SAMSUNG K7N163601A Technical data

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K7N163601A K7N161801A
Document Title
512Kx36 & 1Mx18-Bit Pipelined NtRAM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
1.0
2.0
History
1. Initial document.
1. Add JTAG Scan Order
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Speed bin merge. From K7N1636(32/18)09A to K7N1636(32/18)01A.
2. AC parameter change. tOH(min)/tLZC(min) from 0.8 to 1.5 at -25 tOH(min)/tLZC(min) from 1.0 to 1.5 at -22 tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
1. Final spec release.
1. Release Icc on page 14. part # From To
-25 440 470
-22 400 430
-20 370 400
-16 340 350
-13 280 290
512Kx36 & 1Mx18 Pipelined NtRAM
Draft Date
March. 21. 2001 May. 10. 2001 Aug. 30. 2001
Dec. 26. 2001
May. 10 .2002
May. 22. 2002
Remark
Preliminary Preliminary Preliminary
Preliminary
Final
Final
TM
2.1
3.0
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques­tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
1. Delete 119BGA package.
2. Correct the Ball Size of 165 FBGA.
1. Delete x32 Org.
2. Delete the 225MHz speed bin
April. 04. 2003
Nov. 17, 2003
Final
Final
- 1 -
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
16Mb NtRAM(Flow Through / Pipelined) Ordering Information
Org. Part Number Mode VDD
512Kx36 & 1Mx18 Pipelined NtRAM
FT ; Access Time(ns)
Pipelined ; Cycle Time(MHz)
TM
Speed
PKG Temp
1Mx18
512Kx36
K7M161825A-QC(I)65/75 FlowThrough 3.3 6.5/7.5 ns K7N161801A-Q(F)C(I)25/20/16/13 Pipelined 3.3 250/200/167/133MHz K7N161845A-Q(F)C(I)25/20/16/13 Pipelined 2.5 250/200/167/133MHz K7M163625A-QC(I)65/75 FlowThrough 3.3 6.5/7.5 ns K7N163601A-Q(F)C(I)25/20/16/13 Pipelined 3.3 250/200/167/133MHz K7N163645A-Q(F)C(I)25/20/16/13 Pipelined 2.5 250/200/167/133MHz
Q : 100TQFP F : 165FBGA
C ; Commercial Temp.Range
I
; Industrial
Temp.Range
- 2 -
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
512Kx36 & 1Mx18 Pipelined NtRAM
TM
512Kx36 & 1Mx18-Bit Pipelined NtRAM
3.3V+0.165V/-0.165V Power Supply.
• I/O Supply Voltage 3.3V+0.165V/-0.165V for 3.3V I/O or 2.5V+0.4V/-0.125V for 2.5V I/O.
• Byte Writable Function.
Enable clock and suspend operation.
Single READ/WRITE control pin.
Self-Timed Write Cycle.
Three Chip Enable for simple depth expansion with no da ta- contention .
A interleaved burst or a linear burst mode.
Asynchronous output enable control.
• Power Down mode.
• 100-TQFP-1420A
• 165FBGA(11x15 ball aray) with body size of 13mmx15mm.
• Operating in commeical and industrial temperature range.
FAST ACCESS TIMES
PARAMETER Symbol -25 -20 -16 -13 Unit
Cycle Time tCYC 4.0 5.0 6.0 7.5 ns Clock Access Time tCD 2.6 3.2 3.5 4.2 ns Output Enable Access Time tOE 2.6 3.2 3.5 4.2 ns
TM
GENERAL DESCRIPTIONFEATURES
The K7N163601A and K7N161801A are 18,874,368-bits Syn­chronous Static SRAMs. The N tRAMTM, or No Turnaround Random Access Memory uti­lizes all the bandwidth in any combination of operating cycles. Address, data inputs, and all control signals except output enable and linear burst order are synchronized to input clock. Burst order control must be tied "High or Low". Asynchronous inputs include the sleep mode enable(ZZ). Output Enable controls the outputs at any given time. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation and provides increased timing flexibility for incoming signals. For read cycles, pipelined SRAM output data is temporarily stored by an edge triggered output register and then released to the output buffers at the next rising edge of clock. The K7N163601A and K7N161801A are implemented with SAMSUNG′s high performance CMOS technology and is avail- able in 100pin TQFP and 165FBGA packages. Multiple power and ground pins minimize ground bounce.
LOGIC BLOCK DIAGRAM
A [0:18]or A [0:19]
CLK
CKE
CS1 CS2
CS2 ADV
WE BWx
(x=a,b,c,d or a,b)
OE ZZ
DQa0 ~ DQd7 or DQa0 ~ DQb8 DQPa ~ DQPd
LOGIC
CONTRO L
ADDRESS
REGISTER
K
CONTROL
REGISTER
LBO A 0~A1
A2~A 18 or A2~A19
WRITE
ADDRESS
REGISTER
BURST
ADDRESS
COUNTER
ADDRESS
REGISTER
CONTROL
LOGIC
WRITE
A0~A 1
36 or 18
K
K
512Kx36, 1Mx18
MEMORY
ARRAY
DATA-IN
REGISTER
DATA-IN
REGISTER
K
OUTPUT
REGISTER
BUFFER
NtRAMTM and No Turnaround Random Access Memory are trademarks of Samsung.
- 3 -
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
PIN CONFIGURATION(TOP VIEW)
A6
A7
CS 1
512Kx36 & 1Mx18 Pipelined NtRAM
CS 2
BWd
BWc
BWb
BWa
CS 2
VDD
VSS
CLKWECK EOEADV
A18
A17
A881A9
TM
NC/DQPc
DQc0 DQc1
VDDQ
VSSQ DQc2 DQc3 DQc4 DQc5
VSSQ
VDDQ DQc6 DQc7
VDD VDD VDD
VSS DQd0 DQd1
VDDQ
VSSQ DQd2 DQd3 DQd4 DQd5
VSSQ
VDDQ DQd6 DQd7
NC/ DQPd
99
98
1
100
2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
31LBO
9796959493
100 Pin TQFP
(20mm x 14mm)
K7N163601A(512Kx36)
36
35
34
33
32
92
9190898887
42
41
40
39
38
37
86
858483
46
45
44
43
82
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
49
48
47
DQPb/NC DQb7 DQb6 VDDQ VSSQ DQb5 DQb4 DQb3 DQb2 VSSQ VDDQ DQb1 DQb0 VSS VDD VDD ZZ DQa7 DQa6 VDDQ VSSQ DQa5 DQa4 DQa3 DQa2 VSSQ VDDQ DQa1 DQa0 DQPa/NC
A5
VSS
VDD
N.C.
N.C.
A10
N.C.
N.C.
A13
A12
A11
A16
A15
A14
A0
A1
A2
A3
A4
PIN NAME
SYMBOL PIN NAME TQFP PIN NO. SYMBOL PIN NAME TQFP PIN NO.
A0 - A18
ADV WE CLK CKE CS1 CS2 CS2 BWx(x=a,b,c,d) OE ZZ LBO
Note : 1. A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
Address Inputs
Address Advance/Load Read/Write Control Input Clock Clock Enable Chip Select Chip Select Chip Select Byte Write Inputs Output Enable Power Sleep Mode Burst Mode Control
32,33,34,35,36,37,44 45,46,47,48,49,50,81 82,83,84,99,100 85 88 89 87 98 97 92 93,94,95,96 86 64 31
- 4 -
V DD V SS
N.C.
DQa0~a7 DQb0~b7 DQc 0~c7 DQd0~d7 DQPa~P d or NC
V DDQ
V SSQ
Power Supply(+3.3V) Ground
No Connect
Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs
Output Power Supply (3.3V or 2.5V) Output Ground
14,15,16,41,65,66,91 17,40,67,90
38,39,42,43
52,53,56,57,58,59,62,63 68,69,72,73,74,75,78,79 2,3,6,7,8,9,12,13 18,19,22,23,24,25,28,29 51,80,1,30
4,11,20,27,54,61,70,77
5,10,21,26,55,60,71,76
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
PIN CONFIGURATION(TOP VIEW)
A6
A7
CS 1
99
N.C. N.C. N.C.
VDDQ
VSSQ
N.C.
N.C. DQb8 DQb7
VSSQ
VDDQ DQb6 DQb5
VDD VDD VDD
VSS DQb4 DQb3
VDDQ
VSSQ DQb2 DQb1 DQb0
N.C.
VSSQ
VDDQ
N.C. N.C. N.C.
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
98
100
33
32
31LBO
512Kx36 & 1Mx18 Pipelined NtRAM
CS 2
9796959493
BWb
BWa
CS 2
VDD
VSS
N.C.
N.C.
92
CLKWECK EOEADV
9190898887
86
100 Pin TQFP
(20mm x 14mm)
K7N161801A(1Mx18)
45
44
43
42
41
40
39
38
37
36
35
34
A19
858483
47
46
TM
A18
A881A9
82
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
49
48
A10 N.C. N.C. VDDQ VSSQ N.C. DQa0 DQa1 DQa2 VSSQ VDDQ DQa3 DQa4 VSS VDD VDD ZZ DQa5 DQa6 VDDQ VSSQ DQa7 DQa8 N.C. N.C. VSSQ VDDQ N.C. N.C. N.C.
A5
VSS
VDD
N.C.
N.C.
A11
N.C.
N.C.
A14
A13
A12
A17
A16
A15
A0
A1
A2
A3
A4
PIN NAME
SYMBOL PIN NAME TQFP PIN NO. SYMBOL PIN NAME TQFP PIN NO.
A 0 - A19
ADV WE CLK CKE CS1 CS2 CS2 BW x(x=a,b) OE ZZ LBO
NOTE : A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
Address Inputs
Address Advance/Load Read/Write Control Input Clock Clock Enable Chip Select Chip Select Chip Select Byte Write Inputs Output Enable Power Sleep Mode Burst Mode Control
32,33,34,35,36,37,44 45,46,47,48,49,50,80 81,82,83,84,99,100 85 88 89 87 98 97 92 93,94 86 64 31
VDD VSS
N.C.
DQa0~a8 DQb0~b8
VDDQ
VSSQ
- 5 -
Power Supply(+3.3V) Ground
No Connect
Data Inputs/Outputs Data Inputs/Outputs
Output Power Supply (3.3V or 2.5V) Output Ground
14,15,16,41,65,66,91 17,40,67,90
1,2,3,6,7,25,28,29,30, 38,39,42,43,51,52,53, 56,57,75,78,79,95,96
58,59,62,63,68,69,72,73,74 8,9,12,13,18,19,22,23,24
4,11,20,27,54,61,70,77
5,10,21,26,55,60,71,76
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
165-PIN FBGA PACKAGE CONFIGURATIONS(TOP VIEW)
K7N163601A(512Kx36)
1 2 3 4 5 6 7 8 9 10 11
512Kx36 & 1Mx18 Pipelined NtRAM
TM
A NC A CS1 BW c BWb
CS2
CKE ADV A A NC
B NC A CS2 BWd BWa CLK WE OE A A NC C DQPc NC V DDQ VSS VSS VSS VSS VSS VDDQ NC DQPb D DQc DQc V DDQ VDD VSS VSS VSS VDD VDDQ DQb DQb E DQc DQc V DDQ VDD VSS VSS VSS VDD VDDQ DQb DQb F DQc DQc V DDQ VDD VSS VSS VSS VDD VDDQ DQb DQb
G DQc DQc V DDQ VDD VSS VSS VSS VDD VDDQ DQb DQb
H NC VDD NC V DD VSS VSS VSS VDD NC NC ZZ
J DQd DQd V DDQ VDD VSS VSS VSS VDD VDDQ DQa DQa K DQd DQd V DDQ VDD VSS VSS VSS VDD VDDQ DQa DQa L DQd DQd V DDQ VDD VSS VSS VSS VDD VDDQ DQa DQa
M DQd DQd V DDQ VDD VSS VSS VSS VDD VDDQ DQa DQa
N DQPd NC V DDQ VSS NC NC NC VSS VDDQ NC DQPa P NC NC A A TDI A1* TDO A A A NC R LBO NC A A TMS A0* TCK A A A A
Note : * A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
PIN NAME
SYMBOL PIN NAME SYMBOL PIN NAME
A
A0,A1 ADV WE CLK CKE CS1 CS2 CS2 BWx (x=a,b,c,d)
OE ZZ LBO
TCK TMS TDI TDO
Address Inputs
Burst Address Inputs Address Advance/Load Read/Write Control Input Clock Clock Enable Chip Select Chip Select Chip Select Byte Write Inputs
Output Enable Power Sleep Mode Burst Mode Control
JTAG Test Clock JTAG Test Mode Select JTAG Test Data Input JTAG Test Data Output
VDD VSS
N.C.
DQa DQb DQc DQd DQPa~Pd
VDDQ
- 6 -
Power Supply Ground
No Connect
Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs
Output Power Supply
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
165-PIN FBGA PACKAGE CONFIGURATIONS(TOP VIEW)
K7N161801A(1Mx18)
1 2 3 4 5 6 7 8 9 10 11
512Kx36 & 1Mx18 Pipelined NtRAM
TM
A NC A CS1 BWb NC
CS2
CKE ADV A A A
B NC A CS2 NC BWa CLK WE OE A A NC C NC NC V DDQ VSS VSS VSS VSS VSS VDDQ NC DQPa D NC DQb V DDQ VDD VSS VSS VSS VDD VDDQ NC DQa E NC DQb V DDQ VDD VSS VSS VSS VDD VDDQ NC DQa F NC DQb V DDQ VDD VSS VSS VSS VDD VDDQ NC DQa
G NC DQb V DDQ VDD VSS VSS VSS VDD VDDQ NC DQa
H NC VDD NC V DD VSS VSS VSS VDD NC NC ZZ
J DQb NC V DDQ VDD VSS VSS VSS VDD VDDQ DQa NC K DQb NC V DDQ VDD VSS VSS VSS VDD VDDQ DQa NC L DQb NC V DDQ VDD VSS VSS VSS VDD VDDQ DQa NC
M DQb NC V DDQ VDD VSS VSS VSS VDD VDDQ DQa NC
N DQPb NC V DDQ VSS NC NC NC VSS VDDQ NC NC P NC NC A A TDI A1* TDO A A A NC R LBO NC A A TMS A0* TCK A A A A
Note : * A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.
PIN NAME
SYMBOL PIN NAME SYMBOL PIN NAME
A
A0,A1 ADV WE CLK CKE CS1 CS2 CS2 BWx (x=a,b)
OE ZZ LBO
TCK TMS TDI TDO
Address Inputs
Burst Address Inputs Address Advance/Load Read/Write Control Input Clock Clock Enable Chip Select Chip Select Chip Select Byte Write Inputs
Output Enable Power Sleep Mode Burst Mode Control
JTAG Test Clock JTAG Test Mode Select JTAG Test Data Input JTAG Test Data Output
VDD VSS
N.C.
DQa DQb DQPa, Pb
VDDQ
- 7 -
Power Supply Ground
No Connect
Data Inputs/Outputs Data Inputs/Outputs Data Inputs/Outputs
Output Power Supply
Nov. 2003
Rev 3.0
K7N163601A K7N161801A
512Kx36 & 1Mx18 Pipelined NtRAM
TM
FUNCTION DESCRIPTION
The K7N163601A and K7N161801A are NtRAMTM designed to sustain 100% bus bandwidth by eliminating turnaround cycle when there is transition from Read to Write, or vice versa. All inputs (with the exception of OE, LBO and ZZ) are synchronized to rising clock edges.
All read, write and deselect cycles are initiated by the ADV input. Subsequent burst addresses can be internally generated by the burst advance pin (ADV). ADV should be driven to Low once the device has been deselected in order to load a new address for next operation.
Clock Enable(CKE) pin allows the operation of the chip to be suspended as long as necessary. When CKE is high, all synchronous inputs are ignored and the internal device registers will hold their previous values.
NtRAMTM latches external address and initiates a cycle, when CKE, ADV are driven to low and all three chip enables(CS1, CS2, CS2) are active . Output Enable(OE ) can be used to disable the output at any given time.
Read operation is initiated when at the rising edge of the clock, the address presented to the address inputs are latched in the address register, CKE is driven low, all three chip enables(CS 1, CS2 , CS2) are active, the write enable input signals WE are driven high, and ADV driven low.The internal array is read between the first rising edge and the second rising edge of the clock and the data is latched in the output register. At the second clock edge the data is driven out of the SRAM. Also during read operation OE must be driven low for the device to drive out the requested data.
Write operation occurs when WE is driven low at the rising edge of the clock. BW[d:a] can be used for byte write operation. The pipe­lined NtRAMTM uses a late-late write cycle to utilize 100% of the bandwidth. At the first rising edge of the clock, WE and address are registered, and the data associated with that address is required two cycle later.
Subsequent addresses are generated by ADV High for the burst access as shown below. The starting point of the burst seguence is provided by the external address. The burst address counter wraps around to its initial state upon completion. The burst sequence is determined by the state of the LBO pin. When this pin is low, linear burst sequence is selected. And when this pin is high, Interleaved burst sequence is selected.
During normal operation, ZZ must be driven low. When ZZ is driven high, the SRAM will enter a Power Sleep Mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM normally operates after 2 cycles of wake up time.
BURST SEQUENCE TABLE (Interleaved Burst, LBO=High)
LBO PIN HIGH
First Address
Fourth Address
Case 1 Case 2 Case 3 Case 4
A1 A0 A1 A0 A1 A0 A1 A0
0 0 1 1
0 1 0 1
0 0 1 1
1 0 1 0
1 1 0 0
0 1 0 1
1 1 0 0
1 0 1 0
BQ TABLE (Linear Burst, LBO=Low)
LBO PIN LOW
First Address
Fourth Address
Note : 1. LBO pin must be tied to High or Low, and Floating State must not be allowed.
Case 1 Case 2 Case 3 Case 4
A1 A0 A1 A0 A1 A0 A1 A0
0 0 1 1
0 1 0 1
0 1 1 0
1 0 1 0
1 1 0 0
0 1 0 1
1 0 0 1
1 0 1 0
- 8 -
Nov. 2003
Rev 3.0
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