The information described in this SPEC is preliminary and can be changed
without prior notice
Page 2
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Table of Contents
REVISION HISTORY ................................................................................................................................................ 3
1. GENERAL DESCRIPTION .................................................................................................................................... 4
2. ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 6
8. RELIABILITY TEST ............................................................................................................................................. 25
10. GENERAL PRECAUTIONS .............................................................................................................................. 29
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Date.
Rev.No.
Page
Revision Description
01/31/13
P00
All
Initial Release
02/20/13
P01
All
Model code was modified.
REVISION HISTORY
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Item
Specification
Unit
Note
Display area
344.232 (H) x 193.536 (V) (15.6”diagonal)
mm Driver Element
a-Si TFT active matrix
Display colors
262,144 (6bit)
Number of pixel
1366 * 768
Pixel
16:9
Pixel Arrangement
RGB vertical stripe
Pixel pitch
0.252 (H) x 0.252 (V) (TYP.)
mm
Display Mode
Normally white, TN mode
Thickness of glass
0.5
mm Surface treatment
TBD Glare
Environmental safe regulation
Pb Free, Halogen Free
1. GENERAL DESCRIPTION
DESCRIPTION
The LTN156AT34-D uses a color active matrix TFT (Thin Film Transistor) liquid crystal display (LCD) that uses
amorphous silicon TFTs as switching components. This model is composed of a TFT LCD panel, a driver circuit,
and a backlight unit. This 15.6” model has a resolution of 1366 x 768 pixels and can display up to 262,144
colors.
FEATURES
High contrast ratio
HD (1366 x 768 pixels) resolution
Low power consumption
Fast Response
LED back light with an embedded LED driver
DE (Data enable) only mode
3.3V LVDS interface
Onboard EEDID chip
APPLICATIONS
Notebook PC
If the intent to use this product is for other purpose, please contact Samsung Display.
GENERAL INFORMATION
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Item
Min.
Typ.
Max.
Unit
Note
Module
Size
Horizontal (H)
359.0
359.5
360.0
mm
Vertical (V)
223.3
223.8
224.3
mm
with flange
206.0
206.5
207.0
mm
w/o flange
Depth (D)
-
-
3.2
mm
(1)
Weight
- - 380 g
MECHANICAL INFORMATION
NOTE (1) Measuring method for thickness
Force to be applied for measurement : The 200gf when using the height gauge
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Item
Symbol
Min.
Max.
Unit
Note
Storage temperate
TSTG
-20
60
C
(1)
Operating temperature
(Temperature of glass surface)
TOPR 0 50
C
(1)
Shock ( non-operating )
Snop - 240 G (2), (4)
Vibration (non-operating)
Vnop - 2.41 G (3), (4)
2. ABSOLUTE MAXIMUM RATINGS
2.1 ENVIRONMENTAL ABSOLTE RATINGS
Note (1) The range of temperature and relative humidity are shown in the graph below 90% RH Max. .
(39℃≥ Ta) If the temperature is higher than 40 ℃, the maximum temperature of wet–bulb shall be
less than 39℃. No condensation
(2) Vibrate X, Y, and Z axis in the shape of the half sine wave one time for 2ms .
(3) Vibrate the X, Y, and Z randomly within a 5 - 500 Hz range for 30min.
(4) When testing a vibration and a shock, the fixture, which holds the module to be tested shall be
hard and rigid in order for the the module not to be twisted or bent by the fixture.
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Item
Symbol
Min.
Max.
Unit
Note
Power Supply Voltage
VLCD_VCC
VSS - 0.3
TBD
V
(1),(2)
LVDS Input Voltage
VLVDS
VSS - 0.3
TBD
Item
Symbol
Min.
Max.
Unit
Note
BLU Supply Voltage
V
BL_PWR
VSS - 0.3
26.5
V
(1), (2)
BLU Supply Current
I
BL_PWR
- 0.9
A
(1), (2)
Vin=12V
Duty 100%
Item
Test Conditions
Remark
CONTACT DISCHARGE
150pF, 330, 8kV, 200points, 1 time/point
Operating
AIR DISCHARGE
150pF, 330, 15kV, 200points, 1 time/point
Operating
2.2 ELECTRICAL ABSOLUTE RATINGS
(1) TFT LCD MODULE
VLCD_VCC =3.3V, VSS = GND = 0V
Note (1) Within Ta (25 2 C )
(2) Permanent damage to the device may occur if exceed maximum values
.
(2) BACKLIGHT UNIT
VSS = GND = 0V
Note (1) Within Ta (25 2 C )
(2) Permanent damage to the device may occur if exceed maximum values
2.3 THE OTHERS
(1) STATIC ELECTRICITY PRESSURE RESISTANCE
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Item
Symbol
Condition
Min.
Typ.
Max.
Unit
Note
Contrast Ratio
CR
Normal
Viewing
Angle
= 0
= 0
500 - -
-
(1),(2),(5)
Response time
( Rising + Falling )
TRT
-
16
25
msec
(1),(3)
Average Luminance
of White (5 Points)
YL,AVE
170
200
-
cd/m2
IF=100%
Duty
(1),(4)
Color
Chromaticit
y
(CIE)
Red
RX
-0.03
TBD
+0.03
(1),(5)
RY
TBD
Gree
n
GX
TBD
GY
TBD
Blue
BX
TBD
BY
TBD
Whit
e
WX
TBD
WY
TBD
Viewing
Angle
Hor.
L
CR 10
At center
40
45
-
Degrees
(1),(5)
H
40
45
-
Ver.
H
10
15
-
L
30
35
-
Color
Gamut
CG -
45 - %
White variation
(13P)
L
- TBD
(6)
3. OPTICAL CHARACTERISTICS
The following items are measured under the stable conditions.* The optical characteristics should be measured
in the dark room or the equivalent environment by the methods shown in the Note (5).
Measuring equipment : TOPCON SR-3
Ta = 25 2 C, VLCD_VCC =3.3V, fv= 60Hz, fDCLK = (TBD)MHz, IF = 100% duty
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Note (1) The definition of viewing angle : The range of viewing angle (10 C/R)
Note (2) The definition of contrast ratio (CR) : The ratio of max. gray and min gray at 5 points
(33, 55, 77, 37, 73)
Note (3) The definition of Response time : Subtotal of the time, during which the transmission changes from
10% to 90% when the TFT turns on and off.
Note (4) The definition of average luminance of white : Measure the luminance of white at 5 points.
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L =
Maximum luminance of 11 points
Minimum luminance of 11 points
Note (5) Measure the panel, which is left for 30 min. at the normal temp. after leaving it for 30 min with turning
the back light on at the rating. The measurement should be executed under the condition including
the ambient temp., 25℃±2℃, the dark room, windless(removed the direct wind), and no vibration.
Note (6) The definition of white variation at 11 points ( L): 11,22,33,44,55,66,77,88,99,19,91 point
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LTN156AT34-D
4. BLOCK DIAGRAM
4.1 TFT LCD MODULE
4.2 THE STRUCTURE OF LED PLACEMENT
(TBD)
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Item
Symbol
Min.
Typ.
Max.
Unit
Note
Power Supply Voltage
VLCD_VCC
3.0
3.3
3.6 V
T-CON TTL
Input Voltage
High
VIH
TBD V
Low
VIL
TBD V Vsync
60Hz
fv
60 Hz Hsync
60Hz
fh
TBD kHz
Main Frequency
60Hz
fDCLK
TBD
MHz
Rush Current
IRUSH
TBD A
(5)
Input Current
White
ILCD_VCC
-
TBD - mA
(4)
Mosaic
ILCD_VCC
-
TBD - mA
Black
ILCD_VCC
-
TBD - mA
Red
ILCD_VCC
-
TBD mA
Green
ILCD_VCC
-
TBD mA
Blue
ILCD_VCC
-
TBD mA
5. ELECTRICAL CHARACTERISTICS
5.1 TFT LCD MODULE
* Ta = 25 ± 2 °C
Note (1) The data pins for display and signal pins for timing should be connected.(GND= 0V)
(2) fV = 60Hz, fDCLK = (TBD) MHZ, VLCD_VCC = 3.3V , DC Current.
(3) In the case of 40Hz & 50Hz, FOS, Flicker & Brightness are not guaranteed, because their level might
be different from 60Hz operation.
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Note (4) The dissipation pattern for power
Note (5) The condition for measurement for rush current
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Item
Symbol
Min.
Typ.
Max.
Unit
Note
LED Forward Current
IF
TBD mA
LED Forward Voltage
VF
TBD V
IF = TBD mA
LED Array Voltage
VP
TBD V
VF * LED Counts
LED Power Consumption
P -
2.6
W
LED Life time
Hr
15,000 - -
Hour
(1)
LED Counts
Q
-
TBD - EA
Item
Symbol
Min.
Typ.
Max.
Unit
Note
Input Voltage
VBL_PWR
TBD V
Input Current
IBL_PWR
TBD mA
Vin=12V Duty 100%
PWM duty Ratio
DBL_PWM_DIM
TBD %
PWM : TBD
External PWM Frequency
FBL_PWM_DIM
TBD kHz
In-Rush Current
IRUSH_BL_PWR
TBD A
(1)
5.2 BACK LIGHT UNIT
Ta = 25 2 C
Note (1) The life time (Hr) of LEDs can be defined as the time during which it continues to operate under the
condition, which the Ta is 25 2 C and IF= TBD mArms until the one of the following events
occurs when the brightness becomes 50% or lower than the original..
5.3 LED DRIVER
The manufacturer of LED driver: TBD Ta= 25 2 C
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Note (1) Rush current measurement condition
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Characteristics
Symbol
Min.
Typ.
Max.
Unit
Conditions
Differential input high
threshold voltage
VTH - -
+200
mV
VCM = 1.2V
Differential input low
threshold voltage
VTL
-200 - -
mV
Differential input voltage
|VID|
200
400
600
mV
Common mode voltage
VCM
0.4
1.2
1.8
V
|VID|= 100mV
Characteristics
Symbol
Min.
Typ.
Max.
Unit
Remarks
ROUTCLK frequency
fRCP
(TBD)
(TBD)
(TBD)
Mhz
LVDS RX Skew
(Strobe) Right
Margin
85MHz
T
RSRM
- - 400
ps
50MHz - -
700
ps
LVDS RX Skew
(Strobe) Left
Margin
85MHz
T
RSLM
-400 - -
ps
50MHz
-700 - -
ps
V
TL
RIN1P
RIN1P-RIN1N
Tr
Vcm
V
TH
1101010
RINCLKP
Vid
RINCLKN
RIN1N
0
5.4 LVDS INTERFACE
LVDS DC Specifications
LVDS AC Specifications
< The definition of LVDS DC characteristics >
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< The definition of LVDS Receiver Skew (Strobe) Margin >
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Characteristics
Symbol
Min.
Typ.
Max.
Unit
Remarks
Modulation Rate
Fmr
-3 0 +3 %
Modulation Frequency
Fmf
30
-
300
kHz
@ MAINCLK =
(TBD)MHz
LVDS SSC Specification
< Definition of SSC (Spread Spectrum Clock) >
Timing diagrams of LVDS transmission
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Signal
Item
Symbol
Min.
Typ.
Max.
Unit
Note
Frame Frequency
Cycle
TV TBD
Lines
Vertical active
in the display term
Display Period
TVD - 768
-
Lines
Scanning time in
one line
Cycle
TH TBD
Clocks
Horizontal active
in the display term
Display Period
THD
-
1366
-
Clocks
5.5 INTERFACE TIMING
5.5.1 TIMING PARAMETERS
5.5.2 TIMING DIAGRAMS OF INTERFACE SIGNAL
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5.6 INPUT COLOR DATA MAPPING
Note (1) Definition of gray : Rn: Red gray, Gn: Green gray, Bn: Blue gray (n=gray level)
Note (2) Input signal: 0 =Low level voltage, 1=High level voltage
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Timing (ms)
Remarks
0.5<T1≤10
VLCD_VCC rising time from 10% to 90%
0<T2 ≤50
Interval from VLCD_VCC to valid data at power ON
0<T3 ≤50
Interval from valid data OFF to VLCD_VCC OFF at power Off
150 ≤T4
VLCD_VCC OFF time for Windows restart
200 ≤T5
Interval from valid data to B/L enable at power ON
0 ≤T6
Interval from valid data off to B/L disable at power Off
0<T7 ≤10
VLCD_VCC falling time from 90% to 10%
10<T8
Interval from valid data on to LED driver Vin rising time 10%
10<T9
Interval from LED driver Vin falling time 10% to valid data Off
0.5<T10≤10
LED V
in
rising time from 10% to 90%
0.5<T11≤10
LED V
in
falling time from 90% to 10%
0<T12
Interval from LED driver Vin rising time 90% to PWM ON
0<T13
Interval from PWM Off to LED driver Vin falling time 10%
0 ≤ T14
Interval from PWM ON to B/L Enable ON
0 ≤ T15
Interval from B/L Enable Off to PWM Off
5.7 POWER ON/OFF SEQUENCE
To prevent the product from being latched up or the DC in the LCD module from starting an operation, the
order to turn the power on and off should be changed to the order as shown in the diagram below.
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The backlight may be flashed if the interface signal remains floated when the above-mentioned signal
becomes invalid.
Note (1) The power voltage from system shall be supplied to the input pin of LCD constantly.
(2) Enable the voltage to the LED within the range, which the LCD is operated. The screen becomes
white when turning the back-light on before the LCD is operated or turning the LCD off before
turning the back-light off. Operation or the LCD turns off before the back-light turns off, the display
may momentarily become white.
(3) Don’t leave the system at a high impedance state, which the interface signal is out for a long time
after the Vcc is enabled.
(4) The T4 should be measured the module is fully discharged.
(5) The interface signal shall not maintain the high impedance when the power is on.
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Pin
Symbol
Function
1
NC
Hot Plug Detect or No connection (optional)
2
LCD_VCC
LCD logic and driver IC Power(3.3V typ.)
3
LCD_VCC
LCD logic and driver IC Power(3.3V typ.)
4
VCC_EDID
DDC power
5
BIST_EN (WPN)
BIST enable and Reserved for the use by LCD manufacturer. (WPN)
6
CLK_EDID
DDC clock 7 DAT_EDID
DDC data 8 RX0-
Negative LVDS differential data input for pixel
9
RX0+
Positive LVDS differential data input for pixel
10
H_GND
High speed ground
11
RX1-
Negative LVDS differential data input for pixel
12
RX1+
Positive LVDS differential data input for pixel
13
H_GND
High speed ground
14
RX2-
Negative LVDS differential data input for pixel
15
RX2+
Positive LVDS differential data input for pixel
16
H_GND
High speed ground
17
RXC-
Negative LVDS differential clock input for pixel
18
RXC+
Positive LVDS differential clock input for pixel
19
LCD_GND
LCD logic and driver IC Ground
20
NC
No connection
21
NC
No connection
22
LCD_GND
LCD logic and driver IC Ground
23
NC
No connection
24
NC
No connection
25
LCD_GND
LCD logic and driver IC Ground
26
NC
No connection
27
NC
No connection
28
LCD_GND
LCD logic and driver IC Ground
29
NC
No connection
30
NC
No connection
31
BL_GND
Backlight ground
32
BL_GND
Backlight ground
33
BL_GND
Backlight ground
34
NC
Hot Plug Detect or No connection (optional)
35
BL_PWM_DIM
Signal input for the system PWM for dimming
36
BL_ENABLE
Backlight on/off
37
APS_EN
APS on/off or No connection (optional)
38
BL_PWR
Backlight power
39
BL_PWR
Backlight power
40
BL_PWR
Backlight power
5.8 INPUT TERMINAL PIN ASSIGNMENT
5.8.1 INPUT SIGNAL & POWER
(
(LVDS, Connector : 20455-040E-0, I-PEX or the equipment with the equivalent capability)
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1366
Line 768
6. PIXEL FORMAT
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TBD
7. OUTLINE DIMENSION
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Under the display quality test conditions with normal operation state,
these should be no change which may affect practical display functions.
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No
Part name
Quantity
1
Static electric protective sack
36 pcs
2
Packing case (Inner box)
included shock absorber
1 set
3
Pictorial marking
2
4
Carton
1 set
9. PACKING
9.1 CARTON
(1) Packing Form
Corrugated Cardboard box and Corrupad form as shock absorber.
(2) Packing Method
Note (1) Total Weight : Approximately 18 Kg
(2) Acceptance number of piling : 36 sets
(3) Carton size : 373(W) 470(D) 372(H))
(3) Packing Material
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Build Name(s)
Revision Code(s)
SST (WS)
X00, X01, X02, … X09
PT (ES)
X10, X11, X12, … X19
ST (CS)
X20, X21, X23, … X29
XB (MP)
A00, A01, A02, … A99
Panel number
Cell ID
Lot ID
Month
Year
Product Code
Line
Samsung Revision Code
9.2 MARKING
A nameplate is affixed to the specified location on each product.
(1)Parts number : LTN156AT34
(2)Revision code : 3 letters
(3)Lot number : X X X X XXX XX X D01
(4) Nameplate Indication
Parts name : LTN156AT34
Lot number : XXXXXXXXXX
Inspected work week : 1304 (2013 year 4th week)
Product Revision Code : D01
DP/N : Dell Part No (“0PT8JP” is for LTN156AT34-D)
※ Panel revision code scheme (Refer to the Red box on the label)
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TBD
(5) Packing small box attach
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10. GENERAL PRECAUTIONS
10.1 HANDLING
(a) When the module is assembled, It should be attached to the system firmly using every mounting holes.
Be careful not to twist and bend the modules.
(b) Refrain from strong mechanical shock and / or any force to the module. In addition to damage, this may
cause improper operation or damage to the module and CCFT back-light.
(c) Note that polarizers are very fragile and could be easily damaged. Do not press or scratch the surface
harder than a HB pencil lead.
(d) Wipe off water droplets or oil immediately. If you leave the droplets for a long time, Staining and
discoloration may occur.
(e) If the surface of the polarizer is dirty, clean it using some absorbent cotton or soft cloth.
(f) The desirable cleaners are water, IPA (Isoprophyl Alcohol) or Hexane. Do not use Ketone type materials(ex.
Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride. It might permanent damage to the polarizer
due to chemical reaction.
(g) If the liquid crystal material leaks from the panel, it should be kept away from the eyes or mouth .In case
of contact with hands, legs or clothes, it must be washed away thoroughly with soap.
(h) Protect the module from static , it may cause damage to the C-MOS Gate Array IC.
(i) Use fingerstalls with soft gloves in order to keep display clean during the incoming inspection and assembly
process.
(j) Do not disassemble the module.
(k) Do not pull or fold the LED FPC.
(l) Do not touch any component which is located on the back side.
(m) Protection film for polarizer on the module shall be slowly peeled off just before use so that the
electrostatic charge can be minimized.
(n) Pins of I/F connector shall not be touched directly with bare hands.
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ITEM
Unit
Min.
Max.
Storage
Temperature
(℃)
5
40
Storage
Humidity
(%rH)
35
75
Storage Life
12 months
Storage
Condition
- The storage room should be equipped with a good ventilation facility, which has a
temperature controlling system.
- Products should be placed on the pallet, which is away from the wall not on the floor.
- Prevent products from being exposed to the direct sunlight, moisture, and water.;
Be cautious not to pile the products up.
- Avoid storing products in the environment, which other hazardous material is placed.
- If products are delivered or kept in the storage facility more than 3 months,we recommend
you to leave products under the condition including a 20℃ temperature and a humidity of
50% for 24 hours.
- If you store semi-manufactured products for more than 3 months, bake the products under
the condition including the 50℃ temp. and the 10% humidity for 24hrs after being used.
10.2 STORAGE
We highly recommend to comply with the criteria in the table below.
10.3 OPERATION
(a) Do not connect, disconnect the module in the “ Power On” condition.
(b) Power supply should always be turned on/off by following item 6.3 “ Power on/off sequence “.
(c) Module has high frequency circuits. Sufficient suppression to the electromagnetic interference shall be
done by system manufacturers. Grounding and shielding methods may be important to minimize the
interference.
(d) The FPC cable between the LED chips and its converter power supply shall be a minimized length and be
connected directly .The longer cable between the back-light and the converter may cause lower luminance
of light source (LED).
(e) The standard limited warranty is only applicable when the module is used for general notebook
applications. If used for purposes other than as specified, SEC is not to be held reliable for the defective
operations. It is strongly recommended to contact SEC to find out fitness for a particular purpose.
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10.4 OTHERS
(a) Ultra-violet ray filter is necessary for outdoor operation.
(b) Avoid condensation of water. It may result in improper operation or disconnection of electrode.
(c) Do not exceed the absolute maximum rating value. ( the supply voltage variation, input voltage variation,
Variation in part contents and environmental temperature, so on) Otherwise the module may be damaged.
(d) If the module displays the same pattern continuously for a long period of time, it can be the situation when
The image “sticks” to the screen.
(e) This module has its circuitry PCB’s on the rear side and should be handled carefully in order not to be
stressed.
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TBD
11. EDID
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1
[Common]Gap in the rear of display
Prevent the product from being defected resulted from the interference and
the lack of gap between the rear cover of system and the LCD module.
Recommendation
A. The gap between the rear cover of system and the rear of LCD module.
: Min. 0.3mm (Recommend)
B. Based on the size of part in a maximum size between the rear cover of
system and the LCD module.
: Min. 0.3mm (Recommend)
(※ Based on the maximum thickness of module, which the tolerance is
considered.)
Risk factor
Pooling / White Spot / Being divided
2
Gap in the front of display
Prevent the product from being defected resulted from the interference and the
lack of gap between the front cover of system and the LCD module.
Recommendation
: Min. 0.3mm (Recommend)
(※ Based on the maximum thickness of module, which the tolerance is
considered.)
Risk factor
Pooling
12. APPENDIX
12.1 SYSTEM DESIGN GUIDE
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3
[Common] The shape of key pad of system
Prevent the product from being defected resulted from the shape of key pad in
the system.
Recommendation
A. Make the shape of frame, which surrounds the key pad as round as possible.
B. Prevent the product from being defected resulted from the pressurization by
attaching the sponge on the cover of system not to be overlapped with the
position of the frame around key pad.
C. Prevent the product from being defected, which is resulted from the
pressurization from outside by eliminating the difference in height between
the key pad and the frame around key pad.
Risk factor
White Spot / Black Spot / Being broken in glass.
4
[Common] The arrangement of user cable (Camera, Antenna)
Prevent the product from being defected resulted from the user cable arranged
on the rear of module.
Recommendation
A. Arrange the user cable in the side not in the rear(the active area) of
LCD module.
Risk factor
Pooling / White Spot
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5
[Common] The arrangement of input cable
Prevent the product from being defected resulted from the overlapping
between the input cable and the film of LCD module .
Recommendation
A. Arrange the input cable not to be overlapped with the COF film.
B. Minimization of the height of input cable and making the COF film flat.
Risk factor
A/D (The damaged COF film is cracked., The chip is broken.)
6
[ELS] Gap between the bracket and the LCD Module
Prevent the LCD module from being interfered when testing the product in
terms of the performance of hinge and the occurrence of twist.
Recommendation
A. Secure the min. 1.0mm distance between the bracket and the LCD module at
4 corners of screen respectively.
B. Control the angle of bracket on the system.
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7
[ELS] Suggestion on the angle of bracket
Prevent the product from being defected resulted from the changed top
chassis by the angle and the shape of bracket on the system.
Recommendation
A. Don't form the bracket hole.
B. Control the angle in the event that the bracket, which has L-shape is applied.
(90 ± 2˚)
Risk factor
Pooling / Light leakage
8
[UMS] Control the angle of the connected part on the user flange
Prevent the user flange from not being placed horizontally, which is caused
when the LCD module, which is structured in UMS is assembled.
Recommendation
A. Prevent the product from being pooled resulted from the changed user
flange
created when assembling the LCD module to the system.
B. Insert the screw to the hole of flange vertically when LCD module is
assembled to the system.
Risk factor
Pooling
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Doc. No. LTN156AT34-D Page 36 of 36 Rev. No. 05-P01-S-130220
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