This model uses a liquid crystal display (LCD) of amorphous silicon TFT as switching components. This
model is composed of a TFT LCD panel, a driver circuit, and an ass’y KIT of source PBA. This 46.0”
model has a resolution of a 1366 x 768 and can display up to 16.7 million colors with the wide viewing
angle of 89° or a higher degree in all directions. This panel is designed to support applications by
providing a excellent performance function of the flat panel display such as home-alone multimedia TFTLCD TV and a high definition TV.
General Information
Features
RoHS compliance (Pb-free)
High contrast ratio & aperture ratio with the wide color gamut
SVA mode
Wide viewing angle (±178°)
High speed response
FHD resolution (16:9)
Low power consumption
DE (Data enable) mode
The interface (2pixel/clock) of 2ch LVDS (Low voltage differential signaling)
ItemsSpecificationUnitNote
Active Display Area698.4(H) x 392.85(V)㎜
Switching Componentsa-Si TFT Active matrix
Glass Size
Panel Size
Weight 1200 (max 1320) g ± 10%
Display Colors
Number of Pixels1,920 × 1,080pixel16 : 9
Pixel ArrangementRGB Vertical Stripe
Display ModeNormally Black
TFT : 715.4 (H) x 409.5 (V)
CF : 715.4 (H) x 406.9 (V)
715.4 (H) x 409.5 (V) mm ±0.4mm
1.80(D) mm ±0.1mm
16.7M (True Display)
1.07B (Dithered 10bit)
mm ±0.4mm
color
Surface TreatmentAG-POL(Anti-Glare),
Haze Haze 2.3%± 2.1%
Hardness Hard coating 2H
MODEL LSF320HN02-A Doc. No Page 4 / 39
SAMSUNG Confidential
1. Absolute Maximum Ratings
If the figures on measuring instruments exceed maximum ratings, it can cause the malfunction or the
unrecoverable damage on the device.
ItemSymbolMin.Max.UnitNote
Power supply voltage
Temperature for storage
Temperature of glass surface
Operating temperature
Humidity for storage
Operating humidity
V
T
T
T
H
H
DD
STG
OPR2
OPR
STG
OPR
10.8 13.2 V (1)
-20 65 ℃(2),(4)
0 65 ℃(2)
0 50 ℃(2),(5)
595%RH(2),(4)
2095%RG(2),(5)
Endurance on static electricity 150 V (3)
Note (1) The power supply voltage at Ta= 25 ± 2 °C
(2) Temperature and the range of relative humidity are shown in the figure below.
a. 95 % RH Max. (Ta ≤ 39 °C)
b. The relative humidity is 95% or less. (Ta >39 °C)
c. No condensation
d. Operating condition with SET
(3) Keep the static electricity under 150V in Polarizer attaching process.
(4) Operating condition with source PCB
(5) Storage temperature condition including glass
(6) Condition without packing. (Unpacking condition)
95
Fig. Range for temperature and relative humidity
MODEL LSF320HN02-A Doc. No Page 5 / 39
SAMSUNG Confidential
2. Optical characteristics
The optical characteristics should be measured in the dark room or the space surrounded by the similar setting.
Measuring equipment : TOPCON RD-80S, TOPCON SR-3 ,ELDIM EZ-Contrast
(Ta = 25 ± 2°C, VDD=12.0V, fv=60Hz, f
Item Symbol Condition Min. Typ. Max. Unit Light Source Note
=148.5MHz, Light source: D65 Standard light)
DCLK
Contrast ratio
(At the center of screen)
Response
time
Luminance of white
(At the center of screen)
Chromaticity
(CIE 1931)
sRGB Concordance - 99%
Color gamut - -72-%VD BLU
Viewing
Angle
G-to-G Tg
Red
Green
Blue
White
Color -
Hor.
Ver.
C/R
Y
L
Rx
Ry
Gx
Gy
Bx
By
Wx
Wy
q
L
qR
q
U
qD
T
PAN,SUR
=29.9℃
Normal
qL,R=0
qU,D=0
Viewing
Angle
C/R≥10
40005000 - Standard
- 8 16 msec
250 300 -
0.640
0.330
0.300
TYP.
-0.03
75 89 -
75 89 -
75 89 -
75 89 -
0.600
0.150
0.060
0.280
0.290
- 10,000- K
TYP.
+0.03
2
cd/m
Degree
Standard
or
VD BLU
VD BLU
VD BLU
Standard
or
VD BLU
(1)
SR-3
(3)
RD-80S
(4)
SR-3
(5),(6)
SR-3
(5)
SR-3
(6)
SR-3
EZ-Contrast
Brightness uniformity
(9 Points)
Transmissivity T
Transmissivity Uniformity
Gamma Value GMA
Gamma variation Gdiff
ACC Linearity ACC_lin
5nit Uniformity Buni_5nit
White Color Coordinate
Uniformity
B
- - 25 % Standard
uni
T
uni
(@20G~128G)
(@20G~128G)
Wx uni
Wy uni 0.008
4.374.7 - % Standard
- - 10 % Standard
2.0 2.2 2.4
-0.14- 0.14
-0.015- 0.015
-30 - 30 %
0.005
- -
Standard
or
VD BLU
Standard
or
VD BLU
Standard
(38G/255G)
Standard
(2)
SR-3
(7)
D65/SR3
(8)
D65/SR3
(9)
SR-3
(11)
SR-3
(12)
SR-3
(10)
SR-3
(13)
SR-3
Notice
MODEL LSF320HN02-A Doc. No Page 6 / 39
SAMSUNG Confidential
(a) Setup for test equipment
The measurement should be executed in a stable, windless, and dark room for 40min and 60min after
operating the panel at the given temperature for stabilization of the standard light. (SDC uses the standard
luminance of the D65 media).
This measurement should be measured at the center of screen.
The environment condition: Ta = 25 ± 2 °C
(b) D65 media has the general light source.
The temperature of color is 6847K. The coordinate of color is Wx 0.313, Wy 0.329
The luminance of this product is 7217cd/㎡.
Photo detector Field
SR-3 2°/1°
RD-80S1°
(c) The CIE positions D65 as the standard daylight illuminant:
[D65] is intended to represent average daylight and has a correlated color temperature of
approximately 6500 K. CIE standard illuminant D65 should be used in all colorimetric calculations
requiring representative daylight, unless there are specific reasons for using a different illuminant.
- Definition of the test point
Note (1) Definition of contrast ratio (C/R)
: The ratio of gray max (Gmax) & gray min (Gmin) at the center point ⑤ of the panel
The measurement goes in D65 Standard light source
CR
G
/
max
=
G
min
Gmax : The luminance with all white pixels
MODEL LSF320HN02-A Doc. No Page 7 / 39
SAMSUNG Confidential
−
Gmin : The luminance with all black pixels
Note (2) Definition of the brightness uniformity of 9 points (Test pattern : The full white)
The measurement shall be executed with the standard light source of D65 .
BB
Buni
=∗
Bmax : The maximum brightness
Bmin : The minimum brightness
Note (3) Definition of the response time : Sum of Tr, Tf
Of optical instruments
Display data
The response
(max min)
100
B
max
※ G-to-G : Average response time between whole gray scale to whole gray scale.
The response time is the value that was measured after it was operated in Samsung's standard BLU for
one hour.( at room temperature)
Note (4) The definition of luminance of white: The luminance of white at the center point ⑤
The measurement shall be executed with the standard light source of D65.
Note (5) The definition of chromaticity (CIE 1931)
The color coordinate of red, green, blue and white at the center point ⑤
The measurement shall be executed with the standard light source of D65.
Note (6) Definition of viewing angle
: The range of viewing angle (C/R ≥10)
The measurement shall be executed with the standard light source of D65.
MODEL LSF320HN02-A Doc. No Page 8 / 39
SAMSUNG Confidential
Note (7) Definition of transmissivity
The measurement shall be executed with the standard light source of D65.
Note (8) Definition of the
The measurement shall be executed with the standard light source of D65.
Note (9) Management Criteria of Gamma Value
Transmissivity uniformity of 9 points (Test pattern: The full white)
Tuni
= 100*
Tmax : The maximum
Tmin : The minimum
Transmissivity
Transmissivity
Gamma Value
- 20 ~ 128Gray : 2.0 ~ 2.4 (Typ. 2.2)
Note (10) 5nit Low Gray Uniformity
[Panel Measure Point]
Buni_5nit
= 100*
Bmax_5nit : The maximum brightness at 5nit Gray
Vertical 1/6 Point
Vertical 1/6 Point
Bmin_5nit : The minimum brightness at 5nit Gray
MODEL LSF320HN02-A Doc. No Page 9 / 39
SAMSUNG Confidential
Note (11) Gamma Variation between Center and Left (or Right)
Gamma measured at 10cm point from the left & right side is more less than 0.1 than Gamma
measured at Center
(Gamma measured at 10cm of the P-4 & P-6 is more less than 0.1 than Gamma measured at P-5)
Note (12) Management Criteria of ACC Linearity
255Gray Wx/Wy value basis (a module unit basis)
a. Color coordinate differences are less than 15/1,000 at
Any Point above 30Gray and 255Gray
b. When Wx/Wy coordinates reverse at 0Gray, it permits
an once intersection under, 30Gray
Note (13)
White Color Coordinate Uniformity of 9 points (Test pattern: The full white)
Wx, uni
Wx max : The maximum Wx
Wy, uni
Wy max: The maximum Wy
= Wx max-Wx min
Wx min : The minimum Wx
= Wy max-Wy min
Wy min: The minimum Wy
MODEL LSF320HN02-A Doc. No Page 10 / 39
SAMSUNG Confidential
3. Electrical characteristics – Sony Model Attached Reference file
3.1 TFT LCD Module
The connector for the display data & timing signal should be connected.
Ta = 25°C ± 2 °C
Item Symbol Min. Typ. Max. Unit Note
Voltage of Power Supply Module V
(a) Black
10.8 12.0 13.2 V (1)
DD
-
420 700
Current of
I
Power
Supply
(b) White
(d) Sub_V_Stripe
Vsync Frequency f
Main Frequency f
Rush Current I
DD
-
-
476063Hz
V
5067.575kHz
H
130148.5160MHz
DCLK
RUSH
- -
360 700
650 1000
Note (1) The ripple voltage should be controlled fewer than 10% of V
(2) fV=60Hz, fDCLK =148.5MHz, V
= 12.0V, DC Current.
DD
(3) Power dissipation check pattern (LCD Module only)
a) Black pattern b) White pattern c) Sub V-stripe
mA
mA
mA
4 A (4)
(Typ.) voltage.
DD
(2),(3)
(Without
Inverter)
Column Driving
Hsync Frequency f
(4) Conditions for measurement
The rush current, I
can be measured during T
RUSH
RUSH
is 470us
MODEL LSF320HN02-A Doc. No Page 11 / 39
4. Block diagram
SAMSUNG Confidential
MODEL LSF320HN02-A Doc. No Page 12 / 39
SAMSUNG Confidential
5. The Pin assignment in the input terminal
5.1. Input signal & power
Connector :
No No
1
2 DC power supply VDD(+12[V]) 27 Even LVDS Signal -
3 DC power supply VDD(+12[V]) 28 Even LVDS Signal +
4 DC power supply VDD(+12[V]) 29 Even LVDS Signal -
5 DC power supply VDD(+12[V]) 30 Even LVDS Signal +
6 Not Connected * 31 GND
7 GND 32 Even LVDS Clock -
8 GND 33 Even LVDS Clock +
9 GND 34 GND
10 Odd LVDS Signal - 35 Even LVDS Signal -
11 Odd LVDS Signal + 36 Even LVDS Signal +
FI-RE51S-HF (JAE)
DC power supply VDD(+12[V]) 26 Even LVDS Signal +
12 Odd LVDS Signal - 37 Not Connected *
13 Odd LVDS Signal + 38 Not Connected *
14 Odd LVDS Signal - 39 GND
15 Odd LVDS Signal + 40 SCL_I
16 GND 41 SDA_I
17 Odd LVDS Clock - 42 Not Connected *
18 Odd LVDS Clock + 43 B_INT
19 GND 44 SDA_I
20 Odd LVDS Signal - 45 LVDS_SEL
21 Odd LVDS Signal + 46 Not Connected
22 Odd LVDS Signal - 47 Not Connected
23 Odd LVDS Signal + 48 Not Connected
24 GND 49 Not Connected
25 Even LVDS Signal - 50 Not Connected
51 Not Connected
MODEL LSF320HN02-A Doc. No Page 13 / 39
SAMSUNG Confidential
Note (1) Pin number which starts from the left side.
a. Power GND pins should be connected to the LCD’s metal chassis.
b. All power input pins should be connected together.
c. All NC pins should be separated from other signal or power.
Note(2) LVDS OPTION : IF THIS PIN : LOW (GND V)/ NC → JEIDA LVDS FORMAT
OTHERWISE : HIGH (3.3V) → NORMAL NS LVDS FORMAT
Note(3) AGING ENABLE PIN / IF THIS PIN GND→ BIST MODE (ROLLING PATTERN IS OPERATED)
Fig . The diagram of connector
MODEL LSF320HN02-A Doc. No Page 14 / 39
SAMSUNG Confidential
5.2 LVDS Interface
- LVDS receiver : T-con (merged) ( 8Bit)
- Data format
LVDS pin JEIDA -DATA Normal-DATA
TxOUT/RxIN0
TxOUT/RxIN1
TxIN/RxOUT0 R2
TxIN/RxOUT1 R3
TxIN/RxOUT2 R4
TxIN/RxOUT3 R5
TxIN/RxOUT4 R6
TxIN/RxOUT6 R7
TxIN/RxOUT7 G2
TxIN/RxOUT8 G3
TxIN/RxOUT9 G4
TxIN/RxOUT12 G5
TxIN/RxOUT13 G6
TxIN/RxOUT14 G7
TxIN/RxOUT15 B2
R0
R1
R2
R3
R4
R5
G0
G1
G2
G3
G4
G5
B0
TxOUT/RxIN2
TxOUT/RxIN3
TxIN/RxOUT18 B3
TxIN/RxOUT19 B4
TxIN/RxOUT20 B5
TxIN/RxOUT21 B6
TxIN/RxOUT22 B7
TxIN/RxOUT24 HSYNC
TxIN/RxOUT25 VSYNC
TxIN/RxOUT26 DEN
TxIN/RxOUT27 R0
TxIN/RxOUT5 R1
TxIN/RxOUT10 G0
TxIN/RxOUT11 G1
TxIN/RxOUT16 B0
B1
B2
B3
B4
B5
HSYNC
VSYNC
DE
R6
R7
G6
G7
B6
TxIN/RxOUT17 B1
TxIN/RxOUT23 RESERVED
B7
RESERVED
MODEL LSF320HN02-A Doc. No Page 15 / 39
SAMSUNG Confidential
5.3 Input signals, basic display colors and the gray scale of each color. (8bit))
Note) The definition of gray :
Rn : Red gray, Gn : Green gray, Bn : Blue gray (n = Gray level)
Input signal : 0 = Low level voltage, 1 = High level voltage
MODEL LSF320HN02-A Doc. No Page 16 / 39
SAMSUNG Confidential
5.4 LVDS receiver : T-con (merged) ( 8Bit)
- Data format
LVDS pin JEIDA -DATA Normal -DATA
TxOUT/RxIN0
TxOUT/RxIN1
TxIN/RxOUT0 R2
TxIN/RxOUT1 R3
TxIN/RxOUT2 R4
TxIN/RxOUT3 R5
TxIN/RxOUT4 R6
TxIN/RxOUT6 R7
TxIN/RxOUT7 G2
TxIN/RxOUT8 G3
TxIN/RxOUT9 G4
TxIN/RxOUT12 G5
TxIN/RxOUT13 G6
TxIN/RxOUT14 G7
TxIN/RxOUT15 B2
TxIN/RxOUT18 B3
TxIN/RxOUT19 B4
TxIN/RxOUT20 B5
R0
R1
R2
R3
R4
R5
G0
G1
G2
G3
G4
G5
B0
B1
B2
B3
TxOUT/RxIN2
TxOUT/RxIN3
TxOUT/RxIN4(dithered10bi
t)
TxIN/RxOUT21 B6
TxIN/RxOUT22 B7
TxIN/RxOUT24 HSYNC
TxIN/RxOUT25 VSYNC
TxIN/RxOUT26 DEN
TxIN/RxOUT27 R0
TxIN/RxOUT5 R1
TxIN/RxOUT10 G0
TxIN/RxOUT11 G1
TxIN/RxOUT16 B0
TxIN/RxOUT17 B1
TxIN/RxOUT23 RESERVED
TxIN/RxOUT28 R0 R8
TxIN/RxOUT29 R1 R9
TxIN/RxOUT30 G0 G8
TxIN/RxOUT31 G1 G9
TxIN/RxOUT32 B0 B8
B4
B5
HSYNC
VSYNC
DE
R6
R7
G6
G7
B6
B7
RESERVED
TxIN/RxOUT33 B1 B9
TxIN/RxOUT34 RESERVED RESERVED
MODEL LSF320HN02-A Doc. No Page 17 / 39
SAMSUNG Confidential
5.5 Input signals, basic display colors and the gray scale of each color. (10bit)
Note) The definition of gray :
Rn : Red gray, Gn : Green gray, Bn : Blue gray (n = Gray level)
Input signal : 0 = Low level voltage, 1 = High level voltage
MODEL LSF320HN02-A Doc. No Page 18 / 39
SAMSUNG Confidential
6. Interface timing
6.1 The parameters of timing ( Only DE mode )
SIGNAL ITEM SYMBOLMIN. TYP. MAX. UNIT NOTE
Clock
Vsync Fh 50 67.5 75 KHz
Hsync Fv 47 60 63 Hz
Vertical Active
Disply Term
Horizontal Active
Display Term
Note) These products don’t have to receive the signal of Hsync & Vsync from the input device.
(1) Key points when testing: TTL controls the signal and the CLK at the input terminal of LVDS Tx of the system.
(2) Internal VDD = 3.3V
(3) Spread spectrum
- The limit of spread spectrum's range of SET in which the LCD module is assembled should be within ± 3 %.
Frequency
Cycle
Display Period TVD
Vertical Total TVB1092 1125 1158 lines
Display Period THD
Horizontal
Total
1/TC 130 148.5 160 MHz
--
-
TH 2090 2200 2350 clocks
1080
1920
--
-
lines
clocks
TxOUT/RxIN4(
dithered10bit)
TxIN/RxOUT28 R0 R8
TxIN/RxOUT29 R1 R9
TxIN/RxOUT30 G0 G8
TxIN/RxOUT31 G1 G9
TxIN/RxOUT32 B0 B8
TxIN/RxOUT33 B1 B9
TxIN/RxOUT34 RESERVED RESERVED
MODEL LSF320HN02-A Doc. No Page 19 / 39
SAMSUNG Confidential
6.2 Timing diagrams of interface signal (Only DE mode )
MODEL LSF320HN02-A Doc. No Page 20 / 39
SAMSUNG Confidential
6.3 Characteristics of Input data of LVDS
ITEMSYMBOLMin.Typ.Max.UNITNOTE
Differential input high
VTH--+100mV
threshold voltage
Differential input low
VTL-100--mV
threshold voltage
Input common mode voltage
Differential Input Voltage
Input data position
F
IN
=80MHz
V
CM
|VID|
t
RSRM
t
RSLM
0.21.22.0V-
100-600mV
--450ps
-450-ps
Notice The spread spectrum should be 0% when the skew is measured.
Position of a measurement is T-CON LVDS input pin
V
CM
|VID|=100mV
= 1.2V
MODEL LSF320HN02-A Doc. No Page 21 / 39
SAMSUNG Confidential
6.4 The sequence of power on and off – Sony Model attached Reference file
To prevent a latch-up phenomena or the DC operation of the LCD Module, the power on/off sequence should
be accorded with the settings described in the diagram below.
T1 : The V
T2 : The time from the point which V
rising time from 10% to 90%
DD
DD
reach to 90% of voltage to the point which the valid data is out when
the power is on.
T3: The time from the point which the valid data is out to the point which V
reach to the 90% of voltage
DD
when the power is off.
T4: the time from the point which the Vdd decrease to the point which the Vdd increase again for windows to
restart.
※ The recommended operating condition of the back light system
T5: The time which takes for B/L to be turned on after the signal is entered when the time is on.
T6 : The time which takes until the signal is out after BL is turned off
The condition of supply voltage to enter in the module from the external system should have
the same condition as the definition of V
DD
.
Apply the voltage for the lamp within the range which the LCD operates. when the back light is turned on
before the LCD is operated or when the LCD is turned off before the back light is turned off, the display may
show the abnormal screen momentarily.
While the V
is off level, please keep the level of input signals low or keep a high impedance condition.
DD
The figure of T4 should be measured after the module has been fully discharged between the periods
when the power is on and off.
The interface signal must not keep the high impedance condition when the power is on.
MODEL LSF320HN02-A Doc. No Page 22 / 39
SAMSUNG Confidential
7. Outline dimension
7.1 The adhesive size of POL
The next figure shows the size of POL on the drawing sheet attached to the panel for BLU design.
<Figure.>
The POL size of CF : 712.8 X 404.3 ± 0.5mm
The POL size of TFT: 712.8 X 404.3 ± 0.5mm
The total adhesion allowance of POL is ± 1.15㎜
7.2 The drawing sheet for the size of the OLB bonding
S-IC Input ±7KV, Output ±4KV
Output 은 data TP 에 직접 인가 후 진행
Input 은 CKV,VCOM 등에 FFC CNT 를 통하여 TEST 를 진행
Item Test condition
Vin Input
step
Signal Input
step
Surge combination (High impedance)
Pass Condition: 5kV under
Surge combination (High impedance)
Pass Condition: 120V under
1pallet
3
2
[ Criteria on evaluation]
There should be no change of the product, which may affect to the practical display functions, when the
display quality test is executed under the normal operation setting.
* HTOL/ LTOL : The operating cycle on the high and low temperature
* THB : Temperature humidity slant
* HTS/LTS : The storage at the high and low temperature
* WHTS : The storage in the high temperature with the high humidity
MODEL LSF320HN02-A Doc. No Page 24 / 39
9. General precautions
SAMSUNG Confidential
9.1 Handling
(a) When the panel kit and BLU kit are assembled, the panel kit and BLU kit should be attached to the
set system firmly by combining each mounted holes. Be careful not to give the mechanical stress.
(b) Be careful not to give any extra mechanical stress to the panel when designing the set, and BLU kit.
(c) Be cautious not to give any strong mechanical shock and / or any forces to the panel kit.
Applying the any forces to the panel may cause the abnormal operation or the damage to the panel
kit and the back light unit kit.
(d) Refrain from applying any forces to the source PBA and the drive IC in the process of the handling
or installing to the set. If any forces are applied to the products, it may cause damage or a
malfunction in the panel kit.
(e) Refrain from applying any forces which cause a constant shock to the back side of panel kit, the set
design and BLU kit. If any forces are applied to the products, it may cause an abnormal display, a
functional failure and etc.
(f) Note that polarizer could be damaged easily.
Do not press or scratch the bare surface with the material which is harder than a HB pencil lead.
(g) Wipe off water droplets or oil immediately. If you leave the droplets for a long time on the product, a
staining or the discoloration may occur.
(h) If the surface of the polarizer is dirty, clean it using the absorbent cotton or the soft cloth.
(i) Desirable cleaners are water or IPA (Isopropyl Alcohol).
Do not use Kenton type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride.
These might cause the permanent damage to the polarizer due to chemical reaction.
(j) If the liquid crystal material leaks from the panel, this should be kept away from the eyes or mouth.
If this contacts to hands, legs, or clothes, you must washed it away with soap thoroughly and see a
doctor for the medical examination.
(k) Protect the panel kit and BLU Kit out of the static electricity. Otherwise the circuit IC could be
damaged.
- Reference : Process control standard of SDC
No. Item Control standard
1 Ionizer All Equipment should be controlled under 150V.(Typ. 100V)
2 Carrying Roller Carrying Roller should be controlled under 200V.
Equipment Ground
All Equipment Ground Should be less than 1ohm.
3
Resistance
MODEL LSF320HN02-A Doc. No Page 25 / 39
SAMSUNG Confidential
(l) Remove the stains with finger-stalls wearing soft gloves in order to keep the display clean in the
process of the incoming inspection and the assembly process.
(m) Do not pull or fold the source drive IC which connects to the source PBA and the panel or the gate
drive IC.
(n) Do not pull, fold or bend the source drive IC and the gate drive IC in any processes.
If not, the source drive IC could be bent one time in the process of assembling the panel Kit and the
BLU Kit.
(o) Do not adjust the variable resistor located on the panel kit and BLU kit except when adjusting the
flicker.
(p) Do not touch the pins of the interface connector directly with bare hands.
(q) Be cautious not to be peeled off the protection film.
- Make sure to peel off slowly
(It is recommended to peel it off at the speed of more than 8sec.
constantly.)
- The peeling direction is shown at the Fig
- Instruct the ground worker to work with the adequate methods
such as the antistatic wrist band.
- Maker sure to be grounded the source PBA while peeling of the
protection film.
- Ionized air should be blown over during the peeling
- The protection film should not t be contacted to the source drive
IC.
- If the adhesive stains remain on the polarizer after the
protection film is peeled off, please move stains with isopropyl-
alcohol liquid.
(r) The protection film for the polarizer on the panel kit should be slowly peeled off just before using so
that the electrostatic charge can be minimized.
(s) The panel kit and BLU kit have high frequency circuits. The sufficient suppression to the EMI should
be done by the set manufacturers.
(t) The set of which the panel is assembled shall not be twisted. If the product is twisted, it may cause
the damage on the product.
(u) Surface Temp. of IC should be controlled less than 100℃, operating over the Temp. can cause the
damage or decrease of lifetime.
MODEL LSF320HN02-A Doc. No Page 26 / 39
9.2 Storage
r
The storage condition for packing
ITEM Unit Min. Max.
SAMSUNG Confidential
Storage
Temperature
Storage
Humidity
Storage life
Storage
Condition
ITEM
Storage
Temperature
(℃) 5 40
(%RH) 35 75
12 months
Based on shipping date at SDC site
(1) Design the warehouse to be ventilated efficiently with equipping the roof, the
ventilation system, and the temp. controller.
(2) Don't load the product on the floor and store the product with loaded on the pallet
placed far away from the wall.
(3) Avoid exposing the product to the direct light, moisture, and water and prevent the
product from being condensed.
(4) Don't store the product at the container located outside where it rains and the
direct light shines.
(5) Prevent the product from being exposed to the noxious gas such as the acid gas o
alkali gas which may damage the electric device.
(6) Don't store the product at the location surrounded by dangerous factors, which can
deteriorate the quality of product.
9.3 Operation
(a) Do not connect or disconnect the FFC cable during the "Power On" condition.
(b) Power supply should be always turned on and off by the "Power on/off sequence"
(c) The module has high frequency circuits. The sufficient suppression to the electromagnetic interference
should be done by the system manufacturers. The grounding and shielding methods is important to
minimize the interference.
(d) The cables between TV SET connector and Control PBA interface cable should be connected directly
to have a minimized length. A longer cable between TV SET connector and Control PBA interface
cable maybe operate abnormal display
(e) Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize
the characteristic of the initial TFT.
(f) Response time depends on the temperature.( In Lower temperature, it becomes longer)
MODEL LSF320HN02-A Doc. No Page 27 / 39
SAMSUNG Confidential
9.4 Operation condition guide
(a) The LCD product shall be operated under normal conditions.
(b) If the product will be used under extreme conditions such as under the high temperature, humidity,
display patterns or the operation time etc.., it is strongly recommended to contact SDC for the
advice about the application of engineering . Otherwise, its reliability and the function may not be
guaranteed. Extreme conditions are commonly found at airports, transit stations, banks, stock
markets, and controlling systems.
9.5 Others
(a) The ultra-violet ray filter is necessary for the outdoor operation.
(b) Avoid the condensation of water which may result in the improper operation of product or the
disconnection of electrode.
(c) Do not exceed the limit on the absolute maximum rating. (For example, the supply voltage
variation, the input voltage variation, the variation in content of parts and environmental
temperature, and so on) If not, panel may be damaged.
(d) If the module keeps displaying the same pattern for a long period of time, the image may be
remained to the screen. To avoid the image sticking, it is recommended to use a screen saver.
(e) This Panel has its circuitry of PCB's on the rear side, so it should be handled carefully in order for a
force not to be applied.
(f) Please contact the SDC in advance when the same pattern is displayed for a long time
MODEL LSF320HN02-A Doc. No Page 28 / 39
SAMSUNG Confidential
10. Special precautions
10.1 Lists to be cautious when executing the design process
No. Component Expected cause
Upholding part for
1
2
3
4
5 Drive IC
6 Drive IC
7
panel
The shape of the
upholding part for
panel
The edge of
upholding part for
panel
Upholding part for
panel
IC
component
Prevent the panel from breaking by assigning gaps between the panel and the upholding part for panel on the drawing
for the upholding part for panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
Design the upholding part for panel to fit to the panel appropriately when designing the BLU since the shape of the
upholding part for panel may damage the panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
Design the edge of panel to have a sufficient space with the upholding part for panel when designing the BLU since the
edge of the upholding part for panel may damage the panel when assembling the panel and BLU.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
Place the upholding part for the panel in order for the shape of mold, which contacts with the panel not to interfere with
the area of panel.
Refer to the (a), (b), (c) of 3-1 for the design of BLU.
Design the BLU in order for the COF not to contain the lead crack resulted from the tensioned COF created when the
product is twisted if the space between the D-IC COF and the middle mold isn't sufficient.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
Design the BLU in order for the product not to contain the lead crack resulted from the tensioned COF caused under the
condition, which the product is twisted by fixing the source PCB.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
1) The temperature of each part of product suggested by our company and the second vendor shall meet the standard
of temperature, which is recommended not to be exceeded by our company when the product is affected under the
various temperature ranges.
Apply over 1mm long separation distance stated in the safety standard between the electric part and each conductor.
(Apply the rated separation distance when insulating.)
8 Thermal pad
9 POL
10 PBA
11 Circuit
The height of
12
component
Between the FFC
13
and the C-PBA
14 Panel
15 Aging
The attachment of
16
17 Drive IC
18
19 S-PBA
gasket
The prohibited
bandwidth
Apply the thermal pad in a designated size to the product as a measure to lower the temperature of heat in order for
each part to use the rated temperature.
The surrounding area of the POL shall be treated with an electrification treatment since the external ESD may cause a
phenomenon, which the POL is coming off.
In addition, the GND portion of source PBA shall be grounded.
The GND portion of each PBA shall be contacted with the GND portion of BLU.
Refer to the (a) and (b) of 3-3 for the design of BLU.
The standardized approval from the client is required since the EMI is executed by a client.
Our company can only measure the reference since the client measures the BLU.
Design the BLU with considering the maximum height of parts, which our company suggests.
Design the instrument with considering the length between the FFC and the control PBA.
(The marginal minimum length of 5mm or 8mm is required.)
The surface temperature of panel shall be maintained within 0℃ and 45℃ when the external ambient temperature is at
25℃. (Design the BLU with considering the increase of the temperature in the panel by the LED, CCFL, and etc.)
Recommend to age for over 1 hour at least in the state, which the product is driving initially to stabilize the characteristic
of the initial TFT.
The additional confirmation by our company is required If the attachment of gasket to the S-PBA of our company is
required.(To fix the S-PBA or the EMI)
Design the top chassis and the driver IC to be contacted by placing the shape of emboss inside the top chassis as a
measure to prevent the driver IC from heating. The size of emboss shall be designed in larger size than the size of IC
inside the film of the driver IC.
Refer to the (a), (b), (c),(d),(e),(f), and (g)of 3-2 for the design of BLU.
Design the BLU in order for the BLU not to interfere with the area, where the control PBA and the source PBA are
located densely according to the drawing for the BLU from our company.
The material, which contacts with the bottom side of S-PBA which has a pattern shall be non-conducting material or
shall be insulated.
MODEL LSF320HN02-A Doc. No Page 29 / 39
SAMSUNG Confidential
11. Example
. The length between the FFC and the C-PBA
. The grounding of PCB
MODEL LSF320HN02-A Doc. No Page 30 / 39
SAMSUNG Confidential
Appendix2
Recommendation for the BLU Design
The Information described in this specification is for the first draft and can be changed without prior notice
Samsung Display Co., LTD
MODEL LSF320HN02-A Doc. No Page 31 / 39
1. The schematic of panel
SAMSUNG Confidential
Item Symbol Remark
Protector Film ① Removable
Polaroid Film ②
Color Filter Glass ③
TFT Glass ④
Source IC ⑤
Gate IC ⑥
Source PBA ⑦
FFC ⑧
MODEL LSF320HN02-A Doc. No Page 32 / 39
SAMSUNG Confidential
2. The guide for the mechanical design
2.1 The panel guide
(a) When the panel guiding part is made of plastic resin, the gap between the panel and the guiding
structure should be considered at the design process. The shrinkage of the plastic resin under the
temperatures change can cause the light leakage. The gap should be determined to cover the temperature
change from the guarantee condition and the BLU structure. SDC recommends the total gap between the
panel and the guide structure as below, but the suggested dimension does not guarantee the quality of the
products.
(b) It is recommended to follow the dimension and the shape of the guiding structure illustrated as below
since the distortion of the panel can cause the light leakage.
Chamfer
Over 20mm
Round
(c) When the panel guide is designed to be located at the corner of the BLU, the edge point of the panel
shall not be in contact with the panel guide structures to prevent the crack of the panel caused by the burr
at the edge of the glass. The distance larger than 2.5mm as shown in the picture is recommended.
(※ Suggested dimension does not guarantee the quality of the products.)
Over 2.5mm
MODEL LSF320HN02-A Doc. No Page 33 / 39
SAMSUNG Confidential
(d) It is recommended to keep the distance between the panel guides and other ribs over 1mm. If the ribs
are placed at the same line with the panel guide, panel broken can be happen when the operator makes
the mistake by placing the panel on the top of the ribs.
(※ Suggested dimension does not guarantee the quality of the products.)
Panel Guide
Over 1.0mm
(e) The gap between the panel guide and the front cover (or front chassis) should be zero in z-direction. If
there is gap, the panel is easily stuck into the gap and can be broken by external forces.
Zero Gap
Panel Guide
2.2 The COF and the Drive IC
(a) It is recommended to secure sufficient gap between the COF and the other parts, since the lack of gap
can cause the damage on the COF such as the lead crack, under the vibration and twist condition.
(※ Over 3.0mm for moving space is recommended, but the suggested dimension does not guarantee the
quality of the products.)
COF moving space
MODEL LSF320HN02-A Doc. No Page 34 / 39
SAMSUNG Confidential
(b) The pattern of COF can be damaged at the sharp edge of the press part and the burr of mold part
under the vibration condition. Therefore, it is recommended to avoid placing the gate position and parting
line of the injection mold and sharp structure of metal parts around the COF.
(c) The temperature of the surface of Drive-IC should be less than 125℃.
(d) Sufficient space for the COF and the Drive-IC should be secured to prevent the damage on the Drive-
IC from external forces by adding the ribs around COF. And it is also important to reduce the gap between
the ribs and the front cover as small as possible
Front Cover
Ribs
Ribs
(e) It is recommended to make ribs for protecting Drive-IC as close as possible from the COF, otherwise
forces from outside can deform the front cover and damage to the D-IC.
External Forces
MODEL LSF320HN02-A Doc. No Page 35 / 39
SAMSUNG Confidential
(f) When metal parts are assembled next to the Drive-IC, the metal part should be insulated to avoid the
damage on Drive-IC from electrostatic discharge.
Drive-IC
Insulation
Chassis (Metal)
(g) If the length of COF is designed to be short, the lead crack can be occurred by applying the tension on
the COF due to the drop, vibration and twist of the product.
(h) It is recommended that the source PCB should be easily moved in the direction which is parallel to the
longer side of the panel, in order for the tension not to be applied to the COF under vibrating condition,
such as transportation of the product.
MODEL LSF320HN02-A Doc. No Page 36 / 39
SAMSUNG Confidential
(I) It is suggested to make the holding structures of source PCB at the positions which is provided by SDC.
They are marked at the 2D drawing and named as ‘PCB guide area’.
SR Open
3.3 The control PBA and the Source PBA
(a) The gap between the circuit parts of the source PBA (or control PBA) and other parts should be
considered to avoid damage on electrical parts by the static electrostatic discharge, short and external
forces. If the shielding part is made of metal and if there is not enough distance from circuit parts, adding
insulation is recommended. SDC will provide maximum height of circuit parts with 2D and 3D drawing,
each customer can decide the distance under consideration of the material, thickness and other
characteristics.
Forbidden Area
(PCB Guide Area)
24
Circuit Component’s max. height : X.XX mm 3D Drawing
2D Drawing
MODEL LSF320HN02-A Doc. No Page 37 / 39
SAMSUNG Confidential
3. 4 The 4-Corner and the cloudy light leakage
(a) SDC recommends to design in a way that the heat from light source should be dissipated effectively.
For example, it is recommended to make the contact area between the heat sink and the bottom chassis
to be maximized. The sharp change of temperature or the large temperature gradient in the surface of
panel can cause the light leakage.
Contact Design
Aluminum Bar
Bottom Chassis (Metal)
(b) The distortion of the panel by the lack of the stiffness of BLU can cause the light leakage and therefore
it is recommended to design strong structure against distortion, such as place the strong beads at the
corner of BLU to control the flatness of the panel.
Bead or Forming
MODEL LSF320HN02-A Doc. No Page 38 / 39
SAMSUNG Confidential
3.5 Others
(d) Sharp or the round shape near the panel should be changed to flat shape, such as screw point, gate
point of the injection mold etc. Since the panel can be damaged by the concentrated force of the convex
point when there is external force.
(b) It is recommended to design the temperature of the active area below 50℃ at room temperature for the
protection from abnormalities in the screen due to the deterioration of the liquid crystal. In addition, each
Risk Point
customer needs to consider all the guarantee conditions connected with temperature for this problem not to
happen.
MODEL LSF320HN02-A Doc. No Page 39 / 39
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