Samsung KM41V4000DLT-6, KM41V4000DLJ-7, KM41V4000DLJ-6, KM41V4000DJ-7, KM41V4000DJ-6 Datasheet

KM41C4000D, KM41V4000D CMOS DRAM

This is a family of 4,194,304 x 1bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory cells
within the same row. Power supply voltage (+5V or +3.3V), access time (-5, -6 or -7), power consumption(Normal or Low power), and
package type (SOJ or TSOP-II) are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and
Hidden refresh capabilities. Furthermore, self-refresh operation is available in Low power version.
This 4Mx1 Fast Page Mode DRAM family is fabricated using Samsung′s advanced CMOS process to realize high band-width, low power
consumption and high reliability. It may be used as main memory for main frames and mini computers, personal computer and high per­formance microprocessor systems.

• Part Identification

- KM41C4000D/D-L(5V, 1K Ref.)

- KM41V4000D/D-L(3.3V, 1K Ref.)

• Fast Page Mode operation

• CAS-before-RAS refresh capability

• RAS-only and Hidden refresh capability

• Self-refresh capability (3.3V, L-ver only)

• Fast parallel test mode capability

• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs

• Common I/O using early write

• JEDEC Standard pinout

• Available in 26(20)-pin SOJ 300mil and TSOP(II)
300mil packages

• +5V±10% power supply(5V product)

• +3.3V±0.3V power supply(3.3V product)

Control
Clocks

VBB Generator

Refresh Timer

Refresh Control

Refresh Counter

Row Address Buffer

Col. Address Buffer

Row Decoder

Column Decoder

RAS
CAS

W

Vcc
Vss

Memory Array

4,194,304 x1

Cells

SAMSUNG ELECTRONICS CO., LTD. reserves the right to
change products and specifications without notice.

4M x 1Bit CMOS Dynamic RAM with Fast Page Mode

DESCRIPTION

FEATURES

FUNCTIONAL BLOCK DIAGRAM

• Refresh Cycles
Part

NO.

Refresh

cycle

Refresh Period

Normal L-ver

KM41C4000D

1K 16ms 128ms

KM41V4000D

• Performance Range

Speed

tRAC tCAC tRC tPC

Remark

-5 50ns 15ns 90ns 35ns 5V only

-6 60ns 15ns 110ns 40ns 5V/3.3V

-7 70ns 20ns 130ns 45ns 5V/3.3V

• Active Power Dissipation

Speed 3.3V 5V

-5 - 470

-6 220 415

-7 200 360

Unit : mW

Sense Amps & I/O

Data out

Buffer

Data in

Buffer

Q

A0~A9

D

KM41C4000D, KM41V4000D CMOS DRAM

D

W

RAS

N.C
A10

A0
A1
A2
A3

VCC

VSS
Q
CAS
N.C
A9

A8
A7
A6
A5
A4

1
2
3
4
5

6
7
8
9
10

20
19
18
17
16

15
14
13
12
11

PIN CONFIGURATION (Top Views)

Pin Name Pin function

A0 - A10 Address Inputs

D Data In
Q Data out

VSS Ground
RAS Row Address Strobe
CAS Column Address Strobe

W Read/Write Input

N.C No Connection

VCC

Power(+5V)
Power(+3.3V)

D

W

RAS

N.C

A10

A0
A1
A2
A3

VCC

VSS
Q
CAS
N.C
A9

A8
A7
A6
A5
A4

1
2
3
4
5

6
7
8
9
10

20
19
18
17
16

15
14
13
12
11

( SOJ )

( TSOP-II )

•KM41C/V4000DJ

•KM41C/V4000DT

KM41C4000D, KM41V4000D CMOS DRAM

ABSOLUTE MAXIMUM RATINGS

* Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to

the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.

Parameter Symbol

Rating

Units

3.3V 5V

Voltage on any pin relative to VSS VIN,VOUT -0.5 to +4.6 -1 to +7.0 V
Voltage on VCC supply relative to VSS VCC -0.5 to +4.6 -1 to +7.0 V
Storage Temperature Tstg -55 to +150 -55 to +150 °C
Power Dissipation PD 600 600 mW
Short Circuit Output Current IOS 50 50 mA

RECOMMENDED OPERATING CONDITIONS (Voltage referenced to Vss, TA= 0 to 70°C)

*1 : VCC +1.3V/15ns(3.3V), VCC +2.0V/20ns(5V), Pulse width is measured at VCC
*2 : - 1.3V/15ns(3.3V), - 2.0V/20ns(5V), Pulse width is measured at VSS

Parameter Symbol

3.3V 5V
Units

Min Typ Max Min Typ Max

Supply Voltage VCC 3.0 3.3 3.6 4.5 5.0 5.5 V
Ground VSS 0 0 0 0 0 0 V
Input High Voltage VIH 2.0 -

VCC+0.3

*1

2.4 -

VCC+1.0

*1

V

Input Low Voltage VIL

-0.3

*2

- 0.8

-0.1

*2

- 0.8 V

DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted.)

Parameter Symbol Min Max Units

3.3V

Input Leakage Current (Any input 0≤VIN≤VCC+0.3V,
all other input pins not under test=0 Volt)

II(L) -5 5 uA

Output Leakage Current
(Data out is disabled, 0V≤VOUT≤VCC)

IO(L) -5 5 uA

Output High Voltage Level(IOH=-2mA) VOH 2.4 - V
Output Low Voltage Level(IOL=2mA) VOL - 0.4 V

5V

Input Leakage Current (Any input 0≤VIN≤VCC+0.5V,
all other input pins not under test=0 Volt)

II(L) -5 5 uA

Output Leakage Current
(Data out is disabled, 0V≤VOUT≤VCC)

IO(L) -5 5 uA

Output High Voltage Level(IOH=-5mA) VOH 2.4 - V
Output Low Voltage Level(IOL=4.2mA) VOL - 0.4 V

KM41C4000D, KM41V4000D CMOS DRAM

*Note :

ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.
ICC is specified as an average current. In ICC1, ICC3 ICC6 and ICC7, address can be changed maximum once while RAS=VIL. In
ICC4, address can be changed maximum once within one fast page mode cycle time, tPC.

DC AND OPERATING CHARACTERISTICS (Recommend operating conditions unless otherwise noted.)

ICC1* : Operating Current (RAS and CAS cycling @tRC=min.)
ICC2 : Standby Current (RAS=CAS=W=VIH)
ICC3* : RAS-only Refresh Current (CAS=VIH, RAS, Address cycling @tRC=min.)
ICC4* : Fast Page Mode Current (RAS=VIL, CAS, Address cycling @tPC=min.)
ICC5 : Standby Current (RAS=CAS=W=VCC-0.2V)
ICC6* : CAS-Before-RAS Refresh Current (RAS and CAS cycling @tRC=min)
ICC7 : Battery back-up current, Average power supply current, Battery back-up mode
Input high voltage(VIH)=VCC-0.2V, Input low voltage(V IL)=0.2V, CAS=0.2V,
DQ=Don′t Care, TRC=125us(L-ver.), TRAS=TRASmin~300ns
ICCS : Self refresh current

RAS=CAS=VIL, W=OE =A0 ~ A10=D=VCC-0.2V or 0.2V

Symbol Power Speed

Max

Units

KM41V4000D KM41C4000D

ICC1 Don′t Care

-5

-6

-7

­60
55

85
75
65

mA
mA
mA

ICC2 Don′t Care Don′t Care 1 2 mA

ICC3 Don′t Care

-5

-6

-7

­60
55

85
75
65

mA
mA
mA

ICC4 Don′t Care

-5

-6

-7

­45
40

65
55
45

mA
mA
mA

ICC5

Normal

L

Don′t Care

0.5

100

1

200

mA

uA

ICC6 Don′t Care

-5

-6

-7

­60
55

85
75
65

mA
mA
mA

ICC7 L Don′t Care 200 300 uA

ICCS L Don′t Care 150 - uA

KM41C4000D, KM41V4000D CMOS DRAM

CAPACITANCE (TA=25°C, VCC=5V or 3.3V, f=1MHz)

Parameter Symbol Min Max Units

Input capacitance [D] CIN1 - 5 pF
Input capacitance [A0 ~ A10] CIN2 - 5 pF
Input capacitance [RAS, CAS, W] CIN3 - 7 pF
Output capacitance [Q] COUT - 7 pF

Test condition (5V device) : VCC=5.0V±10%, Vih/Vil=2.4/0.8V, Voh/Vol=2.4/0.4V

Note) *1 : 5V only

Parameter Symbol

-5

*1

-6 7
Units Notes

Min Max Min Max Min Max

Random read or write cycle time

tRC

90 110 130 ns

Read-modify-write cycle time

tRWC

110 130 150 ns

Access time from RAS

tRAC

50 60 70 ns 3,4,10

Access time from CAS

tCAC

15 15 20 ns 3,4,5

Access time from column address

tAA

25 30 35 ns 3,10

CAS to output in Low-Z

tCLZ

0 0 0 ns 3

Output buffer turn-off delay

tOFF

0 12 0 12 0 17 ns 6

Transition time (rise and fall)

tT

3 50 3 50 3 50 ns 2

RAS precharge time

tRP

30 40 50 ns

RAS pulse width

tRAS

50 10K 60 10K 70 10K ns

RAS hold time

tRSH

15 15 20 ns

CAS hold time

tCSH

50 60 70 ns

CAS pulse width

tCAS

15 10K 15 10K 20 10K ns

RAS to CAS delay time

tRCD

20 35 20 45 20 50 ns 4

RAS to column address delay time

tRAD

15 25 15 30 15 35 ns 10

CAS to RAS precharge time

tCRP

5 5 5 ns

Row address set-up time

tASR

0 0 0 ns

Row address hold time

tRAH

10 10 10 ns

Column address set-up time

tASC

0 0 0 ns

Column address hold time

tCAH

10 10 15 ns

Column address to RAS lead time

tRAL

25 30 35 ns

Read command set-up time

tRCS

0 0 0 ns

Read command hold time referenced to CAS

tRCH

0 0 0 ns 8

Read command hold time referenced to RAS

tRRH

0 0 0 ns 8

Write command hold time

tWCH

10 10 15 ns

Write command pulse width

tWP

10 10 15 ns

Write command to RAS lead time

tRWL

15 15 15 ns

Write command to CAS lead time

tCWL

13 15 15 ns

AC CHARACTERISTICS (0°C≤TA≤70°C, See note 1,2)

Test condition (3.3V device) : VCC=3.3V±0.3V, Vih/Vil=2.2/0.7V, Voh/Vol=2.0/0.8V

KM41C4000D, KM41V4000D CMOS DRAM

AC CHARACTERISTICS (0°C≤TA≤70°C, See note 2)

Note) *1 : 5V only

Parameter Symbol

-5

*1

-6 -7
Units Notes

Min Max Min Max Min Max

Data set-up time

tDS

0 0 0 ns 9

Data hold time

tDH

10 10 15 ns 9

Refresh period (Normal)

tREF

16 16 16 ms

Refresh period (L-ver)

tREF

128 128 128 ms

Write command set-up time

tWCS

0 0 0 ns 7

CAS to W delay time

tCWD

15 15 20 ns 7

RAS to W delay time

tRWD

50 60 70 ns 7

Column address to W delay time

tAWD

25 30 35 ns 7

CAS precharge to W delay time

tCPWD

30 35 40 ns 7

CAS set-up time (CAS-before-RAS refresh)

tCSR

10 10 10 ns

CAS hold time (CAS-before-RAS refresh)

tCHR

10 10 15 ns

RAS to CAS precharge time

tRPC

5 5 5 ns

CAS precharge time (C-B-R counter test cycle)

tCPT

20 20 25 ns

Access time from CAS precharge

tCPA

30 35 40 ns 3

Fast Page mode cycle time

tPC

35 40 45 ns

Fast Page read-modify-write cycle time

tPRWC

53 60 70 ns

CAS precharge time (Fast Page cycle)

tCP

10 10 10 ns

RAS pulse width (Fast Page cycle)

tRASP

50 200K 60 200K 70 200K ns

RAS hold time from CAS precharge

tRHCP

30 35 40 ns

Write command set-up time (Test mode in)

tWTS

10 10 10 ns

Write command hold time (Test mode in)

tWTH

10 10 10 ns

W to RAS precharge time (C-B-R refresh)

tWRP

10 10 10 ns

W to RAS hold time (C-B-R refresh)

tWRH

10 10 10 ns

RAS pulse width (C-B-R self refresh)

tRASS

100 100 100 us 14,15,16

RAS precharge time (C-B-R self refresh)

tRPS

90 110 130 ns 14,15,16

CAS Hold time (C-B-R self refresh)

tCHS

-50 -50 -50 ns 14,15,16