Samsung HABANA NP-P50 Series, HABANA NP-R65 Series, R65, P50 Service Manual
SAMSUNG
R65/P50
HABANA
NP-R65xxxx/xxx
NP-P50xxxx/xxx
SERVICE
Manual
SAMSUNG R65/P50
FEATURES
1. Simple & Essential Note PC
-. New Intel Napa technology.
-. High Bright Gloss, 4:3 LCD.
-. Convenient Multi-media.
2. High Performance &
Convenient Management function.
-. High-Performance Dual Core
-. Powerful connectivity.
If there are the Contents not included in this book, please refer to K-zone Service Manual
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- Contents -
1. Precautions
1) General After-Sales Service Precautions
2) Safety Precautions
3) Ground
4) Static Electricity Precautions
2. Introduction and Specification
1) Introduction
2) Specification
3) Specification comparison between R50 and R65.
4) Wireless LAN Specification
5) Option list
6) The seperate sale list
3. Function
1) Construction of System
2) Keyboard
3) Multi Card Slot
4) PC Card Slot
5) SPDIF Port
6) ASF and Core Multi Processing
7) Description of Main board
4. Disassembly and Reassembly
1) Disassembly and Reassembly of R65
2) Disassembly and Reassembly of P50
5. Troubleshooting
1) General
2) Debugging Flow Chart
3) System Diagnosis
4) Hardware Troubleshooting
5) Device Settings Related Software Diagnosis
6) CPU Fan Control Problems
7) Battery Use Time
6. Exploded view
1) Exploded view of R65
2) Exploded view of P50
3) ODD
7. Schematic
1) SYSTEM
2) External GFx Board
3) Ontop Board
4) Touchpad Board
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- Contents -
8. System Block Diagram
1) Block diagram
9. System Wire Diagram
1) R65 Top
2) R65 Bottom
3) P50 Top
4) P50 Bottom
5) LCD
10. Part list
1) SYSTEM
2) External GFx board
11. References
1) Safety Notice
2) Model Numbering Rule
3) CPU Code table
4) Glossary
5) Hardware Upgrade
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1.
Precautions
1) General After-Sales Service Precautions
(1) Do not let customers repair the product themselves.
☞
There is a danger of injury and the product life time may be shortened.
(2) Make sure to disconnect the power cord from the wall outlet before repairing the product
(especially for after-sales service of electric parts).
☞
There is a danger of electric shock.
(3) Do not let customers plug several electric home appliances into a single wall outlet at the same
time
☞
There is a danger of fire due to overheating.
(4) Check if the power plug or wall outlet are damaged in any way.
repair or replace it immediately. (There is a danger of electric shock or fire)
(5) Make sure that it is properly grounded. (Check the ground of the wall outlet)
☞
Electricity leakage may cause electric shock.
(6) Do not spray water on to the product to clean it.
☞
There is a danger of electric shock or fire and it may shorten the lifetime of the product.
(7) Check the assembly status of the product after the after-sales service.
☞
The assembly status of the product must be the same as before the after-sales service.
(8) Unplug the power cord holding the power plug (and not the cord).
☞
If the cord is disconnected, it may cause electric shock or fire.
(9) Repair the product using only authorized parts.
(10) Keep the product away from heating devices such as heaters.
☞
Exposure to heaters may cause deformation of the product or fire.
☞
If a defect is found,
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1.
Precautions
2) Safety Precautions
(1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
(2) Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET
or CMOS. Since these types of devices are highly susceptible to static electricity or current
leakage, an isolation break may be caused. Therefore read and follow the instructions below.
1. When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms
of resistance. In addition, wear gloves and a jacket made of cotton and not of synthetic fibers
that easily generate static electricity.
2. When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the
earth on the worktable.
3. You must use a soldering iron without a leakage current.
4. Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
5. When inserting an IC into a PCB, be careful with the direction of the IC. When installing an
IC in the wrong direction, it might become damaged.
6. When carrying an IC, package the IC with conducting material such as aluminum foil or
conducting sponge so as to keep the voltage level of each of the terminals the same.
7. Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room
temperature, if possible.
8. When installing or removing a device from a PCB or installing or removing a board, you
must disconnect the power before taking any action.
9. When soldering an IC, solder it in as short a time as possible so that unnecessary heat is
not applied to the device.
10. Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering
acustomIC.
11.TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
12. Take care to not break the printed circuit pattern on the PCB when separate an IC.
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1.
Precautions
3) Ground
The product must be grounded to protect it from static electricity and other dangers. When using a
multitap,pleaseuseamultitapwithagroundterminalonly.
If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid
using wall outlets if they are not grounded even if they have a ground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe.
Connect the ground cable to the ground terminal at the rear of the main body. To ground the product,
connect the ground terminal of the product to a metal water pipe, wall outlet or exclusive ground terminal
with an electric wire equal to or thicker than #18.
Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or
gas pipe, because this does not actually ground the product and may be dangerous.
4) Static Electricity Precautions
Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD)
device is very important for the safety of the user and the user's surroundings. Using an ESD device
increases the probability of a successful repair and lowers the expenses for damaged parts.
To prevent static electricity, follow the instructions below.
(1) Perform the repair in a location without static electricity.
(2) Touch your hands to a metal water pipe or some metal object connected to the ground to
discharge any static electricity from your body before handling the parts.
(3) Touch only the edges of the board, if possible.
(4) Do not touch any parts unless absolutely necessary
(5) Disassemble the parts on the anti-static-electricity pad.
(6) When a board is not installed in the system, packagetheboardwithananti-static-electricity
packaging.
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11. References
1) Safety Notice
(1) An electric leakage related safety
Electric leakage is the flow of electricity to the ground through electrical wires due to ripped coating or bad
insulation. Electric leakage can cause electric shock or fire, which in turn may lead to casualties and loss. It
can also result in excessive electric charges.
(2) An electric leakage prevention
- Do not separate or disassemble the system even though system is shut down in a AC power supplies.
In that situation, system could be damaged.
- The electricity could be generated in winter or a dry space, prepare the leakage prevention for the
electricity when you try to disassemble.
- Do not use in strong magnetic space.
- Use the proper adapter and battery.
- Insertion of including saline could cause the leakage.
If you don't keep those things, there is a danger of electric shock, system damage and so on.
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11. References
2) Model Numbering Rule
1.
CTO ( Computer Model Numbering System)
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11. References
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11. References
2.
Non - CTO ( Computer Model Numbering System)
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11. References
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11. References
3) CPU Code table
Code name Samsung CODE FSB L1 cache L2 cache clock speed
T1300
T2300
T2400
T2500
T2600
T2700
T1400
0902-001943 667MHz 32KB 2M 1.66GHz
0902-001916 667MHz 32KB 2M 1.66GHz
0902-001939 667MHz 32KB 2M 1.83GHz
0902-001938 667MHz 32KB 2M 2.00GHz
0902-001937 667MHz 32KB 2M 2.16GHz
0902-001935 667MHz 32KB 2M 2.33Ghz
0902-001945 667MHz 32KB 2M 1.83GHz
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11. References
4) Glossary
Bad Sector
An area on a hard disk or floppy disk that cannot be used to store data, because of a
manufacturing defect or accidental damage. A floppy or hard disk saves data in units and the
smallest unit of storage on a disk is a sector. A bad sector means a sector that is damaged and
cannot be used to write or read data.
BIOS
An acronym for Basic Input/Output System. A set of instructions stored on a read-only memory
(ROM) chip which handles all input-output functions. The BIOS communicates between the operating
system and the computer's hardware. This is a part of the computer firmware (computer dedicated
software).
The BIOS allows the computer's hardware and the operating system to communicate with application
programs and peripheral devices as well as providing the fundamental services required for the
computer's operation. To view or change the BIOS settings, press the "Del" key when the system is
booting up.
Boot Sector
The very first track (track 0) on a hard drive of an IBM compatible PC. If the power is turned on,
the booting software reads the first block of the boot sector which contains a very short program (in
the order of a few hundred bytes) which will load and start running the operating system properly.
Bus Mastering
Bus mastering is a feature that enables a CPU extension board or software controller connected to
the bus to communicate directly with other devices on the bus without going through the CPU.
Although the CPU generally controls data communication over the bus (which lowers the data rate),
some high-speed devices may communicate with each other without going through the CPU. To
resolve this problem, a microprocessor installed on an extension board or a piece of software must
take control of the data transfer over the bus. By taking over some of the work of the system
microprocessor, the bus master creates a multiprocessing environment and increases the overall
system performance. This technology is called bus mastering.
Cache
A c ache is temporary high speed memory designed to speed up access to resources. It is similar to
RAM but is much faster than RAM or a hard disk drive. A cache is used to reduce the wait time
caused by the difference in the data rate between two different types of storages such as the hard
disk and the RAM.
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11. References
Cache Memory
High-speed memory with a copy of the most recently used memory data. When the CPU's request
for instructions or data can be satisfied from the cache, the CPU can run at full rated speed. Using
a part of the hard disk space as cache memory due to small main memory capacity is called disk
cache.
Co-Processor
A specialized processor that performs calculations very quickly under the control of the CPU. There
are two types of co-processors, a numerical co-processor and a memory manager co-processor.
Numerical co-processor does arithmetic calculations or handles graphic processing. In a PC, co-
processor is used to do floating point calculations quickly.
COM Port
Abbreviation of ‘Communications Port’. A COM port refers to the serial communication port provided
by an IBM compatible PC. There are four COM ports supported: COM1, COM2, COM3, and COM4.
These are used to connect a mouse or modem. Since COM 1 and COM 3 perform the same
function and COM 2 and COM 4 perform the same function, avoid setting a mouse or modem to the
same port.
Bay
AspacewithinaPCcasesothatperipheraldevicescanbeinstalled.Ingeneral,aharddiskdrive,
a floppy disk drive and a CD-ROM drive are installed in the bays. 5.25 and 3.5 inch bays are
provided.
CMOS
Abbreviation for ‘Complementary Metal Oxide Semiconductor’. It consumes little power and operates
on battery power. The CMOS saves basic PC information such as the date, time and system
information. A main board has a ROM and a CMOS. The ROM contains a PC checking program and
theCMOScontainsbasicPCinformationsuchastheharddisktype.SincethedataintheCMOSis
maintained by battery power, the data is lost if the battery is completely discharged.
Bus
A collection of wires through which data is transmitted from one part of the computer to another. You
canthinkofabusasahighwayonwhichdatatravelsbetweenpartssuchastheCPU,storage
devices and peripheral devices within a computer. All PC components use data bus to exchange data
or access memory.
There are two types of data bus: address and data bus. Although actual data is transferred through
the data bus, the destination of the data is sent via the address bus. The size of the bus refers to
the width of the bus which determines the amount of data that can be transferred at the same time.
A ‘Bit Bus’ can transfer a bit at a time.
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11. References
Device Driver
A program stored on the hard drive that tells the operating system how to communicate with an
input/output device such as a printer. You may think of it as dedicated software that controls a
device such as a printer. To use a new peripheral device, the corresponding device driver must be
installed.
DIMM
Abbreviation for ‘Dual In-line Memory Module’. The memory capacity is doubled by installing DRAM
chips on both sides of the memory module. This is similar to a combined 2 SIMM that uses only a
single side. This technology enables a larger capacity without increasing the number of memory
banks by utilizing both sides of the memory module.
Dot Pitch
An indication of the image quality of a monitor, this is the measurement of the distance in millimeters
between two phosphor dots, which is the minimum unit of a s creen on a monitor. It determines the
minimum size of a dot on a monitor. The smaller the dot pitch the better the quality, since it allows
for m ore dots to be displayed and therefore a greater resolution. The dot pitch defines the resolution
of a monitor.
DRAM & SRAM
The highly integrated memory includes two memory devices: DRAM and SRAM. Although DRAM
requires power to maintain data, the circuit density and capacity of DRAM is much higher than
SRAM. The unit capacity, generally, is in MB.
DVD
Abbreviation for ‘Digital Video Disk’. A DVD a large capacity media that can save up to 4.7GB of
data. Due to its high capacity, it is useful for storing multimedia data. The maximum capacity is
17GB and the data rate is between 600Kbps∼1.3Mbps. Since a DVD-ROM drive is also compatible
with existing CD-R media, it will replace the CD-ROM drive in the future.
DVD-RAM
Abbreviation for ‘Digital Versatile Disc-RAM’. A DVD media type that allows multiple data to be written
toadiskandcansaveupto2.6GB,whichisequalto70minutesofaDVDtitleor18001.44MB
floppy disks.
DVD-R Media
A DVD media type that only allows data to be read. Although the basic capacity is 4.7GB, single-
side single-layer, single-side dual-layer, double-side single-layer and double-side dual-layer recording
types are supported. If a DVD disc is recorded via a double-side dual-layer recording, the capacity
increases by 4 times that of the single-side single-layer recording.
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11. References
EPROM
Abbreviation for ‘Erasable Programmable Read Only Memory’. An EPROM differs from a PROM in
that a PROM can be written to only once and cannot be erased. IF an EPROM is exposed to
ultraviolet light, the data is erased.
An EPROM is covered by transparent glass and 30 minutes of exposure to ultraviolet light erases all
data. To prevent data loss by mistake, place an anti-ultraviolet sticker on the glass of the chip.
Flash Memory
Since flash memory can be written or deleted electrically, you can delete data by blocks and
reprogram the memory. Flash memory can continue to store information in the absence of a power
source, can allow tens of thousands of reading and writing operations, and is expected as the next
generation external storage device that can replace the floppy disk and magnetic disks. It has the
simple structure of a ‘1 bit per element’ and provides more circuit density in a unit area than RAM.
Firmware
This is software that has been written to the ROM or PROM. Firmware is a combination of software
and hardware. It is generally used to improve performance by updating the data saved on the BIOS
or ROM o n the main board.
DAC
Abbreviation for ‘Digital Analog Converter’. DAC converts a digital signal into analog.
WAN (Wide Area Network)
This stands for wide area network. A computer network that spans a wider area than does a local
area network (LAN).
Bluetooth
A global initiative set up in May 1998 by Ericsson (Sweden), IBM and Intel (U.S.) and Nokia
(Finland) to define a standard for cable-free connectivity between mobile phones, mobile PCs, PDAs
and other peripherals for easier use of devices at home and the office. Bluetooth uses short-range
radio links in the 2.4 GHz Instrumentation Scientific and Medical (ISM) band based on IEEE 802.11
specifications.
AGP (Accelerated Graphics Port)
A graphic interface specification developed by Intel. AGP is designed especially for the throughput
demands of 3-D graphics. Rather than using the PCI bus for graphics data, AGP introduces a
dedicated point-to-point channel so that the graphics controller can directly access the main memory.
While the PCI bus operates at 33MHz, AGP operates at 60∼133MHz and provides a much higher
throughput for 3-D graphics.
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11. References
ALU (Arithmetic-Logic Unit)
Abbreviation for ‘Arithmetic Logic Unit’. A part of the CPU. ALU carries out additions, subtractions,
multiplications and divisions, as well as logical operations within instructions.
AP (Access Point)
An access point is a connection that ties wireless communication devices into a network. The access
point operates independently and is usually connected to an Ethernet hub or server.
FAT (File Allocation Table)
FAT is a file allocation table used by the operating system to keep track of which clusters are
allocated to specific files and which are available for use.
LVDS (Low Voltage Differential Signalling)
LVDS is a digital signal transmission standard developed for the connection of laptop computers to
their local LCD displays and can be run at very high speeds over cheap, twisted-pair copper cables.
The prefix, 'LV', means that it uses 3.3 or 1.5V for signalling instead of the standard voltage, 5V.
POP3 (Post Office Protocol Version 3)
POP3 is the third version of the post office protocol used to deliver emails over the Internet. POP3
is a commonly implemented method of delivering email from the mail server to the client machine
over the Internet.
SMP (Symmetric Multi-Processing)
SMP is a multiprocessor computer architecture where two or more identical processors are connected
to a single shared main memory. SMP systems allow any processor to work on any task no matter
where the data for that task is located in memory. SMP systems can easily move tasks between
processors to efficiently balance the work load. Most common multiprocessor systems today use SMP
architecture.
Skin
This refers to the appearance of a program's user interface or character. Skin can be a graphics or
audio file. A graphics skin can take the appearance of hardware. In other words, a skin allows users
to change the appearance of a program as a user changes the appearance of Winamp or the
Windows background. In general, you can download skins for free from a Web site.
Cookie
A small information text file that certain Web sites copy to a user's hard drive while the user is
browsing a website. A Cookie can contain information such as the user ID, user preferences, archive
shopping cart information, etc. The use of cookies enables a Web site to become more interactive
with its users, especially for future visits. The downside is that the cookie information may expose
information about the visited web sites of the user.
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11. References
Firmware
Low-level software that controls the hardware. Firmware is a combination of software and hardware.
The name, 'Firmware', is used because it is partly hardware and it is partly software that controls the
underlying hardware of the system.
GPS (Global Positioning System)
GPS is a worldwide positioning system that was developed by the US. Department of Defense in the
1970s. In addition to military purposes, it is permitted to use GPS for general purposes. The error
limit is 50m for military purposes and 200m for general purposes. The DGPS system has been
developed to reduce errors even for general purposes.
Memory Module
An extension board with RAM chips on it.
Bandwidth
The number of bits that can be continuously transmitted or received per second. The higher the
bandwidth the more efficient as data can be transferred in a shorter time.
Address Bus
The data bus used to specify the address of an input or output device or memory by the CPU.
Control Bus
The data bus used to transmit control signals by the CPU so as to notify the storage device, input
or output, of the current status or changes.
rpm (revolutions per minute)
Thisreferstothespeedofreadingdatasavedontheplatterofaharddiskdrive.Itisalsocalled
revolutions per minute or disk revolutions per minute.
Platter
Thisrefertoplatesthatareincludedonaharddiskdriveandusedtorecorddata.Generally,a
harddiskdriveconsistsof2to8platters.
Device
It refers to an electric or mechanical instrument. In PCs, it refers to the active devices used in
electric circuits such as transistor, ICE, etc.
Resistance
An electric characteristic that hinders current flow. All materials except for superconductors have
electric resistance. The symbol is ‘R’. The unit is ‘Ω’.
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11. References
Audio Frequency
An audio frequency normally audible to humans. Although the audio frequencies may differ depending
on individuals and the volume and type of the sound, audio frequencies range roughly from 20 Hz to
20 kHz.
RTC (Real-Time Clock Generator)
An electronic circuit included on the main board and which maintains the time of day. It operates
even if the computer is turned off, as it operates on separate power. Since keeping the time of the
day is convenient, most computers nowadays adopt this circuit.
IMT-2000 (International Mobile Telecommunication-2000)
This is used in our country and it refers to FPLMTS (Future Public Land Mobile Telecommunication
Systems). The International Telecommunications Union Radio Communication Sector (ITU-R) has
standardized FPLMTS so that anyone can use various communication services (voice and data)
anywhere with a single terminal. Because the pronunciation of ‘FPLMTS’ is difficult, it was renamed
IMT-2000 in 1996.
ACPI (Advanced Configuration and Power Interface)
This is an open industry power management specification co-developed by Intel and Microsoft to
replace the APM (Advanced Power Management) specification. ACPI establishes industry-standard
interfaces for OS-directed configurations and power management on laptops, desktops and servers.
ACPI has been adopted by Windows 98 and Windows 2000. Since ACPI efficiently manages the
power consumption of the system and peripherals, it is especially useful for notebook computers.
Wafer
A round slice of silicon crystal used to create an IC. Micro-circuits such as transistors, resistors and
capacitors are constructed by diffusion (or other doping techniques, such as ion implantation) and the
deposition of various materials. The diameter of a wafer is approximately 5cm and the thinness is
0.25mm. In general, a few tens or hundreds of chips whose height and width are 5mm are
constructed on a wafer. An IC is created by slicing the chips on the wafer.
LED (Light Emitting Diode)
A diode that emits light when the current flows. It is used as an indicator in a PC or as a light
source in optical communications. It is generally made of potassium, arsenic and phosphorus.
Booting
This term derives from the phrase, ‘Wear boots and stand up’. This refers to the processes and
functions that a computer goes through when first starting up, ending with the proper loading of the
Operating System and preparing it for receiving commands.
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11. References
Dual Core
This refers to a CPU that has dual processing cores within and has been developed by technology
that incorporates two or more Intel Pentium-based processing cores within a single processor.
TPM ( Trusted Platform Module)
The Trusted Platform Module is a component on the desktop board that is specifically designed to
enhance platform security above-and-beyond the capabilities of today's software by providing a
protected space for encrypted keys, passwords and digital certificates so as to provide security
against attacks by external software and physical theft of the hardware.
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11. References
5) Hardware Upgrade
All reassembly is done in the reverse order of disassembly.
(1) Upgrading the ODD
1. Remove the screws at the bottom of the system.
2. Press the keyboard hooks downwards and lift the keyboard up at the same time.
3. Remove the screws fixing the ODD.
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11. References
4. Remove the ODD.
5. ODD Types
ODDs that can be used for the R65/P50 include DVD-Combo, CD-ROM, DVD-ROM and
Super Multi Drive (Dual Layer).
- DVD-Combo Drive
- Super Multi Drive (Dual Layer)
-DVD-ROMDrive
- CD-ROM Drive
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11. References
(2) Upgrading the HDD.
1. Remove the HDD compartment cover.
2. Separate the HDD-FPC from the HDD connector on the main board.
3. Separate the HDD from the BRKT-HDD and replace the HDD. (The HDD type is PATA)
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(3) Replacing the Bluetooth Module
1. Remove the HDD compartment cover.
2. Remove the screw fixing the Bluetooth module.
3. Replace the Bluetooth module (When replacing the module, note the shape of the cable)
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(4) Replacing the WLAN
1. Remove the screws at the bottom of the system.
2. Press the keyboard hooks downwards and lift the keyboard up.
3. Remove the screws fixing the BRK-KBD.
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11. References
4. Remove the WLAN Cable-Antenna.
5. Remove the WLAN (Lift the WLAN up sliding the WLAN hook left)
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(5) Upgrading Memory
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3. Function
1)
Construction of System
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3. Function
3- 2
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