Samsung MX-D850 Schematic

MINI-CompactSystem

ModelNameMX-D850

ModelCodeMX-D850/ZP

MANUAL

SERVICE

MINI-CompactSystem

1.Precaution

2.ProductSpecication

3.Disassembly&Reassembly

MX-D850

4.Troubleshooting

5.PCBDiagram

6.SchematicDiagram

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4

2.ProductSpecication.........................................................................................................................2−1

2.1.ProductFeature.......................................................................................................................2−1

2.1.1.MX-D830ProductFeature............................................................................................2−1

2.1.2.MX-D830DProductFeature..........................................................................................2−2

2.1.3.MX-D850ProductFeature............................................................................................2−3

2.1.4.MX-D870ProductFeature............................................................................................2−4

2.1.5.MX-D870DProductFeature..........................................................................................2−5

2.2.Specications..........................................................................................................................2−6

2.3.SpecicationsAnalysis.............................................................................................................2−7

2.4.Accessories............................................................................................................................2−9

2.4.1.SuppliedAccessories...................................................................................................2−9

3.Disassembly&Reassembly................................................................................................................3−1

3.1.OverallDisassemblyReassembly................................................................................................3−1

4.Troubleshooting................................................................................................................................4−1

4.1.CheckpointsbyErrorMode.......................................................................................................4−1

4.1.1.NoPower...................................................................................................................4−2

4.1.2.NoOutput..................................................................................................................4−4

4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−5

4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−5

4.2.2.CheckAMPinPowerProtection....................................................................................4−6

4.3.MICOM,MPEGInitialization&Update......................................................................................4−7

4.4.Buyer-RegionCodeSettingMethod............................................................................................4−8

4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−8

5.PCBDiagram...................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−1

5.2.KEYPCBTop........................................................................................................................5−2

5.3.KEYPCBBottom....................................................................................................................5−3

5.4.VFDPCBTop.........................................................................................................................5−4

5.4.1.PinConnection...........................................................................................................5−5

5.5.VFDPCBBottom....................................................................................................................5−6

5.6.MAINPCBTop......................................................................................................................5−7

5.6.1.PinConnection...........................................................................................................5−8

5.6.2.TestPointWaveForm..................................................................................................5−10

5.7.MAINPCBBottom..................................................................................................................5−11

Contents

6.SchematicDiagram...........................................................................................................................6−1

6.1.OverallBlockDiagram.............................................................................................................6−1

6.2.FRONT-KEY..........................................................................................................................6−2

6.3.FRONT-VOLUME..................................................................................................................6−3

6.4.FRONT-JACK/VFD.................................................................................................................6−4

6.5.MAIN–1................................................................................................................................6−5

6.5.1.TestPointWaveForm..................................................................................................6−6

6.6.MAIN–2................................................................................................................................6−7

6.7.MAIN–3................................................................................................................................6−8

6.8.MAIN–4................................................................................................................................6−9

6.9.MAIN–5................................................................................................................................6−10

6.10.MAIN–6................................................................................................................................6−11

1.Precaution

DEVICE UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE CORD

ALSO TE S T WITH

PLUG REVERS ED

(US ING AC

ADAPTER P LUG

AS R EQ UIRED)

EARTH

GR OUND

(RE ADING SH OULD NOT BE ABOVE 0.5m A)

1.Precaution

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith dangerousinternalcomponents.

3)DesignAlterationWarning:

Neveralteroraddtothemechanicalorelectricaldesignoftheunit.

Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.

Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies withAmericanNationalStandardsInstitute(ANSIC101.1,LeakageCurrentforAppliances),andUnderwriters Laboratories(ULPublicationUL1410,59.7).

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoa120VACoutlet.Withtheunit’spowerswitched fromtheONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.

KnownGrounds-Earth

KnownMetalparts-screwheads,metalcabinets,etc.

Figure1.1ACLeakageTest

1.Precaution

Ante nna

Term inal

ohm

Expo sed

Meta l Part

Ohmmet er

5)InsulationResistanceColdCheck:

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs. (2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2

InsulationResistanceTest

Figure1.2InsulationResistanceT est

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.

Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage. Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice:

Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or.Usereplacement componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother hazards.

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:(a)Removeorreinstallany componentorassembly,(b)Disconnectanelectricalplugorconnector,(c)Connectatestcomponentinparallelwith anelectrolyticcapacitor.

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused. Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.

Makesurethattheportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels, inputterminalsandearphonejacks).

6)InsulationCheckingProcedure:DisconnectthepowercordfromtheACsource.Connectaninsulationresistance meter(500V)tothebladesoftheACplug.

TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)shouldbe greaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead; alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.

SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).

Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.Thefollowingtechniqueswillreducetheoccurrence ofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.

MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

2.ProductSpecication

2.1.ProductFeature

2.1.1.MX-D830ProductFeature

■Power

•2.0ch:560WTotalRMS/6200WPMPO(Front:280W/ch)

•IRAmp

■SpecialFunctions

•TotalRipping

•SPKLighting

•TwinUSB

•GiGASound

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

■Disc

•Type:3Tray

•Compatible:MP3,CD/CD-R,RW ,WMA

2.1.2.MX-D830DProductFeature

■Power

•2.0ch:560WTotalRMS/6200WPMPO(Front:280W/ch)

•IRAmp

■SpecialFunctions

•TotalRipping

•SPKLighting

•TwinUSB

•GiGASound

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

2.ProductSpecication

■Disc

•Type:3Tray

•Compatible:DVD,Divx,MP3,CD/CD-R,RW,WMA,VCD(RegionalOption)

•VideoOut:Component/Composite

2.ProductSpecication

2.1.3.MX-D850ProductFeature

■Power

•2.1ch:760WTotalRMS/8300WPMPO(Front:280W/ch,Subwoofer:200W)

•IRAmp

■SpecialFunctions

•TotalRipping

•SPKLighting

•TwinUSB

•GiGASound

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

■Disc

•Type:3Tray

•Compatible:MP3,CD/CD-R,RW ,WMA

2.1.4.MX-D870ProductFeature

■Power

•4.2ch:1200WT otalRMS/13200WPMPO(Front:280W/ch,Subwoofer:200W/ch,Rear:120W/ch)

•IRAmp

■SpecialFunctions

•TotalRipping

•SPKLighting

•TwinUSB

•GiGASound

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

2.ProductSpecication

■Disc

•Type:3Tray

•Compatible:MP3,CD/CD-R,R W

2.ProductSpecication

2.1.5.MX-D870DProductFeature

■Power

•4.2ch:1200WT otalRMS/13200WPMPO(Front:280W/ch,Subwoofer:200W/ch,Rear:120W/ch)

•IRAmp

■SpecialFunctions

•TotalRipping

•SPKLighting

•TwinUSB

•GiGASound

■Connectivity

•USBHost

•PortableAudioIn(3.5phiStereoJack)

■Disc

•Type:3Tray

•Compatible:DVD,Divx,MP3,CD/CD-R,RW,WMA,VCD(RegionalOption)

•VideoOut:Component/Composite

2.2.Specications

■BasicSpecication

RADIOAM (Option)

COMPACT DISC PLAYER

2.ProductSpecication

Signal/noiseratio62dB

Usablesensitivity10dB RADIOFM

Totalharmonicdistortion0.4%

Signal/noiseratio40dB

Usablesensitivity58dB

Totalharmonicdistortion1.5%

Capacity3disc

Frequencyrange20Hz-20kHz(±1dB)

Signal/noiseratio70dB(at1kHz,withlter,2V)

Distortion0.1%(at1kHz)

Channelseparation75dB

DiscsizesDiameter:120or80mm.Thickness:1.2mm

MX-D830-560Watts(10%THD)

Frontspeaker280W/CH(6Ω/100Hz)

MX-D830-640Watts(MAX.THD)

Frontspeaker320W/CH(6Ω/100Hz)

MX-D850-760Watts(10%THD)

Frontspeaker

Subwoofer

Output power

AMPLIFIER

Channelseparation60dB

Signal/noiseratio70dB

MX-D850-860Watts(MAX.THD)

Frontspeaker

Subwoofer

MX-D870-1,200Watts(10%THD)

Frontspeaker

Subwoofer

RearSpeaker

MX-D870-1,400Watts(MAX.THD)

Frontspeaker

Subwoofer

280W/CH(6Ω/100Hz)

200W/CH(8Ω/100Hz)

310W/CH(6Ω/100Hz)

240W/CH(8Ω/100Hz)

270W/CH(6Ω/100Hz)

200W/CH(8Ω/100Hz)

130W/CH(12Ω/15kHz)

300W/CH(6Ω/100Hz)

250W/CH(8Ω/100Hz)

150W/CH(12Ω/15kHz)

Dimensions(MX-D830/MX-D850)294(W)x398.8(H)x436.8(D)mm

General

Dimensions(MX-D870)294(W)x379.8(H)x436.8(D)mm

Weight(MX-D830/MX-D850)5.8Kg

Weight(MX-D870)6.2Kg

2.ProductSpecication

2.3.SpecicationsAnalysis

ModelNameMX-D830MX-D830DMX-D850MX-C870

Photo

OUTPUTPOWER2.0ch560W2.0ch560W2.1ch760W

FRONTDISPLA YVFDVFDVFDVFD

SLEEPOOOO

DIMMEROOOO

CD/DVDCDDVDCDCD

MP3OOOO

USBHOSTOOOO

2.0ch200W

+2.0ch260W

+2.0ch90W

CDRIPPINGTotalTotalTotalTotal

TAPEXXXO

AUDIOINOOOO

HEADPHONEOOOO

FM/RDSFM/AMFM/AMFM/AMFM/AM

REMOTEKEY32KEY38KEY32KEY32KEY

DUALVOL T AGEOOOO

SPKIMPEDANCE4Ohm4Ohm4Ohm

TIP

O:FeatureIncluded,X:NotIncluded

Front:3Ohm

S/W:4Ohm

Rear:6Ohm

2.ProductSpecication

ModelNameMX-D870MX-D870DMX-C870

Photo

OUTPUTPOWER4.2ch760W4.2ch760W

FRONTDISPLAYVFDVFDVFD

SLEEPOOO

DIMMEROOO

CD/DVDCDDVDCD

MP3OOO

USBHOSTOOO

CDRIPPINGTotalT otalTotal

TAPEXXO

2.0ch200W

+2.0ch260W

+2.0ch90W

AUDIOINOOO

HEADPHONEOOO

FM/RDSFM/AMFM/AMFM/AM

REMOTEKEY38KEY38KEY32KEY

DUALVOLTAGEOOO

SPKIMPEDANCE4Ohm4Ohm

TIP

O:FeatureIncluded,X:NotIncluded

Front:3Ohm

S/W:4Ohm

Rear:6Ohm

2.ProductSpecication

2.4.Accessories

2.4.1.SuppliedAccessories

AccessoriesItemItemcodeRemark

RemoteControlAH59-02363A

Batteries4301-000121

FMAntennaAH42-00021A

AMAntennaAH42-00035A

User’sManual

LocalSamsungDealer

AH68-02331B

AH68-02331C

3.Disassembly&Reassembly

3.1.OverallDisassemblyReassembly

3.Disassembly&Reassembly

CAUTION

•Becarefultofollowthedisassemblysequence describedinthemanual.Otherwise,theproductmay bedamaged.

•Besuretocarefullyreadandunderstandthesafety instructionsbeforeperforminganyworkastheIC chipsonthePCBarevulnerabletostaticelectricity .

•Inordertoassemblereversetheorderofdisassembly.

CAUTION

Becarefulnottomakeanyscratchesasyouremovethem.

1.Poweronandopenthedisk,SeparateCD-Door.

2.Unfasten6screws.

:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A

3.Unfasten2screws.

:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A

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