Samsung DVD-927, DVD-907 Reference Information

Samsung Electronics 2-1

2. Reference Information

2-1 Semiconductor Base Diagram

Fig. 2-1

RQ1

SS9012

S9012 G-634

E B C

D G S

K184

Y 6A

SQ1

K184

2-2 Samsung Electronics

2-2 Chip Replacement

1) Do not touch the part body directly with the soldering iron. ICs, especially TSOP, are easily damaged by heat.

2) Use care regarding soldering iron tip and avoid repidly heating parts. Some parts can be damaged by sudden heating. Preheat the part at about 100°… for several minutes before installing it.

3) Use soldering tip temperature of about 240°… or larger parts, use a slightly higher temperature (about 280°…).

4) The thin(0.3mm)solder for miniature parts does not contain adequate flux. Supplementary flux is thus needed in most cases.

5) Use care not to damage the circuit pattern, especially when removing.

6) Because of the many pins, cleanliness of the pattern is extremely important after removing the IC.

7) Use care to avoid solder bridges. Remove any that occurs.

8) Position the part carefully. They will also affect the soldering operation. Be very precise in positioning the IC. Soldering opposite pins first holds the IC in place and makes soldering the other pins easier.

9) Do not reuse removed parts.

10) Check for solder joints, especially miniature parts with small lead.

11) A defective trimming resistor cannot be adjusted externally. Replace with an ordjnary variable resistor.

12) It is important to inspect the work with a magnifier. Check after installing (cold solder joints, etc.).

2-2-1 Precaution for the chip Replacement

The tools for the chip replacement are as follows:

1) Thin tip type soldering iron

2) Small flat-blade tip-type soldering iron

3) Special desoldering tip iron

4) Airblower unit

5) Flat Package Pick-up

6) Flux can be cleaned by water

7) 0.3mm thin solder can be cleaned by water

8) Desoldering wire

9) Tweezers

2-2-2 Tools for the Chip Replacement

2-2-3 Chip Resistors and Chip Capacitors

-- Kind of the Part The kind of chip resistors and chip capacitors as follows:d

1) Think Film Chip Resistors

2) Carbon Film Chip Resistors

3) Metal Film Chip Resistors

4) Chip Ceramic Capacitors

5) Chip Trimming Resistors

-- Removing the Part

1) Using two soldering irons:

Use thin tip soldering irons. Use soldering tip temperature of about 280°…. Simultaneously heat both ends of the part. While heating, grasp the part with the tips of the

soldering irons and remove it.

Use desoldering wire to completely remove the old

solder from the part location of the board.

A clean pattern for installing the new part is very

important.

Fig 2-2

-- Installing the Part

1) Use desoldering wire to remove the previous solder.

2) Clean the location.

3) Apply flux.

4) Position the IC and solder two pins at opposite sides.

5) Use a sharp tipped soldering iron and carefully solder each Pin.(After gaining experience, a thicker tip can be used for better work efficiency.)

6) Remove any solder bridges with desoldering wire.

7) Inspect the work with a magnifier.

1

2

3

4

5

6

Precautions

Samsung Electronics 2-3

-- Kind of the Part The kind of the part is as follows:

1) Chip VRs.

2) Chip Trimmer Capacitors

3) Diode

4) Transistors

-- Removing the Part

1) Using two soldering irons: Use small flat-blade tips. Heat the leads of the part simultaneously. When the solder melts, grasp and remove the part with the soldering iron tips. Remove the old solder with desoldering wire.

2-2-4 Diodes and Tr.

-- The kind of the Chip ICs

The kind of the chip ICs are as follows:

1) SOP(Small Outline Package)IC

2) SSOP(Shrink Small Outline Package)IC

3) VSOP(Very Small Outline Package)IC

4) QFP(Quad Flat Package)IC

5) VQFP(Very Quad Flat Package)IC

6) PLCC(Plastic Leaded Chip Carrier)IC

7) TSOP(Thin Small Outline Package)IC

2-2-5 Chip ICs

-- Removing the Part

1) Using special desoldering iron: Selet the tip according to the size and shape of the IC.

“Tin” the tip with a small amount of the IC leads.

Set the tip squarely over the IC leads. When the solder melts, carefully twist the iron.

Raise and remove the IC.

2) Using shaped airblower unit: Select the correct nozzle. Select the temperature and airblow(suggested: temperature:7, airblow:4) Engage the IC removing tool. Use the airblow to preheat the IC for about 5 seconds, then heat with the nozzle until the IC remover lifts the part from the board.

IC

Fig 2-4

-- Installing the Part

1) Use desoldering wire to remove the previous solder.

2) Clean the location.

3) Apply flux.

4) Position the IC and solder two pins at opposite sides.

5) Use a sharp tipped soldering iron and carefully sol

der each Pin.(After gaining experience, a thicker tip

can be used for better work efficiency.)

6) Remove any solder bridges with desoldering wire.

7) Inspect the work with a magnifier.

Fig 2-3

-- Installing the Part

1) Clean the area where the new part is to be mounted.

2) Apply flux.

3) Set part correctly into position, prevent it from shifting.

4) Use sharp soldering iron tip. Bring close to the part contact without actually touching it. Melt thin solder between the tip and part si that it flows into the part contact.

1

234

123

45123

4

Precautions

2-4 Samsung Electronics

MEMO

6-1Samsung Electronics

6-1 DVD DATA PROCESSOR

TC90A19F DIC1

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

81828384858687888990919293949596979899

100

81828384858687888990919293949596979899

100

R

VSS

RVR

I

DVR D

M

O

R

A

S

N

C

A

S

N

M

O

E

N

M

W

E

N

D

VSS

DVD

D

3

M

A

9

M

A

8

M

A

7

M

A

6

M

A

5

M

A

4

M

A

3

M

A

2

M

A

1

M

A

0

D

VSS

DVD

D

5

M

D

7

M

D

6

M

D

5

M

D

4

M

D

3

M

D

2

M

D

1

M

D

0

Memory I/F

De-Scrambler ECC 8/16 DEM Sync Det.

Control

Circuit

Frame Sync

Sector Sync

Frame Number

Correction

PWM

CLV

Contol

RF Signal

Process

PLL

(SVCK)

(PFCK)

HOST INTERFACE

(ECC)

STATUS OUT

UNIVERSAL PWM

(DPCK) (SVCK)

E

D

3

E

D

2

E

D

1

E

D

0

P

L

C

K

H

A

I

H

A

0

HIN

T

DVD

D

5

D

VSS

H

D

7

H

D

6

H

D

5

H

D

4

H

D

3

H

D

2

H

D

1

H

D

0

H

CEN

HDR

D

H

D

W

T

N

C

DVD

D

3

D

VSS

S

VCK

0

DVC

K

1

DVD

D

3

DPC

K

1

D

VSS

D

P

W

M

RFIN

RVDD

RVR2

AVDD

PVR

VRC

AVR

AVSS

SCLO

VCOF

LPFO

LPFN

RLLD

PDOP

PDON

TEST

ED7

ED6

ED5

ED4

SD7

SD6

SD5

SD4

DVSS

DVDD3

SD3

SD2

SD1

SD0

SERR

SBGN

SENB

SDCK

DVSS

SREQ

RSTN

DVDD3

STDA

STCK

6. IC Descriptions

BLOCK DIAGRAM

IC Descriptions

6-2 Samsung Electronics

PIN ASSIGNMENT

Extension data bus I/O

UPWM

DV

SS1

DPCKI

DVDD1

SVCKI

SVCKO

DV

SS1

DV

DD1

WAIT

HDWT

HDRD HCEN

HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7

DV

SS2

DV

DD2

HINT

HA0 HA1

PLCK

ED0 ED1 ED2 ED3 ED4 ED5 ED6

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

NAME FUNCTION

Wide use PWM output Digital ground

Signal process reference clock input (27 to 34MHz)

Digital power supply (3.3V) Servo reference clock input

(oscillation circuit input) Servo reference clock output

(oscillation circuit input) Digital ground

Digital power supply (3.3V) Waiting MPU WRITE signal input MPU READ signal input MPU chip selection MPU data bus I/O MPU data bus I/O MPU data bus I/O MPU data bus I/O MPU data bus I/O MPU data bus I/O MPU data bus I/O MPU data bus I/O Digital ground Digital power supply

MPU interruption signal output (interruption:L)

MPU address bus input MPU address bus input VCO oscillation clock I/O Extension data bus I/O Extension data bus I/O Extension data bus I/O Extension data bus I/O Extension data bus I/O

Extension data bus I/O

NAME FUNCTION

External RAM address bus output

ED7

TEST PDON PDOP TMAX

LPFN LPFO VCOF SLCO

AV

SS

AVR

VRC

PVR AVDD RVR2

RV

DD

RFIN RV

SS

RVR1

DVR

DMO RASN CASN

MOEN MWEN

DV

SS1

DV

DD1

MA9 MA8 MA7 MA6 MA5

34 35 36 37 38 39 40 41 42 43 44

45

46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65

Extension data bus I/O Test mode input Phase error signal output(- polarity) Phase error signal output(+polarity) RLL detecting result output Inverting input for PLL loop filter amplifier Output for PLL loop filter amplifier VCO filter output DAC output for making data slice level Analog ground

Non PLL system analog reference voltage (1.65V)

Resistor dividing point electrical potential output(for analog reference electrical potential generation)

PLL system analog reference voltage output(1.65V)

Analog power supply (3.3V) Second reference voltage(for connecting

capacitor) For power supply

RF signal input For ground

First reference voltage (for connecting capacitor)

DMO reference voltage input (2.1V) Disc equalizer output

(3 value PWM +Hiz) for DVD External RAM row address selection (negative

logic) External RAM column address selection

(negative logic) External RAM output acknowledgement signal

output External RAM READ/WRITE selection

Digital ground Digital power supply External RAM address bus output External RAM address bus output External RAM address bus output External RAM address bus output

IC Descriptions

6-3Samsung Electronics

PIN ASSIGNMENT

MA4 MA3 MA2 MA1 MA0

DV

SS2

DV

DD2

MD7 MD6 MD5 MD4 MD3 MD2 MD1 MD0 SD7 SD6 SD5 SD4

DV

SS1

DV

DD1

SD3 SD2 SD1 SD0

66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90

External RAM address bus output

External RAM address bus output External RAM address bus output External RAM address bus output Digital ground Digital power supply External RAM data bus I/O External RAM data bus I/O External RAM data bus I/O External RAM data bus I/O External RAM data bus I/O External RAM data bus I/O External RAM data bus I/O External RAM data bus I/O MPEG data output MPEG data output MPEG data output MPEG data output Digital ground Digital power supply MPEG data output MPEG data output MPEG data output MPEG data output

SERR SBGN SENB SDCK DV

SS1

SREQ RSTN DV

DD1

STDA

STCK

Digital power supply

MPEG data reliability flag output (data error:L)

MPEG output secter synchronous signal output (secter top:L)

MPEG data effective flag output (effective:L) MPEG data transfer clock output Digital ground MPEG data request flag input(request:L) Hard reset input (reset:L)

Operation monitor data output (Output is carried out in synchronization with the falling edge of SDCK)

Operation monitor synchronous signal output (data top bit:L)

91 92 93 94 95 96 97 98

99

100

NAME FUNCTION

IC Descriptions

6-4 Samsung Electronics

6-2 RF IC

TA1236F RIC1

48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

LPF

SEL

Vref

Focus Error Detector

LD-APC

LD-Po Sel.

ATT

CD-EQ

DVD-EQ

VCA

DVD-EQ

SEL

Peak & Bottom

Detector

SEL

Ripple

Detector

VREF & 2VR

GEN.

TIME-CON.

LPF

Fullwave

RECT.

GND3

RFR FIL

RFRP

OUT

RFcen

FWR FIL

FE

OUT

FE

IN

DVDGD

NC

PRE FIL

NC

TE

OUT

V

ref

V

ref

FIL

2V

ref

2V

ref

FIL

GND2

MCK

ADJ. FIL

Vcc2

RPD etP

DetSR

RPDetB

GND1

DPD

TE

NC

3B

OUT

3B

IN

3BTE

SB

OUT

SB

IN

TE BAL

S/D sel

F

IN

E

IN

V

refIN

D

IN

C

IN

B

IN

A

IN

Vcc1

RFN

IN

RFP

IN

LDP

sel

OUT

LDC

Vcc3

MD

IN

RF

Gain

DVD

sel

EQ

OUTEQINSQsel

DVD EQ

CDEQ

DVD

Time

CD

Time

RF CD

OUT

DPD/3B sel

Vcc4

RF

cen

P

RF

cen

B

RF DVD

OUT

RP

sel

BLOCK DIAGRAM

IC Descriptions

6-5Samsung Electronics

RF system ground

TEB

SBI

SBAD

3BTE

3BIN

3BO N.C.

TE1B

GNDSV

RFB

DETR

RFP

V

CCD

ADJF

MCK

GNDD2

2CVR

2VR CVR V

REF

TEO

N.C.

RFDEQ

N.C.

EQGD

FEI

FEO

3TF

RFZC RFRP

RPF

GNDRF

1

2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

Control input to change sub beam subtraction ratio at-3beam system tracking error(TE)generation

Inverting input for sub-beam summing amplifier

Sub-beam summing amplifier output 3 beam TE signal intermediate output

Amplifier inverting input for 3 beam TE level adjustment

Amplifier output for 3 beam TE level adjustment No connection DPD system TE signal input Servo system ground RF ripple datector RF ripple datector RF ripple datector Power supply

Filter external capacitor for DVD-EQ time constant compensation

Clock input for DVD-EQ time constant compensation

Ground Reference voltage smoothing external capacitor Reference voltage twice output Reference voltage smoothing external capacitor Reference voltage output TE output after switching DPD/3B No connection Pre filter output for RF No connection

Group delay characteristic control input for DVD-EQ

Inverting input for focus error(FE) signal output amplifier

FE output Filter external capacitor to DVD-WV

detecting signal Amplitude center voltage output of RF ripple

signal RF ripple signal output

Filter external capacitor for RFRP signal

Control input when selecting DVD-WV detecting signal for RFRP

RPS SFSD RFZB RFZP

V

CC3

1B3B

RFCD

CD

TIME

CDF

FREQ

HSB

EQI

EQO

CD/SD

RFG V

CCRF

MDI LDC LDO

LDP RFP RFN

V

CC5V

AI BI CI DI

V

IRF

TNI TPI

DBL

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64

EQ output for DVD RFRP center level detection RFRP center level detection Power supply for reference voltage

Control input to select DPD or 3B for TE Signal

EQ output for CD Frequency adjustment input for CD-EQ

curve Frequency adjustment input for DVD-EQ

curve Peak gain adjustment input for CD-EQ curve

DVD-EQ curve peak gain adjustment Input Normal/four times linear speed selecting input

for CD-EQ DVD/CD-EQ input

VCA passing Output for RFN and RFP Selection control input for DVD-CD Control input for RF signal VCA RF system power supply Monitoring input for laser diode APC ON/OFF control input for LD

External current driver control output for LD

Selection input for APC control polarity RF signal non-inverting input from PU RF signal inverting input from PU Servo system power supply

Main beam four divisions detector A input for making focus error (FE)

Main beam four divisions detector B input for making FE

Main beam four divisions detector C input for making FE

Main beam four divisions detector D input for making FE

2.1V reference voltage input Sub-beam E input Sub-beam F input

Single/double layer system selection input

NAME FUNCTION

PIN ASSIGNMENT