Samsung ITM S B User Manual

ITM

Version 1.0

Samsung Electronics

page 1 of 8

User Manual

1. Product Description

The ITM is Bluetooth LE module with Telink TLSR8269F512, BLE wireless Soc solution. It provides the
feature and functions needed for 2.4GHz BLE standard on IOT devices, using for lighting application devices
mainly. The TLSR8269F512 chipset combines the radio frequency, digital processing, protocols stack
software and profiles for BLE standards into a single SoC.
The module supports standards and industrial alliance specifications including Bluetooth Smart(BLE4.0 and

4.2) and BLE mesh.

The module is made up of the following components:

 Telink SoC TLSR8269F512AT32 chipset
 Internal 512KB flash memory (IC embedded)
 IC embedded LDO
 12MHz Crystal
 PCB printed antenna for 2.4GHz ISM band
 10pins SMD type or 4pins header mold (optional)
 RF can-shield

Product Form Factor

 Module Size (mm): 9.5 (W) X 18.5 (L) X 2.4(H)
 PCB size (mm): 9.5 (W) X 18.5 (L) X 1.0 (H)
 Shield can (mm): 8.1 (W) X 11.5 (L) X 1.4 (H)
 Antenna Type : PCB Printed Antenna
 Weight : 0.67g

2. Key Feature

General Feature

 TLSR8269F512 Embedded 32-bit high performance MCU with clock up to 48Mhz
 Chipset embedded program memory : internal 512KB Flash
 Data memory : 32kB on-chip SRAM
 4 channels PWM
 UART with hardware flow control
 Debug interface: SWS
 TLSR8269F512 Embedded hardware AES

ITM

Version 1.0

Samsung Electronics

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RF Feature

 TX output power : Typ. +6.5dBm (Max. +7.5dBm) / RX sensitivity : -92dBm (@1Mbps)
 Single printed PCB antenna with about peak gain 3.8dBi
 BLE RF transceiver embedded, working in worldwide 2.4GHz ISM band
 Bluetooth 4.2 Compliant, 1Mbps LE enhancement

Power management Feature

 Power supply : 1.9~3.6V
 Chipset embedded LDO
 Multiple stage power management to minimize power consumption
 Low power consump[tion

- Receiver mode current: 12mA

- Transmitter mode current: 15mA (@ 0dBm)

Typical Apllication

 Smart lighting

ITM

Version 1.0

Samsung Electronics

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3. Product Specifications

Absolute Maximum Ratings

Absolute Maximum Ratings (AMR) are stress ratings only. AMR corresponds to the maximum value that can be applied

without leading to instantaneous or very short-term unrecoverable hard failure (destructive breakdown). Stresses beyond
those listed under AMR may cause permanent damage to the device.

Functional operation of the device at these or any other conditions beyond those indicated under “Recommended

Operating Range” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may adversely

affect device reliability.
Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at

the test conditions specified.

CONDITION

MIN

MAX

Supply Voltage

-0.3V

3.9V

Storage Temperature

-40ºC

+85ºC

Soldering Temperature

+260ºC

Static Discharge Voltage1)

-30KV

+30KV

Notes;

1) System level ESD : IEC 61000-4-2; C = 150pF, R = 330Ω

Recommended Operating Conditions

PARAMETER

MIN

TYP

MAX

UNIT

VDD, Supply pin voltage

1.9

3.3

3.6

V

Ambient Temperature (TA)

-20 70

ºC

BLE RF PHY Characteristics

Operating Conditions: VDD = 3.3V, TA = 25 ºC, RF Freq = 2.4Ghz band channel. At conducted measurement port

Parameter

Min

Typ.

Max

Unit

TX power (avg.)

4.5

6.5

7.5

Bandwidth

2 MHz