IIC Bus Interface update
Overview, Electrical Data update
(Operating voltage of VDD_SDRAM: 1.8V => 1.8V/2.5V/3.3V)
Page 3
S3C2443X
32-BIT RISC
MICROCONTROLLERS
USER MANUAL
Revision 1.2
Page 4
Important Notice
The information in this publication has been carefully
checked and is believed to be entirely accurate at
the time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from
the use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
notice and is not required to update this
documentation to reflect such changes.
This publication does not convey to a purchaser of
semiconductor devices described herein any license
under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or
guarantee regarding the suitability of its products for
any particular purpose, nor does Samsung assume
any liability arising out of the application or use of
any product or circuit and specifically disclaims any
and all liability, including without limitation any
consequential or incidental damages.
"Typical" parameters can and do vary in different
applications. All operating parameters, including
"Typicals" must be validated for each customer
application by the customer's technical experts.
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authorized for use as components in systems
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manufacture of said product.
S3C2443X 32-Bit RISC Microcontrollers
User manual, Revision 1.2
Publication Number:
any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior
written consent of Samsung Electronics.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Dong, Giheung- gu
Yongin-City, Gyeonggi-Do, Korea
C.P.O. Box #37, Suwon 449-900
TEL: (82)-(031)-209-1928
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Home Page: http://www.samsungsemi.com
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21-S3-C2443X-012007
Samsung Electronics' microcontroller business has been awarded full ISO-14001
certification (BVQ1 Certificate No. 9330). All semiconductor products are
designed and manufactured in accordance with the highest quality standards and objectives.
Signal Descriptions .......................................................................................................................................1-26
Power Management......................................................................................................................................2-13
Power Mode State Diagram.................................................................................................................2-13
Power Saving Modes ...........................................................................................................................2-14
Special Function Registers............................................................................................................................3-2
Bus Priority Map ...................................................................................................................................4-1
Bus Turnaround....................................................................................................................................5-11
Special Registers ..........................................................................................................................................5-13
Bank Idle Cycle Control Registers 0-5..................................................................................................5-13
Bank Read wait State Control Registers 0-5........................................................................................5-13
Bank Write wait State Control Registers 0-5........................................................................................5-14
Bank Output Enable Assertion Delay Control Registers 0-5................................................................5-14
Bank Write Enable Assertion Delay Control Registers 0-5..................................................................5-15
Bank Control Registers 0-5 ..................................................................................................................5-16
Bank Status Registers 0-5....................................................................................................................5-18
Bank Burst Read wait Delay Control Registers 0-5..............................................................................5-18
Bank Onenand Type Selection Register ..............................................................................................5-19
SMC Status Register............................................................................................................................5-19
SMC Control Register...........................................................................................................................5-20
Features ...............................................................................................................................................7-1
Control Register ...................................................................................................................................7-14
Data Register........................................................................................................................................7-16
Main Data Area ECC Register .............................................................................................................7-17
Spare Area ECC Register....................................................................................................................7-18
Examples of Possible Cases................................................................................................................9-7
DMA Special Registers.................................................................................................................................9-8
S3C2443X Port Configuration..............................................................................................................11-2
Port Control Descriptions ..............................................................................................................................11-8
Port Configuration Register (Gpacon-Gpmcon)...................................................................................11-8
Port Data Register (Gpadat-Gpmdat)...................................................................................................11-8
Port Pull-Up/Down Register (Gpbudp-Gpeudp,Gpgudph,Gphudp,Gpjudp,Gpludp,Gpmudp).............11-8
Miscellaneous Control Register............................................................................................................11-8
External Interrupt Control Register.......................................................................................................11-8
I/O Port Control Register...............................................................................................................................11-9
Port A Control Registers (GPACDL, GPACDH)...................................................................................11-9
Features ...............................................................................................................................................14-1
Real Time Clock Operation..................................................................................................................14-2
Leap Year Generator............................................................................................................................14-2
Alarm Function .....................................................................................................................................14-3
Tick time interrupt.................................................................................................................................14-4
Uart Special Registers...................................................................................................................................15-10
Uart Line Control Register....................................................................................................................15-10
Uart Control Register............................................................................................................................15-11
Uart Control Register............................................................................................................................15-11
Uart FIFO Control Register...................................................................................................................15-13
Uart Modem Control Register...............................................................................................................15-14
Uart Tx/Rx Status Register...................................................................................................................15-15
Uart Error Status Register ....................................................................................................................15-16
Uart FIFO Status Register....................................................................................................................15-17
Uart Modem Status Register ................................................................................................................15-18
Function Address Register (FAR)........................................................................................................17-9
Frame Number Register (FNR)............................................................................................................17-10
ENdpoint Direction Register (EDR)......................................................................................................17-11
Test Register (TR)................................................................................................................................17-12
System Status Register (SSR).............................................................................................................17-13
System Control Register (SCR) ...........................................................................................................17-15
EP0 Status Register (EP0SR)..............................................................................................................17-17
EP0 Control Register (EP0CR)]...........................................................................................................17-18
Flowcharts of Operations in Each Mode ..............................................................................................18-7
IIC-Bus Interface Special Registers ..............................................................................................................18-11
Multi-Master IIC-Bus Control (IICCON) Register..................................................................................18-11
SPI special registers......................................................................................................................................19-7
SPI Control Register.............................................................................................................................19-7
SPI Status Register ..............................................................................................................................19-9
SPI Pin Control Register.......................................................................................................................19-11
Signal Description .........................................................................................................................................20-3
SPI Transfer Format......................................................................................................................................20-4
Sequence of Special Function Register........................................................................................................20-5
Video Operation ...................................................................................................................................21-5
Dithering and Frame Rate Control.......................................................................................................21-7
Memory Data Format (STN, BSWP = 0)..............................................................................................21-9
PAD Muxing ..................................................................................................................................................21-17
LCD Controller Special Registers ........................................................................................................21-18
Top block diagram Display Controller...........................................................................................................22-2
Features ...............................................................................................................................................22-3
Brief of the sub-block............................................................................................................................22-4
Data Flow .............................................................................................................................................22-4
Overview of the Color Data..................................................................................................................22-6
VD Signal Connection..........................................................................................................................22-18
PAD Muxing..........................................................................................................................................22-32
Signal Description.................................................................................................................................23-2
Camera Interface Operation..........................................................................................................................23-5
Two DMA ports.....................................................................................................................................23-5
Features ...............................................................................................................................................24-1
Internal Data Path.................................................................................................................................26-3
SDI Special Registers...................................................................................................................................27-4
SDI Control Register (SDICON)...........................................................................................................27-4
SDI Special Registers...................................................................................................................................28-3
Maximum Current Capabilities Register...............................................................................................28-46
Control Register 2.................................................................................................................................28-47
Control Register 3 Register ..................................................................................................................28-49
Host Controller Version Register..........................................................................................................28-50
Chapter 29 Electrical Data
Absolute Maximum Ratings...........................................................................................................................29-1
A.C. Electrical Characteristics.......................................................................................................................29-6
29-23 High Speed SPI Interface Transmit/Receive Timing Constants.........................................29-27
29-24 USB Electrical Specifications..............................................................................................29-28
29-25 USB Full Speed Output Buffer Electrical Characteristics ...................................................29-29
29-26 USB High Speed Output Buffer Electrical Characteristics..................................................29-29
29-27 High Speed SDMMC Interface Transmit/Receive Timing Constants.................................29-29
S3C2443X MICROCONTROLLER xxv
Page 28
NOTES
xxvi S3C2443X MICROCONTROLLER
Page 29
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
1 PRODUCT OVERVIEW
INTRODUCTION
This user’s manual describes SAMSUNG's S3C2443X 16/32-bit RISC microprocessor. SAMSUNG’s S3C2443X
is designed to provide hand-held devices and general applications with low-power, and high-performance microcontroller solution in small die size. To reduce total system cost, the S3C2443X includes the following
components.
The S3C2443X is developed with ARM920T core, 0.13um CMOS standard cells and a memory complier. Its lowpower, simple, elegant and fully static design is particularly suitable for cost- and power-sensitive applications. It
adopts a new bus architecture known as Advanced Micro controller Bus Architecture (AMBA).
The S3C2443X offers outstanding features with its CPU core, a 16/32-bit ARM920T RISC processor designed by
Advanced RISC Machines, Ltd. The ARM920T implements MMU, AMBA BUS, and Harvard cache architecture
with separate 16KB instruction and 16KB data caches, each with an 8-word line length.
By providing a complete set of common system peripherals, the S3C2443X minimizes overall system costs and
eliminates the need to configure additional components. The integrated on-chip functions that are described in
this document include:
• Power control: Normal, Idle, Stop and Sleep mode
• On-chip clock generator with PLL
1-1
Page 30
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
FEATURES
Architecture
•Integrated system for hand-held devices and
general embedded applications.
•16/32-Bit RISC architecture and powerful
instruction set with ARM920T CPU core.
•Enhanced ARM architecture MMU to support
WinCE, EPOC 32 and Linux.
•Instruction cache, data cache, write buffer and
Physical address TAG RAM to reduce the effect
of main memory bandwidth and latency on
performance.
•ARM920T CPU core supports the ARM debug
architecture.
•Internal Advanced Microcontroller Bus
Architecture (AMBA) (AMBA2.0, AHB/APB).
System Manager
• Little/Big Endian support.
• Two independent memory bus - one for the
ROM/SRAM bus (ROM Bank0~Bank5) and one
for the DRAM bus (SDRAM Bank0~Bank1)
•Address space: 64M bytes for Rom bank0 ~
bank5, 128M bytes for SDRAM bank0 ~ bank1.
•Supports programmable 8/16-bit data bus width
for ROM/SRAM bank and programmable 16/32bit data bus width for DRAM bank
•Fixed bank start address from Rom bank 0 to
bank 5 and SDRAM bank 0 to bank1.
•Eight memory banks:
– Six memory banks for ROM, SRAM, and
others (NAND/CF etc.).
– Two memory banks for Synchronous DRAM.
•Complete Programmable access cycles for all
memory banks.
NAND Flash Boot Loader
•Supports booting from NAND flash memory.
(Only 8bit boot support)
• 4KB internal buffer for booting.
• Supports storage memory for NAND flash
memory after booting.
•Supports Advanced NAND flash
Cache Memory
•64-way set-associative cache with I-Cache
(16KB) and D-Cache (16KB).
•8words length per line with one valid bit and two
dirty bits per line.
•Pseudo random or round robin replacement
algorithm.
•Write-through or write-back cache operation to
update the main memory.
•The write buffer can hold 16 words of data and
four addresses.
Clock & Power Manager
•On-chip MPLL and EPLL:
EPLL generates the clock to operate USB Host,
IIS, UART, etc.
MPLL generates the clock to operate MCU at
maximum 533Mhz @ 1.375V.
•Clock can be fed selectively to each function
block by software.
•Power mode: Normal, Idle, STOP and Sleep
mode
Normal mode: Normal operating mode
Idle mode: The clock for only CPU is stopped.
STOP mode: All clocks are stopped.
Sleep mode: The Core power including all
peripherals is shut down.
•Supports external wait signals to expand the bus
cycle.
• Supports self-refresh mode in SDRAM for
• Woken up by EINT[15:0] or RTC alarm & tick
interrupt from Sleep mode and STOP mode.
power-down.
•Supports various types of ROM for booting
(NOR/NAND Flash, EEPROM, OneNAND and
others).
•4-ch 16-bit Timer with PWM / 1-ch 16-bit internal
timer with DMA-based or interrupt-based
operation
•Programmable duty cycle, frequency, and
polarity
• Dead-zone generation
• Supports external clock sources
RTC (Real Time Clock)
•Full clock feature: msec, second, minute, hour,
date, day, month, and year
• 32.768 KHz operation
• Alarm interrupt
• Time tick interrupt
LCD Controller STN LCD Displays Feature
•Supports 3 types of STN LCD panels: 4-bit dual
scan, 4-bit single scan, 8-bit single scan display
type
•Supports monochrome mode, 4 gray levels, 16
gray levels, 256 colors and 4096 colors for STN
LCD
•Supports multiple screen size
– Typical actual screen size: 640x480,
320x240,
160x160, and others.
– Maximum frame buffer size is 4 Mbytes.
– Maximum virtual screen size in 256 color
mode: 4096x1024, 2048x2048, 1024x4096
and others
TFT(Thin Film Transistor) Color Displays Feature
•Supports 1, 2, 4 or 8 bpp (bit-per-pixel) palette
color displays for color TFT
•Supports 16, 24 bpp non-palette true-color
displays for color TFT
•Supports maximum 16M color TFT at 24 bpp
mode
•Supports multiple screen size
– Typical actual screen size: 640x480, 320x240,
160x160, and others.
– Maximum frame buffer size is 4Mbytes.
– Maximum virtual screen size in 64K color
mode: 2048x2048, and others
General Purpose Input/Output Ports
• 24 external interrupt ports
• 147 Multiplexed input/output ports
DMA Controller
• 6-ch DMA controller
• Supports memory to memory, IO to memory,
memory to IO, and IO to IO transfers
•Burst transfer mode to enhance the transfer rate
1-3
• Support 2 overlay windows for TFT
UART
•4-channel UART with DMA-based or interrupt-
based operation
•Supports 5-bit, 6-bit, 7-bit, or 8-bit serial data
transmit/receive (Tx/Rx)
•Supports external clocks for the UART operation
(UEXTCLK)
• Programmable baud rate
• Supports IrDA 1.0
• Loopback mode for testing
• Each channel has internal 64-byte Tx FIFO and
64-byte Rx FIFO.
Page 32
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
FEATURES (Continued)
A/D Converter & Touch Screen Interface
• 10-ch multiplexed ADC
• Max. 500KSPS and 10-bit Resolution
• Internal FET for direct Touch screen interface
Watchdog Timer
• 16-bit Watchdog Timer
• Interrupt request or system reset at time-out
IIC-Bus Interface
• 1-ch Multi-Master IIC-Bus
• Serial, 8-bit oriented and bi-directional data
transfers can be made at up to 100 Kbit/s in
Standard mode or up to 400 Kbit/s in Fast mode.
IIS-Bus Interface
•1-ch IIS-bus for audio interface with DMA-based
operation
• Serial, 8-/16-bit per channel data transfers
• 128 Bytes (64-Byte + 64-Byte) FIFO for Tx/Rx
• Supports IIS format and MSB-justified data
format
AC97 Audio Interface
•1-ch AC97 for audio interface with DMA-based
operation
•16-bit Stereo Audio
USB Host
• 2-port USB Host
• Complies with OHCI Rev. 1.0
• Compatible with USB Specification version 1.1
USB Device
• 1-port USB Device
• 9 Endpoints for USB Device
• Compatible with USB Specification version 2.0
SD/MMC Host Interface
•Normal, Interrupt and DMA data transfer mode
(byte, halfword, word transfer)
• DMA burst4 access support (only word transfer)
• Compatible with SD Memory Card Protocol
version 1.0
• Compatible with SDIO Card Protocol version 1.0
• 64 Bytes FIFO for Tx/Rx
• One Compatible with Multimedia Card Protocol
version 2.11, the other with version 4.0 (HSMMC)
SPI Interface
•Compatible with 2-ch Serial Peripheral Interface
Protocol version 2.11 (1ch. High speed SPI
interface)
• 2x8 bits Shift register for Tx/Rx
• DMA-based or interrupt-based operation
Camera Interface
• ITU-R BT 601/656 8-bit mode support
• DZI (Digital Zoom In) capability
• Programmable polarity of video sync signals
• Max. 16M pixels input support (8M pixel input
support for scaling)
•Image mirror and rotation (X-axis mirror, Y-axis
mirror, and 180° rotation)
•Camera output format (RGB 16/24-bit and
YCbCr 4:2:0/4:2:2 format)
Operating Voltage Range
•Core: 1.3 V for 400MHz
1.375 V for 533MHz
ROM/SRAM: 1.8V/ 2.5V/3.0V/3.3V
SDRAM: 1.8V/ 2.5V/ 3.3V
•I/O: 1.8V/2.5V/3.3V(refer to electrical data)
Operating Frequency
• Fclk Up to 533MHz
• Hclk Up to 133MHz
• Pclk Up to 67MHz
Package
• 400 FBGA 13x13
1-4
Page 33
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
BLOCK DIAGRAM
ARM920T
Trace
interface
Port
Interrupt Cont.
Power Management
External MasterSMC
External
coprocessor
interface
JTAG
Instruction
Cache
(16KB)
R13
IVA[31:0]
ARM9TDMI
Processor core
(Internal Embedded ICE)
DVA[31:0]
R13
Data Cache
(16KB)
DD[31:0]
DMVA[31:0]
Multi-AHB Bus
Instruction
IMVA[31:0]
ID[31:0]
Data
MMU
DINDEX[31:0]
USB Device 2.0
MMU
CP15
USB Host 1.1
IPA[31:0]
Write
Buffer
DPA[31:0]
Write Back
PA TAG RAM
AMBA
bus
interface
WBPA[31:0]
ASB
TFT LCD Controller
CSTN LCD Controller
Camera Interface
HS-MMC
UART 0,1,2,3
SD/MMC
Watchdog Timer
I2C
PWM 0,1,2,3
Timer 4
Figure 1-1. S3C2443X Block Diagram
Bridge & DMA ( 6 Ch)
APB Bus
CF
NFCON
DRAMC
SPI 0,1(SPI0 => HSSPI)
I2S
GPIO
RTC
TSADC
EBI
Memory
Port 0
Memory
Port 1
1-5
Page 34
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
PIN ASSIGNMENTS
1
2
3
4
5
6
7
8
23
22
21
20
19
18
17
16
15
14
121311
10
9
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
Bottom View
Figure 1-2. S3C2443X Pin Assignments (400-FBGA) Top view
1-6
Page 35
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
Table 1-1. 400-Pin FBGA Pin Assignments – Pin Number Order (1/4)
Pin Pin Name Ball Pin Pin Name BallPin Pin Name Ball
XTIpll AI Crystal input signals for internal osc circuit.
When OM[0] = 0, XTIpll is used for MPLL CLK source and EPLL CLK source.
If it isn't used, it has to be Low (0V)
XTOpll AO Crystal output signals for internal osc circuit.
When OM[0] = 0, XTIpll is used for MPLL CLK source and EPLL CLK source.
If it isn't used, it has to be float
MPLLCAP AI Loop filter capacitor for Main PLL.
EPLLCAP AI Loop filter capacitor for Extra PLL
XTIrtc AI 32.768 kHz crystal input for RTC. If it isn’t used, it has to be High
(VDD_RTC=3.3V).
XTOrtc AO 32.768 kHz crystal output for RTC. If it isn’t used, it has to be float.
CLKOUT[1:0] O Clock output signal. The CLKSEL of MISCCR(GPIO register) register
configures the clock output mode among the MPLL_CLK, EPLL CLK,
ARMCLK, HCLK, PCLK.
nRESET ST nRESET suspends any operation in progress and places S3C2443X into a
known reset state. For a reset, nRESET must be held to L level for at least 4
OSCin after the processor power has been stabilized.
nRSTOUT O For external device reset control (nRSTOUT = nRESET & nWDTRST &
SW_RESET) *SW_RESET = nRSTCON of GPIO MISCCR
PWREN O core power on-off control signal
nBATT_FLT I Probe for battery state (Does not wake up at Sleep mode in case of low
battery state). If it isn’t used, it has to be High (3.3V).
OM[4:0] I
OM[4:0] set operating modes of S3C2443X
Refer to “S3C2443 OPERATION MODE DESCRIPTION TABLE”
EXTCLK I Ex t e rnal clock source.
When OM[0] = 1, EXTCLK is used for MPLL and EPLL CLK source.
If it isn't used, it has to be Low (0V).
Memory Interface (ROM/SRAM/NAND/CF)
RADDR[25:0]
O
RADDR[25:0] (Address Bus) outputs the memory address of the
corresponding bank .
RDATA[15:0]
IO
RDATA[15:0] (Data Bus) inputs data during memory read and outputs data
during memory write. The bus width is programmable among 8/16-bit.
nRCS[5:0]
O
nRCS[5:0] (Chip Select) are activated when the address of a memory is within
the address region of each bank. The number of access cycles and the bank
size can be programmed.
nRWE
nROE
nRBE[1:0]
nWAIT
O nRWE (Write Enable) indicates that the current bus cycle is a write cycle.
O nOE (Output Enable) indicates that the current bus cycle is a read cycle.
O Upper byte/lower byte enable (In case of 16-bit SRAM)
I nWAIT requests to prolong a current bus cycle. As long as nWAIT is L, the
current bus cycle cannot be completed. If nWAIT signal isn’t used in your
system, nWAIT signal must be tied on pull-up resistor.
1-26
Page 55
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
Signal In/Out Description
SDRAM I/F
SADDR[15:0] O SDRAM/DDR Address bus
SDATA[31:0] IO SDRAM/DDR Data Bus
nSRAS O SDRAM/DDR row address strobe
nSCAS O SDRAM/DDRcolumn address strobe
nSCS[1:0] O SDRAM/DDR chip select
DQM[3:0] O SDRAM/DDR data mask
DQS[1:0] O DDR Data Strobe
SCLK O SDRAM/DDR clock
nSCLK O DDR Conversion clock
SCKE O SDRAM/DDR clock enable
NAND Flash
FCLE O Command latch enable
FALE O Address latch enable
nFCE O Nand flash chip enable
nFRE O Nand flash read enable
nFWE O Nand flash write enable
FRnB I Nand flash ready/busy
SMC/OneNAND
RSMCLK I/O SMC Clock
RSMVAD O SMC Address Valid
RSMBWAIT O SMC Burst Wait
CF I/F
nOE_CF O CF Output Enable Strobe
nWE_CF O CF Write Enable Strobe
nIREQ_CF I Interrupt request from CF card
nINPACK_CF I Input acknowledge in I/O mode
CardPWR_CF O Card Power Enable
nREG_CF O Register in CF card strobe
RESET_CF O CF card reset
1-27
Page 56
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
Signal In/Out Description
LCD Control Unit
VD[23:0] O STN/TFT/SEC TFT: LCD data bus
LCD_PWREN O STN/TFT/SEC TFT: LCD panel power enable control signal
VCLK O STN/TFT: LCD clock signal
VFRAME O STN: VFRAM signal
TFT: VSYNC signal
VLINE O STN: VLINE signal
TFT: HSYNC signal
VM O STN: VM alternates the polarity of the row and column voltage
TFT: VDEN enable data signals
LEND O TFT: Line end signal
LCDVF[2:0] O SEC TFT: Timing control signal for specific TFT LCD(OE/REV/REVB) CAMERA Interface
CAMRESET O Camera interface reset
CAMCLKOUT O Camera interface master clock
CAMPCLK I Camera interface pixel clock
CAMHREF I Camera interface horizontal sync
CAMVSYNC I Camera interface horizontal sync
CAMDATA[7:0] I Camera interface data
Interrupt Control Unit
EINT[23:0] I External interrupt request
External I/F
nXDREQ[1:0] I External DMA request
nXDACK[1:0] O External DMA acknowledge
nXBREQ I nXBREQ (Bus Hold Request) allows another bus master to request control of
the local bus. nXBACK active indicates that bus control has been granted.
nXBACK O nXBACK (Bus Hold Acknowledge) indicates that the S3C2443X has
surrendered control of the local bus to another bus master.
UART
RXD[3:0] I UART receives data input (ch. 0/1/2)
TXD[3:0] O UART transmits data output (ch. 0/1/2)
nCTS[2:0] I UART clear to send input signal (ch. 0/1)
nRTS[2:0] O UART request to send output signal (ch. 0/1)
EXTUARTCLK I External clock input for UART
1-28
Page 57
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
Signal In/Out Description
TSADC
AIN[9:0] AI ADC input[9:0]. If it isn’t used pin, it has to be low (ground).
When touch screen device is used, A[6], A[7] , A[8] and A[9] are used as YM,
YP, XM and XP, respectively.
Vref AI ADC Vref
IIC-Bus
IICSDA IO IIC-bus data
IICSCL IO IIC-bus clock
IIS-Bus
I2SLRCK IO IIS-bus channel select clock
I2SSCLK IO IIS-bus serial clock
I2SCDCLK O CODEC system clock
I2SSDI I IIS-bus serial data input
I2SSDO O IIS-bus serial data output
AC’97
AC_nRESET
AC_SYNC
AC_BIT_CLK0
AC_SDI0
AC_SDO0
IO AC’97 Master H/W Reset
IO 12.288MHz serial data clock
O
48kHz fixed rate sample sync
I Serial, time division multiplexed, AC’97 input stream
O Serial, time division multiplexed, AC’97 output stream
USB Host
DN IO
DP IO
DATA(–) from USB host. (Need to 15kΩ pull-down)
DATA(+) from USB host. (Need to 15kΩ pull-down)
USB Device
DM_UDEV IO DATA(–) for USB peripheral.
DP_UDEV IO DATA(+) for USB peripheral.
REXT O External Resist ( 3.4Kohm +/- 1%)
XO_UDEV OSC Crystal output
XI_UDEV OSC Crystal input
1-29
Page 58
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
Signal In/Out Description
SPI
SPIMISO[1:0] IO SPIMISO is the master data input line, when SPI is configured as a master.
When SPI is configured as a slave, these pins reverse its role.
* SPIMISO[0] is for the High Speed SPI Interface.
SPIMOSI[1:0] IO SPIMOSI is the master data output line, when SPI is configured as a master.
When SPI is configured as a slave, these pins reverse its role.
* SPIMOSI[0] is for the High Speed SPI Interface.
SPICLK[1:0] IO SPI clock
* SPICLK[0] is for the High Speed SPI Interface.
nSS[1:0] I SPI chip select (only for slave mode)
*nSS[0] is for the High Speed SPI Interface.
SDMMC Interface
SD0_DAT[7:0] IO SD0 receive/transmit data
SD0_CMD IO SD0 receive response/ transmit command
SD0_CLK O SD0 clock
SD0_nWP O SD0 Write Protect
SD0_nCD O SD0 Card Detect
SD0_nLED O SD0 LED
SD1_DAT[3:0] IO SD1 receive/transmit data
SD1_CMD IO SD1 receive response/ transmit command
SD1_CLK O SD1 clock
General Port
GPn[147:0] IO
General input/output ports, which are multiplexed with other function pins (some ports
are output only).
TIMMER/PWM
TOUT[3:0] O Timer output[3:0]
TCLK I External timer clock input
JTAG TEST LOGIC
nTRST I nTRST (TAP Controller Reset) resets the TAP controller at start.
If debugger is used, A 10K pull-up resistor has to be connected.
If debugger (black ICE) is not used, nTRST pin must be issued by a low active
pulse (Typically connected to nRESET).
TMS I TMS (TAP Controller Mode Select) controls the sequence of the TAP
controller's states.
TCK I TCK (TAP Controller Clock) provides the clock input for the JTAG logic.
TDI I TDI (TAP Controller Data Input) is the serial input for test instructions and
data.
TDO O TDO (TAP Controller Data Output) is the serial output for test instructions and
data.
1-30
Page 59
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
Signal In/Out Description
Power
VDDalive P S3C2443X reset block and port status register VDD.
It should be always supplied whether in normal mode or in Sleep mode.
VDDiarm P S3C2443X core logic VDD for ARM core.
VDDi P S3C2443X core logic VDD for Internal block.
VSSi/VSSiarm P S3C2443X core logic VSS
VDDA_MPLL P S3C2443X MPLL analog and digital VDD.
VSSA_MPLL P S3C2443X MPLL analog and digital VSS.
VDD_RTC P RTC VDD (3.0V, Input range: 2.5 ~ 3.6V)
This pin must be connected to power properly if RTC isn't used.
VDDA_EPLL P S3C2443X EPLL analog and digital VDD
VSSA_EPLL G S3C2443X EPLL analog and digital VSS
VDD_OP1 P S3C2443X System I/O Power (2.5 ~ 3.3V)
VDD_OP2 P S3C2443X System I/O Power 2 ( 1.8 ~ 3.3V)
VDD_CAM P S3C2443X Camera I/O Power (1.8 ~ 3.3V)
VDD_LCD P S3C2443X LCD I/O Power (2.5 ~ 3.3V)
VDD_SD P S3C2443X SD/MMC I/O Power (1.8 ~ 3.3V)
VDD_SDRAM P S3C2443X SDRAM/DDR I/O Power (1.8V/ 2.5V/ 3.3V)
VDD_SRAM P S3C2443X ROM/SRAM I/O Power
VSS_OP1 G S3C2443X System I/O Ground
VSS_OP2 G S3C2443X System I/O Ground
VSS_CAM G S3C2443X Camera I/O Ground
VSS_LCD G S3C2443X LCD I/O Ground
VSS_SD G S3C2443X SD/MMC I/O Ground
VSS_SDRAM G S3C2443X SDRAM/DDR I/O Ground
VSS_SRAM G S3C2443X ROM/SRAM I/O Ground
VDDA_ADC P S3C2443X ADC VDD(3.3V)
VSSA_ADC P S3C2443X ADC VSS
VDDI_UDEV P USB 2.0 Phy Power ( 1.2V)
VSSI_UDEV G USB 2.0 Phy Ground
VDDA33C/VDDA33T1 P USB 2.0 Phy Power ( 3.3V)
VSSA33C/VSSA33T2 G USB 2.0 Phy Ground
* OM[0] selects the clock source of MPLL/EPLL
( You can select different EPLL clock source with that of MPLL by software setting – refer to SYSCON)
* addr(x) means the number of address cycle during NAND Flash operation.
Mode
NAND
(Muxed)
ROM/
1-32
Page 61
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
S3C2443X MEMORY MAP AND BASE ADDRESS OF SPECIAL REGISTERS
Memory Map
R/W Bank0 read wait state control register
R/W Bank1 read wait state control register
R/W Bank2 read wait state control register
R/W Bank3 read wait state control register
R/W Bank4 read wait state control register
R/W Bank5 read wait state control register
R/W Bank0 write wait state control register
R/W Bank1 write wait state control register
R/W Bank2 write wait state control register
R/W Bank3 write wait state control register
R/W Bank4 write wait state control register
R/W Bank5 write wait state control register
R/W
R/W
Bank0 output enable assertion delay
control register
Bank1 output enable assertion delay
control register
1-35
Page 64
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
Table 1-5. S3C2443X Special Registers (Continued)
Register
Name
SMBWSTOENR2 0x4F00004C
SMBWSTOENR3 0x4F00006C
SMBWSTOENR4 0x4F00008C
SMBWSTOENR5 0x4F0000AC
Address
(B. Endian)
Address
(L. Endian)
Acc.
Unit
Read/
Write
R/W
R/W
R/W
R/W
Function
Bank2 output enable assertion delay
control register
Bank3 output enable assertion delay
control register
Bank4 output enable assertion delay
control register
Bank5 output enable assertion delay
control register
R/W Bank0 control register
R/W Bank1 control register
R/W Bank2 control register
R/W Bank3 control register
R/W Bank4 control register
R/W Bank5 control register
R/W Bank0 status register
R/W Bank1 status register
R/W Bank2 status register
R/W Bank3 status register
R/W Bank4 status register
R/W Bank5 status register
ATA enable and clock down status
ATA status
ATA command
ATA software reset
ATA interrupt sources
ATA interrut mask
ATA configuration for ATA interface
ATA PIO timing
ATA UDMA timing
ATA transfer number
ATA current transfer count
ATA start address of track buffer
ATA size of track buffer
ATA PIO device Feature/Error register
ATA PIO sector count register
ATA PIO device LBA low register
ATA PIO device LBA middle register
ATA PIO device LBA high register
ATA PIO device register
R/W DMA 0 initial source control
R/W DMA 0 initial destination
R/W DMA 0 initial destination control
R/W DMA 0 control
R DMA 0 count
R DMA 0 current source
R DMA 0 current destination
R/W DMA 0 mask trigger
R/W DMA 3 initial source control
R/W DMA 3 initial destination
R/W DMA 3 initial destination control
R/W DMA 3 control
R DMA 3 count
R DMA 3 current source
R DMA 3 current destination
R/W DMA 3 mask trigger
W R/W MPLL lock time count register
LOCKCON1 0x4C00_0004 EPLL lock time count register
OSCSET 0x4C00_0008 Oscillator stabilization control register
Reserved 0x4C00_000C Reserved
MPLLCON 0x4C00_0010 MPLL configuration register
RESERVED 0x4C00_0014 RESERVED
EPLLCON 0x4C00_0018 EPLL configuration register
CLKSRC 0x4C00_0020 Clock source control register
CLKDIV0 0x4C00_0024 Clock divider ratio control register0
CLKDIV1 0x4C00_0028 Clock divider ratio control register1
HCLKCON 0x4C00_0030 HCLK enable register
PCLKCON 0x4C00_0034 PCLK enable register
SCLKCON 0x4C00_0038 Special clock enable register
RESERVED 0x4C00_003C Reserved
PWRMODE 0x4C00_0040 Power mode control register
SWRST 0x4C00_0044 Software reset control register
BUSPRI0 0x4C00_0050 Bus priority control register 0
SYSID 0x4C00_005C R System ID register
PWRCFG 0x4C00_0060
R/W Power management configuration
register
RSTCON 0x4C00_0064 Reset control register
RSTSTAT 0x4C00_0068 R Reset status register
WKUPSTAT 0x4C00_006C R/W Wake-up status register
INFORM0 0x4C00_0070 SLEEP mode information register 0
INFORM1 0x4C00_0074 SLEEP mode information register 1
INFORM2 0x4C00_0078 SLEEP mode information register 2
INFORM3 0x4C00_007C SLEEP mode information register 3
PHYCTRL 0x4C00_0080 usb phy control register
PHYPWR 0x4C00_0084 usb phy power control register
URSTCON 0x4C00_0088 usb phy reset control register
UCLKCON 0x4C00_008C usb phy clock control register
1-43
Page 72
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
Table 1-5. S3C2443X Special Registers (Continued)
Register
Name
Address
(B. Endian)
Address
(L. Endian)
Acc.
Unit
Read/
Write
Function
TFT LCD Controller
VIDCON0 0x4C80_0000 R/W Video control 0 register
VIDCON1 0x4C80_0004 Video control 1 register
VIDTCON0 0x4C80_0008 Video time control 0 register
VIDTCON1 0x4C80_000C Video time control 1 register
VIDTCON2 0x4C80_0010 Video time control 2 register
WINCON0 0x4C80_0014 Window control 0 register
WINCON1 0x4C80_0018 Window control 1 register
VIDOSD0A 0x4C80_0028 Video Window 0’s position control
register
VIDOSD0B 0x4C80_002C Video Window 0’s position control
register
VIDOSD0C 0x4C80_0030 Video Window 0’s position control
register
VIDOSD1A 0x4C80_0034 Video Window 1’s position control
register
VIDOSD1B 0x4C80_0038 Video Window 1’s position control
register
VIDOSD1C 0x4C80_003C Video Window 1’s position control
VIDINTCON 0x4C80_00AC Indicate the Video interrupt control
register
W1KEYCON0 0x4C80_00B0 Color key control register
W1KEYCON1 0x4C80_00B4 Color key value (transparent value)
register
W2KEYCON0 0x4C80_00B8 Color key control register
W2KEYCON1 0x4C80_00BC Color key value (transparent value)
register
W3KEYCON0 0x4C80_00C0 Color key control register
W3KEYCON1 0x4C80_00C4 Color key value (transparent value)
register
W4KEYCON0 0x4C80_00C8 Color key control register
W4KEYCON1 0x4C80_00CC Color key value (transparent value)
register
WIN0MAP 0x4C80_00D0 Window color control
WIN1MAP 0x4C80_00D4 Window color control
WPALCON 0x4C80_00E4 Window Palette control register
SYSIFCON0 0x4C80_0130 System Interface control for Main LDI
SYSIFCON1 0x4C80_0134 System Interface control for Sub LDI
DITHMODE1 0x4C80_0138 Dithering mode register.
rSIFCCON0 0x4C80_013C System interface command control
rSIFCCON1 0x4C80_0140 SYS IF command data write control
rSIFCCON2 0x4C80_0144 SYS IF command data read control
rCPUTRIGCON1 0x4C80_015C CPU trigger source mask
rCPUTRIGCON2 0x4C80_0160 Software based trigger control
rVIDW00ADD0B1 0x4C80_0068 Window 0’s buffer start ADDR
rVIDW01ADD0 0x4C80_006C Window 1’s buffer start ADDR
Control register
Command register
Address register
Data register
1st and 2nd main ECC data register
3rd and 4th main ECC data register
Spare ECC read register
Programmable start block address
register
Programmable end block address
register
R NAND status registet
R ECC error status0 register
R ECC error status1 register
R Generated ECC status0 register
R Generated ECC status1 register
R Generated Spare area ECC status
Target image format of preview DMA
Preview DMA control related
Preview pre-scaler ratio control
Preview pre-scaler destination format
Preview main-scaler control
Preview scaler target area
UART 2 FIFO control
UTRSTAT2 0x50008010 R UART 2 Tx/Rx status
UERSTAT2 0x50008014 UART 2 Rx error status
UFSTAT2 0x50008018
UART 2 FIFO status
UTXH2 0x50008023 0x50008020B W UART 2 transmission hold
URXH2 0x50008027 0x50008024R UART 2 receive buffer
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Page 79
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
Table 1-5. S3C2443X Special Registers (Continued)
Register
Name
UBRDIV2 0x50008028
UDIVSLOT2 0x500802C
Address
(B. Endian)
Address
(L. Endian)
←
Acc.
Unit
Read/
Write
Function
W R/W UART 2 baud rate divisor
Baud rate divisior(decimal place)
register 2
ULCON3 0x5000C000
UART 3 line control
UCON3 0x5000C004 UART 3 control
UFCON3 0x5000C008 UART 3 FIFO control
UTRSTAT3 0x5000C010 R UART 3 Tx/Rx status
UERSTAT3 0x5000C014 UART 3 Rx error status
UFSTAT3 0x5000C018
UART 3 FIFO status
UTXH3 0x5000C023 0x5000C020B W UART 3 transmission hold
URXH3 0x5000C027 0x5000C024R UART 3 receive buffer
UBRDIV3 0x5000C028
UDIVSLOT3 0x500C02C
Pull-up/down control M
Miscellaneous control
DCLK0/1 control
External interrupt control register 0
External interrupt control register 1
External interrupt control register 2
External interrupt control register 2
External interrupt control register 3
External interrupt mask register
External interrupt pending register
GSTATUS0 0x560000ac External pin status
GSTATUS1 0x560000b0 Chip ID
DSC0 0x560000c0 Strength control register 0
DSC1 0x560000c4 Strength control register 1
DSC2 0x560000c8 Strength control register 2
MSLCON 0x560000cc Memory I/F HiZ control register
DATAPEN 0x560000e8 Pull down control for S/RDATA
RTC
RTCCON 0x57000043 0x57000040B R/W RTC control
TICNT0 0x57000047 0x57000044Tick time count register 0
TICNT1 0x5700004F 0x5700004CTick time count register 1
RTCALM 0x57000053 0x57000050RTC alarm control
ALMSEC 0x57000057 0x57000054 Alarm second
ALMMIN 0x5700005B 0x57000058 Alarm minute
ALMHOUR 0x5700005F 0x5700005C Alarm hour
ALMDATE 0x57000063 0x57000060 Alarm day
ALMMON 0x57000067 0x57000064 Alarm month
ALMYEAR 0x5700006B 0x57000068 Alarm year
BCDSEC 0x57000073 0x57000070 BCD second
BCDMIN 0x57000077 0x57000074 BCD minute
BCDHOUR 0x5700007B 0x57000078 BCD hour
BCDDATE 0x5700007F 0x5700007C BCD day
BCDDAY 0x57000083 0x57000080 BCD date
BCDMON 0x57000087 0x57000084 BCD month
BCDYEAR 0x5700008B 0x57000088 BCD year
TICKCNT 0x57000090W R Internal tick time counter
RTCLBAT 0x57000097 0x57000094B R/W RTC LOW battery check
1-55
Page 84
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
Table 1-5. S3C2443X Special Registers (Continued)
Register
Name
Address
(B. Endian)
Address
(L. Endian)
Acc.
Unit
Read/
Write
Function
A/D Converter
ADCCON 0x58000000
ADCTSC 0x58000004
←
W R/W ADC control
ADC touch screen control
ADCDLY 0x58000008 ADC start or interval delay
ADCDAT0 0x5800000C R ADC conversion data
ADCDAT1 0x58000010 ADC conversion data
ADCUPDN 0x58000014 R/W Stylus up or down interrupt status
ADCMUX 0x58000018 R/W Analog input channel select
SPI(SPI Channel 1)
SPCON1 0x59000000
←
W R/W SPI Channel 1 control
SPSTA1 0x59000004 R SPI Channel 1 status
SPPIN1 0x59000008 R/W SPI Channel 1 pin control
SPPRE1 0x5900000C SPI Channel 1 baud rate prescaler
SPTDAT1 0x59000010 SPI Channel 1 Tx data
SPRDAT1 0x59000014 R SPI Channel 1 Rx data
SPTXFIFO1 0x59000018 W SPI Channel 1 Tx FIFO Register
SPRXFIFO1 0x5900001C R SPI Channel 1 Rx FIFO Register
SPRDATB1 0x59000020 R SPI Channel 1 Rx Data Register
SPFIC1 0x59000024 R/W SPI Channel 1 FIFO Interrupt and
DMA control Register
SPTOV1 0x59000028 R/W SPI Channel 1 Rx FIFO Timeout Value
W R/W SDI control
SDIPRE 0x5A000004 SDI baud rate prescaler
SDICARG 0x5A000008 SDI command argument
SDICCON 0x5A00000C SDI command control
SDICSTA 0x5A000010 R/(C)SDI command status
SDIRSP0 0x5A000014 R SDI response
SDIRSP1 0x5A000018 SDI response
SDIRSP2 0x5A00001C SDI response
SDIRSP3 0x5A000020 SDI response
SDIDTIMER 0x5A000024 R/W SDI data / busy timer
SDIBSIZE 0x5A000028 SDI block size
SDIDCON 0x5A00002C
SDI data control
SDIDCNT 0x5A000030 R SDI data remain counter
SDIDSTA 0x5A000034 R/(C)SDI data status
SDIFSTA 0x5A000038 R SDI FIFO status
SDIIMSK 0x5A00003C
←
W SDI interrupt mask
SDIDAT 0x5A000043 0x5A000040B R/W SDI data
1-56
Page 85
S3C2443X RISC MICROPROCESSOR PRODUCT OVERVIEW
Table 1-5. S3C2443X Special Registers (Continued)
Register
Name
Address
(B. Endian)
Address
(L. Endian)
Acc.
Unit
Read/
Write
Function
HSSPI(SPI Channel 0)
CH_CFG 0x52000000 R/W SPI configuration register
Clk_CFG 0x52000004 Clock configuration register
MODE_CFG 0x52000008 SPI FIFO control register
Slave_slection_reg 0x5200000C Slave selection signal
SPI_INT_EN 0x52000010 SPI Interrupt Enable register
SPI_STATUS 0x52000014 SPI status register
SPI_TX_DATA 0x52000018 SPI TX DATA register
SPI_RX_DATA 0x5200001C SPI RX DATA register
Packet_Count_reg 0x52000020 Count how many data master gets
Pending_clr_reg 0x52000024 Pending clear register
HSMMC(SD/MMC Channel 0)
SYSAD 0x4A800000
←
R/W SDI control register
BLKSIZE 0x4A800004 Host DMA Buffer Boundary and
Transfer Block Size Register
BLKCNT 0x4A800006 Blocks Count For Current Transfer
ARGUMENT 0x4A800008 Command Argument Register
TRNMOD 0x4A80000C Transfer Mode Setting Register
CMDREG 0x4A80000E Command Register
RSPREG0 0x4A800010 Response Register 0
RSPREG1 0x4A800014 Response Register 1
RSPREG2 0x4A800018 Response Register 2
RSPREG3 0x4A80001C Response Register 3
BDATA 0x4A800020 Buffer Data Register
PRNSTS 0x4A800024 Present State Register
HOSTCTL 0x4A800028 Present State Register
PWRCON 0x4A800029 Present State Register
BLKGAP 0x4A80002A Block Gap Control Register
WAKCON 0x4A80002B Wakeup Control Register
CLKCON 0x4A80002C Command Register
TIMEOUTCON 0x4A80002E Timeout Control Register
SWRST 0x4A80002F Software Reset Register
NORINTSTS 0x4A800030 Normal Interrupt Status Register
ERRINTSTS 0x4A800032 Error Interrupt Status Register
1-57
Page 86
PRODUCT OVERVIEW S3C2443X RISC MICROPROCESSOR
Table 1-5. S3C2443X Special Registers (Continued)
Register
Name
Address
(B. Endian)
Address
(L. Endian)
Acc.
Unit
Read/
Write
Function
NORINTSTSEN 0x4A800034 Normal Interrupt Status Enable
Register
ERRINTSTSEN 0x4A800036 Error Interrupt Status Enable Register
NORINTSIGEN 0x4A800038 Normal Interrupt Signal Enable
Register
ERRINTSIGEN 0x4A80003A Error Interrupt Signal Enable Register
ACMD12ERRSTS 0x4A80003C Auto CMD12 Error Status Register
CAPAREG 0x4A800040 Capabilities Register
MAXCURR 0x4A800048 Maximum Current Capabilities
W R/W AC97 global control register
AC_GLBSTAT 0x5B000004 R AC97 global status register
AC_CODEC_CMD 0x5B000008 R/W AC97 codec command register
AC_CODEC_STAT 0x5B00000C R AC97 codec status register
AC_PCMADDR 0x5B000010
AC_MICADDR 0x5B000014
AC_PCMDATA 0x5B000018
AC_MICDATA 0x5B00001C
AC97 PCM out/in channel FIFO
address register
AC97 mic in channel FIFO address
register
R/W AC97 PCM out/in channel FIFO data
register
AC97 MIC in channel FIFO data
register
Cautions on S3C2443X Special Registers
1. In the little endian mode ‘L’, endian address must be used. In the big endian mode ‘B’ endian address must be
used.
2. The special registers have to be accessed for each recommended access unit.
3. All registers except ADC registers, RTC registers and UART registers must be read/write in word unit (32-bit)
in little/big endian.
4. Make sure that the ADC registers, RTC registers and UART registers be read/write by the specified access
unit and the specified address. Moreover, one must carefully consider which endian mode is used.
5. W : 32-bit register, which must be accessed by LDR/STR or int type pointer (int *).
HW : 16-bit register, which must be accessed by LDRH/STRH or short int type pointer (short int *).
B : 8-bit register, which must be accessed by LDRB/STRB or char type pointer (char int *).
1-58
Page 87
S3C2443X RISC MICROPROCESSOR SYSTEM CONTROLLER
2 SYSTEM CONTROLLER
OVERVIEW
The system controller consists of three parts; reset control, system clock control, and system power-management
control. The system clock control logic in S3C2443X can generate the required system clock signals which are the
inputs of ARM920T, several AHB blocks, and APB blocks. There are two PLLs in S3C2443X to generate internal
clocks. One is for general functional blocks, which include ARM, AHB, and APB. The other is for the special
functional clocks which are the USB, I2S and camera interface clock. Software program control the operating
frequency of the PLLs, internal clock sources and enabled or disabled the clocks to reduce the power
consumption.
S3C2443X has various power-down modes to keep optimal power consumption for a given task. The power-down
modes consists of four modes; NORMAL mode, IDLE mode, STOP mode, and SLEEP mode. In NORMAL mode,
the input clock of each block is enabled or disabled according to the software to eliminate the power consumption
of unused blocks for a certain application. For example, if an UART is not needed, the software can disable the
input clock independently. The major power dissipation of S3C2443X is due to ARM core, since the operating
speed is relative higher than that of the other blocks. Typically, the operating frequency of the ARM core is
533MHz, while the AHB blocks and the APB blocks operate on 133MHz and 66MHz, respectively. Thus, the
power control of the ARM core is major issue to reduce the overall power dissipation in S3C2443X, and IDLE
mode is supported for this purpose. In IDLE mode, the ARM core is not operated until the external interrupts or
internal interrupts. The STOP mode freezes all clocks to all peripherals as well as the ARM core by disabling
PLLs. The power consumption is only due to the leakage current and the minimized alive block in S3C2443X.
SLEEP mode is intended to disconnect the internal power. So, the power consumption due to the ARM core and
the internal logic except the wake-up logic will be nearly zero in the SLEEP mode. In order to use the SLEEP
mode two indenpendent power sources are required. One of the two power soruces supplies the power for the
wake-up logic. The other one supplies the normal functional blocks including the ARM core. It should be controlled
in order to turn ON/OFF with a special pin in S3C2443X. The detailed description of the power-saving modes such
as the entering sequence to the specific power-down mode or the wake-up sequence from a power-down mode is
given in the following Power Management section.
FEATURE
• Include two on-chip PLLs called main PLL(MPLL), extra PLL(EPLL)
• MPLL generates the system reference clock
• EPLL generates the clocks for the special functional blocks
• Independent clock ON/OFF control to reduce power consumption
• Support three power-down modes, IDLE, STOP, and SLEEP, to optimize the power dissipation
• Wake-up by one of external Interrupt, RTC alarm, Tick interrupt and BATT_FLT.(Stop and Sleep mode)
• Control internal bus arbitration priority
2-1
Page 88
SYSTEM CONTROLLER S3C2443X RISC MICROPROCESSOR
BLOCK DIAGRAM
off-partalive-part
Clocks
Clock
Generator
AHB
Glue
Power Management
Register
Signal
Masking
Power Management
Glue
Register
Reset
Control
Reset
Power
ON/OFF
Figure 2-1. System controller block diagram
Figure 2-1 shows the system controller block diagram. The system controller is divided into two blocks, which are
the OFF block and the ON block. Since the system controller must be alive when the external power supply is
disabled. The ALIVE-part is supplied by an auxiliary power source and waits until external/internal interrupts.
However, the OFF-part is disabled when the power-down mode is SLEEP. The clock generator makes all internal
clocks, which include ARMCLK for the ARM core, HCLK for the AHB blocks, PCLK for the APB block, and other
special clocks. The special functional registers (SFR) are located at the register blocks, and their values are
configured through AHB interface. If a software want to change into a power-down mode, then the power
management blocks detect the values within the SFR and change the mode. In addition, they assert the external
power ON/OFF signal if required. All reset signals are generated at the reset control block.
The detailed explanations for each block will be described in the following sections.
2-2
Page 89
S3C2443X RISC MICROPROCESSOR SYSTEM CONTROLLER
FUNCTIONAL DESCRIPTIONS
The system controller for S3C2443X has three functions, which include the reset management, the clock
generation, and the power management. In this section, the behavior will be described.
Reset Management
When S3C2443X is power-on, the external device must assert reset to initialize internal states.
Reset Types
S3C2443X has four types of resets and reset controller in system controller can place the system into the
predefined states with one of the following four resets.
•Hardware Reset – It is generated when nRESET pin is asserted. It is an uncompromised, unmaskable, and
complete reset, which is used when you need no information in system any more.
•Watchdog Reset – The watchdog timer monitors the device state and generates the watchdog reset when the
state is abnormal.
• Software Reset – Software can initialize the internal state by writing the special control register (SWRST).
• Wakeup Reset – When the system wakes up from SLEEP mode, it generates reset signals.
Hardware Reset
Hardware reset is invoked when the nRESET pin is asserted and all units in the system (except RTC) are
initialized to known states. During the hardware reset, the following actions will occur:
• All internal registers and ARM920T core goes into their pre-defined initial state.
• All pins get their reset state, and BATT_FLT pin is ignored.
• The nRSTOUT pin is asserted while the reset is progressed.
When the unmaskable nRESET pin is asserted as low, the internal hardware reset signal is generated. Upon
assertion of nRESET, S3C2443X enters into reset state regardless of the previous state. To enter hardware reset
state, nRESET must be held long enough to allow internal stabilization and propagation of the reset state.
Caution: An external power source, regulator, for S3C2443X must be stable prior to the deassertion of nRESET.
Otherwise, it damages to S3C2443X and its operation will not be guaranteed.
Figure 2-2 shows the clock behavior during the power-on reset sequence. The crystal oscillator begins oscillation
within several milliseconds after the power source supplies enough power-level to S3C2443X. Initially, two internal
PLLs (MPLL and EPLL) stop. The nRESET pin should be released after the fully settle-down of the power supplylevel. S3C2443X requires a hazard-free system clock (SYSCLK, ARMCLK, HCLK, and PCLK) to operate properly
when the system reset is released. Since the PLL does not work initially, the PLL input clock (F
SYSCLK instead of the PLL output clock (F
). Software must configure MPLLCON and EPLLCON register to
OUT
) is directly fed to
IN
use each PLL. The PLL begins the lockup sequence toward the new frequency only after the S/W configures the
PLL with a new frequency-value. The PLL output is immediately fed to SYSCLK after lock time.
You should be aware that the crystal oscillator settle-down time is not explicitly added by the hardware during the
power-up sequence and the crystal oscillation must be settle-down during this period. However, S3C2443X will
explicitly add the crystal oscillator settle-down time (XTALWAIT) when it wakes up from the STOP mode.
2-3
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SYSTEM CONTROLLER S3C2443X RISC MICROPROCESSOR
The EPLL output clock is directly fed to some special clocks for TFT Controller, I2S, HS-MMC, USB host and
UART. Since the EPLL input clock is initially fed to the input clocks for them, software must configure EPLLCON
register to use the EPLL.
POWER
nRESET
EXTCLK
or XTIpll
PLL is configured by S/W first time
Clock
disable
Lock time
VCO is adapte to new clock frequency
.
VCO
output
SYSCLK
The logic is operarted by
EXTCLK or XTIpll
SYSCLK is FOUT
Figure 2-2. Power-on reset sequence
WATCHDOG RESET
Watchdog reset is invoked when software fails to prevent the watchdog timer from timing out.
During the watchdog reset, the following actions occur :
• All units(except some blocks listed in table 2-1 ) go into their pre-defined reset state.
• All pins get their reset state, and BATT_FLT pin is ignored.
• The nRSTOUT pin is asserted during watchdog reset.
Watchdog reset can be activated in normal and idle mode because watchdog timer can expire with clock.
Watchdog reset is invoked when watchdog timer and reset are enabled (WTCON[5] = 1, WT CON[0]=1) and
watchdog timer is expired. Watchdog reset is invoked then, the following sequence occurs. :
1. Watchdog reset source asserts.
2. Internal reset signals and nRSTOUT are asserted and reset counter is activated.
3. Reset counter is expired then, internal reset signals and nRSTOUT are deasserted.
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S3C2443X RISC MICROPROCESSOR SYSTEM CONTROLLER
SOFTWARE RESET
Software can initialize the device state itself when it writes “0x533C_2443” to SWRST register.
During the software reset, the following actions occur :
• All units(except some blocks listed in table 2-1 ) go into their pre-defined reset state.
• All pins get their reset state, and BATT_FLT pin is ignored.
• The nRSTOUT pin is asserted during software reset.
Software reset is invoked then, the following sequence occurs. :
1. User write “0x533C_2443” to SWRST register.
2. System controller request bus controller to finish current transactions.
3. Bus controller send acknowledge to system controller after completed bu s transactions.
4. System controller request memory controller to enter into self refresh mode.
5. System controller wait for self refresh acknowledge from memory controller.
6. Internal reset signals and nRSTOUT are asserted and reset counter is activated.
7. Reset counter is expired then, internal reset signals and nRSTOUT are deasserted.
WAKEUP RESET
When S3C2443X is woken up from SLEEP mode by wakeup event, the wakeup reset is invoked. The detail
description will be explained in the power management mode section.
Table 2-1 lists alive registers which are not influenced various reset sources except nRESET. With the exception
of below registers(in table 2-1), All S3C2443X’s internal registers are reset by above-mentioned reset sources.
Table 2-1. Registers & GPIO status in RESET (R: reset, S: sustain previous value)
Figure 2-3 shows the block diagram of the clock generation module. The main clock source comes from an
external crystal (XTI) or external clock (EXTCLK). The clock generator consists of two PLLs (Phase-Locked-Loop)
which generate the high-frequency clock signals required in S3C2443X.
OM[0]
XTI
EXTCLK
XTI
EXTCLK
OM[0]&
CLKSRC
CLOCK SOURCE SELECTION
MPLL
ExtClk Div
EPLL
SYSCLK
ECLK
Figure 2-3. Clock generator block diagram
ARMCLK
HCLK
PCLK
DDRCLK
Clock
Divider &
Mux
USBHOST
CAMCLK
LCDCLK
I2SCLK
UARTCLK
Table 2-2 and 2-3 show the relationship between the combination of mode control pins OM[0] and the selection of
source clock for S3C2443X.
Table 2-2. Clock source selection for the main PLL and clock generation logic
OM[0]
MPLL Reference Clock
(Main clock source)
note1
0 XTI
1 EXTCLK
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S3C2443X RISC MICROPROCESSOR SYSTEM CONTROLLER
Table 2-3. Clock source selection for the EPLL
CLKSRC[8] (register)
0
0
1
1
CLKSRC[7] (register)
X
X
0 X
1 X
PLL & Clock Generator generally uses the following conditions.
Loop filter capacitance
CLF
MPLLCAP :Typ. :150pF(142 ~ 175pF)
EPLLCAP :Typ: 700pF(630 ~ 770pF)
Fin
Fout
External capacitance used for X-tal
- MPLL: 10 – 30 MHz
MPLL: 300 – 1100 MHz
C
15 – 22 pF
EXT
Main Oscillator circuit examples
OM[0] EPLL Reference Clock
0 XTI
1 EXTCLK
XTI
EXTCLK
EPLL: 10 – 40 MHz
EPLL: 20 – 100 MHz
EXTCLK
C EXT
XTIpll
C EXT
XTOpll
a) X-TAL O scillation (O M [0]=0)b) External Clock Source (O M [0]=1)
External
OSC
EXTCLK
XTIpll
XTOpll
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SYSTEM CONTROLLER S3C2443X RISC MICROPROCESSOR
PLL (PHASE-LOCKED-LOOP)
The PLL (Phase-Locked Loop) frequency synthesizer is constructed in CMOS on single monolithic structure. The
PLL provides frequency multiplication capabilities.
MPLL generates the clock sources for ARMCLK, HCLK, PCLK, DDRCLK and SSMCCLK and EPLL generates
clock sources for USBHOSTCLK, CAMCLK and so forth.
The following sections describe the operation of the PLL, that includes the phase difference detector, charge
pump, VCO (Voltage controlled oscillator), and loop filter.
Refer to MPLLCON and EPLLCON registers to change PLL output frequency.
Off-chip loop filter
FinPre-Divider
PFD
Charge
Pump
Main
Divider
VCO
Post
Scaler
Fout
Figure 2-4. PLL(Phase-Locked Loop) Block Diagram
CHANGE PLL SETTINGS IN NORMAL OPERATION
During the operation of S3C2443X in NORMAL mode, if the user wants to change the frequency by writing the
PMS value, the PLL lock time is automatically inserted. During the lock time, the clock is not supplied to the
internal blocks in S3C2443X. The timing diagram is as follow.
MPLL_clk
PMS setting
PLL Locktime
SYSCLK
It changes to LOW value during
lock time automatically
It changes to new PLL clock
after lock time automatically
Figure 2-5. The case that changes slow clock by setting PMS value
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S3C2443X RISC MICROPROCESSOR SYSTEM CONTROLLER
SYSTEM CLOCK CONTROL
The ARMCLK is used for ARM920T core, the main CPU of S3C2443X. The HCLK is the reference clock for
internal AHB bus and peripherals such as the memory controller, the interrupt controller, LCD controller, the DMA,
USB host block, System Controller, Power down controller and etc. The PCLK is used for internal APB bus and
peripherals such as WDT, IIS, I2C, PWM timer, ADC, UART, GPIO, RTC and SPI etc. DDRCLK is the data strobe
clock for DDR memories. CAMclk is used for camera interface block.
EXTCLK
XTI
System
Controller
MPLL
PLL3000X
EPLL
PLL2126X
ARM920T
ARMCLK
HCLK part
PCLK part
EPLLclk
TIC
DMA
(6ch)
MEMC
CAMIF
LCD Con
(STN)
FIMD
(TFT)
INTC
HS-MMC
USB dev
(V2.0)
USB host
(V1.1)
EXT_CLK
(mpll)
usb_phy
AC97
TSADC
SD-MMC
(SDI)
PWM
UART
SPI 2.0
SPI_0
SPI_1
I2C
GPIO
WDT
RTC
gpio
I2S
Figure 2-6. The clock distribution block diagram
2-9
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SYSTEM CONTROLLER S3C2443X RISC MICROPROCESSOR
XTI
EXTCLK
Divider
(1 ~ 15)
PLL3000X
(300 ~ 1100Mhz)
MSysClk
ARM-DIVIDER
1/1 ~ 1/16
PRE-DIVIDER
1/1 ~ 1/4
MSysClkPreDiv
1/
1/
1/
2 DI
4 DI
8 DI
0
1
DVS
0
1
2
Hx2_MHCLK_M
V
V
V
0
1
0
Hx1_2_MPCLK _M
1
2
3
0
1
2
3
ARMCLK
(533Mhz)
HCLK
(133Mhz)
DDRCLK
(266Mhz)
SSMCCLK
(133Mhz)
PCLK
(66Mhz)
Figure 2-7. MPLL Based clock domain
The MSysClk is the base clock for S3C2443 system clock, such as ARMCLK, HCLK, PCLK, DDRCLK, etc.
The following table shows the clock division ratios between ARMCLK, HLCK and PCLK. This ratio is deter mined
by PREDIV, HCLKDIV and PCLKDIV bits of CLKDIV0 control register.
Figure 2-8 shows EPLL and special clocks for various peripherals
SCL
I2
K
DISPSYSCL
K
(FIMD)
UARTCLK
XTI
EXTCLK
EPllRefClk
PLL2126X
(20 ~ 100Mhz)
ESYSCLK
Divider
(1~
Divider
(1~
Divider
(1~
25
1
)
6
I2SEXTCLK
)
6
1
)
6
Divider
(1~4)
Divider
(1~4)
Divider
(1~4)
Divider
(1~
1
)
6
USBHOSTCLK
HSMMCCLK
SPICLK(2.0)
CAMCLK
(portOut)
Figure 2-8. EPLL Based clock domain
ESYSCLK CONTROL
Clocks of the EPLL can be used for various peripherals. Each divider value is configured in CLKDIV1 register and
all clocks are enabled or disabled by accessing SCLKCON register. According to USB host interface, If you want
to get the clock with exact 50% duty cycle, then make EPLL generate 96MHz and divide the clock.
EPLL will be turned off during STOP and SLEEP mode automatically. Also, EPLL will be generated clock to
ESYSCLK, after exiting STOP and SLEEP mode if corresponding bits are enabled in SCLKCON register.
Table 2-5. ESYSCLK Control
Condition ESYSCLK state EPLL state
After reset EPLL reference clock off
After configuring EPLL
During PLL lock time: LOW
After PLL lock time: EPLL output
on
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S3C2443X RISC MICROPROCESSOR SYSTEM CONTROLLER
POWER MANAGEMENT
The power management block controls the system clocks by software for the reduction of power consumption in
S3C2443X. These schemes are related to PLL, clock control logic(ARMCLK, HCLK, PCLK) and wake-up signal.
S3C2443X has four power-down modes. The following section describes each powe r management mode.
Related registers are PWRMODE, PWRCFG and WKUPSTAT.
POWER MODE STATE DIAGRAM
Figure 2-9 shows that Power Saving mode state and Entering or Exiting condition. In general, the entering
conditions are set by the main CPU.
Normal
(General Clock
CMDCMD
Gating Mode)
IDLE
One of
wakeup
source
CMD
restricted
SLEEP
One of
wakeup
source
STOP
Reset
or
wakeup
evants.
Figure 2-9. Power mode state diagram
2-13
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SYSTEM CONTROLLER S3C2443X RISC MICROPROCESSOR
POWER SAVING MODES
Normal Mode (General Clock Gating Mode)
In General Clock Gating mode, the On/Off clock gating of the individual clock source of each IP block is performed
by controlling of each corresponding clock source enable bit. The Clock Gating is applied instantly whenever the
corresponding bit (or bits) is changed. (these bits are set or cleared by the main CPU.)
IDLE Mode
In IDLE mode, the clock to CPU core is stopped. The IDLE mode is activated just after the execution of the
STORE instruction that enables the IDLE Mode bit. The IDLE Mode bit should be cleared after the wake-up from
the IDLE state for the entering of next IDLE Mode. The H/W logic only detects the low-to-high triggering of the
IDLE Mode bit.
STOP Mode
In STOP mode, all clocks are stopped for minimum power consumption. Therefore, the PLL and oscillator circuit
are also stopped(oscillator circuit is stopped optionally, see PWRCFG register). The STOP Mode is activated after
the execution of the STORE instruction that enables the STOP mode bit. The STOP Mode bit should be cleared
after the wake-up from the STOP state for the entering of next STOP mode. The H/W logic only detects the lowto-high triggering of the STOP Mode bit.
To exit from STOP mode, External interrupt, RTC alarm, RTC Tick, or BATT_FLT has to be activated. During the
wake-up sequences, the crystal oscillator and PLL may begin to operate. The crystal-oscillator settle-down-time
and the PLL locking-time is required to provide stabilized ARMCLK. Those time-waits are automatically inserted
by the hardware of S3C2443X. During these time-waits, the clock is not supplied to the internal logic circuitry.
STOP mode Entering sequence
note3
is as follows
1. Set the STOP Mode bit ( by the main CPU)
2. System controller requests bus controller to finish current transactions.
3. Bus controller send acknowledge to system controller after completed bu s transactions.
4. System controller request memory controller to enter into self refresh mode. It is for preserving contents in
SDRAM.
5. System controller wait for self refresh acknowledge from memory controller.
6. After receiving the self-refresh acknowledge, system controller disables system clocks, and switches
SYSCLK’s source to MPLL reference clock.
7. Disables PLLs and Crystal(XTI) oscillation. If OSC_EN_STOP bit in PWRCFG register is ‘high’ then system
controller doesn’t disable crystal oscillation.
note3. DRAM has to be in self-refresh mode duri ng STOP and SLEEP mode to retain valid memory data. LCD must be
stopped before STOP and SLEEP mode, because DRAM can't be accessed when it is in self-refresh mode.
STOP mode Exiting sequence is as follows
1. Enable X-tal Oscillator if it is used, and wait the OSC settle down (around 1ms).
2. After the Oscillator settle-down, the System Clock is fed using the PLL input clock and also enable the PL Ls
and waits the PLL locking time
3. Switching the clock source, now the PLL is the clock source.
2-14
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