Samsung MX-F870-ZP Schematic

MINI-CompactSystem

ModelNameMX-F870

ModelCodeMX-F870/ZP

MANUAL

SERVICE

MINI-CompactSystem

1.Precaution

2.ProductSpecication

3.DisassemblyandReassembly

MX-F870

4.Troubleshooting

5.PCBDiagram

6.SchematicDiagram

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

Contents

1.Precaution........................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4

2.ProductSpecication.........................................................................................................................2−1

2.1.ProductFeature.......................................................................................................................2−1

2.1.1.ProductFeatureMX-F830/MX-F830B............................................................................2−1

2.1.2.ProductFeatureMX-F850.............................................................................................2−2

2.1.3.ProductFeatureMX-F870.............................................................................................2−3

2.2.Specications..........................................................................................................................2−4

2.3.SpecicationsAnalysis.............................................................................................................2−6

2.4.Accessories............................................................................................................................2−7

2.4.1.SuppliedAccessories...................................................................................................2−7

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.MainDisassemblyandReassembly.............................................................................................3−1

4.Troubleshooting................................................................................................................................4−1

4.1.CheckpointsbyErrorMode.......................................................................................................4−1

4.1.1.NoPower...................................................................................................................4−2

4.1.2.NoOutput..................................................................................................................4−3

4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−7

4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−7

4.2.2.CheckAMPinPowerProtection....................................................................................4−8

4.3.MICOM,MPEGInitialization&Update......................................................................................4−9

4.4.Buyer-RegionCodeSettingMethod............................................................................................4−10

4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−10

5.PCBDiagram...................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−1

5.2.MAINPCBTop......................................................................................................................5−2

5.2.1.PinConnection...........................................................................................................5−3

5.2.2.TestPointWaveForm..................................................................................................5−4

5.3.MAINPCBBottom..................................................................................................................5−5

5.4.FRONT-JACKPCBTop...........................................................................................................5−6

5.5.FRONT-JACKPCBBottom......................................................................................................5−7

5.5.1.PinConnection...........................................................................................................5−8

5.6.FRONT-VFDPCBTop.............................................................................................................5−9

5.6.1.PinConnection...........................................................................................................5−10

5.7.FRONT-VFDPCBBottom........................................................................................................5−11

5.8.SPKLEDPCBTop..................................................................................................................5−12

iCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents

5.8.1.PinConnection...........................................................................................................5−13

5.9.SPKLEDPCBBottom.............................................................................................................5−14

5.10.SMPSPCBTop.......................................................................................................................5−15

5.10.1.PinConnection...........................................................................................................5−16

5.11.SMPSPCBBottom..................................................................................................................5−17

6.SchematicDiagram...........................................................................................................................6−1

6.1.OverallBlockDiagram.............................................................................................................6−1

6.2.MAIN-1.................................................................................................................................6−2

6.3.MAIN-2.................................................................................................................................6−3

6.4.MAIN-3.................................................................................................................................6−4

6.5.MAIN-4.................................................................................................................................6−5

6.6.MAIN-5.................................................................................................................................6−6

6.6.1.TestPointWaveForm..................................................................................................6−7

6.7.MAIN-6.................................................................................................................................6−8

6.7.1.TestPointWaveForm..................................................................................................6−9

6.8.MAIN-7.................................................................................................................................6−10

6.8.1.TestPointWaveForm..................................................................................................6−11

6.9.FRONT-JACK........................................................................................................................6−12

6.10.FRONT-VFD-1.......................................................................................................................6−13

6.11.FRONT-VFD-2.......................................................................................................................6−14

6.12.SPKLED...............................................................................................................................6−15

6.13.SMPS-1.................................................................................................................................6−16

6.14.SMPS-2.................................................................................................................................6−17

Copyright©1995-2013SAMSUNG.Allrightsreserved.ii

1.Precaution

DEVICE
UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE CORD

ALSO TE S T WITH

PLUG REVERS ED

(US ING AC

ADAPTER P LUG

AS R EQ UIRED)

EARTH

GR OUND

(RE ADING
SH OULD NOT BE
ABOVE 0.5m A)

1.Precaution

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.

3)DesignAlterationWarning:

Neveralteroraddtothemechanicalorelectricaldesignoftheunit.

Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.

Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies.

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoaACoutlet.Withtheunit’spowerswitchedfrom
theONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.

KnownGrounds-Earth

KnownMetalparts-screwheads,metalcabinets,etc.

Figure1.1ACLeakageT est

1-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution

Ante nna

Term inal

ohm

Expo sed

Meta l Part

Ohmmet er

5)InsulationResistanceColdCheck:

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe
chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2

InsulationResistanceTest

Figure1.2InsulationResistanceTest

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC
andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.

Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage.
Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice:

Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or.Usereplacement
componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A
replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother
hazards.

Copyright©1995-2013SAMSUNG.Allrightsreserved.1-2

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly ,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor.

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).

6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

Copyright©1995-2013SAMSUNG.Allrightsreserved.1-4

2.ProductSpecication

2.ProductSpecication

2.1.ProductFeature

2.1.1.ProductFeatureMX-F830/MX-F830B

■Power

•2.0ch:1000WTotalRMS/12000WPMPO(Front:500W/chx2)

•IRAmp

■SpecializedFunction

•Bluetooth(OnlyMX-F830B)

•FrontSpeakLEDLighting

•CDRipping(Abletorippingwhilelistening)

•NewBassSoundSystem(CalledGIGASound)

•TwinUSB

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

•MICInput(3.5phiStereoJack)

■Disc

•Type:1Tray

•Compatible:MP3,CD/CD-R,RW,WMA

2-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.1.2.ProductFeatureMX-F850

■Power

•2.1ch:1200WTotalRMS/14400WPMPO(Front:400W/chx2,Subwoofer:400W/ch)

•IRAmp

■SpecializedFunction

•FrontSpeakLEDLighting

•CDRipping(Abletorippingwhilelistening)

•NewBassSoundSystem(CalledGIGASound)

•TwinUSB

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

2.ProductSpecication

•MICInput(3.5phiStereoJack)

■Disc

•Type:1Tray

•Compatible:MP3,CD/CD-R,RW,WMA

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-2

2.ProductSpecication

2.1.3.ProductFeatureMX-F870

■Power

•4.2ch:1600WTotalRMS/19200WPMPO(Front:330W/Chx2,Rear:165W/Chx2,W oofer:330W/x2)

•IRAmp

■SpecializedFunction

•FrontSpeakLEDLighting

•CDRipping(Abletorippingwhilelistening)

•NewBassSoundSystem(CalledGIGASound)

•TwinUSB

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

•MICInput(3.5phiStereoJack)

■Disc

•Type:1Tray

•Compatible:MP3,CD/CD-R,RW,WMA

2-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.2.Specications

■BasicSpecicationMX-F830/MX-F830B

Weight8.60lbs

Dimensions9.17(W)x13.82(H)x11.81(D)inches

General

AMT uner

(optional)

OperatingTemperature
Range

OperatingHumidityRange10%to75%

Signal/Noiseratio55dB

Usablesensitivity12dB FMTuner

Totalharmonicdistortion0.6%

Signal/Noiseratio35dB

Usablesensitivity70dB

Totalharmonicdistortion4%

2.ProductSpecication

+41°F~+95°F

CDDisc

Amplier

CD:12cm
(CompactDisc)

TotalOutputPower1000Watts(MAX)

Frontspeakeroutput500W/CH(6Ω/100Hz)

Frequencyrange20Hz~20KHz

S/NRatio75dB

Channelseparation50dB

Inputsensitivity(AUX)800mV

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:74min.

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-4

2.ProductSpecication

■BasicSpecicationMX-F850/MX-F870

Weight3.9Kg

Dimensions233(W)x351(H)x300(D)mm

General

AMT uner

(optional)

OperatingTemperature
Range

OperatingHumidityRange10%to75%

Signal/Noiseratio55dB

Usablesensitivity12dB FMTuner

Totalharmonicdistortion0.6%

Signal/Noiseratio35dB

Usablesensitivity70dB

Totalharmonicdistortion4%

+5°C~+35°C

CDDisc

Amplier

NOTE

•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.

•Weightanddimensionsareapproximate.

•Designandspecicationsaresubjecttochangewithoutpriornotice.

•ForthepowersupplyandPowerConsumption,refertothelabelattachedtotheproduct.

CD:12cm
(CompactDisc)

ModelMX-F850MX-F870

TotalOutputPower1200W atts(MAX)1650W atts(MAX)

Frontspeakeroutput400W/CH(6Ω/100Hz)330W/CH(6Ω/100Hz)

Rearspeakeroutput
(OnlyF870)

Subwoofer400W(6Ω/100Hz)330W(6Ω/100Hz)

Frequencyrange20Hz~20KHz20Hz~20KHz

S/NRatio75dB75dB

Channelseparation50dB50dB

Inputsensitivity(AUX)800mV(AUX)800mV

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:74min.

-

165W/CH(12Ω/100Hz)

2-5Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.3.SpecicationsAnalysis

ModelNameMX-F830/MX-F830BMX-F850MX-F870MX-E63*/MX-E66*

Photo

OUTPUT

POWER

2.0CH1000W2.1CH1200W4.2CH1650W

2.ProductSpecication

MX-E63*:2.0

CH160W

MX-E66*:2.0

CH350W

FRONT

DISPLAY

DIMMEROOOO

Bluetooth

CD/DVDCDCDCDCD/DVD

MP3OOOO

USBHOSTOOOO

CDRIPPINGOOOO

TAPEXXXX

AUDIOINOOOO

HEADPHONEXXXO

FM/RDSFM/AMFM/AMFM/AMFM/AM

REMOTEKEY45KEY45KEY45KEY45KEY

DUAL

VOLTAGE

SPK

IMPENDANCE

VFDVFDVFDVFD

X

(MX-F830BOnly)

XXXO

6Ω6Ω6Ω4Ω

XXX

TIP

O:FeatureIncluded

X:NotIncluded

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-6

2.ProductSpecication

TUNER/AUX

REPEAT

GIGA

REPEAT

A-B

AUTO CHANGE

2.4.Accessories

2.4.1.SuppliedAccessories

AccessoriesItemItemcode

Batteries(AAA)4301-000116

RemoteControlAH59-02554A

User’sManualAH68-02606J

FMAntenna

(MX-F830BOnly)

FM/AMAntenna

(MX-F830,MX–F850Only)

AH42-00036A

2-7Copyright©1995-2013SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly

Lift

3.DisassemblyandReassembly

3.1.MainDisassemblyandReassembly

CAUTION

•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.

•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson
thePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly .

DescriptionDescriptionPhoto

1.FrontKittingAssy

Unfasten2ScrewsoneachSideandV olumeKnob
:BH3*10BLACK

CAUTION

Becarefulnottomakeanyscratchesasyouremovethem.

2.LifttheBottomoftheFrontCovertoSeparateitfromBack
Cover.

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-1

3.DisassemblyandReassembly

3.Unplug2Cables

4.FrontKittingAssy

DescriptionDescriptionPhoto

5.FrontPCBAssy

Unfasten18ScrewsandUnplug1Cable
:BH3*10WHITE

3-2Copyright©1995-2013SAMSUNG.Allrightsreserved.

6.VFDPCB

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

JACKPCB

7.SMPSPCBAssy

Unfasten2Screws
:BH3*10BLACK

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-3

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

8.Unfasten3ScrewsUnplug2wiresandpowercord
:BH3*10BLACK

9.Unfasten5Screws
:BH3*10WHITE

10.SMPSPCBAssy

3-4Copyright©1995-2013SAMSUNG.Allrightsreserved.

11.MAINPCBAssy

Unfasten2Screws
:BH3*10BLACK

3.DisassemblyandReassembly

DescriptionDescriptionPhoto

12.Unfasten2ScrewsUnplug2CablesandtheF AN
:BH3*10BLACK

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-5

3.DisassemblyandReassembly

13.Unfasten4Screws
:BH3*10SILVER

14.MAINPCBAssy

DescriptionDescriptionPhoto

3-6Copyright©1995-2013SAMSUNG.Allrightsreserved.

4.Troubleshooting

4.1.CheckpointsbyErrorMode

OscilloscopeSettingValuesNormalVoltage24MHz32.768KHz

V oltage/DIV1V ol/DIV1V ol/DIV1Vol/DIV

TIME/DIV1uS/DIV10ns/DIV0.1uS/DIV

4.Troubleshooting

Copyright©1995-2013SAMSUNG.Allrightsreserved.4-1