Samsung HW-D450 Service Manual

CrystalSurroundAir Track

ModelNameHW-D450

ModelCodeHW-D450/ZA

SERVICE

CrystalSurroundAirTrack

MANUAL

HW-D450

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

1.Precaution

DEVICE UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE COR D

ALSO TE S T WITH

PLUG REVER S ED

(US ING AC

ADAPTER P LUG

AS R EQ UIRED )

EARTH

GR OUND

(RE ADING SH OULD NOT BE ABOVE 0.5m A)

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith dangerousinternalcomponents.

3)DesignAlterationWarning:

Neveralteroraddtothemechanicalorelectricaldesignoftheunit.

Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.

Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.

1.Precaution

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies withAmericanNationalStandardsInstitute(ANSIC101.1,LeakageCurrentforAppliances),andUnderwriters Laboratories(ULPublicationUL1410,59.7).

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoa120VACoutlet.Withtheunit’spowerswitched fromtheONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.

KnownGrounds-Earth

KnownMetalparts-screwheads,metalcabinets,etc.

Figure1.1ACLeakageTest

1.Precaution

Ante nna

Term inal

ohm

Expo s ed

Meta l Pa rt

Ohmmet er

5)InsulationResistanceColdCheck:

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs. (2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2

InsulationResistanceTest

Figure1.2InsulationResistanceT est

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.

Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage. Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice:

Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or.Usereplacement componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother hazards.

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:(a)Removeorreinstallany componentorassembly,(b)Disconnectanelectricalplugorconnector,(c)Connectatestcomponentinparallelwith anelectrolyticcapacitor.

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused. Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.

Makesurethattheportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels, inputterminalsandearphonejacks).

6)InsulationCheckingProcedure:DisconnectthepowercordfromtheACsource.Connectaninsulationresistance meter(500V)tothebladesoftheACplug.

TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)shouldbe greaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead; alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.

SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).

Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.Thefollowingtechniqueswillreducetheoccurrence ofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.

MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

2.ProductSpecication

2.1.ProductFeature

■HW-D550/HW-D570

•310W(80Wx2+150W)

•2.1CH,Wireless(active)

-DD,DTS

-1Analog/2Opticals

-HDMIOUT1/HDMIIN2

-SmartVolumeII

-VirtualSurround(Music/News/Movie/Drama/Game/Sports/Pass)

-3DSOUND

-2way3spk

2.ProductSpecication

■HW-D450

•280W(80Wx2+120W)

•2.1CH,Wireless(active)

-DD,DTS

-1Analog/2Opticals

-SmartVolumeII

-VirtualSurround(Music/News/Movie/Drama/Game/Sports/Pass)

-3DSOUND

-2way3spk

■HW-D350

•120W(60Wx2)

•2.1CH,Wireless(active)

-DD,DTS

-1Analog/2Opticals

-SmartVolumeII

-VirtualSurround(Music/News/Movie/Drama/Game/Sports/Pass)

-3DSOUND

-2way3spk

2.ProductSpecication

2.2.Specications

■HW-D550/HW-D570BasicSpecication

PowersupplyAC120V ,60Hz

Standbypowerconsumption0.75W

Powerconsumption

General

AMPLIFIER

FREQUENCY

RESPONSE

Weight

Dimensions

(WxHxD)

Operatingtemperaturerange+41°Fto+95°F

Operatinghumidityrange10%to75%

Ratedoutputpower

Inputsensitivity/Impedance570mV/20KΩ

S/Nratio(analoginput)70dB

Separation(1kHz)70dB

Analoginput20Hz~20kHz(±3dB)

Digitalinput/48kHzPCM20Hz~20kHz(±3dB)

Mainunit45W

Subwoofer20W

Mainunit4.41Ibs

Subwoofer12.01Ibs

Mainunit41.65x3.15x1.58inches

Subwoofer6.89x13.78x11.61inches

Mainunit80W/CH,4Ω,THD=10%,1kHz

Subwoofer150W,3Ω,THD=10%,100Hz

■HW-D450BasicSpecication

2.ProductSpecication

PowersupplyAC120V ,60Hz

Standbypowerconsumption0.75W

AMPLIFIER

FREQUENCY

RESPONSE

■HW-D350BasicSpecication

Powerconsumption

General

Weight

Dimensions

(WxHxD)

Operatingtemperaturerange+41°Fto+95°F

Operatinghumidityrange10%to75%

Ratedoutputpower

Inputsensitivity/Impedance570mV/20KΩ

S/Nratio(analoginput)70dB

Separation(1kHz)70dB

Analoginput20Hz~20kHz(±3dB)

Digitalinput/48kHzPCM20Hz~20kHz(±3dB)

Mainunit45W

Subwoofer20W

Mainunit5.01Ibs

Subwoofer12.01Ibs

Mainunit37.66x3.62x1.77inches

Subwoofer6.89x13.78x11.61inches

Mainunit80W/CH,4Ω,THD=10%,1kHz

Subwoofer120W,4Ω,THD=10%,100Hz

PowersupplyAC120V ,60Hz

Standbypowerconsumption0.75W

PowerconsumptionMainunit45W

General

AMPLIFIER

FREQUENCY

RESPONSE

WeightMainunit5.01Ibs

Dimensions

(WxHxD)

Operatingtemperaturerange+41°Fto+95°F

Operatinghumidityrange10%to75%

RatedoutputpowerMainunit80W/CH,4Ω,THD=10%,1kHz

Inputsensitivity/Impedance570mV/20KΩ

S/Nratio(analoginput)70dB

Separation(1kHz)70dB

Analoginput20Hz~20kHz(±3dB)

Digitalinput/48kHzPCM20Hz~20kHz(±3dB)

Mainunit37.66x3.62x1.77inches

2.ProductSpecication

2.3.SpecicationsAnalysis

OutputPower

Compatible

DVD(Video)

ModelName

Photo

RMS(10%THD), REF:1ch

OutputPower (ch)

DiscPlaybackN/AN/AN/AN/A

Media

iPodDock(select regionsonly)

WirelessReadyXXXX

USBHOSTXXXX ExtraFeatures

BluetoothXXXX

ProgressiveScan (NT/PAL)

VirtualSurroundOOOO

HW-D550

HW-D570

310W280W120W280W

80Wx2+150W80Wx2+150W60Wx280Wx2+120W

XXXX

HW-D450HW-D350HW-C450

3DSoundOOOX

DSP

AudioIn/Out

OpticalJackIn(DigitalIn)O(2)O(2)O(2)O(2)

Headphone

ASCXXXX

SmartV olumeSmartV olumeIISmartV olumeIISmartV olumeIISmartV olumeII

AudioUpscaleXXXX

PowerBassXXXX

DolbyDigital/ Plus

DolbyT rueHDN/AN/AN/AN/A AudioDecoding

DTS/DTS-HD (HR/MA)

ComponentOutXXXX

HDMIOut(CEC)1XXX Video

HDMIInput2XXX

MiniJackAudio In

RCAInputXXXX

HeadphoneJack (3.5Φ)

DolbyDigitalDolbyDigitalDolbyDigitalDolbyDigital

DTSDTSDTSDTS

AUX1(3.5φ)AUX1(3.5φ)AUX1(3.5φ)AUX1(3.5φ)

XXXX

Tuner

FMXXXX

PresetMemory15151515

2.ProductSpecication

ModelName

Photo

Speaker

TIP

O:FeatureIncluded,X:NotIncluded

Type(Sat/T allboy)

Active(Powered) S/W

HW-D550

HW-D570

InternalType

(MainFrame

Built-InType)

2way3spk

HW-D450HW-D350HW-C450

InternalType

(MainFrame

Built-InType)

2way3spk

InternalType

(MainFrame

Built-InType)

2way3spk

WirelessActiveWirelessActiveXWirelessActive

InternalType

(MainFrame

Built-InType)

2way3spk

2.ProductSpecication

POWER

TV POWER

AUDIO

MUTE

TV INFO

AUTO POWER

AV SYNC

AH59-02330A

VOL

TV CH

SOUND MODE

SOUND

S.VOL

INPUT SELECT

DIMMER

S/W LEVEL

HDMISPK CONTROL

DRC

2.4.Accessories

2.4.1.SuppliedAccessories

AccessoriesItemItemcodeRemark

RemoteControlAH59–02330A

Bracket-WallMountAH61-02952A

FerriteCore

(ForSubwooferpower

3301-000144

cable1EA)

Batteries(AAAsize)4301-000116

OpticalCableAH39-00925B

AudioCableAH39-01077A

User’sManualAH68-02334D

LocalSamsungDealer

3.Disassembly&Reassembly

3.1.HW-D550/HW-D570Disassembly&Reassembly

3.Disassembly&Reassembly

CAUTION

•Becarefultofollowthedisassemblysequence describedinthemanual.Otherwise,theproductmay bedamaged.

•Besuretocarefullyreadandunderstandthesafety instructionsbeforeperforminganyworkastheIC chipsonthePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly.

1.Unfasten13screwsontheRear.

:BH,+,-,B,M3,L10,ZPC(BLK)

CAUTION

Becarefulnottomakeanyscratchesasyouremove them.

2.RemoveCoverJack,CoverHDMI.

5.Unfasten6screwsonthefront.

:BH,+,-,B,M3,L10,ZPC(SIL VER)

6.DisconnectFPCwire3eachandSPKwire2ea.

7.RemoveASSY -PCB-MAINandASSY-PCB-SMPS.

8.Unfasten1screwontheRear.

:BH,+,-,B,M3,L6,ZPC(SIL VER)

3.RemoveACCord.

4.RemoveCoverRear.

9.RemoveWIRELESSTXPCB.

3.Disassembly&Reassembly

10.Unfasten2screwsonthefront.

:BH,+,-,B,M3,L6,ZPC(SIL VER)

11.LoosenhooksformASSYSHIELDPCBandRemove ASSY-PCB-VFD.

12.LoosenhooksformASSYSHIELDPCBandRemove ASSY-PCB-VFD.

13.DetachSHEET -BUTTONfromAssy-COVER-FRONT .

14.RemoveASSY -SPKRIGHT,ASSY-SPKLEFT.

3.2.HW-D450/HW-D350Disassembly&Reassembly

AMP-PCB

SMPS-PCB

3.Disassembly&Reassembly

CAUTION

•Becarefultofollowthedisassemblysequence describedinthemanual.Otherwise,theproductmay bedamaged.

•Besuretocarefullyreadandunderstandthesafety instructionsbeforeperforminganyworkastheIC chipsonthePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly.

1.V erticalTypeStanding

2.Removethe11screwsfromthebottomof

CABINET-REAR.

:BH,+,B,M3,L10,ZPC(BLK),SWRCH18A

CAUTION

5.AfterdisconnectingthePowercord,Liftthe Cabinet-Rearupcompletely.

6.Separate3cable(FFCCable)fromAMPPCB.

7.Separate2SPKWiresfromAMPPCB

Becarefulnottomakeanyscratchesasyouremove them.

3.RemovetheJACK-COVERfromtheRearCabinet.

4.LifttheCABINET-REARuptoseparatePowerCord.

8.SeparatetheconnectionbetweenSMPSPCB&

PCB.

9.Remove6screws.

:BH,+,-,B,M3,L10,ZPC(WHT),SWRCH18A,

10.RemovethescrewandseparateWirelessModule.

:BH,+,-,B,M3,L6,ZPC(WHT),SWRCH18A,RF

3.Disassembly&Reassembly

11.Separatethechassisfromthefrontcover.

12.SeparatetheVFDAss’y.

13.RemoveASSY -SPKRIGHT,ASSY-SPKLEFT.

4.Troubleshooting

Ye s

Ch eck if 5.6V is m ea su re d a t the

Po wer P CB(SMP S ).

Ch eck SM PS , MAIN P CB SMPS : CN 2 No . 1 (5. 6V)

MAIN: PC ON1 No. 19 (5.6V)

Ye s

The powe r doe s n ot tu rn on.

AC Cab le ch ec k a nd re place

Ye s

Check if “H(3.3V)” is

me asu red a t the pin 2 6 o f the

UIC1 wh e n Ma in PCB

power is turn ed on .

Re place the Micom (UIC1)

Check if 3.3 V is

me asu red on the IC20 03 Main PCB

pins Pin 22 , 23 , 53 ,

70, 73

Check th e po wer circu it of

SMPS PCB

(Check th e ou tputs of TRANS )

Re place the S MPS

Check the po we r(3V)

at the MAIN PC B CN1 002

No.1 8 an d the pin No.2 o f the

SMPS PC B

4.1.CheckpointsbyErrorMode

V oltage/DIV1V/div

TIME/DIV500ms/div

4.1.1.NoPower

4.Troubleshooting

OscilloscopeSettingV alues

4.Troubleshooting

(1)

Che ck if sign al is

measured at p in No. 4, 12 o f IC3001

of the Main P CB.

Yes

Che ck if 3.3 V powe r is

measured at pin 1 6 of IC300 1

of the Main P CB

No o utput

Yes

(2)

Che ck th e IC30 02 pins

69, 70, 71 , 7 4 S igna l

Che ck the MAIN PC B

IRIC1 No .10,12 DATA.

Che ck P_ CON1 No.1 (-27V) ,

No.2 (-21V), No.3 (-18V),

No.4 ,8 (+,-25 v),

No.1 0 (-13v), N o.13, 14 (5v)

Che ck SP DIF Ou tput.

Che ck DS P

INPUT / Ou tput.

Cha nge Sp ea ker L,R

(3)

Che ck th e MAIN PC B

SP K-JACK1, 2 pin 2 sp e ake r

output sig na l

Speaker outp ut ch eck.

* Re fer to wa ve pa ttern

image of Fig. 4-1 .

* Re fer to wa ve pa ttern

image of Fig. 4-2 .

* Re fer to wa ve pa ttern

image of Fig. 4-3 .

Che ck th e re sis tanc e SP K-JACK1 CN500 1, SP K-JACK2 CN500 3

Che ck if 3.3 V powe r is

measured at pin N o. 72,72 of

IC3002 o f the Main P CB

Re place IC300 1

Cha nge Main P CB

Re place IC300 2

Cha nge Main P CB

Cha nge MAIN PC B.

Yes

4.1.2.NoSoundOutput

33OHM

33 OHM

OPE N

33OHM

OPE N

VCC3.3 V

VCC3. 3V

74 LCX157 MTCX

10 0NF

C2_RST

IC3001

R3001

R3019

C3001

R3017

R3002

R3 02 7

R3 02 6

SPD IF_IN1

OP T_ IN2

EP_SDA

H_ARC_S PD IF

OP T_ IN1

CII_RESET

EP_SCL

SEL

/OE

GND

/2Q 3D1

/3Q

2D1

1D0

3D0

2D0

4D1

4D0

/4Q

/1Q

1D1

VCC

* 6.10 . CRES CENDO

IC300 9

IC3001

IC301 0

IC2002

IC20 0 6

* 5.15. MAIN P CB Bottom

<Fig. 4 -1>

(1)

4.Troubleshooting

DGND

1/16W 33OHM

DGND

AGND

10KO HM

1/16 W

ES868 0C 1 28 -LQF P

1/16 W

10KO HM

AGND

R31 09

R31 08

R31 07

R31 06

R31 04

R30 50

R30 49

R30 48

R30 45

MGND1

DCS0_ B

DWE_B

DAC_O4L

DAC_O4R

DAC_O5L

DAC_O5R

LINE_IN_R

LINE_IN_L

LINE_IN_R

DB[9]

DB[10]

DB[11]

VD33

DB[12]

DB[13]

DB[14]

DB[15]

AUX[7]

AUX[6]

AUX[5]

AUX[4]

AUX[3]

RESET_B

AUX[2]

AUX[1]

SR[12 ]

SR[13 ]

SP [21]

VD33

VS33

SP[15]

SR[32]

SP[06]

DAC_O1L

DAC_O1R

DAC_O2L

VD33ADAC

VS33ADAC

DAC_O2R

DAC_O3L

DAC_O3R

OP[2]

OP[3]

OP[4]

OP[5]

OP[6]

OP[7]

VDD

SR[10 ]

SR[11 ]

DMA[0]

DMA[10]

DRAS2_B

DRAS1_B

DCS1_ B

DRAS0_B

DCAS_B

DSCK

VDD

DQM

VD33

DB[7]

DB[6]

DB[5]

DB[4]

DB[3]

DB[2]

DB[1]

DB[0]

VDD

DB[8]

AUX[0]

DAC_O6L

VD33ADAC

VS33ADAC

DAC_O6R

MCLK

VDD

VID_XO

VID_XI

VD33

SPDIF _IN

VD33PLL

LINE_IN_L

LINE_IN_R

LINE_IN_L2

SP I_CS2

SP I_CS3

SP I_CLK

VD33

SP I_DI

SP I_DO

VDD

SP DIF_OUT

OP[0]

OP[1]

* 6.10. CRES CENDO

IC3002

IC3003

IC300

IC3010

* 5.15. MAIN P CB Bottom

<Fig. 4 -2>

(2)

+ 43 hidden pages