SAMSUNG LSF550HJ02-A Specification

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SAMSUNG TFT-LCD

MODEL: LSF550HJ02-A

Samsung Display Co., LTD

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Contents

Revision History ……………………………………………………………………………………………….(3)
General Description …………………………………………………………………………… ………………(4)
General Information ……………………………………………………………………………………………(4)

1. Absolute Maximum Ratings ……………………………………………………………………………….(5)

2. Optical Characteristics ……………………………………………………………………….....................(6)

3. Electrical Characteristics …………………………………………………………………………………….(11)

3.1 TFT LCD Module

4. Block Diagram ………………………………………………………………………………………………(12)

5. Input Terminal Pin Assignment …………………………………………………………………………….(13)

5.1 Input Signal & Power

5.2 LVDS Interface

5.3 Input Signals, Basic Display Colors and Gray Scale of Each Color

6. Interface ………………………………………………………………………………………………………..(19)

6.1 Timing Parameters (DE only mode)

6.2 Characteristics of LVDS Input data

6.3 Timing Diagrams of interface Signal (DE only mode)

6.4 Power ON/OFF Sequence

7. Outline Dimension ………………………………………………………………….…………………….…..(23)

7.1 The adhesive size of POL

7.2 The drawing sheet for the size of the OLB bonding

7.4 Cross Section of cell

7.5 Source PCB

7.6 FFC cable

7.7 Control PCB5

8. Reliability Test ………………………………………………………………………….…………………..…(24)

9. General Precaution ………………………………………………………………………………..….…..….(25)

9.1 Handling

9.2 Storage

9.3 Operation

9.4 Guide for the Operation Condition

9.5 Others

10. Special Precautions………………………………………………………………………………….……...(29)

11. Example ……………………………………………………………………………………………….……..(30)
Appendix1 ……………………………………………………………………………………………….…….(31)
Appendix2 ……………………………………………………………………………………………….…….(35)

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Date

Rev. No

Page

Summary

30. Nov. 2012

000

all

First Issue (First Draft)

07.Dec. 2012

001 6 Change Optical characteristics

13.Dec. 2012

002

5

13~17

Change Relative humidity

and Pin assignment

sony model

special list

VD Model Special

list

The revision history

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General Description

Description

This model uses a liquid crystal display (LCD) of amorphous silicon TFT as switching components. This
model is composed of a TFT LCD panel, a driver circuit, and an ass’y KIT of source PBA. This 55.0”
model has a resolution of a 1920 x 1080 and can display up to 16.7 million colors with the wide viewing

angle of 89° or a higher degree in all directions. This panel is designed to support applications by

providing a excellent performance function of the flat panel display such as home-alone multimedia TFT­LCD TV and a high definition TV.

General Information

Features

 RoHS compliance (Pb-free)
 High contrast ratio & aperture ratio with the wide color gamut
 SVA(Super vertical align) mode
 Wide viewing angle (±178°)
 High speed response
 FHD resolution (16:9)
 Low power consumption
 DE (Data enable) mode
 The interface 4ch LVDS (Low voltage differential signaling)

Items

Specification

Unit

Note

Active Display Area

1209.6(H) x 680.4(V)

mm

Switching Components

a-Si TFT Active matrix

Glass Size

TFT : 1227.6(H) x 700.6(V)

CF : 1222.4(H) x 697.9(V)

mm

±0.4mm

Panel Size

1227.6(H) x 700.6(V)

mm

±0.4mm

1.8(D)

mm

±0.1mm

Weight

3400

g

Display Colors

16.7M (True Display)

1.07B (Dithered 10bit)

color

Number of Pixels

1,920 × 1,080

pixel

16 : 9

Pixel Arrangement

RGB Vertical Stripe

Display Mode

Normally Black

Surface Treatment

7G Anti Glare

Haze

2.3%

Hardness

2H

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1. Absolute Maximum Ratings

If the figures on measuring instruments exceed maximum ratings, it can cause the malfunction or the
unrecoverable damage on the device.

Item

Symbol

Min.

Max.

Unit

Note

Power supply voltage

V

DD

10.8

13.2

V

(1)

Temperature for storage

T

STG

-20

65

℃

(2),(4)

Temperature of glass surface

T

OPR2

0

65

℃

(2)

Operating temperature

T

OPR

0

50

℃

(2),(5)

Humidity for storage

H

STG

5

95

%RH

(2),(4)

Operating humidity

H

OPR

20

95

%RG

(2),(5)

Endurance on static electricity

150 V (3)

Note (1) The power supply voltage at Ta= 25 ± 2 °C
(2) Temperature and the range of relative humidity are shown in the figure below.
a. 95 % RH Max. (Ta ≤ 39 °C)
b. The relative humidity is 95% or less. (Ta ＞39 °C)
c. No condensation
d. Operating condition with SET

(3) Keep the static electricity under 150V in Polarizer attaching process.
(4) Operating condition with source PCB
(5) Storage temperature condition including glass
(6) Condition without packing. (Unpacking condition)

Fig. Range for temperature and relative humidity

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2. Optical characteristics

The optical characteristics should be measured in the dark room or the space surrounded by the similar

setting.
Measuring equipment : TOPCON RD-80S, TOPCON SR-3 ,ELDIM EZ-Contrast
(Ta = 25 ± 2°C, VDD=12.0V, fv=60Hz, f

DCLK

=148.5MHz, Light source: D65 Standard light)

Item

Symbol

Condition

Min.

Typ.

Max.

Unit

Light Source

Note

Contrast ratio

(At the center of screen)

C/R

4,000

5,000

-

Standard

(1)

SR-3

Response

time

G-to-G

Tg

T

PAN,SUR

=29.9℃

-

6.0

15.0

msec

Standard

or

VD BLU

(3)

RD-80S

Luminance of white

(At the center of screen)

YL

Normal
qL,R=0

qU,D=0

Viewing

Angle

- - -

cd/m2

VD BLU

(4)

SR-3

Chromaticity

(CIE 1931)

Red

Rx

TYP.

-0.03

0.640

TYP.

+0.03

VD BLU

(5),(6)

SR-3

Ry

0.330

Green

Gx

0.300

Gy

0.600

Blue

Bx

0.150

By

0.060

White

Wx

0.280

Wy

0.290

sRGB Concordance

- - 99 - %

(5)

SR-3

Color gamut

- - 72 - %

VD BLU

Color

- 7,000

10,000

13,000 K

Viewing

Angle

Hor.

qL

C/R≥10

75

89

-

Degree

Standard

or

VD BLU

(6)

SR-3

EZ-Contrast

qR

75

89

-

Ver.

qU

75

89

-

qD

75

89

-

Brightness uniformity

(9 Points)

B

uni

- 30

%

Standard

(2)

SR-3

Transmissivity

T 5.47

5.88 - %

Standard

(7)

D65/SR3

Transmissivity Uniformity

T

uni

-

10

%

Standard

(8)

D65/SR3

Gamma Value

GMA

2.0

2.2

2.4

Standard

or

VD BLU

(9)

SR-3

Gamma variation

(20G~128G)

Gdiff

-0.14

-

0.14

(11)

SR-3

ACC Linearity

ACC_lin

-0.015

-

0.015

Standard

or

VD BLU

(12)

SR-3

5nit Uniformity

Buni_5n

it

-30 - 30

%

Standard

(38G/255G)

(10)

SR-3

White Color Coordinate Uniformity

Wx uni
Wy uni

-

-

0.005

0.008

Standard

(13)

SR-3

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Notice
(a) Setup for test equipment

The measurement should be executed in a stable, windless, and dark room for 40min and 60min after
operating the panel at the given temperature for stabilization of the standard light. (SDC uses the standard
luminance of the D65 media).
This measurement should be measured at the center of screen.
The environment condition: Ta = 25 ± 2 °C

(b) D65 media has the general light source.

The temperature of color is 6847K. The coordinate of color is Wx 0.313, Wy 0.329
The luminance of this product is 7217cd/㎡.

Photo detector

Field

SR-3

2°/1°

RD-80S

1°

(c) The CIE positions D65 as the standard daylight illuminant:

[D65] is intended to represent average daylight and has a correlated color temperature of
approximately 6500 K. CIE standard illuminant D65 should be used in all colorimetric calculations
requiring representative daylight, unless there are specific reasons for using a different illuminant.

- Definition of the test point

Note (1) Definition of contrast ratio (C/R)

: The ratio of gray max (Gmax) & gray min (Gmin) at the center point ⑤ of the panel

The measurement goes in D65 Standard light source

Gmax : The luminance with all white pixels

C R

G

G

/

max

min



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Gmin : The luminance with all black pixels

Note (2) Definition of the brightness uniformity of 9 points (Test pattern : The full white)

The measurement shall be executed with the standard light source of D65 .

Bmax : The maximum brightness
Bmin : The minimum brightness

Note (3) Definition of the response time : Sum of Tr, Tf

※ G-to-G : Average response time between whole gray scale to whole gray scale.
The response time is the value that was measured after it was operated in Samsung's standard BLU for
one hour.( at room temperature)

Note (4) The definition of luminance of white: The luminance of white at the center point ⑤

The measurement shall be executed with the standard light source of D65.

Note (5) The definition of chromaticity (CIE 1931)

The color coordinate of red, green, blue and white at the center point ⑤
The measurement shall be executed with the standard light source of D65.

Note (6) Definition of viewing angle

: The range of viewing angle (C/R ≥10)

The measurement shall be executed with the standard light source of D65.

The response

Of optical instruments

Buni

B B

B

 



100

( max min)

max

Display data

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Tuni

= 100*

󰇛󰇜



Gamma Value

- 20 ~ 200Gray: 2.2 ±0.2

Buni_5nit

= 100*

󰇛󰇜



Bmax_5nit : The maximum brightness at 5nit Gray

Bmin_5nit : The minimum brightness at 5nit Gray

Vertical 1/6 Point

[Panel Measure Point]

Vertical 1/6 Point

Note (7) Definition of transmissivity

The measurement shall be executed with the standard light source of D65.

Note (8) Definition of the Transmissivity uniformity of 9 points (Test pattern: The full white)

The measurement shall be executed with the standard light source of D65.

Tmax : The maximum Transmissivity
Tmin : The minimum Transmissivity

Note (9) Management Criteria of Gamma Value

Note (10) 5nit Low Gray Uniformity

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255Gray Wx/Wy value basis (a module unit basis)
a. Color coordinate differences are less than 15/1,000 at
Any Point above 30Gray and 255Gray
b. When Wx/Wy coordinates reverse at 0Gray, it permits
an once intersection under, 30Gray

Wx, uni

= Wx max-Wx min

Wx max : The maximum Wx

Wx min : The minimum Wx

Wy, uni

= Wy max-Wy min

Wy max: The maximum Wy

Wy min: The minimum Wy

Note (11) Gamma Variation between Center and Left (or Right)

Gamma measured at 10cm point from the left & right side is more less than 0.1 than Gamma
measured at Center
(Gamma measured at 10cm of the P-4 & P-6 is more less than 0.1 than Gamma measured at P-5)

Note (12) Management Criteria of ACC Linearity

Note (13) White Color Coordinate Uniformity of 9 points (Test pattern: The full white)

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3. Electrical characteristics – Sony Model Attached Reference file

3.1 TFT LCD Module

The connector for the display data & timing signal should be connected.

Ta = 25°C ± 2 °C

Item

Symbol

Min.

Typ.

Max.

Unit

Note

Voltage of power supply

V

DD

10.8

12.0

13.2

V

(1)

Current

of power

supply

(a) Black

I

DD

700

800

1300

mA

(2),(3)

(b) White

700

800

1300

mA

(c) H-Stripe

1200

1400

2000

mA

Vsync frequency

f

V

60

Hz Hsync frequency

f

H

67.5

kHz Main frequency

Fdclk

148.5

MHz Rush current

I

RUSH

- - 5

A

(4)

Note (1) The ripple voltage should be controlled fewer than 10% of V

DD

(Typ.) voltage.
(2) fV=60Hz, fDCLK =148.5MHz, VDD = 12.0V, DC Current.
(3) Power dissipation check pattern (LCD Module only)

(4) Conditions for measurement

a) Black pattern b) White pattern c) H-stripe

The rush current, I

RUSH

can be measured during T

RUSH

is 470us

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4. Block diagram

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5. The Pin assignment in the input terminal

5.1. Input signal & power
Connector : FI-RE51S-HF (JAE/UJU)

Pin

Description

Pin

Description

1

Vdd (12V)

26

Even

LVDS

Signal

RE[0]P 2 Vdd (12V)

27

RE[1]N 3 Vdd (12V)

28

RE[1]P 4 Vdd (12V)

29

RE[2]N 5 Vdd (12V)

30

RE[2]P 6 No connection

31

GND 7 GND

32

RECLK- 8 GND

33

RECLK+ 9 GND

34

GND

10

Odd

LVDS

Signal

RO[0]N

35

RE[3]N

11

RO[0]P

36

RE[3]P

12

RO[1]N

37

RE[4]N

13

RO[1]P

38

RE[4]P

14

RO[2]N

39

GND

15

RO[2]P

40

No connection

NOTE1

16

GND

41

No connection

17

ROCLK-

42

No connection

18

ROCLK+

43

No connection

19

GND

44

No connection

20

RO[3]N

45

No connection

21

RO[3]P

46

No connection

22

RO[4]N

47

No connection

23

RO[4]P

48

No connection

24

GND

49

No connection

25

Even LVDS

RE[0]N

50

No connection

51

Aging EN

NOTE2

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Note (1) Pin number which starts from the left side.

a. Power GND pins should be connected to the LCD’s metal chassis.

b. All power input pins should be connected together.

c. All NC pins should be separated from other signal or power.

Note(2) AGING ENABLE PIN / IF THIS PIN GND

→ BIST MODE (ROLLING PATTERN IS OPERATED)

Fig . The diagram of connector

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5.2 LVDS Interface

- LVDS receiver : T-con (merged) ( 8Bit)

- Data format

LVDS pin

JEIDA -DATA

TxOUT/RxIN0

TxIN/RxOUT0

R2

TxIN/RxOUT1

R3

TxIN/RxOUT2

R4

TxIN/RxOUT3

R5

TxIN/RxOUT4

R6

TxIN/RxOUT6

R7

TxIN/RxOUT7

G2

TxOUT/RxIN1

TxIN/RxOUT8

G3

TxIN/RxOUT9

G4

TxIN/RxOUT12

G5

TxIN/RxOUT13

G6

TxIN/RxOUT14

G7

TxIN/RxOUT15

B2

TxIN/RxOUT18

B3

TxOUT/RxIN2

TxIN/RxOUT19

B4

TxIN/RxOUT20

B5

TxIN/RxOUT21

B6

TxIN/RxOUT22

B7

TxIN/RxOUT24

HSYNC

TxIN/RxOUT25

VSYNC

TxIN/RxOUT26

DEN

TxOUT/RxIN3

TxIN/RxOUT27

R0

TxIN/RxOUT5

R1

TxIN/RxOUT10

G0

TxIN/RxOUT11

G1

TxIN/RxOUT16

B0

TxIN/RxOUT17

B1

TxIN/RxOUT23

RESERVED

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5.3 Input signals, basic display colors and the gray scale of each color. (8bit))

COLOR

DISPLAY

(8bit)

DATA SIGNAL

GRAY
SCALE
LEVEL

RED

GREEN

BLUE

R0

R1

R2

R3

R4

R5

R6

R7

G0

G1

G2

G3

G4

G5

G6

G7

B0

B1

B2

B3

B4

B5

B6

B7

BASIC

COLOR

BLACK

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

-

BLUE

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

1

-

GREEN

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

-

CYAN

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

-

RED

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

-

MAGENTA

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

1

-

YELLOW

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

-

WHITE

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

-

GRAY

SCALE

OF

RED

BLACK

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

R0

DARK

↑

↓

LIGHT

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

R1

0

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

R2

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

R3~

R252

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

1

0

1

1

1

1

1

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

R253

0

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

R254

RED

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

R255

GRAY

SCALE

OF

GREEN

BLACK

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

G0

DARK

↑

↓

LIGHT

0

0

0

0

0

0

0

0

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

G1

0

0

0

0

0

0

0

0

0

1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

G2

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

G3~

G252

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

0

0

0

0

0

0

0

0

1

0

1

1

1

1

1

1

0

0

0

0

0

0

0

0

G253

0

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

G254

GREEN

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

1

0

0

0

0

0

0

0

0

G255

GRAY

SCALE

OF

BLUE

BLACK

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

B0

DARK

↑

↓

LIGHT

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

1

0

0

0

0

0

0

0

B1

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

1

0

0

0

0

0

0

B2

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

B3~

B252

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

:

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

1

0

1

1

1

1

1

1

B253

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

B254

BLUE

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

0

1

1

1

1

1

1

1

1

B255

Note) The definition of gray :

Rn : Red gray, Gn : Green gray, Bn : Blue gray (n = Gray level)

Input signal : 0 = Low level voltage, 1 = High level voltage

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5.4 LVDS receiver : T-con (merged) ( 8Bit)

- Data format

LVDS pin

JEIDA -DATA

TxOUT/RxIN0

TxIN/RxOUT0

R2

TxIN/RxOUT1

R3

TxIN/RxOUT2

R4

TxIN/RxOUT3

R5

TxIN/RxOUT4

R6

TxIN/RxOUT6

R7

TxIN/RxOUT7

G2

TxOUT/RxIN1

TxIN/RxOUT8

G3

TxIN/RxOUT9

G4

TxIN/RxOUT12

G5

TxIN/RxOUT13

G6

TxIN/RxOUT14

G7

TxIN/RxOUT15

B2

TxIN/RxOUT18

B3

TxOUT/RxIN2

TxIN/RxOUT19

B4

TxIN/RxOUT20

B5

TxIN/RxOUT21

B6

TxIN/RxOUT22

B7

TxIN/RxOUT24

HSYNC

TxIN/RxOUT25

VSYNC

TxIN/RxOUT26

DEN

TxOUT/RxIN3

TxIN/RxOUT27

R0

TxIN/RxOUT5

R1

TxIN/RxOUT10

G0

TxIN/RxOUT11

G1

TxIN/RxOUT16

B0

TxIN/RxOUT17

B1

TxIN/RxOUT23

RESERVED

TxOUT/RxIN4(dithered10b

it)

TxIN/RxOUT28

R0

TxIN/RxOUT29

R1

TxIN/RxOUT30

G0

TxIN/RxOUT31

G1

TxIN/RxOUT32

B0

TxIN/RxOUT33

B1

TxIN/RxOUT34

RESERVED

5.5 Input signals, basic display colors and the gray scale of each color. (10bit)

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COLOR

DISPLAY

DATA SIGNAL

GRAY

SCALE

LEVEL

RED

GREEN

BLUE

R0

R1

R2

R3

R4

R5

R6

R7

R8

R9

G0

G1

G2

G3

G4

G5

G6

G7

G8

G9

B0

B1

B2

B3

B4

B5

B6

B7

B8

B9

BASIC

COLOR

BLACK

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

BLUE

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 -

GREEN

0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 -

CYAN

0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 -

RED

1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

MAGENTA

1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 -

YELLOW

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 -

WHITE

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 -

GRAY

SCALE

OF RED

BLACK

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R0

DARK

↑

↓

LIGHT

1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1

0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R2

: : : : : : : : : : : : : : : : : : : : : : : : : : : : :

:

R3~

R1020

: : : : : : : : : : : : : : : : : : : : : : : : : : : : :

:

1 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1021

0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1022

RED

1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R1023

GRAY

SCALE

OF

GREEN

BLACK

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G0

DARK

↑

↓

LIGHT

0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G1

0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 G2

: : : : : : : : : : : : : : : : : : : : : : : : : : : : :

:

G3~

G1020

: : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 0 0 0 0 0 0 0 0 0 0 1 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 G1021

0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 G1022

GREEN

0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 G1023

GRAY

SCALE

OF

BLUE

BLACK

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 B0

DARK

↑

↓

LIGHT

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 B1

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 B2

: : : : : : : : : : : : : : : : : : : : : : : : : : : : :

:

B3~

B1020

: : : : : : : : : : : : : : : : : : : : : : : : : : : : :

:

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 1 1 1 1 1 1 1 B1021

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 B1022

BLUE

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 B1023

Note) The definition of gray :

Rn : Red gray, Gn : Green gray, Bn : Blue gray (n = Gray level)

Input signal : 0 = Low level voltage, 1 = High level voltage

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6. Interface timing

6.1 The parameters of timing ( Only DE mode )

SIGNAL

ITEM

SMBOL

MIN.

TYP.

MAX.

Unit

NOTE

Clock

Frequency

1/T

C

148.5

MHz

-

Hsync

F

H

67.5

KHz

-
Vsync

F

V

60

Hz

-

Term for the

vertical

display

Active

display

period

T

VD

-

1080

-

Lines

-

Total vertical

T

V

1125

Lines

-

Term for the

horizontal

display

Active

display

period

T

HD

-

1920

-

Clocks

-

Total

Horizontal

T

H

2200

clocks

-

Note) These products don’t have to receive the signal of Hsync & Vsync from the input device.

(1) Key points when testing: TTL controls the signal and the CLK at the input terminal of LVDS Tx of the

system.

(2) Internal VDD = 3.3V

(3) Spread spectrum

- The limit of spread spectrum's range of SET in which the LCD module is assembled should be within ± 3 %.

TxOUT/RxIN4(dithered10bit)

TxIN/RxOUT28

R0

R8

TxIN/RxOUT29

R1

R9

TxIN/RxOUT30

G0

G8

TxIN/RxOUT31

G1

G9

TxIN/RxOUT32

B0

B8

TxIN/RxOUT33

B1

B9

TxIN/RxOUT34

RESERVED

RESERVED

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6.2 Timing diagrams of interface signal (Only DE mode )

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6.3 Characteristics of Input data of LVDS

ITEM

SYMBOL

Min.

Typ.

Max.

UNIT

NOTE

Differential input high

threshold voltage

VTH

-

-

+100

mV

V

CM

= 1.2V

Differential input low

threshold voltage

VTL

-100 - -

mV

Input common mode voltage

V

CM

0.2

1.2

2.0 V -

Differential Input Voltage

|V

ID

|

100

-

600

mV

|V

ID

|=100mV

Input data position

F

IN

=80MHz

t

RSRM

- - 450

ps

t

RSLM

-450

-

ps

Notice The spread spectrum should be 0% when the skew is measured.
Position of a measurement is T-CON LVDS input pin

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6.4 The sequence of power on and off – Sony Model attached Reference file
To prevent a latch-up phenomena or the DC operation of the LCD Module, the power on/off sequence should
be accorded with the settings described in the diagram below.

T1 : The VDD rising time from 10% to 90%
T2 : The time from the point which V

DD

reach to 90% of voltage to the point which the valid data is out when

the power is on.

T3: The time from the point which the valid data is out to the point which VDD reach to the 90% of voltage

when the power is off.

T4: the time from the point which the Vdd decrease to the point which the Vdd increase again for windows to

restart.

※ The recommended operating condition of the back light system

T5: The time which takes for B/L to be turned on after the signal is entered when the time is on.
T6 : The time which takes until the signal is out after BL is turned off

 The condition of supply voltage to enter in the module from the external system should have

the same condition as the definition of VDD.

 Apply the voltage for the lamp within the range which the LCD operates. when the back light is turned on
before the LCD is operated or when the LCD is turned off before the back light is turned off, the display may
show the abnormal screen momentarily.

 While the V

DD

is off level, please keep the level of input signals low or keep a high impedance condition.

 The figure of T4 should be measured after the module has been fully discharged between the periods
when the power is on and off.

 The interface signal must not keep the high impedance condition when the power is on.

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7. Outline dimension

7.1 The adhesive size of POL
The next figure shows the size of POL on the drawing sheet attached to the panel for BLU design.

<Figure.>
The POL size of CF : 1220.8 X 695.45 ± 0.2mm
The POL size of TFT: 1220.4 X 695.45 ± 0.2mm
The total adhesion allowance of POL is ± 0.5㎜

7.2 The drawing sheet for the size of the OLB bonding

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8. Reliability test

Item

Test Condition

Quantity

Note

HTOL

60 ℃ (Panel change 500hr / circuit change 250hr)

8

LTOL

-5 ℃ (Panel change 500hr / circuit change 250hr)

4

THB

50 ℃ / 90 %RH(Panel change 500hr / circuit change 250hr)

10

ASG

Low

temperature

Max. frequency 25℃~-40℃

Each

Cell

ASG Product Only

ASG

High

Temperature

Min. frequency 60℃operation 96hr

Each

Cell

ASG Product Only

Image sticking

25 ℃ / Mosaic pattern(9*10) 12hrs

8

Rolling pattern 12hrs / 3cycles

Decompressio

n

-40~50℃, 0m(0ft) ~ 13,700m(45,000ft), 72.5Hr

4

HTS

70 ℃, Storage (Panel change 500hr / circuit change 250hr)

4

LTS

-25 ℃, Storage(Panel change 500hr / circuit change 250hr)

4

Transportation

condition

drop(20cm) → temperature/humidity(-30~60℃ / 40℃ 90%RH)
→ pressure → vibration(5~200Hz 1.05Grms, 2hr) → drop(20cm)

1pallet

WHTS

60 ℃ / 75 %RH , Storage

4

Noise

Electromagnetic noise: Overall 23dB 이하

2

Complex

stress

-20℃~60℃, 0~90%RH, 2cycle

4

ESD

S-IC Input ±7KV, Output ±4KV
Output 은 data TP 에 직접 인가 후 진행
Input 은 CKV,VCOM 등에 FFC CNT 를 통하여 TEST 를 진행

3

EOS (optional)

Item

Test condition

Vin Input

step

Surge combination (High impedance)

Pass Condition: 5kV under

Signal Input

step

Surge combination (High impedance)

Pass Condition: 120V under

2

[Criteria on evaluation]

There should be no change of the product, which may affect to the practical display functions, when the
display quality test is executed under the normal operation setting.
* HTOL/ LTOL : The operating cycle on the high and low temperature
* THB : Temperature humidity slant
* HTS/LTS : The storage at the high and low temperature

* WHTS : The storage in the high temperature with the high humidity

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9. General precautions

9.1 Handling

(a) When the panel kit and BLU kit are assembled, the panel kit and BLU kit should be attached to the

set system firmly by combining each mounted holes. Be careful not to give the mechanical stress.

(b) Be careful not to give any extra mechanical stress to the panel when designing the set, and BLU kit.

(c) Be cautious not to give any strong mechanical shock and / or any to the panel kit.
Applying the any to the panel may cause the abnormal operation or the damage to the panel kit and

the back light unit kit.

(d) Refrain from applying any to the source PBA and the drive IC in the process of the handling

or installing to the set. If any are applied to the products, it may cause damage or a malfunction in
the panel kit.

(e) Refrain from applying any which cause a constant shock to the back side of panel kit, the set

design and BLU kit. If any are applied to the products, it may cause an abnormal display, a
functional failure and etc.

(f) Note that polarizer could be damaged easily.

Do not press or scratch the bare surface with the material which is harder than a HB pencil lead.

(g) Wipe off water droplets or oil immediately. If you leave the droplets for a long time on the product, a

staining or the discoloration may occur.

(h) If the surface of the polarizer is dirty, clean it using the absorbent cotton or the soft cloth.

(i) Desirable cleaners are water or IPA (Isopropyl Alcohol).

Do not use Kenton type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride.
These might cause the permanent damage to the polarizer due to chemical reaction.

(j) If the liquid crystal material leaks from the panel, this should be kept away from the eyes or mouth.

If this contacts to hands, legs, or clothes, you must washed it away with soap thoroughly and see a
doctor for the medical examination.

(k) Protect the panel kit and BLU Kit out of the static electricity. Otherwise the circuit IC could be

damaged.

- Reference : Process control standard of SDC

No.

Item

Control standard

1

Ionizer

All Equipment should be controlled under 150V.(Typ. 100V)

2

Carrying Roller

Carrying Roller should be controlled under 200V.

3

Equipment Ground

Resistance

All Equipment Ground Should be less than 1ohm.

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(l) Remove the stains with finger-stalls wearing soft gloves in order to keep the display clean in the

process of the incoming inspection and the assembly process.

(m) Do not pull or fold the source drive IC which connects to the source PBA and the panel or the gate

drive IC.

(n) Do not pull, fold or bend the source drive IC and the gate drive IC in any processes.

If not, the source drive IC could be bent one time in the process of assembling the panel Kit and the
BLU Kit.

(o) Do not adjust the variable resistor located on the panel kit and BLU kit except when adjusting the

flicker.
(p) Do not touch the pins of the interface connector directly with bare hands.
(q) Be cautious not to be peeled off the protection film.

(r) The protection film for the polarizer on the panel kit should be slowly peeled off just before using so

that the electrostatic charge can be minimized.

(s) The panel kit and BLU kit have high frequency circuits. The sufficient suppression to the EMI should

be done by the set manufacturers.

(t) The set of which the panel is assembled shall not be twisted. If the product is twisted, it may cause

the damage on the product.

(u) Surface Temp. of IC should be controlled less than 100℃, operating over the Temp. can cause the

damage or decrease of lifetime.

- Make sure to peel off slowly
(It is recommended to peel it off at the speed of more than 8sec.
constantly.)

- The peeling direction is shown at the Fig

- Instruct the ground worker to work with the adequate methods
such as the antistatic wrist band.

- Maker sure to be grounded the source PBA while peeling of the
protection film.

- Ionized air should be blown over during the peeling

- The protection film should not t be contacted to the source drive
IC.

- If the adhesive stains remain on the polarizer after the
protection film is peeled off, please move stains with isopropyl­alcohol liquid.

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9.2 Storage

The storage condition for packing

ITEM

Unit

Min.

Max.

Storage

Temperature

(℃)

5

40

Storage

Humidity

(%RH)

35

75

Storage life

12 months

Based on shipping date at SDC site

Storage

Condition

(1) Design the warehouse to be ventilated efficiently with equipping the

roof, the ventilation system, and the temp. controller.

(2) Don't load the product on the floor and store the product with loaded

on the pallet placed far away from the wall.

(3) Avoid exposing the product to the direct light, moisture, and water and

prevent the product from being condensed.

(4) Don't store the product at the container located outside where it rains

and the direct light shines.

(5) Prevent the product from being exposed to the noxious gas such as the

acid gas or alkali gas which may damage the electric device.

(6) Don't store the product at the location surrounded by dangerous

factors, which can deteriorate the quality of product.

9.3 Operation
(a) Do not connect or disconnect the FFC cable during the "Power On" condition.
(b) Power supply should be always turned on and off by the "Power on/off sequence"
(c) The module has high frequency circuits. The sufficient suppression to the electromagnetic interference

should be done by the system manufacturers. The grounding and shielding methods is important to
minimize the interference.

(d) The cables between TV SET connector and Control PBA interface cable should be connected directly

to have a minimized length. A longer cable between TV SET connector and Control PBA interface
cable maybe operate abnormal display

(e) Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize

the characteristic of the initial TFT.

(f) Response time depends on the temperature.( In Lower temperature, it becomes longer)

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9.4 Operation condition guide

(a) The LCD product shall be operated under normal conditions.
The normal condition is defined as below;

- Temperature : 20±15℃

- Humidity : 55±20%

- Display pattern : continually changing pattern (Not stationary)

(b) If the product will be used under extreme conditions such as under the high temperature, humidity,

display patterns or the operation time etc.., it is strongly recommended to contact SDC for the
advice about the application of engineering . Otherwise, its reliability and the function may not be
guaranteed. Extreme conditions are commonly found at airports, transit stations, banks, stock
markets, and controlling systems.

9.5 Others

(a) The ultra-violet ray filter is necessary for the outdoor operation.

(b) Avoid the condensation of water which may result in the improper operation of product or the

disconnection of electrode.

(c) Do not exceed the limit on the absolute maximum rating. (For example, the supply voltage

variation, the input voltage variation, the variation in content of parts and environmental
temperature, and so on) If not, panel may be damaged.

(d) If the module keeps displaying the same pattern for a long period of time, the image may be

remained to the screen. To avoid the image sticking, it is recommended to use a screen saver.

(e) This Panel has its circuitry of PCB's on the rear side, so it should be handled carefully in order for a

not to be applied.

(f) Please contact the SDC in advance when the same pattern is displayed for a long time

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10. Special precautions

10.1 Lists to be cautious when executing the design process

No.

Component

Expected cause

1

Upholding part for

panel

Prevent the panel from breaking by assigning gaps between the panel and the upholding part for panel on the drawing
for the upholding part for panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.

2

The shape of the

upholding part for

panel

Design the upholding part for panel to fit to the panel appropriately when designing the BLU since the shape of the
upholding part for panel may damage the panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.

3

The edge of

upholding part for

panel

Design the edge of panel to have a sufficient space with the upholding part for panel when designing the BLU since the
edge of the upholding part for panel may damage the panel when assembling the panel and BLU.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.

4

Upholding part for

panel

Place the upholding part for the panel in order for the shape of mold, which contacts with the panel not to interfere with
the area of panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.

5

Drive IC

Design the BLU in order for the COF not to contain the lead crack resulted from the tensioned COF created when the
product is twisted if the space between the D-IC COF and the middle mold isn't sufficient.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.

6

Drive IC

Design the BLU in order for the product not to contain the lead crack resulted from the tensioned COF caused under the
condition, which the product is twisted by fixing the source PCB.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.

7

IC

component

1) The temperature of each part of product suggested by our company and the second vendor shall meet the standard
of temperature, which is recommended not to be exceeded by our company when the product is affected under the
various temperature ranges.
Apply over 1mm long separation distance stated in the safety standard between the electric part and each conductor.
(Apply the rated separation distance when insulating.)

8

Thermal pad

Apply the thermal pad in a designated size to the product as a measure to lower the temperature of heat in order for
each part to use the rated temperature.

9

POL

The surrounding area of the POL shall be treated with an electrification treatment since the external ESD may cause a
phenomenon, which the POL is coming off.
In addition, the GND portion of source PBA shall be grounded.

10

PBA

The GND portion of each PBA shall be contacted with the GND portion of BLU.
Refer to the (a) and (b) of 3-3 for the design of BLU.

11

Circuit

The standardized approval from the client is required since the EMI is executed by a client.
Our company can only measure the reference since the client measures the BLU.

12

The height of

component

Design the BLU with considering the maximum height of parts, which our company suggests.

13

Between the FFC

and the C-PBA

Design the instrument with considering the length between the FFC and the control PBA.
(The marginal minimum length of 5mm or 8mm is required.)

14

Panel

The surface temperature of panel shall be maintained within 0℃ and 45℃ when the external ambient temperature is at
25℃. (Design the BLU with considering the increase of the temperature in the panel by the LED, CCFL, and etc.)

15

Aging

Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize the characteristic
of the initial TFT.

16

The attachment of

gasket

The additional confirmation by our company is required If the attachment of gasket to the S-PBA of our company is
required.(To fix the S-PBA or the EMI)

17

Drive IC

Design the top chassis and the driver IC to be contacted by placing the shape of emboss inside the top chassis as a
measure to prevent the driver IC from heating. The size of emboss shall be designed in larger size than the size of IC
inside the film of the driver IC.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.

18

The prohibited

bandwidth

Design the BLU in order for the BLU not to interfere with the area, where the control PBA and the source PBA are
located densely according to the drawing for the BLU from our company.

19

S-PBA

The material, which contacts with the bottom side of S-PBA which has a pattern shall be non-conducting material or
shall be insulated.

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11. Example

. The length between the FFC and the C-PBA

. The grounding of PCB

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Appendix1

Reference of each Panel size

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C/F

TFT

0.7 ± 0.07 mm

0.394 ± 0.0394 mm

A

0.394 ± 0.0394 mm

1. Amount of beveling of panel

2. Cross Section of cell

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3. Source PCB

Left

Right

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4. FFC cable

5.Control PCB

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Appendix2

Recommendation for the BLU Design

The Information described in this specification is for the first draft and can be changed without prior notice

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1. The schematic of panel

Item

Symbol

Remark

Protector Film

①

Removable

Polaroid Film

②

Color Filter Glass

③

TFT Glass

④

Source IC

⑤

Gate IC

⑥

Source PBA

⑦

FFC

⑧

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2. The tolerance of panel assembly

Item

Symbol

Min.

Note

Glass Cutting

X1

± 0.3

Y1

± 0.3

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3. The guide for the mechanical design

3.1 The panel guide
(a) It is recommended to avoid the following cases since the light leakage can be caused by the

pressure of the guiding structure.

When the guiding part is made of plastic resin, the gap between the panel and the guiding structure

should be considered when you design. The shrinkage under the situation which the temperatures
change causes the light leakage. For your reference, it is recommended to have a total gap between
the panel and the guide structure as below (When the resin is composed of the PC and the 15% of
G/F.)

tꀀሄ

32”

40”

46”

55”

Total Gap

Right & Left

0.9

0.9

1.0

1.1

Top & Bottom

0.6

0.7

0.8

0.9

It is recommended to follow the dimension and the shape of the guiding structure stated as below
since the distortion of guiding parts can cause the light leakage

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(b) When the panel guide point is designed at the edge of the panel, the points in the corner shall not be

designed to be contacted with the other parts in order to avoid the crack on the panel caused by the
burr of the panel.

(c) It is recommended to avoid placing the ribs as shown below since the panel damage with the unstable

design can be easily happened under the external.

-. The or the round shape near the panel shall be changed to a flat shape, such as the shape of screw
point, the gate point, and etc.

-. It is recommended to keep the gap between the panel guides and ribs over 1mm in the worst

conditions.

(※ The suggested dimension does not guarantee the quality of the products.)

-. The gap between the panel guide and the front cover (or the front chassis) should be a zero in Z-

direction to avoid the being broken in the panel caused by being stuck between the gap.

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3.2 The COF and the Drive IC
(a) The pattern of COF is easily damaged by the edge of the press and the burr of
mold under the condition which the products are shaking while delivering. Therefore, it
is recommended to avoid designing not to locate the gate of mold or the parting line in
the position of COF when designing the product.

(b) It is recommended to secure the sufficient gap between the COF and the other parts when

designing the product since the lack of gap between the COF and the other parts can cause the
damage in the COF such as the lead crack under the condition which the product is twisted.
(※ The space over 3.0mm for moving is recommended, but the quality of products is not
guaranteed.)

(c) The temperature of the surface of Drive-IC should be less than 100℃

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(d) The sufficient space for the COF and the Drive IC should be prepared including the worst condition

to prevent the damage on Drive-IC from the external.

-. If the panel is placed to the upper part of the mold, it is recommended to keep the gap between
the mold and the front cover or the mold and the top chassis by adding the rib between the COF
and COF.

-. Design the gap between the rib and the cover to maintain the space for the protection of COF as
small as possible

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(e) When metal parts are assembled next to the Drive-IC, the metal part should be insulated to avoid

the damage on IC from the static electricity.

(f) If the length of COF is designed to be short, the lead crack can be occurred by applying the tension

on the COF due to the being shaking of the product.

(g) It is recommended to design source PCB can be easily moved to the direction of each axis in

order for the tension not to be applied to the edge of COF under vibrating condition, such as
transportation of the product.

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3.3 The control PBA and the Source PBA

(a) The gaps between the source PBA and the other parts and the control PBA and other parts should

be considered to avoid the damage on electrical parts by the static electricity and the external s. If
the material of shielding part is metal, the insulation method is recommended.

(b) Confirm the status of insulation tape since the inappropriately attached insulation tape can cause

the damage on the parts of product if the insulation tape for the insulation of part of PBA is
attached inconsecutively due to the inappropriate design or the error occurred during the process.

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3. 4 The 4-Corner and the cloudy light leakage

(a) It is recommended to follow the method delineated in the picture below for designing
since the distortion on panel and the increase of the temperature gradient in the
surface of panel can cause the light leakage.

-. Place the strong beads at the corner point to control the flatness of the panel.

-. The heat sinking plane in the lower parts shall contact with the bottom chassis.

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3.5 Others

(a) The corrosion of the source PBA

Be cautious when selecting the specification of tape or designing the product since the corrosion
of the parts of circuit caused by the overuse of the glass cleaner of the end user may cause the
occurrence of the abnormalities in the screen, if the model is the reversed product which has the
source PBA designed at the 90˚.

(b) The deterioration of crystal liquid
It is recommended to design the products to make the temperature of the active area of the product

operated below the 50℃ for the protection from containing the abnormalities in the screen due to the
deterioration of the liquid crystal. In addition, it is recommended to design the product not to cause

the occurrence of the deterioration of liquid crystal under the ambient temperature of 50 ℃.