1. Speed bin merge.
From K7N1636(32/18)09A to K7N1636(32/18)01A.
2. AC parameter change.
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
1. Final spec release.
1. Release Icc on page 14.
part #FromTo
-25440470
-22 400430
-20 370400
-16340350
-13280290
512Kx36 & 1Mx18 Pipelined NtRAM
TM
Draft Date
March. 21. 2001
May. 10. 2001
Aug. 30. 2001
Dec. 26. 2001
May. 10 .2002
May. 22. 2002
Remark
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
TM
2.1
3.0
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
1. Delete 119BGA package.
2. Correct the Ball Size of 165 FBGA.
1. Delete x32 Org.
2. Delete the 225MHz speed bin
April. 04. 2003
Nov. 17, 2003
Final
Final
- 1 -
Nov. 2003
Rev 3.0
K7N163601A
K7N161801A
16Mb NtRAM(Flow Through / Pipelined) Ordering Information
The K7N163601A and K7N161801A are 18,874,368-bits Synchronous Static SRAMs.
The N tRAMTM, or No Turnaround Random Access Memory utilizes all the bandwidth in any combination of operating cycles.
Address, data inputs, and all control signals except output
enable and linear burst order are synchronized to input clock.
Burst order control must be tied "High or Low".
Asynchronous inputs include the sleep mode enable(ZZ).
Output Enable controls the outputs at any given time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-chip
write pulse generation
and provides increased timing flexibility for incoming signals.
For read cycles, pipelined SRAM output data is temporarily
stored by an edge triggered output register and then released
to the output buffers at the next rising edge of clock.
The K7N163601A and K7N161801A are implemented with
SAMSUNG′s high performance CMOS technology and is avail-
able in 100pin TQFP and 165FBGA packages. Multiple power
and ground pins minimize ground bounce.
LOGIC BLOCK DIAGRAM
A [0:18]or
A [0:19]
CLK
CKE
CS1
CS2
CS2
ADV
WE
BWx
(x=a,b,c,d or a,b)
OE
ZZ
DQa0 ~ DQd7 orDQa0 ~ DQb8
DQPa ~ DQPd
LOGIC
CONTRO L
ADDRESS
REGISTER
K
CONTROL
REGISTER
LBO
A 0~A1
A2~A 18 orA2~A19
WRITE
ADDRESS
REGISTER
BURST
ADDRESS
COUNTER
ADDRESS
REGISTER
CONTROL
LOGIC
WRITE
A′0~A ′1
36 or 18
K
K
512Kx36, 1Mx18
MEMORY
ARRAY
DATA-IN
REGISTER
DATA-IN
REGISTER
K
OUTPUT
REGISTER
BUFFER
NtRAMTM and No Turnaround Random Access Memory are trademarks of Samsung.
JTAG Test Clock
JTAG Test Mode Select
JTAG Test Data Input
JTAG Test Data Output
VDD
VSS
N.C.
DQa
DQb
DQPa, Pb
VDDQ
- 7 -
Power Supply
Ground
No Connect
Data Inputs/Outputs
Data Inputs/Outputs
Data Inputs/Outputs
Output Power Supply
Nov. 2003
Rev 3.0
K7N163601A
K7N161801A
512Kx36 & 1Mx18 Pipelined NtRAM
TM
FUNCTION DESCRIPTION
The K7N163601A and K7N161801A are NtRAMTM designed to sustain 100% bus bandwidth by eliminating turnaround cycle when
there is transition from Read to Write, or vice versa.
All inputs (with the exception of OE, LBO and ZZ) are synchronized to rising clock edges.
All read, write and deselect cycles are initiated by the ADV input. Subsequent burst addresses can be internally generated by the
burst advance pin (ADV). ADV should be driven to Low once the device has been deselected in order to load a new address for next
operation.
Clock Enable(CKE) pin allows the operation of the chip to be suspended as long as necessary. When CKE is high, all synchronous
inputs are ignored and the internal device registers will hold their previous values.
NtRAMTM latches external address and initiates a cycle, when CKE, ADV are driven to low and all three chip enables(CS1, CS2, CS2)
are active .
Output Enable(OE ) can be used to disable the output at any given time.
Read operation is initiated when at the rising edge of the clock, the address presented to the address inputs are latched in the
address register, CKE is driven low, all three chip enables(CS 1, CS2 , CS2) are active, the write enable input signals WE are driven
high, and ADV driven low.The internal array is read between the first rising edge and the second rising edge of the clock and the data
is latched in the output register. At the second clock edge the data is driven out of the SRAM. Also during read operation OE must
be driven low for the device to drive out the requested data.
Write operation occurs when WE is driven low at the rising edge of the clock. BW[d:a] can be used for byte write operation. The pipelined NtRAMTM uses a late-late write cycle to utilize 100% of the bandwidth.
At the first rising edge of the clock, WE and address are registered, and the data associated with that address is required two cycle
later.
Subsequent addresses are generated by ADV High for the burst access as shown below. The starting point of the burst seguence is
provided by the external address. The burst address counter wraps around to its initial state upon completion.
The burst sequence is determined by the state of the LBO pin. When this pin is low, linear burst sequence is selected.
And when this pin is high, Interleaved burst sequence is selected.
During normal operation, ZZ must be driven low. When ZZ is driven high, the SRAM will enter a Power Sleep Mode after 2 cycles. At
this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM normally operates after 2 cycles of wake up
time.