Samsung K6L0908C2A-TF70, K6L0908C2A-TB70, K6L0908C2A-TB55, K6L0908C2A-GP70, K6L0908C2A-GL70 Datasheet
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K6L0908C2A Family CMOS SRAM
Revision 4.0
January 1997
1
Document Title
64Kx8 bit Low Power CMOS Static RAM
Revision History
Revision No.
0.0
0.1
1.0
2.0
3.0
4.0
Remark
Design target
Preliminary
Final
Final
Final
Final
History
Initial draft
Revision
Finalize
Revision
- Add 45ns part with 30pf test load.
Revision
- Change Data Sheet format :
One data sheets for industrial and commercial product
Revision
- Change Data Sheet format
- Remove 45ns part from commercial product and 100ns part
from industrial product
- Remove low power part form TSOP package
Draft Data
Novemer 28, 1993
May 13, 1994
December 1, 1994
August 12, 1995
April 15, 1996
January 9, 1998
The attached data, sheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
K6L0908C2A Family CMOS SRAM
Revision 4.0
January 1997
2
64Kx8 bit Low Power CMOS Static RAM
GENERAL DESCRIPTION
The K6L0908C2A families are fabricated by SAMSUNG′s
advanced CMOS process technology. The families support
various operating temperature ranges and have various
package types for user flexibility of system design. The
families also support low data retention voltage for battery
back-up operation with low data retention current.
FEATURES
• Process Technology: Poly Load
• Organization: 64Kx8
• Power Supply Voltage: 4.5~5.5V
• Low Data Retention Voltage: 2V(Min)
• Three state output and TTL Compatible
• Package Type: 32-SOP-525, 32-TSOP1-0820F
PIN DESCRIPTION
Name Function
CS1, CS2 Chip Select Inputs
OE Output Enable Input
WE Write Enable Input
A0~A15 Address Inputs
I/O1~I/O8 Data Inputs/Outputs
Vcc Power
Vss Ground
N.C No Connection
PRODUCT FAMILY
Product Family Operating Temperature VCC Range Speed
Power Dissipation
PKG Type
Standby
(ISB1, Max)
Operating
(ICC2, Max)
K6L0908C2A-L
Commercial (0~70°C)
4.5 to 5.5V
55/70ns
100µA
70mA
32-SOP
32-TSOP1-F
K6L0908C2A-B 20µA
K6L0908C2A-P
Industrial (-40~85°C) 70ns
100µA
K6L0908C2A-F 50µA
FUNCTIONAL BLOCK DIAGRAM
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
A11
A9
A8
A13
WE
CS2
A15
NC
NC
A14
A12
A7
A6
A5
A4
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
VSS
I/O3
I/O2
I/O1
A0
A1
A2
A3
32-TSOP
Type1 - Forward
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
N.C
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
VSS
VCC
A15
CS2
WE
A13
A8
A9
A11
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-SOP
N.C
VCC
Precharge circuit.
Memory array
512 rows
128×8 columns
I/O Circuit
Column select
Clk gen.
Row
select
A0 A1 A2 A8 A9 A11A10
A3
A4
A5
A6
A7
A12
A14
CS1
CS2
WE
I/O1
Data
cont
Data
cont
OE
I/O8
A13
A15
Control
Logic
K6L0908C2A Family CMOS SRAM
Revision 4.0
January 1997
3
PRODUCT LIST
Commercial Temperature Products(0~70°C) Industrial Temperature Products(-40~85°C)
Part Name Function Part Name Function
K6L0908C2A-GL55
K6L0908C2A-GB55
K6L0908C2A-GL70
K6L0908C2A-GB70
K6L0908C2A-TB55
K6L0908C2A-TB70
32-SOP, 55ns, L-pwr
32-SOP, 55ns, LL-pwr
32-SOP, 70ns, L-pwr
32-SOP, 70ns, LL-pwr
32-TSOP1-F, 55ns, LL-pwr
32-TSOP1-F, 70ns, LL-pwr
K6L0908C2A-GP70
K6L0908C2A-GF70
K6L0908C2A -TF70
32-SOP, 70ns, L-pwr
32-SOP, 70ns, LL-pwr
32-TSOP1-F, 70ns, LL-pwr
FUNCTIONAL DESCRIPTION
1. X means don′t care.(Must be low or high state)
CS1 CS2 OE WE I/O Pin Mode Power
H
X
1)
X
1)
X
1)
High-Z Deselected Standby
X
1)
L
X
1)
X
1)
High-Z Deselected Standby
L H H H High-Z Output Disabled Active
L H L H Dout Read Active
L H
X
1)
L Din Write Active
ABSOLUTE MAXIMUM RATINGS
1)
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be
restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Item Symbol Ratings Unit Remark
Voltage on any pin relative to Vss VIN,VOUT -0.5 to 7.0 V Voltage on Vcc supply relative to Vss VCC -0.5 to 7.0 V Power Dissipation PD 1.0 W Storage temperature TSTG -65 to 150 °C -
Operating Temperature TA
0 to 70 °C K6L0908C2A-C
-40 to 85 °C K6L0908C2A-I
Soldering temperature and time TSOLDER 260°C, 10sec(Lead Only) - -
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