3 MAXIMUM LOAD CURRENT 0.8A, 20sec 1.3A, 20sec 0.76A, 20sec

4 LOAD CHANGE RANGE 0.1 ~ 0.8A 0.03 ~ 1.3A 0.05 ~ 0.76A

Circuit

Samsung Electronics

6-29

Circuit

6-4-3-4 OCP CIRCUIT

(OVER CURRENT PROTECTIVE CIRCUIT)

If a short in secondary load terminal or a short inside
power device causes excess current, power consump­tion increases. Then it increases current of power tran­sistor .
The current of power transistor increases linearly
when it is on. This current is detected by sensing resis­tance and is impressed to excess voltage
protective circuit of PWM control circuit through RC
integration circuit where over current protection is
built in.
If this voltage becomes bigger than Vbe of excess cur­rent control transistor, the potential of power transis­tor gate falls immediately and it stops driving power
transistor to protect it from excess current.

6-4-3-5 OVP CIRCUIT

(OVER VOLTAGE PROTECTIVE CIRCUIT)

If the main power of power device 11.75V increases
abnormally, this excess voltage is detected by OVP
detecting circuit and 11.75V output terminal shifts to a
state similar to
a short.
If 11.75V output terminal shorts, over current runs on
over current detecting terminal and OCP circuit oper­ates to prevent a fire in power device.

6-4-3-6 +5V OUTPUT TERMINAL

Square wave voltage generated by Ns1 produces DC
voltage rectified and smoothed by half-wave rectifier.
This voltage put in to a three-wire regulator generates
stable DC power of +5V.

6-4-3-7 +30V OUTPUT TERMINAL

Square wave voltage generated by Ns2 is rectified and
smoothed by half-wave rectifier and supplies load
with output voltage without separate
regulation.

6-4-3-8 +11.75V OUTPUT TERMINAL

Square wave voltage generated by Ns3 is rectified and
smoothed by half-wave rectifier, and then detected by
voltage detector. Signals compared by error amplifier
are fed back to primary PWM
control circuit through photo coupler.
PWM control circuit controls the voltage of power
transistor gate driver according to the voltage to sup­ply load with stable output voltage.

6-5-1 Paper Sensing Circuit

This circuit senses whether there is paper or not, using
photo interrupter. If there is no paper, the lever will
cover its sensor and output “/P_EXIT”

will become “High”. If there is paper, the lever will be
lifted and output “/P_EXIT” will become “Low”.

6-5 Others

Lever

+5V +5V

/P_EXIT

Photo

Interrupter

Samsung Electronics

6-30

6-5-2 Home Sensing Circuit.

This circuit checks whether a carriage is at home or
not.
A encorder sensor is used as a home sensor to detect
home position. This encorder sensor uses a encoder
strip, attached to a main frame, to detect current posi­tion and moving direction. Aencoder sensor outputs
CHY and CHX signal to a main controller(U26). U26

uses these two signals to sense the carriage’s direction.

Circuit

7-1

7. Troubleshooting

7-1 SCANNER

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

• Check shading profile.

• Check white Ref. value and black
Ref. value.

• Check CIS signal input level.

• Check shading profile.

• Check if CIS LED is on/off.

• Check white ref.value and black
Ref.value.

• Check CIS signal input level.

• Check shading profile.

• Check printing quality.

• Remake shading profile in the tech mode.

• Replace U27 if it is defective. (white Ref.
=1.3V. black Ref=0V)

• Check if it is 1.3V when operating and 0V
when idle. If defective, replace CIS.

• Remake shading profile in the tech mode.

• Check if CIS harness is pluged.

• If defective, replace U27. (white Ref.=1.3V.
black Ref=0V)

• Check if it is 1.3V when operating and 0V
when idle. If defective, replace CIS.

• Remake shading profile.

• Refer to ‘printing quality.

7-1-1 COPY

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

Scanning error

Defective image
quality

White Copy

Black Copy

Defective image
quality

• Check if Printer cable is installed.

• Check if Printer cable is appropriate.

• Check how TWAIN driver is installed.

• Check parallel port I/P part

a

Check the early state of J2 print
signals : #1,10-14,31,32,36.

b

Check U4 input/output signals

c

Check clock signals of U16-43~51,

U16-43~51 U16-53~61

Refer to ‘1,COPY’

• Check if Printer cable is correctly
installed.

• Check if Printer cable is proper for

IEEE1284.

• Reboot the system after TWAIN driver is
installed again.

• Replace the main PBA.

Refer to ‘1.COPY’.

7-1-2 PC-SCAN

Samsung Electronics

7-2

• Refer to User ’s Guide

Troubleshooting

7-1-4 Setting-up Systemm in User Mode

7-1-3 Service Mode

7-1-3-1 HOW TO ENTER SERVICE MODE

In service mode (tech) mode, the technician can check
the machine and perform various test to
isolate the cause of a malfunction.

To enter the service mode, press MENU, #, 1, 9, 3, 4 in
sequence, and the LCD briefly displays ‘T’, the
machine has entered service (tech) mode. While in ser­vice mode, the machine still performs all nor

mal operations. To return to normal user mode, press
MENU, #, 1, 9, 3, 4 in sequence again, or turn the
power off, then on by unplugging and plugging the
power cord.

Options changed while in service mode do not remain
changed unless you clear the machine’s memeory.

SETUP Item Default Status

DATE JAN/01/98 MONTH- DAY- YEAR JAN/01/98
TIME 12:00:00P HOUR-MINUTE-AM/PM 12:00 PM

CARTRIDGE CHANGE

MAINTENANCE CARTRIDGE CLEAN

CARTRIDGE ALIGN
SCANNER INIT

FAX CONFIRM
TRANSMIT LOG

PRINT REPORT RECEIVE LOG

SPEED DIAL LIST
SELF TEST

PAPER SIZE LETTER / A4/LEGAL LETTER

FAX PRINT

LETTER QUALITY/ LETTER QUALITY
DRAFT QUALITY

RINGER VOLUME OFF / LOW/ MEDIUM/ HIGH MEDIUM

SILENT OPERATION NO / YES NO
FAX RECEIVE MODE FAX/TEL / ANS/FAX/ DRPD FAX
SETUP DRPD LEARN
FAX MEMORY XMIT ON / OFF ON

Samsung Electronics

7-3

Troubleshooting

7-1-5 Setting-up Systemm in Service Mode

SETUP Item Default Status

CIS TEST
AGING TEST SCANNER AGING/

PRINTER AGING
FAX CONFIRM

TRANSMIT LOG
RECEIVE LOG
SPEED DIAL LIST

PRINT REPORT SELF TEST

PROTOCOL DUMP
ASF TEST
SYSTEM DATA

NVRAM DUMP
MAINTENANCE CIS PATTERN
PROGRAM DOWNLOAD
MESSAGE CONFIRM ON/ OFF/ ERR ON-ERROR
AUTO JOURNAL ON/ OFF ON
REMOTE RCV CODE [0-9] 9
DIAL MODE TONE/ PULSE TONE
ECM MODE ON/OFF ON
AUTO REDUCTION OFF / ON - WITH VERTICAL / ON ON
DISCARD SIZE [00-30] 11
RETRY INTERVAL [1-7] 3
RETRY COUNT [0-2] 2
ANSWER ON RINGS [1-7] 1
RPINT RTI. ON/OFF ON

MODEM TEST?

FSK/ 2400 / 4800/ 7200/ 9600/ 12000/

1400 bps/ 1100/ 1650/ 1850/ 2100 Hz
DTMF TEST?
ROM TEST?
MODEM SPEED ITEM[1-6] 14.4/ 12.96 / 72/ 48/ 24 14.4
SET TX LEVEL [01-15] 12
SET RX LEVEL [40-50] 43
PAUSE TIME [1-9] 3

Samsung Electronics

7-4

Troubleshooting

CIS TEST
It is used to adjust the light of CIS. It is already set at

CIS TEST to get optimum quality.

1. Load All white Document in scanner Unit.

2. Press SETUP.

3. LCD will display ‘CIS TESTPRESS START’.

4. Press START then LCD will display ‘SHADING...’.

5. After scanning, shading waveform is printed out.

6. After shading waveform was printed out, press STOP.

7. Turn OFF system and Turn ON.
<note: COLOR CIS AUTO PEAK TESK>

AGING TEST
SCANNER AGING - Scanner part aging

PRINTER AGING - Printer part aging

PRINT REPORT

1. Press SETUP.

2. Press the MENU button until ‘PRINT REPORT’

displays in the top line of the LCD panel.

3. Press the OPTIONS button to select the log you

want to print.

4. Press the START or SETUP button to print the report.

PROGRAM DOWNLOAD

1. Press SETUP.

2. Press MENU 3 times until LCD will display
‘PROGRAM DOWNLOAD PRESS START’.

3. Press START.

4. Download ROM file from a PC that can be
connected with USB cable.

MESSAGE CONFIRM
A message confirmation report shows whether the

transmission was successful or not, how many pages
were sent, etc.

1. Press SETUP.

2. Press MENU 4 times until LCD will display ‘MES­SAGE CONFIRM. 1. ON 2. OFF 3. ERR’.

3. Press 1 to print a confirmation report automatically
each time you send a fax(ON).
Press 2 to turn this feature off(OFF).
Press 3 to print only when an error occurs and the
transmission was not successful(ERR).

AUTO JOURNAL
A journal shows specific information concerning trans-

mission or reception activities, the time and dates of
up to 40 of the most recent transmissions or receptions.

1. Press SETUP.

2. Press MENU button until ‘AUTO JOURNAL’ dis­plays in the top line of the LCD panel.

3. Press 1 to print journal automatically after every 40
transmissions or receptions (ON). Press 2 to print
journal manually (OFF).

REMOTE RCV CODE
The remote receive code allows you to initiate fax

receive from an extension phone plugged into the EXT
jack. If you pick up the extension phone and hear fax
tones, enter the remote receive code and the fax will
start receiving. The password is preset to 9 at factory.

1. Press SETUP.

2. Press the MENU button until ‘REMOTE RCV
CODE’ displays in the top line of the LCD panel.

3. Enter the desired code 0 to 9 on the number keypad.

DIAL

MODE

Select the type of dial system your fax machine is con­nected to.

1. Press SETUP.

2. Press the MENU button until ‘DIAL MODE’ dis­plays in the top line of the LCD panel.

WARNNING!

Shading profile MUST be made after Downloading a
new Firmware. If not, system will not work properly.

Samsung Electronics

7-5

Troubleshooting

3. Press 1 if the fax machine is connected to a tone
(Touch Tone) dial line.
Press 2 if the fax machine is connected to a
pulse(Rotary) dial line.

ECM MODE (Err

or Correction Mode)

This mode compensates for poor line quality and
ensures accurate, error-free transmission with and
other ECM-equipped facsimile machine. If the line
quality is poor, transmission time may be increased
when ECM is enabled.

1. Press SETUP.

2. Press the MENU button until ‘ECM MODE’ dis­plays in the top line of the LCD panel.

3. Press 1 to turn on the Error Correction Mode.
Press 2 to turn off the Error Correction Mode.

AUTO REDUCTION
When receiving a documents as long as or longer than

the paper installed in your machine, the machine cna
reduce the data in the document to fit into your
recording paper size.
Turn on this feature if you want to reduce an incom­ing page that may otherwise need to be divided into
two pages with only a small portion on the second
page. If the fax machine cannot reduce the data to fit
into one page with the feature enabled, the data is
divided and printed in actual size on two or more
sheets if needed.

1. Press SETUP.

2. Press the MENU button until ‘AUTO REDUCTION’
displays in the top line of the LCD panel.
Press 2 to turn only vertical reduction feature ON.
The machine will reduce an incoming page contains
overflow data only in vertical.
Press 3 to turn this feature on.

DISCARD SIZE
When receiving a document as long as, or longer than,

the paper installed in your fax machine, you can set
the fax machine to discard any excess image at the
bottom of the page to fit into the recording paper size.

If the received page is outside the margin you set, it
will be printed on two sheets of paper at the actual size.

If the data is within the margin, and the AUTO REDUC­TION feature is turned on, it will be reduced to fit into
the appropriate size paper(Discard does not take place).
If the AUTO REDUCTION feature is turned OFF or
fails, the data within the margin will be discarded.

1. Press SETUP.

2. Press the MENU button until ‘DISCARD SIZE’

displays in the top line of the LCD panel.

3. Enter the length using the number of keypad.

RETRY INTERVAL

1. Press SETUP

2. Press the MENU button until ‘RETRY INTERVAL’
displays in the top line of the LCD panel.

3. Enter the number of minutes (from 1 to 7) using
the number of keypad.

RETRY COUNT

1. Press SETUP.

2. Press the MENU button until ‘RETRY COUNT’ dis-

plays in dthe top line of the LCD panel.

3. Enter the number of attempts(from 1 to 2) to redial

the number before giving up.
If you enter 0, the machine will not redial.

ANSWER ON RINGS
You can select the number of times your machine

rings before answering an incoming call. If you are
using your machine as both a telephone and a fax
machine, we suggest you set the ring count to at least
4 to give you time to answer.

1. Press SETUP.

2. Press the MENU button until ‘ANSWER ON

RINGS’ displays in the top line of the LCD panel.

3. Enter a number from 1 through 7 on the number

keypad.

PRINT RTI.
This feature allows the machine to automatically print

the receive terminal ID(if registered), page number,
and the date and time of the reception at the bottom
of each page of a received document.

1. Press SETUP.

2. Press the MENU button until ‘PRINT RTI.’ displays

in the top line of the LCD panel.

3. Press 1 to print RTI, otherwise press 2.

MODEM TEST
The modem will send various transmit signals on the

telephone line you cna check the following:

- FSK

- Tones : 1100Hz, 1650Hz, 1850Hz, 2100Hz

- G3 training : 14400, 12000, 9600, 7200, 4800, 2400 bps

1. Press SETUP.

2. Press the MENU button until ‘MODEM TEST?’ dis-

plays in the top line of the LCD panel.

DTMF TEST
DTMF(Dual Tone Multiple Frequency) signal can be

checked.

-1,2,3,4,5,6,7,8,9,0,*,#

1. Press SETUP.

2. Press the MENU button until ‘DTMF TEST ?’ dis-

plays in the top line of the LCD panel.

Samsung Electronics

7-6

ROM TEST
Display rom version and checksum.

1. Press SETUP.

2. Press the MENU button until ‘ROM TEST ?’ dis­plays in the top line of the LCD panel.

3. Press START or SETUP.

MODEM SPEED
Default=14400 bps

Select baud rate of 14400, 12000, 9600, 7200, 4800 ro
2400 bps. The lower the baud rate, the larger the
acceptable error rate. T30 protocol has a fixed speed of
300 bps in the protocol mode. When the TX speed is
set to 14400 or 12000 bps, the RX speed will be either
V.17 or V.33. When the Tx speed is set to 9600 or 7200
bps, the RX speed will be either V.29 or V.27 ter. When
the TX speed is set to 4800 or 2400 bps, the RX speed
will be V.27 ter.

1. Press SETUP.

2. Press the MENU until ‘MODEM SPEED ITEM[1-6]’
displays in the top line of the LCD panel.

3. Enter a number from 1 through 6 on the number
keypad.

SET TX LEVEL
Default=12 dBm

Fcc requires that the transmission level be less than -9
dBm. From -9 dBm to -15 dBm is acceptable You cna
set the transmission level between 0 and -15 dBm in 1

dBm steps using the control panel keypad. Accuracy
is +0/-3 dBm

1. Press SETUP.

2. Press the MENU until ‘SET TX LEVEL’ displays in
the top line of the LCD panel.

3. Enter a number from 01 through 15 on the number
keypad.

SET RX LEVEL
Default=-43 dBm

Reception level may be too low due cable losses. If
set to -43 dBm, reception sensitivity will be between 0
and -43 dBm.

1. Press SETUP.

2. Press the MENU until ‘SET RX LEVEL’ displays in

the top line of the LCD panel.

3. Enter a number from 40 through 50 on the number

keypad.

PAUSE TIME
Default=3.0 dBm

This sets the length of the pause time from 1 through
9 seconds, when the pause button is pressed.

1. Press SETUP.

2. Press the MENU until ‘PAUSE TIME’ displays in

the top line of the LCD panel.

3. Enter a number from 01 through 9 on the number

keypad.

Troubleshooting

7-2 FAX/TELEPHONE Precautions

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

TEL LINE CANNOT
BE ENGAGED (NO
DIAL T ONE)

Cannot MF dial.

MF dial is possible
but not DP dial.

• When you press “OHD” key:

a

Check line cord connection.

b

Check CN12-6(main PBA), main
LIU harness, and P1-6(LIU
PBA),(“low”)

c

Check relaying operation of LIU
PBA : Is the control signal of
U29-49(main) high?

• Check CN12-3(main PBA), main-LIU
harness, and P1-3(LIU PBA)

• Check DP control signal at CN12-10

(Main) and PIL10 (LIU PBA)

• Check DP control signal at Q6, U6

and Q2.

• aInsert it correctly into the connection
jack called “line”.

b

Replace defective parts if level is high.

c

Replace main PBA IF the control signal
of U18-49(main) is low. Replace LIU
PBA if high but phone line cannot be
connected.

• Replace defective parts.

• Replace defective parts.

• Replace LIU PBA.

Samsung Electronics

7-7

Troubleshooting

7-3 Paper Feed

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

ASF feeds paper
but paper is not
supplied to the
engine.

ASF cannot feed
paper.

Tilted Printing

• Check if actuator feed operates
perfectly .

• Check if pick up roller operates
perfectly .

• Check if too much paper has been
supplied.

• Check if paper guide of the ASF is
adjusted to the size of paper.

• Replace actuator-feed, spring, or other
defective parts.

• Replace pick up roller assembly.

• Supply appropriate amount of paper(100
sheets of normal copying paper).

• Adjust paper guide to the size of paper.

* ASF: Automatic Sheet Feeder

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

Defective fax
transmission

Defective automatic
fax reception

• Check CN12-1,3(main PBA), main LIU
harness, and P1-1,3(LIU PBA).

•

1)

Is the external phone hooked off?

2)

Is the output of U2-4(LIU PBA) low?

• Check ‘hook off’. : Refer to ‘TEL LINE
CANNOT BE ENGAGED’ above.

• Check transmission path.: Check
output of U37-44(main PBA) and input
of T2-3(LIU PBA).

• Check reception path.: Check output
of T2-3(LIU PBA) and input of
U37-45(main PBA).

• Is the ring checked?

Check ring pattern at CN12-8(main
PBA).

• Refer to ‘Defective Transmission’.

• Replace defective parts.

• 1)Hook on the external phone correctly.

2)

Replace LIU PBA if low.

• Refer to ‘TEL LINE CANNOT BE
ENGAGED’ above.

• Replace main PBA, if abnormal.

• Replace LIU PBA if the output of
T2-3(LIU PBA) is not confirmed.
Check the circuit around U40,U39(main
PBA) if the input of U37-45(main PBA) is
not confirmed though the output of
T2-3(LIU PBA) is confirmed.

• Replace LIU PBA if it cannot be checked.

(constant high)

• Refer to ‘Defective Transmission’.

Samsung Electronics

7-8

Troubleshooting

7-4. Printing Quality

7-4-1 White lines on letters or graphics.

Cause
If nozzles in print head has a problem, white lines are
marked on the print.

‘CARTRIDGE MAINT’ will let you know if nozzles
have fallen problems.

Solution

1) Run ‘print control panel’ to “clean print nozzles”
and check if nozzles have been blocked.

2) Wipe with soft cloth the contact surfaces of ink car­tridge and carriage, and check if nozzles have been
cleaned properly.

3) Separate ink cartridge from carriage and combine
them. Repeat it about 5 to 6 times and check if con­nection is proper.

4) Replace ink cartridge and check whether there’s a
problem with thehead.

5) Check if head cable is inserted well into the main
circuit board and then check if nozzles have prob­lems.

6) Check if head cable is broken or torn and then
check if nozzles have problems.

7) Replace the main circuit board with a new one and
check if nozzles have problems.

If this line is broken, it confirms that
nozzles have problems.

Samsung Electronics

7-9

Troubleshooting

7-4-2 When Vertical lines are printed

crookedly

Cause : Vertical lines are printed crookedly if you do

not “align Vertical lines” on the printer.

Solution

1) Run print control panel to “align Cartridges”.

2) Select the best one of the above samples and enter
the number.

3) This function to align Vertical lines is available both
for mono and color cartridges.

7-4-3 When ink spreads on transparent film

Cause : You selected a wrong medium on the

driver or you did not use transparent film
designated for inkjet.

Solution

1) Use only transparent film designated for inkjet
when you print on transparent film by an inkjet
printer .

2) Run “Windows driver” and select “transparency”
as the kind of paper if you print on Windows.

Samsung Electronics

7-10

Troubleshooting

7-5. Defective Operation

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

LCD does not
display
(operation panel)

Cannot enter by
keys(operation
panel)

LF MOTOR does
not operate.

CR MOTOR does
not operate.

TX MOTOR does
not operate.

Paper Jam

• Powered up?

• VCC(+5v) M+4.5V?

• Is the level of U26-130(_POR) high
(more than +4V)?

• Check Main to OPE harness and
J1(main).

• Is the level of U26-153 (_RST_OUT)
high (more than +4V)?

• Is the level of U26-154 (_OPE_RST)
high (more than +4V)?

• Check control signals of U26-123,
124(OPE_TXD, OPE_RXD).

• Refer to 8-5 of “LCD does not
display”.

• Check OPE key contacts.

• Check the control signals of
U26-39~44.

• Check input signals (DIR, PWM) and
driving output of U24 and U20.

• Check the control signals of U26­31~36.

• Check input signals(DIR, PWM) and
driving output of U13.

• Check the operation of the document
sensor of OPE PBA.

• Check the operation of TX Motor.

a

Check the control signals of U29­105~108.

b

Check input signals and driving
output of U17.

• Check sheet feeder and ejector.

• Check the operation of LF motor.

• Check paper exit sensor.

• Check power.(SMPS)

a

Check if the cord is connected.

b

Check each power channel. (+5V,
+11.75V, +30V)

• Check power harness.

• Check the circuit around U22.

• Replace defective parts.

• Check the state of data bus of U26.:
Replace the main PBA.

• Check the circuit around U29.

• If signals of OPE_TXD are defective,
replace the main PBA. If signals of
OPE_RXD is defective, replace OPE
PBA.(Refer to circuit explanation.

• Refer to 8-5 of “LCD does not display”.

• Replace OPE.

• If control signals are not made when the
other functions are normal, replace the
main PBA.

• If driving output is defective when input
signals are normal, replace U24 and
U20.

• If control signals are not made when the
other functions are normal, replace the
main PBA.

• If driving output is defective when input
signals are normal, replace U13.

• If defective, replace the sensor.

•

a

If control signals are not made when
the other functions are normal, replace
the main PBA

b

If driving output is defective when the
other functions are normal, replace
U17.

• Get rid of jammed paper.

• Refer to “LF motor does not operate.”

• If the sensor senses paper exit when it
operates normally, replace the main
PBA.

Samsung Electronics

7-11

Troubleshooting

1-2 ESD Precautions

PROBLEM ITEMS TO BE CHECKED HOW TO SOLVE

CLR DOCUMENT
JAM

ADD PAPPER

LOAD DOCUMENT

CHECK
CARTRIDGE

Can’t PRINT

• Check document feeder.

• Check the operation of TX motor.

1)

Check the control signals of U29­105~108.

2)

Check the input signals and driving
output of U17 and U11.

• Paper Empty?

• No document?

• Check the document sensor of OPE
PBA.

• Check if ink cartridge is defective.

• Check the output level of U23-13.

• Check USB cable connection.

• Check what type of print driver has
been installed.

• Check I/F part of USB.

1)

Check the initial state of print con-

trol signal of CN13 : pin 1, 2, 3, 4

2)

Check the signal of U43-27 (/USB_INT).

3)

Check signals of U43-29 and U43-

31.

• Remove jammed documents and insert it
again.

• 1)If control signals are not made when

other functions are normal, replace the
main PBA

2)

If driving output is defective when
input signals are normal, replace U17.

• Feed paper.

• Refer to 8-5 of “Paper Jam”.

• Insert documents.

• If high, replace the document sensor. If
low, replace the OPE PBA.

• Replace ink cartridge.

• If low, replace the main PBA.

• Connect it correctly, and when connected
there should be a inkjet pointes item

displayed in a USB port section of a
computer system information.

• Install the print driver again and reboot
the system.

• Replace the main PBA.

Samsung Electronics

7-12

Troubleshooting

MEMO

Samsung Electronics

Appendix Information

* Please refer to list

BUYER ELAUNIT - OPE PMO-WINDOWS PBA SUB-LIU

PANNEL PBA

SF-4700I/XAA JB96-01141A JB72-00660A JB92-01049A
SF-4700I/XAC JB96-01141A JB72-00660A JB92-01049A
SF-4700I/XEC JB96-01141E JB72-00660D JB92-01049B
SF-4700I/XEP JB96-01 141F JB72-00660E JB92-01049B
SF-4700I/XEU JB96-01141B JB72-00660A JB92-01049B

Exploded Views

Samsung Electronics

8-1

8. Exploded Views and Parts Lists

8-1. Main Assembly

Main Assembly Parts Lists

8-2. OPE Unit Assembly

OPE Unit Assembly Parts Lists

8-3. Mechanism Assembly

Mechanism Assembly Parts Lists

8-4. Scan Lower Assembly

Scan Lower Assembly Parts Lists

8-5. ASF Frame Assembly

ASF Frame Assembly Parts Lists

Exploded Views

Samsung Electronics8-2

8-1. Main Assembly

12

11

10

8

6

9-1

9-2

9

4-1

4-3

4-4

4-3

4-1

4-2

4

5

3

0

1

1-4

1-3

1-1

1-2

1-2-4

1-2-5

1-2-6

1-2-3

1-2-1

1-2-2

2

2-2

2-1

3-1

7

Exploded Views

Samsung Electronics

8-3

Main Assembly Parts Lists

Location No. Description SEC. Code Q’ty SA Remark

0 SET SF-4750 X

1 MEC-COVER TOP JB75-00179A 1 O
1-1 PMO-COVER TOP * 1 X
1-2 MEC-DOOR ASS’Y JB75-1 1150F 1 O

1-2-1 PMO-DOOR * 1 X
1-2-2 PPR-SHEET DOOR * 1 X
1-2-3 PMO-GUIDE DOC L * 1 X
1-2-4 PMO-GUIDE DOC R * 1 X
1-2-5 SCREW-TAPTITE * 1 X
1-2-6 GEAR-PINION * 1 X

1-3 ELA M/MEDIO AUD-SPEAKER-ASS’Y JB96-01135B 1 O
1-4 SCREW-TAPTITE * 2 X

2 MEC-CHUTE JB75-00196A 1 O
2-1 PMO-DUMMY CHUTE * 1 X
2-2 PMO-CHUTE * 1 X

3 ELA UNIT-OPE refer the information 1 O
3-1 PMO-WINDOW PANNEL(LCD) refer the information 1 O

4 MEA ETC-WHITE ROLLER JG97-01035A 1 O
4-1 RING-C * 2 X
4-2 MEC-ROLLER CIS * 1 X
4-3 PMO-BUSHING WHITE * 2 X
4-4 PMO-GEAR DRIVER(B4) * 1 X

5 PRINT HEAD INK-M50 * 1 X

PRINT HEAD INK(C) * 1 X
6 MEA UNIT-MECHANISM(SEC) * 1 X
7 ELA UNIT-FRAME ASF * 1 X
8 SMPS-FV JB44-00008A 1 O
9 MEC-STACKER TX JB75-11152C 1 O

9-1 PMO-STACKER TX1 * 1 X
9-2 PMO-STACKER TX2 * 1 X

10 PBA SUB-LIU PBA refer the information 1 O
1 1 MEC-CASSETTE ASF JB75-00181A 1 O
12 ELAUNIT-FRAME SCAN LOWER JB96-01157A 1 0

S.A. : Service Available

O: Service available X: Service not available

Exploded Views

Samsung Electronics8-4

8-2. OPE Unit Assembly

1-19

1-20

2-3

1-17

1-18

1-16

1-5

1-4

1-8

1-11

1-12

1-7

1-15

1-10

1-6

1-13

1-14

1-10

1-1

1-3

1-2

1

2-12

2-5

2-11

2-6

2-10

2-4

2-14

2-9

2-13

2-2

2-15

2-12

2-7

2-1

2

0

Exploded Views

Samsung Electronics

8-5

OPE Unit Assembly Parts Lists

Location No. Description SEC. Code Q’ty SA Remark

0 ELA UNIT -OPE re f er t he i nf ormation 1 O

1 ELA HOU-OPE COVER * 1 X
1-1 PMO-OPE COVER * 1 X
1-2 PPR-COVER SHEET * 1 X
1-3 MPR-SHEET KEY * 1 X
1-4 RMO-RUBBER KEY TEL * 1 X
1-5 RMO-RUBBER KEY FUN * 1 X
1-6 RMO-RUBBER KEY ONE * 1 X
1-7 PMO-KEY CONTRAST * 1 X
1-8 PMO-KEY REPORT * 1 X ONLY 4750C
1-9 PMO-KEY TEL * 1 X

1-10 PMO-KEY MENU * 2 X
1-11 PMO-KEY START * 1 X
1-12 PMO-KEY STOP * 1 X
1-13 PMO-KEY OHD * 1 X
1-14 PMO-KEY ONE TOUCH * 1 X
1-15 PMO-KEY FUNCTION * 1 X
1-16 PBA SUB-OPE PBA JB92-01091A 1 O
1-17 SCREW-TAPPING * 9 X
1-18 SCREW-TAPTITE * 2 X
1-19 LCD DISPLAY JG07-20001A 1 O
1-20 PMO-WINDOWS PANNEL(LCD) re fer th e inf ormation 1 O

2 ELA HOU-SCAN UPPER * 1 X
2-1 W/HARNESS-SCAN GND * 1 X
2-2 SPRING-ADF * 1 X
2-3 PMO-FRAME UPPER * 1 X
2-4 PMO-LEVER SENSOR * 1 X
2-5 PPR-SHEET ADF * 1 X
2-6 RPR-RUBBER ADF * 1 X
2-7 MEC-PINCH * 1 X
2-8 PMO-ROLL PINCH * 2 X
2-9 PMO-SUPPORTADF * 1 X

2-10 MEC-BRUSH ANTISTA TIC * 1 X
2-11 PMO-HOLDER RUBBER * 1 X
2-12 SCREW-TAPPING * 7 X
2-13 RPR-SPONGE ADF * 1 X
2-14 ICT-SHAFT PINCH * 1 X
2-15 MPR-GROUND SENSOR * 1 X

S.A. : Service Available

O: Service available X: Service not available

Exploded Views

Samsung Electronics8-6

8-3. Mechanism Assembly

14-4

13-1

10-1

10-2

10-4

10-3

10-3-4

10-3-3

10-3-1

10-3-2

10

10-3-4

6

4

5

3-1

3-4

3-2

3-3

3

14-2

14-3

14-5

14

14-1

14-8

14-6

14-7

8

13-2

13

9

7

5

11

12

1-3

1-1

1-2

1-4-1

1-4-3

1-4

1

2-4

2-7

2-10

2-5

2-6

2-8

2

2-1

2-2

0

2-5

1-4-2

2-9

Exploded Views

Samsung Electronics

8-7

Mechanism Assembly Parts Lists

Location No. Description SEC. Code Q’ty SA Remark

0 MEA UNIT MECHANISM(SEC) JB97-01285A 1 O

1 MEC-HOLDER ROLLER JB75-00205A 1 O
1-1 SPRING-ES ACTUA T OR * 1 X
1-2 PMO-ACTUATOR FEED * 1 X
1-3 PMO-HOLDER ROLLER * 1 X
1-4 MEC-FRIC ROLLER * 4 X

1-4-1 SPRING-ES * 4 X
1-4-2 IRP-DEFLECTOR * 4 X
1-4-3 ICT-ROLLER FRICTION * 4 X
1-4-4 PMO-HOLDER FRICTION * 4 X

2 MEC-BRKT (LF MOTOR) JB75-00183A 1 O
2-1 SCREW-TAPTITE * 2 X
2-2 MOTOR-STEP LF JB31-10503A 1 O
2-3 MEC-PLATE LF * 1 X
2-4 GEAR-LF IDLE51 * 2 X
2-5 GEAR-LF IDLE75 * 1 X
2-6 RING-C * 1 X
2-7 BEARING-FEED L * 1 X
2-8 GEAR-DOUBLE 51/13(0.4/0.8) * 1 X
2-9 GEAR-IDLE SWING12(0.8) * 2 X

2-10 PMO-ARM(SWING GEAR 2X12) * 1 X

3 MEC-PULLEY IDLE JB75-11110A 1 O
3-1 SPRING-CC PULLEY * 1 X
3-2 ICT-SHAFT PULLEY IDLE * 1 X
3-3 PMO-PULLEY IDLE * 1 X
3-4 PMO-HOLDER PULLEY * 1 X

4 ICT-SHAFT CR JB70-40906A 1 O

5 SPRING-SHAFT CR JB61-70913A 2 O

6 MEA UNIT-CARRIAGE(SEC) JB97-01298A 1 O

7 BEARING-FEED R JB66-10002A 1 O

8 MEC-ROLLER FEED JB75-00062A 1 O

9 PPR-ENCODER JB72-00005A 1 O

10 MEC-FRAM BASE JB75-00170A 1 O
10-1 BELT-EXIT * 1 X
10-2 MEC-EXIT ROLLER * 1 X
10-3 MEC-HOLDER EXIT * 1 X

10-3-1 IPR-SPRING WHEEL * 1 X
10-3-2 PMO-HOLDER WHEEL * 1 X
10-3-3 MEA UNIT-WHEEL STAR * 6 X
10-3-4 SCREW-TAPPING * 2 X

10-4 MEC-SUB FRAME BASE * 1 X

11 ELA UNIT-C/R MOTOR JB96-01154A 1 O

12 PBA SUB-MAIN PBA JB92-01066C 1 O

13 MEC-FRAME MAIN * 1 X

S.A. : Service Available

O: Service available X: Service not available

Exploded Views

Samsung Electronics8-8

Location No. Description SEC. Code Q’ty SA Remark

13-1 IPR-FRAME MAIN * 1 X
13-2 SPRING-PS ENCODER * 1 X

14 MEC-FRAME HOME JB75-00174A 1 O
14-1 SPRING-CS * 2 X
14-2 SPRING-ES LATCH * 1 X
14-3 PMO-FRAME HOME * 1 X
14-4 PMO-LEVER LATCH * 1 X
14-5 PMO-SLED HOME * 1 X
14-6 RPR-RUBBER CAP HEAD * 2 X
14-7 PMO-HOLDER CAP * 2 X
14-8 RPR-RUBBER WIPE HEAD * 2 X

S.A. : Service Available

O: Service available X: Service not available

Exploded Views

Samsung Electronics

8-9

8-4. Scan Lower Assembly

0

13

13-3

13-1

13-2

13-5

13-8

13-6

13-3

13-5

13-7

13-6

11

12

10

3

2

2-1

2-2

2-3

8

9

7

6

7

1

1-5

1-1

1-4

1-6

1-3

1-7

1-2

4

5

5-6

5-5

5-5

5-1

5-2

5-3

Exploded Views

Samsung Electronics8-10

Scan LowerAssembly Parts Lists

Location No. Description SEC. Code Q’ty SA Remark

0 ELA UNIT-FRAME SCAN LOWER JB96-01157A 1 O

1 MEC-ROLLER ADF JG75-10016A 1 O
1-1 RING-C * 1 X
1-2 RING-C * 1 X
1-3 ICT-SHAFTADF * 1 X
1-4 ICT-SPRING CLUTCH * 1 X
1-5 PMO-GEAR ADF * 1 X
1-6 PMO-BUSHING HOLDER * 1 X
1-7 MEC-ROLLER ADF * 1 X

2 MEA ETC-DRIVE ROLLER JG97-01040A 1 O
2-1 RING-C * 1 X
2-2 PMO-GEAR DRIVE * 1 X
2-3 PMO-DRIVE ROLLER * 1 X

3 PMO-SHAFT EXIT JG72-40042A 1 O

4 PMO-TIE STOPPER JG72-40717A 1 O

5 ELA UNIT-CIS JB96-01138A 1 O
5-1 CONTACT IMAGE SENSOR 0609-001125 1 O
5-2 SCREW-TAPPING * 1 X
5-3 W/HARNESS-CIS * 1 X
5-4 CBF HARNESS-CIS GND * 1 X
5-5 SPRING-CIS(C2) * 2 X
5-6 IPR-BRACKET CIS(D) * 1 X

6 PMO-BUSHING TX JB72-41372A 9 O

7 IPR-LOKER TX JB70-10958A 2 O

8 PMO-GUIDE FPC JB72-00424A 1 O

9 NPR-GROUND SPRING * 1 X

10 PMO-FRAME SCAN LOWER * 1 X
11 IPR-SUPPORT SCANNER * 1 X
12 SCREW-TAPPING * 4 X

13 ELA UNIT-SCAN MOTOR JB96-01140A 1 O
13-1 MOTOR-STEP JB73-00008A 1 O SF-4750
13-2 IPR-BRKE(SCAN MOTOR) * 1 X
13-3 RING-C * 3 X
13-4 SCREW-TAPTITE * 3 X
13-5 GEAR-IDLE25 * 2 X
13-6 GEAR-IDLE17/27 * 2 X
13-7 GEAR-IDLE20/33 * 1 X
13-8 GEAR-IDLE17/35 * 1 X

S.A. : Service Available

O: Service available X: Service not available

Exploded Views

Samsung Electronics

8-11

8-5. ASF Frame Assembly

0

5

8

9

10

12
11

13

14

15

7

6

22

23

21

24

30
28
26

31

32

29

18

27

20

16

19

36

35

33

34

3
4

39

38

37

2

1

40

S1

17

Exploded Views

Samsung Electronics8-12

Location No. Description SEC. Code Q’ty SA Remark

0 FRAME ASF ASS’Y*1X
1 FOOT * 2 X
2 PMO-FRAME ASF * 1 X
3 MPR-FELT UPPER JB74-00014A 1 O
4 MPR-FELT LOWER JB74-00015A 1 O
5 PMO-RX-STACKER MAIN * 1 X
6 PMO-STACKER(L) * 1 X
7 PMO-STACKER S JB72-41398C 1 O
8 MEC-CASSETTE ASF * 1 X
9 PMO-CASSETTE ASF * 1 X
10 PMO-GUIDE-SIDE * 1 X
11 PMO-GUIDE-EXTENSION * 1 X
12 PMO-GUIDE EXTENSION DUMM * 1 X
13 MPR-PAD FRICTION * 1 X
14 IPR-GUIDE SIDE(SPRING) * 2 X
15 PMO-ROLLER IDLER * 1 X
16 MEC-ROLLER DRIVE JB75-00187A 1 O
17 MEC ANTISTATIC BRUSH * 1 X
18 PMO-CLUTCH ARM PIN * 1 X
19 PMO-GUIDE INNER * 1 X
20 E-RING * 2 X
21 MEA UNIT-PICKUP ROLLER JB97-01310A 1 O
22 PMO-SHAFT PICKUP(PC+GF) * 1 X
23 PMO-LEVER CASSETTE * 1 X
24 SPRING LEVER LOCKING * 1 X
25 GEAR-IDLE 32 * 1 X
26 GEAR-IDLER ASF * 1 X
27 GEAR-DOUBLE 25/28(0.8) * 1 X
28 GEAR-DOUBLE 20/14(0.8) * 1 X
29 MEC-ARM(SWING 1X12) * 1 X
30 PMO-ARM(SWING GEAR 1X12) * 1 X
31 GEAR-IDLE SWING12(0.8) * 1 X
32 IPR-WAVE WASHER * 1 X
33 MEC-GUIDE OUTER * 1 X
34 PMO-GUIDE OUTER * 1 X
35 IPR-PINCH ROLLER(SPRING) * 3 X
36 PMO-ROLLER PINCH * 3 X
37 RMO-BUCKLER FRICTION * 1 X
38 PMO-HOUSING BUCKLER * 1 X
39 PMO-GUIDE PAPER * 3 X
40 CBF HARNESS-CONN GND * 1 X
S1 SCREW-TAPPING * 1 X
S2 SCREW-TAPPING * 1 X

ASF Frame Assembly Parts Lists

S.A. : Service Available

O: Service available X: Service not available

SEC CODE LOCATION NO. Q’ty DESCRIPTION

JB92-01066C
0401-000116 “D8,D9,D10” 3 DIODE-SWITCHING “MMSD914T1,100V,200mA,225mW,4nS”
0401-001003 “D1,D2,D3” 3 DIODE-SWITCHING “MMBD6050LT1,70V,200mA,225mW,4n”
0402-000199 D4 1 DIODE-RECTIFIER “EGL41B,100V,1A,DO-213AB,TP”
0403-000283 ZD2 1 DIODE-ZENER “MMBZ5234B,6.2V,5%,225mW,SOT-23”
0403-000287 ZD3 1 DIODE-ZENER “MMBZ5251B,22V,5%,225mW,SOT-23,”
0403-001142 ZD1 1 DIODE-ZENER “PTZ12B,12V,12-13.5V,1W,PSM,TP”
0404-000112 D5 1 DIODE-SCHOTTKY “RB420D,25V,100mA,SOT-23,TP”
0501-000279 Q17 1 TR-SMALL SIGNAL “KSA1182-Y,PNP,150mW,SOT-23,TP,”
0501-000338 “Q1,Q2,Q3,Q4,Q5” 5 TR-SMALL SIGNAL “2SC2812,NPN,200mW,SOT-23,TP,20”
0501-000338 “Q15,18,20,22,23,24” 6 TR-SMALL SIGNAL “2SC2812,NPN,200mW,SOT-23,TP,20”
0501-000338 “Q19,Q21,Q25,Q26” 4 TR-SMALL SIGNAL “2SC2812,NPN,200mW,SOT-23,TP,20”
0501-000338 “Q6,Q9,Q10,Q13,Q14” 5 TR-SMALL SIGNAL “2SC2812,NPN,200mW,SOT-23,TP,20”
0501-000415 “Q11,Q16” 2 TR-SMALL SIGNAL “KSP56,PNP,625mW,TO-92,-,100”
0501-000462 “Q7,Q8” 2 TR-SMALL SIGNAL “MMBT2907A,PNP,225mW,SOT-23,TP,”
0503-000129 Q12 1 TR-DARLINGTON “TIP112,NPN,2W,TO-220AB,-,1000”
0506-000182 U17 1 TR-ARRAY “ULN2003L,NPN,7,1W,SOP-16,ST,10”
0604-001154 S1 1 PHOTO-INTERRUPTER“TR,0.2-1.0MA,80MW,DIP,ST”
0801-000442 U108 1 IC-CMOS LOGIC “74HCU04,INVERTER,SOP,14P,150MI”
0801-001055 U35 1 IC-CMOS LOGIC “74VHC08,AND GATE,SOP,14P,150MI”
0801-001056 U30 1 IC-CMOS LOGIC “74VHC32,OR GATE,SOP,14P,150MIL”
0803-000916 U42 1 IC-TTL “74LS245,TRANSCEIVER,SOP,20P,30”
1001-000170 U41 1 IC-ANALOG SWITCH “MC14051BD,SPDT CMOS,SOP,16P,15”
1001-000171 U39 1 IC-ANALOG SWITCH “MC14053BD,SPDT CMOS,SOP,16P,15”
1003-001122 “U13,U20,U24” 3 IC-MOTOR DRIVER “TEA3718SFP,SOP,20P,300MIL,SING”
1003-001137 “U14,U21” 2 IC-SOURCE DRIVER “CD1603,SOP,24P,150MIL,OCTAL,40”
1003-001138 “U18,U19” 2 IC-SOURCE DRIVER “CD1602,SOP,20P,150MIL,SEVEN,10”
1105-001213 U32 1 IC-DRAM “416C1204,1Mx16BIT,SOJ,42P,400M”
1106-000204 U34 1 IC-SRAM “68257,32Kx8BIT,SOJ,28P,300MIL,”
1107-001121 U31 1 IC-FLASH MEMORY “29F800,1Mx8/512Kx16Bit,TSOP ,48P ,787MIL

,70nS,5V ,10%,PLASTIC,0to+70C,100uA,CMOS,ST”
1201-000105 U38 1 IC-AUDIO AMP “34119,SOP,8P ,150MIL,SINGLE,-,P”
1201-000167 “U27,U40” 2 IC-OP AMP “358,SOP,8P,150MIL,DUAL,100V/mV”
1202-000170 “U16,U23” 2 IC-VOLTAGE COMP. “339,SOP,14P,150MIL,QUAD,36V,-,”
1203-001037 U25 1 IC-VOLTAGE REGULATOR“78L05,SOT-89,3P,185MIL,PLASTIC”
1203-002002 U220 1 IC-VOL. DETECTOR

“61FN4512,SOT-89,3P,98MIL,PLASTIC,4.41/4.59,500mW,-30to+80C,50mA,-,TP”
1205-001134 U37 1 IC-MODEM “KS16117Q,QFP,100P,-,PLASTIC,5V”
1205-001771 U221 1 IC-CLOCK GENERATOR

“FS781BZB,SOP ,8P,150MIL,PLASTIC,5.5V,37mW ,0to+70C,TP,-”
2007-000002 R259 1 R-CHIP “75KOHM,5%,1/10W,DA,TP,2012”
2007-000011 R187 1 R-CHIP “200OHM,1%,1/10W,DA,TP,2012”
2007-000023 R156 1 R-CHIP “120OHM,5%,1/10W,DA,TP,2012”
2007-000023 R232 1 R-CHIP “120OHM,5%,1/10W,DA,TP,2012”
2007-000026 R158 1 R-CHIP “200OHM,5%,1/10W,DA,TP,2012”
2007-000026 “R164,R165” 2 R-CHIP “200OHM,5%,1/10W,DA,TP,2012”
2007-000028 “R159,R160,R166,R162” 4 R-CHIP “39OHM,5%,1/10W,DA,TP,2012”
2007-000028 R167 1 R-CHIP “39OHM,5%,1/10W,DA,TP,2012”
2007-000028 “R5,R7,R16” 3 R-CHIP “39OHM,5%,1/10W,DA,TP,2012”
2007-000029 “C109,C110,C108,C81” 4 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R136,R61” 2 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R188,R262” 2 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R194,R281” 2 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R217,R229,R230,C160,C70” 5 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R273,R138” 2 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R308,R315,R316” 3 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R309,R310” 2 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”
2007-000029 “R320,R321” 2 R-CHIP “0OHM,5%,1/10W,DA,TP,2012”

Samsung Electronics

9-1

9-1 Main PBA

9. Electrical Parts Lists

Electrical Parts List

SEC CODE LOCATION NO. Q’ty DESCRIPTION

2007-000033 “R172,R313,R314,R300,R301” 5 R-CHIP “0OHM,5%,1/8W,DA,TP,3216”
2007-000218 R181 1 R-CHIP “1.2KOHM,1%,1/10W,DA,TP,2012”
2007-000223 “R76,R102” 2 R-CHIP “1.2KOHM,5%,1/8W,DA,TP,3216”
2007-000238 “R209,R215,R220” 3 R-CHIP “1.5KOHM,1%,1/10W,DA,TP,2012”
2007-000240 “R2,R6,R205” 3 R-CHIP “1.5KOHM,1%,1/8W,DA,TP,3216”
2007-000241 R75 1 R-CHIP “1.5KOHM,5%,1/10W,DA,TP,2012”
2007-000279 “R50,R56” 2 R-CHIP “100KOHM,1%,1/8W,DA,TP,3216”
2007-000282 R279 1 R-CHIP “100KOHM,5%,1/10W,DA,TP,2012”
2007-000282 “R46,R67” 2 R-CHIP “100KOHM,5%,1/10W,DA,TP,2012”
2007-000290 “R101,R117,R118,R119” 4 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R104,R105,R106,R109” 4 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R111~R115” 5 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R116,R226,R227,R228” 4 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R121~R125” 5 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R127,R128,R62” 3 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R143,R146,R147” 3 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R148,R149,R155,R157,R163” 5 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R177,R179,R180,R183,R186” 5 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R189,R191,R195 5 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”

,R196,R199”
2007-000290 “R200,R203,R216” 3 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R221!R225,R271” 6 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R91,R92,R93,R95” 4 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000290 “R96,R97,R98,R99,R100” 5 R-CHIP “100OHM,5%,1/10W,DA,TP,2012”
2007-000297 “R184,R236,R34,R42” 4 R-CHIP “10KOHM,1%,1/10W,DA,TP,2012”
2007-000300 “R13,R14,R17,R18,R29” 5 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000300 “R174,R175,R176,R178,R185” 5 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000300 R206 1 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000300 “R234,R47,R9,R12” 4 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000300 “R3,R11,R51,R63,R64” 5 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000300 “R33,R202,R207,R237” 4 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000300 “R69,R82,R137,R170” 4 R-CHIP “10KOHM,5%,1/10W,DA,TP,2012”
2007-000303 R129 1 R-CHIP “10KOHM,5%,1/8W,DA,TP,3216”
2007-000304 R317 1 R-CHIP “10MOHM,5%,1/10W,DA,TP,2012”
2007-000325 R268 1 R-CHIP “118KOHM,1%,1/10W,DA,TP,2012”
2007-000338 R274 1 R-CHIP “120KOHM,5%,1/10W,DA,TP,2012”
2007-000352 “R30,R270” 2 R-CHIP “12KOHM,1%,1/10W,DA,TP,2012”
2007-000367 R275 1 R-CHIP “130KOHM,5%,1/10W,DA,TP,2012”
2007-000392 “R19,R39” 2 R-CHIP “150KOHM,1%,1/10W,DA,TP,2012”
2007-000395 R238 1 R-CHIP “150KOHM,5%,1/10W,DA,TP,2012”
2007-000408 R57 1 R-CHIP “15KOHM,1%,1/8W,DA,TP,3216”
2007-000409 “R272,R261” 2 R-CHIP “15KOHM,5%,1/10W,DA,TP,2012”
2007-000444 “R120,R298,R267” 3 R-CHIP “180KOHM,5%,1/10W,DA,TP,2012”
2007-000449 R212 1 R-CHIP “180OHM,5%,1/10W,DA,TP,2012”
2007-000465 R145 1 R-CHIP “1KOHM,1%,1/10W,DA,TP,2012”
2007-000468 R135 1 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R169,R192,R107” 3 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R242,R243,R254~R257” 6 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R253,R239” 2 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R283,R284,R21,R49,R81,R88” 6 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R303,R304,R305,R306” 4 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R52,R59,R77,R78,R87,R131” 6 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000468 “R94,R132,R133,R60,R134,R130” 6 R-CHIP “1KOHM,5%,1/10W,DA,TP,2012”
2007-000474 “R23,R26” 2 R-CHIP “1MOHM,1%,1/10W,DA,TP,2012”
2007-000477 “R71,R72” 2 R-CHIP “1MOHM,5%,1/10W,DA,TP,2012”
2007-000493 R322 1 R-CHIP “2.2KOHM,5%,1/10W,DA,TP,2012”
2007-000523 “R70,R161” 2 R-CHIP “2.7MOHM,5%,1/10W,DA,TP,2012”
2007-000542 R36 1 R-CHIP “200OHM,5%,1/8W,DA,TP,3216”
2007-000551 “R246,R311” 2 R-CHIP “20OHM,5%,1/10W,DA,TP,2012”
2007-000565 “R89,R297” 2 R-CHIP “220KOHM,5%,1/10W,DA,TP,2012”
2007-000635 R278 1 R-CHIP “270KOHM,5%,1/10W,DA,TP,2012”
2007-000671 R286 1 R-CHIP “2KOHM,5%,1/10W,DA,TP,2012”

Samsung Electronics9-2

Main PBA

SEC CODE LOCATION NO. Q’ty DESCRIPTION

2007-000686 R323 1 R-CHIP “3.3KOHM,5%,1/10W,DA,TP,2012”
2007-000700 R182 1 R-CHIP “3.6KOHM,1%,1/10W,DA,TP,2012”
2007-000703 “R79,R84,R204,R285” 4 R-CHIP “3.6KOHM,5%,1/10W,DA,TP,2012”
2007-000705 R55 1 R-CHIP “3.6KOHM,5%,1/8W,DA,TP,3216”
2007-000728 “R80,R295” 2 R-CHIP “300OHM,5%,1/10W,DA,TP,2012”
2007-000738 R171 1 R-CHIP “30KOHM,5%,1/10W,DA,TP,2012”
2007-000757 R260 1 R-CHIP “330KOHM,5%,1/10W,DA,TP,2012”
2007-000766 “R40,R48” 2 R-CHIP “330OHM,5%,1/10W,DA,TP,2012”
2007-000774 R280 1 R-CHIP “33KOHM,5%,1/10W,DA,TP,2012”
2007-000791 R265 1 R-CHIP “36.5KOHM,1%,1/10W,DA,TP,2012”
2007-000814 R65 1 R-CHIP “39.2KOHM,1%,1/8W,DA,TP,3216”
2007-000841 “R208,R219,R214” 3 R-CHIP “3KOHM,1%,1/10W,DA,TP,2012”
2007-000844 “R190,R263,R312” 3 R-CHIP “3KOHM,5%,1/10W,DA,TP,2012”
2007-000844 R54 1 R-CHIP “3KOHM,5%,1/10W,DA,TP,2012”
2007-000872 R296 1 R-CHIP “4.7KOHM,5%,1/10W,DA,TP,2012”
2007-000872 “R4,R10,R245,R247” 4 R-CHIP “4.7KOHM,5%,1/10W,DA,TP,2012”
2007-000920 R244 1 R-CHIP “47.5KOHM,1%,1/10W,DA,TP,2012”
2007-000941 R35 1 R-CHIP “47KOHM,5%,1/10W,DA,TP,2012”
2007-000941 “R45,R66,R291” 3 R-CHIP “47KOHM,5%,1/10W,DA,TP,2012”
2007-000964 “R140~R142,R150~R152” 6 R-CHIP “5.1KOHM,5%,1/10W,DA,TP,2012”
2007-000964 “R15,R20,R28,R31,R32,R38” 6 R-CHIP “5.1KOHM,5%,1/10W,DA,TP,2012”
2007-000964 “R153,R154” 2 R-CHIP “5.1KOHM,5%,1/10W,DA,TP,2012”
2007-000964 “R43,R83” 2 R-CHIP “5.1KOHM,5%,1/10W,DA,TP,2012”
2007-000964 R90 1 R-CHIP “5.1KOHM,5%,1/10W,DA,TP,2012”
2007-001001 R73 1 R-CHIP “510OHM,5%,1/10W,DA,TP,2012”
2007-001039 R8 1 R-CHIP “56KOHM,5%,1/10W,DA,TP,2012”
2007-001041 “R53,R86” 2 R-CHIP “56KOHM,5%,1/8W,DA,TP,3216”
2007-001055 R85 1 R-CHIP “6.2KOHM,5%,1/10W,DA,TP,2012”
2007-001113 R266 1 R-CHIP “680KOHM,5%,1/10W,DA,TP,2012”
2007-001141 R74 1 R-CHIP “7.5KOHM,5%,1/10W,DA,TP,2012”
2007-001143 “R37,R44” 2 R-CHIP “7.5KOHM,5%,1/4W,DA,TP,3225”
2007-001152 R233 1 R-CHIP “750OHM,1%,1/10W,DA,TP,2012”
2007-001220 R269 1 R-CHIP “86.6KOHM,1%,1/10W,DA,TP,2012”
2007-001273 “R22,R41” 2 R-CHIP “5.23KOHM,1%,1/10W,DA,TP,2012”
2007-002631 R27 1 R-CHIP “56.2KOHM,1%,1/8W,DA,TP,3216”
2007-007388 R1 1 R-CHIP “0.825ohm,1%,1W,DA,TE,6331”
2007-007427 “R24,R25” 2 R-CHIP “294OHM,1%,1/10W,DA,TP,2012”
2007-007664 “R68,R103” 2 R-CHIP “0.604ohm,1%,1W,DA,TP,6331”
2011-001094 “RA1,RA2,RA3,RA4,RA5” 5 R-NETWORK “39ohm,5%,63mW,L,CHIP,8P,TP”
2203-000192 “C138~C141,C144” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C142,C124” 2 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C145,C147,C148,C149,C184” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C156,C159” 2 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 C173 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C177,C180” 2 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C19,C20,C21,C26,C28,C29” 6 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C2,C3,C6,C10,C24,C25” 6 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C30,C31,C32,C62,C63” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C36,C37,C45,C46,C50” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C5,C12,C13,C14,C15” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C51,C57,C64,C75,C76,C79” 6 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C68,C69,C72,C73,C77” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C83,C84,C90,C91,C92” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C85,C104,C112,C130,C132” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C94,C96,C100,C106,C102” 5 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000192 “C98,C99,C125,C133,C16,C194” 6 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
2203-000239 “C183,C185” 2 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,2012”
2203-000239 “C189,C178” 2 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,2012”
2203-000239 C58 1 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,2012”
2203-000239 “C67,C89,C179” 3 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,2012”
2203-000260 “C33,C17,C18,C86, 7 “C-CERAMIC,CHIP” “10nF,10%,50V,X7R,TP,2012”

C93,C101,C208”

Electrical Parts List

Samsung Electronics

9-3

Main PBA

SEC CODE LOCATION NO. Q’ty DESCRIPTION

Electrical Parts List

2203-000361 C88 1 “C-CERAMIC,CHIP” “0.15nF,5%,50V,NP0,TP,2012”
2203-000389 “C122,C123” 2 “C-CERAMIC,CHIP” “0.015nF,5%,50V,NP0,TP,2012”
2203-000429 C172 1 “C-CERAMIC,CHIP” “0.018nF,5%,50V,NP0,TP,2012”
2203-000455 “C113~C117,C119” 6 “C-CERAMIC,CHIP” “1nF,5%,50V,NP0,TP,2012”
2203-000455 “C128,C129” 2 “C-CERAMIC,CHIP” “1nF,5%,50V,NP0,TP,2012”
2203-000455 “C131,C150,C155 6 “C-CERAMIC,CHIP” “1nF,5%,50V,NP0,TP,2012”

,C186,C187,C188”
2203-000455 “C42,C191,C192,C193” 4 “C-CERAMIC,CHIP” “1nF,5%,50V,NP0,TP,2012”
2203-000455 C53 1 “C-CERAMIC,CHIP” “1nF,5%,50V,NP0,TP,2012”
2203-000455 “C54,C59” 2 “C-CERAMIC,CHIP” “1nF,5%,50V,NP0,TP,2012”
2203-000476 “C120,C121” 2 “C-CERAMIC,CHIP” “1000nF,+80-20%,16V,Y5V,TP,2012”
2203-000595 “C4,C8,C11” 3 “C-CERAMIC,CHIP” “0.22nF,5%,50V,NP0,TP,2012”
2203-000595 “C56,C60,C61” 3 “C-CERAMIC,CHIP” “0.22nF,5%,50V,NP0,TP,2012”
2203-000634 “C195,C196,C197,C198 8 “C-CERAMIC,CHIP” “0.022nF,5%,50V,NP0,TP,2012”

,C199,C200,C201,C202”
2203-000634 “C203~C27,C41” 6 “C-CERAMIC,CHIP” “0.022nF,5%,50V,NP0,TP,2012”
2203-000634 “C52,C55” 2 “C-CERAMIC,CHIP” “0.022nF,5%,50V,NP0,TP,2012”
2203-000661 C127 1 “C-CERAMIC,CHIP” “0.27nF,5%,50V,NP0,TP,2012”
2203-000858 C78 1 “C-CERAMIC,CHIP” “0.039nF,5%,50V,NP0,TP,2012”
2203-000938 C209 1 “C-CERAMIC,CHIP” “0.47nF,5%,50V,NP0,TP,2012”
2203-001132 C80 1 “C-CERAMIC,CHIP” “0.68nF,5%,50V,NP0,TP,2012”
2203-001158 C107 1 “C-CERAMIC,CHIP” “0.068nF,5%,50V,NP0,TP,2012”
2203-001223 “C1,C7,C9,C22,C23” 5 “C-CERAMIC,CHIP” “0.82nF,10%,50V,X7R,TP,2012”
2203-001223 “C35,C38” 2 “C-CERAMIC,CHIP” “0.82nF,10%,50V,X7R,TP,2012”
2203-002442 C66 1 “C-CERAMIC,CHIP” “330nF,+80-20%,25V,Y5V,TP,2012”
2401-000042 “C47,C48,C176,C174” 4 C-AL “100uF,20%,16V,GP,TP,6.3x7,5”
2401-000131 C40 1 C-AL “1000uF,20%,16V,GP,TP,10x20,5”
2401-001946 C43 1 C-AL “330uF,20%,50V,GP,TP,10x16,5mm”
2401-003010 C39 1 C-AL “1000uF,20%,6.3V,GP,TP,8x11.5mm”
2402-000135 “C111,C135” 2 “C-AL,SMD” “22uF,20%,16V,GP,TP,5.3x5.3x5.4”
2402-000176 “C34,C49,C87,C143,C154” 5 “C-AL,SMD” “10uF,20%,16V,GP,TP,4.3x4.3x5.4”
2404-000151 C146 1 “C-TA,CHIP” “1uF,20%,16V,-,TP,3216,-”
2703-000125 B4 1 INDUCTOR-SMD “10uH,10%,1.25x2x1.25mm”
2703-000158 R213 1 INDUCTOR-SMD “1uH,10%,1.25x2x0.85mm”
2703-000267 R197 1 INDUCTOR-SMD “680nH,10%,1.25x2x1.25mm”
2801-003330 Y1 1 CRYSTAL-UNIT “38.00053MHz,15ppm,28-AAM,18pF,”
2801-003376 OSC3 1 CRYSTAL-UNIT “0.032768MHz,20ppm,28-AAY,12.5p”
3301-000271 B2 1 CORE-FERRITE BEAD“-,-,-,-”
3301-000325 “B3,BD2,BD3” 3 CORE-FERRITE BEAD“AB,3.2x2.5x1.3mm,-,-”
3301-000325 BD1 1 CORE-FERRITE BEAD“AB,3.2x2.5x1.3mm,-,-”
3301-000362 “BD4,BD7,L3” 3 CORE-FERRITE BEAD“AB,3.2x2.5x1.3mm,-,-”
3301-001084 “R110.R126,R144” 3 CORE-FERRITE BEAD“AB,2.0x1.25x0.9mm,-,-”
3301-001117 “BD5,BD6,B1” 3 CORE-FERRITE BEAD“AB,4.5x3.2x1.5x0.3,250,2900G”
3708-001058 “CN1,CN2,CN3” 3 CONNECTOR-FPC/FC/PIC“30P,1.0MM,STRAIGHT,SN”
3711-000198 CN6 1 CONNECTOR-HEADER“1WALL,3P,1R,2.5mm,STRAIGHT,SN”
3711-000225 CN7 1 CONNECTOR-HEADER“1WALL,4P,1R,2.5mm,STRAIGHT,SN”
3711-000280 CN5 1 CONNECTOR-HEADER“1WALL,6P,1R,2.5mm,STRAIGHT,SN”
3711-000826 CN14 1 CONNECTOR-HEADER“BOX,2P,1R,2mm,ANGLE,SN”
3711-000988 CN9 1 CONNECTOR-HEADER“BOX,5P,1R,2mm,ANGLE,SN”
3711-002003 CN4 1 CONNECTOR-HEADER“BOX,26P,2R,2mm,STRAIGHT,SN”
3711-002807 CN8 1 CONNECTOR-HEADER“BOX,6P,1R,2mm,STRAIGHT,SN”
3711-002813 “CN10,CN12” 2 CONNECTOR-HEADER“BOX,12P,1R,2mm,STRAIGHT,SN”
JB13-10508A U26 1 IC ASIC-CPU “SF-4700,KS32C6400,SMD,160P,-”
JB41-00024B 1 PCB-MAIN “SF-4700,FR-4,4L,1.6T,215X85”
JG13-10062A U29 1 IC ASIC-IMAGE CHIP “SF4400,STOA7110,QFP,128P,-”

Samsung Electronics9-4

Main PBA

JB92-01049A 1 PBA SUB-LIU PBA

0401-000005 D3 1 DIODE-SWITCHING “1N4148,100V,200MA,DO-35,TP”
0401-000148 “D4,D5,D6,D7,D8,D9” 6 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0402-000339 BD1 1 DIODE-BRIDGE “W06G,600V,1.5A,-,BK”
0403-000153 “ZD1,ZD2” 2 DIODE-ZENER “1N4746A,18V,5%,1W,DO-41,TP”
0403-000716 “ZD3,ZD4,ZD5,ZD6” 4 DIODE-ZENER “MTZJ4.7B,4.7V,4.55-4.8V,500mW,”
0501-000398 Q6 1 TR-SMALL SIGNAL “KSC945,NPN,250mW,TO-92,TP,120-”
0502-000133 Q2 1 TR-POWER “2SA1156,PNP,1W,TO-126,-,40-80”
0505-000335 Q1 1 FET-SILICON “VN2410M,N,240V,0.19A,10ohm,7.9”
0604-000118 “U1,U2” 2 PHOTO-COUPLER “TR,20-300%,200mW,DIP-4,ST”
0604-000119 U6 1 PHOTO-COUPLER “TR,200-400%,200mW,DIL-4,ST”
1405-000144 “VAR3,VAR4,VAR5” 3 VARISTOR “430V,2500A,14x6.2mm,TP”
1405-000170 VAR1 1 VARISTOR “82V,1200A,9x4.1mm,TP”
1405-000226 VAR2 1 VARISTOR “-,25A,5mm,TP”
2001-000034 R17 1 R-CARBON “220OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000065 R18 1 R-CARBON “10KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000070 R16 1 R-CARBON “15KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000085 “R1,R2” 2 R-CARBON(S) “100KOHM,5%,1/2W,AA,TP,2.4X6.4MM”
2001-000631 R7 1 R-CARBON “30KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000903 R25 1 R-CARBON “620OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-001004 “R4,R5” 2 R-CARBON “82OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2003-000178 R3 1 R-METAL OXIDE “15Kohm,5%,1W,AA,TP,4.3x12mm”
2003-000659 R20 1 R-METAL OXIDE(S) “33ohm,5%,1W,AA,TP,3.3x9mm”
2004-000284 R15 1 R-METAL “12Kohm,1%,1/4W,AA,TP,2.4x6.4mm”
2201-000119 “C10,C11” 2 “C-CERAMIC,DISC” “100nF,+80-20%,50V,Y5V,TP,8x3,5”
2301-000356 C6 1 “C-FILM,PEF” “47nF,5%,50V,TP,7.5x4.0x6.5,5mm”
2301-000402 C7 1 “C-FILM,PEF” “1nF,5%,50V,TP,5x7x2.8mm,5mm”
2301-001308 C9 1 “C-FILM,MPEF” “15NF,10%,400V,BK,10.5X4X9MM,7.5”
2305-000566 C5 1 “C-FILM,MPEF” “1uF,10%,250V,BK,25.5x9x16.5mm,”
2401-000026 C14 1 C-AL “3.3UF,20%,50V,GP,TP,5X11,5”
2401-000486 “C12,C13” 2 C-AL “10uF,20%,50V,GP,TP,6.3x7mm,5”
2401-000899 C3 1 C-AL “22uF,20%,100V,GP,TP,8x11mm,5mm”
2401-001775 C4 1 C-AL “470nF,20%,50V,GP,TP,4x7,5”
2401-002075 C15 1 C-AL “4.7uF,20%,50V,GP,TP,5x11,5”
3501-001160 CML1 1 RELAY-MINIATURE “12VDC,200MW,2000MA,-,4MS,4MS”
3711-002809 P2 1 CONNECTOR-HEADER “BOX,8P,1R,2mm,STRAIGHT,SN”
3711-002813 P1 1 CONNECTOR-HEADER “BOX,12P,1R,2mm,STRAIGHT,SN”
JB26-00001A T1 1 TRANS-MATCHING-REMOTE “SF-3100,-,30KOHM:30KOHM”
JB41-00012A 1 PCB—LIU “SF-4700,PANOL,1 LAYER,0.8T,110*90*0.8T”
JC39-40511A “JP13~JP17” 5 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JC39-40511A “JP18~JP23” 6 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JC39-40511A “JP2,3,5,R19,JP1,JP6” 6 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JC39-40511A “JP8JP12” 5 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JF27-60051A “FLT1,FLT2,FLT3” 3 COIL FILTER- “CF5400,60uH,50mOHM,18T”
JG26-50001A T2 1 TRANS MATCHING- “SF6000,-,600/600”
JG39-41013A 1 CBF HARNESS-LIU GND “SF4400,WIRE,UL1007,145mm,GRN/Y”

Electrical Parts List

Samsung Electronics

9-5

SEC CODE LOCATION NO. Q’ty DESCRIPTION

9-2 LIU PBA(JC92-01049A)

Electrical Parts List

SEC CODE LOCATION NO. Q’ty DESCRIPTION

JB92-01049B LIU PBA 1

0401-000005 D3 1 DIODE-SWITCHING “1N4148,100V,200MA,DO-35,TP”
0401-000148 D4 1 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0401-000148 D5 1 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0401-000148 D6 1 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0401-000148 D7 1 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0401-000148 D8 1 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0401-000148 D9 1 DIODE-SWITCHING “1N914,100V,500mA,DO-35,TP”
0402-000339 BD1 1 DIODE-BRIDGE “W06G,600V,1.5A,-,BK”
0403-000153 “ZD1,ZD2” 2 DIODE-ZENER “1N4746A,18V,5%,1W,DO-41,TP”
0403-000716 “ZD3,ZD4,ZD5,ZD6” 4 DIODE-ZENER “MTZJ4.7B,4.7V,4.55-4.8V,500mW,”
0404-000109 D1 1 DIODE-SCHOTTKY “BAT47,20V,350mA,DO-35,TP”
0404-000109 D2 1 DIODE-SCHOTTKY “BAT47,20V,350mA,DO-35,TP”
0501-000242 Q5 1 TR-SMALL SIGNAL “BC547B,NPN,500mW,TO-92,TP,200-”
0501-000398 Q6 1 TR-SMALL SIGNAL “KSC945,NPN,250mW,TO-92,TP,120-”
0501-000500 Q4 1 TR-SMALL SIGNAL “KSP45,NPN,625mW,TO-92,TP,50-20”
0502-000133 Q2 1 TR-POWER “2SA1156,PNP,1W,TO-126,-,40-80”
0502-000133 Q3 1 TR-POWER “2SA1156,PNP,1W,TO-126,-,40-80”
0505-000335 Q1 1 FET-SILICON “VN2410M,N,240V,0.19A,10ohm,7.9”
0604-000118 U1 1 PHOTO-COUPLER “TR,20-300%,200mW,DIP-4,ST”
0604-000119 U6 1 PHOTO-COUPLER “TR,200-400%,200mW,DIL-4,ST”
1405-000144 “VAR3,VAR4,VAR5” 3 VARISTOR “430V,2500A,14x6.2mm,TP”
1405-000170 VAR1 1 VARISTOR “82V,1200A,9x4.1mm,TP”
2001-000027 R10 1 R-CARBON “100OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000027 R8 1 R-CARBON “100OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000027 R9 1 R-CARBON “100OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000034 R17 1 R-CARBON “220OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000070 R16 1 R-CARBON “15KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000076 R13 1 R-CARBON “47KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000076 R18 1 R-CARBON “47KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000085 R1 1 R-CARBON(S) “100KOHM,5%,1/2W,AA,TP,2.4X6.4MM”
2001-000119 R19 1 R-CARBON “680OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000323 R25 1 R-CARBON “120OHM,5%,1/4W,AA,TP,2.4X6.4MM”
2001-000395 R2 1 R-CARBON “180KOHM,5%,1/4W,AA,TP,2.4X6.4MM”
2003-000006 R20 1 R-METAL OXIDE “47ohm,5%,1W,AA,TP,4.3x12mm”
2003-000178 R3 1 R-METAL OXIDE “15Kohm,5%,1W,AA,TP,4.3x12mm”
2003-000538 R12 1 R-METAL OXIDE(S) “1Kohm,5%,2W,AA,TP,4x12mm”
2004-000284 R15 1 R-METAL “12Kohm,1%,1/4W,AA,TP,2.4x6.4mm”
2004-001773 R11 1 R-METAL “12ohm,1%,1/4W,AA,TP,2.4x7mm”
2201-000119 “C10,C11” 2 “C-CERAMIC,DISC” “100nF,+80-20%,50V,Y5V,TP,8x3,5”
2201-000119 C18 1 “C-CERAMIC,DISC” “100nF,+80-20%,50V,Y5V,TP,8x3,5”
2201-000119 C8 1 “C-CERAMIC,DISC” “100nF,+80-20%,50V,Y5V,TP,8x3,5”
2305-000566 C5 1 “C-FILM,MPEF” “1uF,10%,250V,BK,25.5x9x16.5mm,”
2305-001024 C1 1 “C-FILM,MPEF” “33nF,10%,250V,BK,10.5x3.5x6.5,”
2305-001024 C16 1 “C-FILM,MPEF” “33nF,10%,250V,BK,10.5x3.5x6.5,”
2401-000059 C4 1 C-AL “220nF,20%,50V,GP,-,5x11,5”
2401-000486 “C12,C13” 2 C-AL “10uF,20%,50V,GP,TP,6.3x7mm,5”
2401-000899 C3 1 C-AL “22uF,20%,100V,GP,TP,8x11mm,5mm”
2401-001775 C14 1 C-AL “470nF,20%,50V,GP,TP,4x7,5”
2403-000140 C15 1 “C-TA,DIPPED” “1uF,10%,25V,WT,TP,4.5x8.6mm,5m”
3501-001160 CML1 1 RELAY-MINIATURE “12VDC,200MW,2000MA,-,4MS,4MS”
3711-002809 P2 1 CONNECTOR-HEADER“BOX,8P,1R,2mm,STRAIGHT,SN”
3711-002813 P1 1 CONNECTOR-HEADER“BOX,12P,1R,2mm,STRAIGHT,SN”
JB13-00006A U3 1 IC-HYBRID-DETECTOR“SF-3000,MA91000045S,BULK,7PIN,27X10mm”
JB41-00012A 1 PCB—LIU “SF-4700,PANOL,1 LAYER,0.8T,110*90*0.8T”
JC39-40511A “JP13~JP17” 5 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JC39-40511A “JP18~JP23” 6 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JC39-40511A “JP3,JP7,JP1,JP6,R27” 5 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JC39-40511A “JP8~JP12” 5 CBF HARNESS- “ML-80,JUMPER,AWG22,52mm,SILVER”
JF27-30055A L1 1 COIL RF- “SF2900M,3mH,6OHM,-”
JF27-30055A L2 1 COIL RF- “SF2900M,3mH,6OHM,-”
JF27-60051A “FLT1,FLT2,FLT3” 3 COIL FILTER- “CF5400,60uH,50mOHM,18T”
JG26-50001A T2 1 TRANS MATCHING- “SF6000,-,600/600”
JG39-41013A 1 CBF HARNESS-LIU GND “SF4400,WIRE,UL1007,145mm,GRN/Y”

Samsung Electronics7-6

9-3 LIU PBA(JC92-01049B)

9-5 OTHERS PBA

Electrical Parts List

7-7

SEC CODE LOCATION NO. Q’ty DESCRIPTION

JB92-01091A 1 PBA SUB-OPE PBA

0401-000116 “D1,D2,D3,D4,D5,D15” 6 DIODE-SWITCHING “MMSD914T1,100V,200mA,225mW,4nS”
0604-000229 S1 1 PHOTO-INTERRUPTER “TR,-,-,-,BK”
0604-001006 S2 1 PHOTO-INTERRUPTER “TR,-,-,DIP-4,BK”
2007-000033 “J1,J2,J3,J4,J5,J21” 6 R-CHIP “0OHM,5%,1/8W,DA,TP,3216”
2007-000033 “J11,J12,J13,J14,J15” 5 R-CHIP “0OHM,5%,1/8W,DA,TP,3216”
2007-000033 “J16,J17,J18,J19,J20” 5 R-CHIP “0OHM,5%,1/8W,DA,TP,3216”
2007-000033 “J6,J7,J8,J9,J10” 5 R-CHIP “0OHM,5%,1/8W,DA,TP,3216”
2007-000303 “R12,R36,R37” 3 R-CHIP “10KOHM,5%,1/8W,DA,TP,3216”
2007-000403 “R22,R23” 2 R-CHIP “150OHM,5%,1/8W,DA,TP,3216”
2007-000542 “R15,R16,R17” 3 R-CHIP “200OHM,5%,1/8W,DA,TP,3216”
2007-000589 “R1,R2,R11,R21,R26” 5 R-CHIP “22KOHM,5%,1/8W,DA,TP,3216”
2007-000589 “R27,R28,R29,R30,R31” 5 R-CHIP “22KOHM,5%,1/8W,DA,TP,3216”
2007-000589 “R32,R33” 2 R-CHIP “22KOHM,5%,1/8W,DA,TP,3216”
2007-001121 R14 1 R-CHIP “680OHM,5%,1/8W,DA,TP,3216”
2203-000208 C16 2 “C-CERAMIC,CHIP” “100nF,10%,50V,X7R,TP,3216”
2203-000208 “C2,C3,C14,C15” 4 “C-CERAMIC,CHIP” “100nF,10%,50V,X7R,TP,3216”
2203-000242 “C9,C10” 2 “C-CERAMIC,CHIP” “0.1nF,5%,50V,NP0,TP,3216”
2203-000636 “C6,C7,C8” 3 “C-CERAMIC,CHIP” “0.022nF,5%,50V,NP0,TP,3216”
2203-001005 “C12,C13” 2 “C-CERAMIC,CHIP” “0.047nF,5%,50V,NP0,TP,3216”
2402-000176 C1 1 “C-AL,SMD” “10uF,20%,16V,GP,TP,4.3x4.3x5.4”
2802-001069 OSC1 1 RESONATOR-CERAMIC “7.37MHz,0.5%,TP,4.7x4.1x1.7”
JB13-00004A U1 1 IC ASIC-OPE “SF-3100,HT48C5,SSOP,48P,16.18X10.67X2.79”
JB39-00050A 1 W/HARNESS-OPE “SF-4750C,WIRE,UL,400mm,BLK/RED,UL1061#26”
JB41-00035A 1 PCB-OPE “SF-4750C,PHENOL,1L,1.6T,308X247mm”
JG07-20001A 1 DISPLAY LCD- “SF4000,UC-162937-TNAR5-A,BLK/G”
JG39-41019A 1 CBF HARNESS-LCD “SF4400,WIRE,UL2878,40mm,GRY,#2”
2203-005030 C11 2 “C-CERAMIC,CHIP” “100nF,+80-10%,50V”

9-7

9-4 OPE PBA

SEC CODE LOCATION NO. Q’ty DESCRIPTION

JB92-01113A 1 PBA SUB-CONN PBA

2202-000654 C167 1 “C-CERAMIC,MLC-RADIAL”“100nF,10%,50V,X7R,TP,5.1x6.6x3.2mm,5”
2401-000042 C85 1 C-AL “100uF,20%,16V,GP,TP,6.3x7,5”
3702-000118 CN2 1 CONNECTOR-RIBBON “36P,FEMALE,ANGLE,AU”
3711-002003 CN1 1 CONNECTOR-HEADER“BOX,26P,2R,2mm,STRAIGHT,SN”
JB41-10529A 1 PCB-CONN(COMPAQ) “SF-4700,FR-4,2L,1.6mm,70*128”

JB92-01088A 1 PBA MAIN-ENCODER PBA

2203-000192 C5 1 “C-CERAMIC,CHIP” “100nF,+80-20%,50V,Y5V,TP,2012,”
3708-001198 CN1 1 CONNECTOR-FPC/FC/PIC“6P,1mm,ANGLE,SN”
JB32-90001A U6 1 SENSOR “MUNICH,QEDS9871-P51”
JB41-10526A 1 PCB-SENSOR “MJC-1300G,FR-4,2L,T1.6mm,43.5X”

Electrical Parts List

Samsung Electronics7-8

MEMO

Samsung Electronics

9-1

9. Connection diagram

SCANIP2

8BIT ADC

SCAN CNTR

Color I P

I/O PORT

DMA

MAIN

LIU

POWER

OPE

PAPER EMPTY

LCD

DOC.POS SENSOR

PAPER EMPTY

SENSOR

AC

(110V

~240V)

EXTERNAL PHONE

&

TAD I/F

SPEAKER

SMPS

(+30V,+11.75V,+5V)

TELEPHONE

LINE

KS32C6400

ARM7TDMI

MEM. CNTR

HEAD CNTR

MOTOR CNTR

DERASTERIZER

UART 2

IEEE 1284

TIMERS

I/O PORT

INT. CNTR

REAL TIME CLOCK

USB Interface

DMA 4

MODEM

14400bps

+22V

GENERATOR

MAIN CLOCK

(40 MHz)

FLASH

Memory

(8Mbit)

DRAM

(16Mbit)

AUDIO

PART

AFE

PARALLEL PORT

INTERFACE

PART

PRINT HEAD

DRIVER

CIS INTERFACE

PART

PRINT HEAD

CHECK & PR EH EA T

PC

CIS

(COLOR 300 DPI)

PAPER EXIT SENSOR

CENTRONICS

STEPPER

MOTOR DRIVER

SCAN

STEP MOTOR

DRAM

(16Mbit)

FAST SRAM

(256Kbit)

COLOR

CARTRIDGE

MONO

CARTRIDGE

PRINTHEAD

(600DPI)

DOUBLE HEIGHT

2 PEN

KEY PANNEL

CENTRONICS I/F

ENCODER

RESET

CONTROLLER

RTC CLOCK

(32.768 KHz)

DOC.DET SENSOR

Thermister

CLOCK

(38.00053 MHz)

DC

MOTOR DRIVER

STEPPER

MOTOR DRIVER

CARRIER

DC MOTOR

LINE FEED

STEP MOTOR

BATTERY

BACK UP

(Cap:1000UF)

MODEM &

EXT_PHONE

SEPER ATING

PART

Ring

Detection

Part

EXTERNAL

PHONE

DETECTION

PART

600//600

Tx/Rx

TRANSFORMER

MEMO

Samsung Electronics9-2

PCB Diagrams

Samsung Electronics

11-1

11-1 Main PCB Diagram(Top)

11.PCB Diagrams

PCB Diagrams

Samsung Electronics11-2

11-2 Main PCB Diagram(Bottom)

PCB Diagrams

Samsung Electronics

11-3

11-3Engine PCB Diagram(Top)

PCB Diagrams

Samsung Electronics11-4

11-4Engine PCB Diagram(Bottom)

12-1 Main Circuit Diagram(1/10)

Samsung Electronics 12-1

12. Schematic Diagrams

Schematic Diagrams

12-2 Samsung Electronics

Main Circuit Diagram(2/10)

*

Main Circuit Diagram(3/10)

Samsung Electronics 12-3

Schematic Diagrams