Samsung MX-FS8000 Schematic

PremiumHI-FI
ComponentSystem

ModelNameMX-FS8000

ModelCodeMX-FS8000/ZA

SERVICE

PremiumHI-FIComponentSystem

MX-FS8000

MANUAL

Contents

1.Precaution

2.ProductSpecication

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagram

6.SchematicDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

Contents

1.Precaution........................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4

2.ProductSpecication.........................................................................................................................2−1

2.1.ProductFeature.......................................................................................................................2−1

2.2.Specications..........................................................................................................................2−2

2.3.SpecicationsAnalysis.............................................................................................................2−3

2.4.Accessories............................................................................................................................2−4

2.4.1.SuppliedAccessories...................................................................................................2−4

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.MainDisassemblyandReassembly.............................................................................................3−1

4.Troubleshooting................................................................................................................................4−1

4.1.CheckpointsbyErrorMode.......................................................................................................4−1

4.1.1.NoPower...................................................................................................................4−2

4.1.2.NoOutput..................................................................................................................4−4

4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−6

4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−6

4.2.2.CheckAMPinPowerProtection....................................................................................4−7

4.3.MICOM,MPEGInitialization&Update......................................................................................4−8

4.4.Buyer-RegionCodeSettingMethod............................................................................................4−10

4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−10

5.PCBDiagram...................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−1

5.2.MAINPCBTop......................................................................................................................5−2

5.2.1.PinConnection...........................................................................................................5−3

5.2.2.TestPointWaveForm..................................................................................................5−5

5.3.MAINPCBBottom..................................................................................................................5−6

5.4.FRONTPCBTop....................................................................................................................5−7

5.4.1.PinConnection...........................................................................................................5−8

5.5.FRONTPCBBottom...............................................................................................................5−9

5.6.VFDPCBTop.........................................................................................................................5−10

5.6.1.PinConnection...........................................................................................................5−11

5.7.VFDPCBBottom....................................................................................................................5−12

5.8.SMPSPCBTop.......................................................................................................................5−13

5.8.1.PinConnection...........................................................................................................5−14

5.9.SMPSPCBBottom..................................................................................................................5−15

6.SchematicDiagram...........................................................................................................................6−1

iCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents

6.1.OverallBlockDiagram.............................................................................................................6−1

6.2.MAIN-1.................................................................................................................................6−2

6.3.MAIN-2.................................................................................................................................6−3

6.4.MAIN-3.................................................................................................................................6−4

6.4.1.TestPointWaveForm..................................................................................................6−5

6.5.MAIN-4.................................................................................................................................6−6

6.6.MAIN-5.................................................................................................................................6−7

6.7.MAIN-6.................................................................................................................................6−8

6.8.MAIN-7.................................................................................................................................6−9

6.9.MAIN-8.................................................................................................................................6−10

6.10.MAIN-9.................................................................................................................................6−11

6.11.MAIN-10...............................................................................................................................6−12

6.11.1.TestPointWaveForm..................................................................................................6−13

6.12.MAIN-11...............................................................................................................................6−14

6.13.FRONT-1...............................................................................................................................6−15

6.14.FRONT-2...............................................................................................................................6−16

6.15.VFD......................................................................................................................................6−17

6.16.SMPS-1.................................................................................................................................6−18

6.17.SMPS-2.................................................................................................................................6−19

6.18.SMPS-3.................................................................................................................................6−20

Copyright©1995-2013SAMSUNG.Allrightsreserved.ii

1.Precaution

DEVICE
UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE CORD

ALSO TE S T WITH

PLUG REVERS ED

(US ING AC

ADAPTER P LUG

AS R EQ UIRED)

EARTH

GR OUND

(RE ADING
SH OULD NOT BE
ABOVE 0.5m A)

1.Precaution

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.

3)DesignAlterationWarning:

Neveralteroraddtothemechanicalorelectricaldesignoftheunit.

Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.

Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies.

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoaACoutlet.Withtheunit’spowerswitchedfrom
theONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.

KnownGrounds-Earth

KnownMetalparts-screwheads,metalcabinets,etc.

Figure1.1ACLeakageT est

1-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution

Ante nna

Term inal

ohm

Expo sed

Meta l Part

Ohmmet er

5)InsulationResistanceColdCheck:

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe
chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2

InsulationResistanceTest

Figure1.2InsulationResistanceTest

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC
andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.

Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage.
Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice:

Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or.Usereplacement
componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A
replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother
hazards.

Copyright©1995-2013SAMSUNG.Allrightsreserved.1-2

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor .

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety .Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).

6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity .
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

Copyright©1995-2013SAMSUNG.Allrightsreserved.1-4

2.ProductSpecication

2.ProductSpecication

2.1.ProductFeature

■Power

•2.2CH:2300WT otalRMS/27600WPMPO(Front:575W/CH,Subwoofer:575W/CH)

•IRAmp

■SpecializedFunctionin2013

•2DDisplay

•BigSizeSpeakerUnit

•DJBEA T

•LEDLighting

■Connectivity

•USBHost(T winUSB)

•PortableAudioIn(3.5phiPhoneJack(L/R))

•MICInput(3.5phiPhoneJack)

•FM/AM(Optional)

•Bluetooth

■Disc

•Type:1SlotIn(12cmCD)

•Compatible:MP3,CD,CD-R,CD-RW,MP3/WMA-CD

2-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecication

2.2.Specications

■BasicSpecication

Weight

General

CDDisc

Dimensions

OperatingT emperatureRange+5°C~+35°C

OperatingHumidityRange10%to75%

Signal/Noiseratio55dB

Usablesensitivity10dB FMT uner

Totalharmonicdistortion1%

Signal/Noiseratio30dB

Usablesensitivity70dB AMT uner

Totalharmonicdistortion4%

CD:12cm
(CompactDisc)

Frontspeakeroutput500W/CH(4Ω)

Subwooferoutput500W/CH(4Ω)

Mainunit5.9Kg

Speaker65Kg

Mainunit550(W)x367(H)x212(D)mm

Speaker648(W)x652(H)x440(D)mm

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:74min.

Amplier

NOTE

•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.

•Weightanddimensionsareapproximate.

•Designandspecicationsaresubjecttochangewithoutpriornotice.

•ForthepowersupplyandPowerConsumption,refertothelabelattachedtotheproduct.

Frequencyrange22Hz~20KHz

S/NRatio65dB

Channelseparation60dB

Inputsensitivity(AUX)800mV

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-2

2.ProductSpecication

2.3.SpecicationsAnalysis

ModelNameMX-FS8000MX-FS9000MX-E870

Photo

MAXOUTPUTPOWER2300W(PMPO:27600W)2560W(PMPO:30720W)1650W(PMPO:19200W)

SPKCHANNEL2.2ch2.2ch4.2ch

FRONTDISPLAY1C-FLT[Dot]1C-FLT[Dot]2C-FLT(DC)

3DDISPLA Y2D3DX

GIGASOUNDOOO

SPKLEDLIGHTINGALLALLFrontonly

DJBEATOOX

BEATWA VINGOOX

COMPATIBLEDISCCD-R/CD-RW/MP3-CDCD-R/CD-RW/MP3-CDCD-R/CD-R W/MP3-CD

COMPATIBLEFILEWMA/MP3WMA/MP3WMA/MP3

USBHOST2.0222

CDRIPPINGOOO

BLUETOOTHOOX

AUDIOIN(RCA/3.5ø)OOO

MICINOOO

HEADPHONEOUTXXO

VIDEOOUTXXX

FM/AMO/OO/OO/O

SPKIMPEDANCEFront:4ohm/W oofer:4ohmFront:4ohm/Woofer:4ohmFront:6ohm/W oofer:6ohm

STBYPOWER

CONSUMPTION

MAINSIZE550(W)X212(H)X367(D)588(W)X238(H)X388(D)233(W)X351(H)X282(D)

SPKSIZE648(W)X652(H)X440(D)588(W)X882(H)X577(D)

0.45W↓0.45W↓0.45W↓

SW:410(W)X373(H)

X330(D)

FRONT:271(W)X432(H)

X290(D)

REAR:190(W)X419(H)

X250(D)

WEIGHT

TIP

O:FeatureIncluded

X:NotIncluded

2-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

(MAIN:5.9Kg/SPK:65Kg)

70.9Kg
(MAIN:8Kg/SPK:70Kg)

83Kg

(MAIN:3.5Kg/SPK

:35.5Kg)

44Kg

2.4.Accessories

USB CD/

AH59-02553A

2.4.1.SuppliedAccessories

2.ProductSpecication

AccessoriesItemItemcode

Batteries(AAA)4301-000116

RemoteControlAH59-02553A

User’sManualAH68-02613A

FMAntennaAH42-00021A

PowerCable3903-000467

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-4

3.DisassemblyandReassembly

LiftLift

P u llP u ll

P u llP u ll

3.DisassemblyandReassembly

3.1.MainDisassemblyandReassembly

CAUTION

•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.

•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson
thePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly.

DescriptionDescriptionPhoto

1.Unfasten8screws(Highlighted)oneachCove.r

:BH,+,B,M3,L10,ZPC(BLK)

PullCover-Side-L/RbackandSeparatethemfromSET.

LiftthetopcovertoSeparateitfromCover-RearandCover-Front.

CAUTION

Becarefulnottomakeanyscratchesasyouremovethem.

3-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

DescriptionDescriptionPhoto

LiftLift

PullPull

2.Unfasten2screws(Highlighted)onBRKT -Shield.
:BH,+,-B,M3,L6,ZPC(WHT)

LifttheBRKT -ShieldtoSeparateitfromCover-Bottom.

3.UnplugallWireandCable(Highlighted).

PullCver-FrontforwardandSeparateditfromCover-Bottom.

3.DisassemblyandReassembly

4.Unfasten4screws(Highlighted)betweenHOLDER-DECK&
ASSY-DECK.
:BH,+,B,M3,L10,ZPC(BLK)

LifttheASSY-DECKtoSeparateditfrom
HOLDER-DECK-DECK.

5.Unfasten1screw(Highlighted)betweenHOLDER-DECK&
BLU-PCB.
:BH,+,B,M3,L10,ZPC(BLK)

LifttheBLU-PCBtoSeparateditfromHOLDER-DECK.

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-2

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

6.Unfasten4screws(Highlighted)betweenHOLDER-DECK&
ASSY-DECK.
:BH,+,B,M3,L10,ZPC(BLK)

LifttheASSY -DECKtoSeparateditfromCover-Bottom.

3-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

7.UnlockWireSaddle.

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

8.Unplug2Cables(Highlighted).

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-4

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

9.Unfasten6screws(Highlighted).
:BH,+,B,M3,L6,ZPC(WHT)()

:BH,+,B,M4,L8,ZPC(WHT)()

10.Unfasten1screw(Highlighted)onbackofCover-Rear.
:BH,+,B,M3,L6,ZPC(WHT)

LifttheSMPS-PCBtoSeparateditfromCover-Bottom.

11.Unfasten5screws(Highlighted).
:BH,+,B,M3,L6,ZPC(WHT)

12.Unfasten4screws(Highlighted)onbackofCover-Rear.
:BH,+,B,M3,L10,ZPC(BLK)

LifttheMain-PCBtoSeparateditfromCover-Bottom.

3-5Copyright©1995-2013SAMSUNG.Allrightsreserved.

DescriptionDescriptionPhoto

LiftLift

13.Unfasten2screws(Highlighted)onbackofCover-Rear.
:BH,+,B,M3,L10,ZPC(BLK)

14.LifttheFANtoSeparateditfromCover-Rear.

3.DisassemblyandReassembly

15.SeparateKnob-V olumefromFront-PCB.

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-6

3.DisassemblyandReassembly

Lens-JogLens-Jog

Sh eet-L en sSh eet-L en s

Kn o b-R o un dKn o b-R o un d

16.Unfasten3screws(Highlighted).
:BH,+,B,M3,L10,ZPC(BLK)

SeparateLens-JogfromCover-Front.

17.SeparateSheet-LensfromKnob-Round.

DescriptionDescriptionPhoto

18.SeparateKnob-RoundfromCover-Front.

19.Unfasten21screws(Highlighted)onFRONT -PCB&JACK-PCB
&VFD-PCB.
:BH,+,B,M3,L10,ZPC(BLK)

SeparateThreePCBfrombackofCover-Front.

3-7Copyright©1995-2013SAMSUNG.Allrightsreserved.

DescriptionDescriptionPhoto

Filter-LensFilter-Lens

20.PushedgeofHolder-LEDonbackofCover-Front.

SeparateHolder-LED(Highlighted)fromFront-PCB.

3.DisassemblyandReassembly

21.Separate8Button&Deco(Highlighted)Frombackof
Cover-Front.

22.SeparateFilter-LensFrombackofCover-Front.

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-8

3.DisassemblyandReassembly

Deco-Front

Deco-Front

Cover-W indowCover-W indow

Ho ld e r-Lens( WHT)Ho ld e r-Lens( WHT)

Sheet- Ho lder(Bla ck )Sheet- Ho lder(Bla ck )

DescriptionDescriptionPhoto

23.SeparateDeco-FrontFrombackofCover-Front.
(Unfasten6Point(Highlighted)usingHand)

PullDeco-FrontouttoSeparateForwardingdirectionof
Cover-Front.

24.SeparateCover-WindowFromForwardofCover-Front.

SeparateBadge-Brand(Highlighted)FromForwardof
Cover-Front.

25.Unfasten3screws(Highlighted).
:BH,+,B,M3,L10,ZPC(BLK)

SeparateVFD-ASSYFromBackofCover-Front.

26.Unfasten3screws(Highlighted).
:BH,+,B,M3,L10,ZPC(BLK)

SeparateHolder-Lens&Sheet-HolderFromVFD-ASSY .

3-9Copyright©1995-2013SAMSUNG.Allrightsreserved.

DescriptionDescriptionPhoto

Lens-Sub

Lens-Sub

Deco-VFDDeco-VFD

Filter-VFDFilter-VFD

27.SeparateLens-SubFromDeco-VFD&Filter-VFD.

28.SeparateFilter-VFDFromDeco-VFD.

3.DisassemblyandReassembly

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-10