Sagem HILO 3G User Manual
HILO 3G
TECHNICAL SPECIFICATION
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FICHE RECAPITULATIVE / SUMMARY SHEET
Ed
1 18/01/2010 URD1– OTL
2 15/03/2010 URD1– OTL
3 17/09/2010 URD1– OTL
4 17/01/2011 URD1 OTL 5696.1-
5 18/03/2011 URD1 OTL 5696.1-
Date
Date
Référence
Reference
5635.2– 001 / 71980
5635.2– 001 / 71980
5635.2– 001 / 71980
004 / 72362 ed 04 -
004 / 72362 ed 05 -
Pages
modifiées
/ Changed
pages
Chapter 2 Block diagram and chapter 8
Update environmental data, mechanical and other
All Changed the document number. Draft watermark
Addition of HiLo3G-850 variant
Creation du document / Document creation
Mechanical updated.
sections
removed
Observations
Comments
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SOMMAIRE / CONTENTS
SOMMAIRE / CONTENTS .................................................................................................................................................3
1. INTRODUCTION......................................................................................................................................................5
1.1 PRODUCT CONCEPT ........................................................................................................................................ 5
1.2 STANDARDS .......................................................................................................................................................5
1.3 TERMS AND ABBREVIATION .........................................................................................................................8
1.4 CONVENTIONS ...................................................................................................................................................9
1.5 PRODUCT FEATURES OVERVIEW ...............................................................................................................9
2. BLOCK DIAGRAM & PINOUT............................................................................................................................ 11
3. FUNCTIONAL DESCRIPTION ............................................................................................................................14
3.1 SIM .......................................................................................................................................................................14
3.1.1 SIM card interface ....................................................................................................................................14
3.1.2 SIM card connection ............................................................................................................................... 14
3.2 AUDIO .................................................................................................................................................................15
3.2.1 ANALOG AUDIO ....................................................................................................................................... 15
3.2.2 DIGITAL AUDIO ........................................................................................................................................15
3.3 PWM ....................................................................................................................................................................16
3.4 DATA ...................................................................................................................................................................16
3.4.1 Data services.............................................................................................................................................16
3.4.2 UART: V24.................................................................................................................................................. 16
3.4.3 USB..............................................................................................................................................................17
3.5 SPARE I/O ..........................................................................................................................................................17
3.6 PWON..................................................................................................................................................................17
3.7 RESET.................................................................................................................................................................18
3.8 ADC ..................................................................................................................................................................... 18
3.9 VBACKUP ..........................................................................................................................................................18
3.10 VGPIO .............................................................................................................................................................18
3.11 POWER SUPPLIES ......................................................................................................................................18
3.12 POWER MANAGEMENT ............................................................................................................................. 19
3.12.1 SLEEP MODES .........................................................................................................................................19
3.12.2 Power supply and power consumption .............................................................................................20
3.12.3 VGPIO..........................................................................................................................................................21
3.12.4 VBACKUP ..................................................................................................................................................21
4. PINOUT ...................................................................................................................................................................22
4.1 I/O CONNECTOR PIN ASSIGNMENTS ........................................................................................................ 22
4.2 POWER DOMAINS AND UNUSED PINS POLICY .....................................................................................24
5. ELECTRICAL SPECIFICATION ......................................................................................................................... 25
5.1 VBAT ...................................................................................................................................................................25
5.2 VBAT WAVEFORM........................................................................................................................................... 26
5.3 VGPIO ................................................................................................................................................................. 27
5.4 VBACKUP ..........................................................................................................................................................27
5.5 VSIM ....................................................................................................................................................................28
5.6 DIGITAL INTERFACE ......................................................................................................................................28
5.7 PWON..................................................................................................................................................................28
5.8 RESET.................................................................................................................................................................29
5.9 SIM .......................................................................................................................................................................29
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5.10 PWM ................................................................................................................................................................ 29
5.11 USB..................................................................................................................................................................29
5.12 ADC .................................................................................................................................................................30
5.13 UART ...............................................................................................................................................................30
5.14 AUDIO SIGNALS...........................................................................................................................................31
5.14.1 Audio Inputs .............................................................................................................................................. 31
5.14.2 Analog Audio Outputs ............................................................................................................................31
5.14.3 Digital Audio..............................................................................................................................................32
5.15 RF SIGNALS .............................................................................................................................................. 33
5.15.1 Load mismatch .........................................................................................................................................33
5.15.2 Input VSWR ...............................................................................................................................................33
5.15.3 Antenna matching network ...................................................................................................................33
6. ENVIRONMENTAL SPECIFICATION................................................................................................................34
6.1 NORMAL TEMPERATURE RANGE..............................................................................................................34
6.2 EXTENDED TEMPERATURE RANGE..........................................................................................................35
6.2.1 Sensitivity .................................................................................................................................................. 35
6.2.2 Transmission characteristics ............................................................................................................... 35
6.2.3 Typical transmission values obtained at extreme temperature................................................... 35
6.3 OUT OF OPERATIONAL RANGE (To be updated)...................................................................................36
7. ESD..........................................................................................................................................................................37
8. MECHANICAL SPECIFICATION........................................................................................................................38
8.1 PHYSICAL DIMENSIONS ................................................................................................................................38
8.2 ASSEMBLY ........................................................................................................................................................40
8.3 TERMINAL ASSIGNMENTS ...........................................................................................................................42
8.3.1 Board to Board connection ................................................................................................................... 42
8.3.2 Antenna connection ................................................................................................................................43
9. ORDERING AND CONTACT INFORMATION .................................................................................................45
9.1 PART NUMBERS ..............................................................................................................................................45
9.2 CONTACT...........................................................................................................................................................45
10. REFERENCE DOCUMENTS...............................................................................................................................46
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1. INTRODUCTION
This document describes the hardware interface of the Sagemcom HiLo 3G M2M module used to connect the
device application and the air interface.
1.1 PRODUCT CONCEPT
The HiLo 3G module is one of the smallest available UMTS/HSDPA module of the market with an industrial
connector. The target application is the Machine to Machine (M2M) market including automotive, AMM
(Automatic Metering Management), tracking system, Alarm, etc. Despite its small size and cost, it has
comprehensive GPRS/EDGE/HSDPA data services.
In addition to its size it has the following outstanding characteristics:
• Automotive temperature range: -40°C to +85°C
• Minimum low power consumption in idle mode: 1.4mA
• High input voltage range: 3.2 V to 4.4 V
• USB High Speed
• Digital Audio PCM
• Form factor compliant with the HiLo module (thickness is higher)
• Pin to pin compliant with HiLo module for the main mandatory signals (Power, Sim, UART)
There are two variants of the HiLo3G module: HiLo3G-900 and HiLo3G-850. Both are quadband for GSM
(GSM850, GSM900, DCS1800, PCS1900) and triple band for UMTS respectively (Band I – 2100 MHz, Band II –
1900 MHz, Band VIII – 900 MHz) for HiLo3G-900 and (Band I – 2100 MHz, Band II – 1900 MHz, Band V –
850 MHz) for HiLo3G-850
As other Sagemcom GSM/GPRS/EDGE modules, it has a full set of AT commands as well as analogue and
Digital audio interface [1].
In addition to the HiLo 3G module a complete development kit can be provided to customers.
1.2 STANDARDS
This product with its evaluation board has been approved to comply with the directives and standards listed
below:
ID
A-Tick Statement
number for HiLo3G-900
HiLo3G-900 VW3HILO3G FCC ID
HiLo3G-850 VW3HILO3G850
HiLo3G-900 2599H-HILO3G IC
Number
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HiLo3G-850 2599H-HILO3G850
CBS11011
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EU Directive – only for HiLo3G-900 variant
« Directive of the European Parliament and of the council of 9 March 1999 on radio
99/05/EC
2004/108/EC Directive on electromagnetic compatibility
2006/95/EC
2002/95/EC RoHS Directive
95/94/EC Automotive EMC Directive
Standards of type approval
3GPP TS 51.010-1 « Digital cellular telecommunications system (Phase 2); Mobile Station (MS)
ETSI EN 301 511 « Candidate Harmonized European Standard (Telecommunications series) Global
GCF-CC v3.39.0
Only for HiLo3G-900
variant
PTCRB NAPRD.03
v5.4
ETSI EN 301 489-7 « Candidate Harmonized European Standard (Telecommunications series) Electro
EN 60 950 Safety of information technology equipment
PTCRB/GCF
2G RF/Protocol/ SIM/
Acoustic :
3GPP TS51.010-1
3G RF : TS 34.121-1
3G Protocol:TS 34.123-1
Acoustic: 3GPP TS
26.132
USIM digital:3GPP TS
31.121
USIM analog: ETSI TS
102230
STK: 3GPP TS 51.010-4
USAT:3GPP TS 31.124
equipment and telecommunications terminal equipment and the mutual recognition of
their conformity », in short referred to as R&TTE Directive 1999/5/EC
« Directive on electrical equipment designed for use within certain voltage limits » (Low
Voltage Directive)
conformance specification »
System for Mobile communications (GSM); Harmonized standard for mobile stations
in the GSM 900 and DCS 1800 bands covering essential requirements under article
3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998) »
Global Certification Forum - Certification Criteria
PCS Type Certification Review Board
Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic
Compatibility (EMC) standard for radio equipment and services; Part 7: Specific
conditions for mobile and portable radio and ancillary equipment of digital cellular
radio telecommunications systems (GSM and DCS)»
GCF: GCF-CC V3.39.0
PTCRB: NAPRD03 V5.4
3GPP TS51.010-1: Mobile Station (MS) conformance specification; Part 1:
Conformance specification
TS 34.121-1 : Terminal conformance specification, Radio transmission and reception
(FDD)
TS 34.123-1: User Equipment (UE) conformance specification; Part 1: Protocol
conformance specification
TS 26.132 : Speech and video telephony terminal acoustic test specification
TS 31.121 UICC-terminal interface; Universal Subscriber Identity Module (USIM)
application test specification
ETSI TS 102230. Technical Specification. Smart cards; UICC-Terminal interface;
Physical, electrical and logical test specification
3GPP TS 51.010-4 : Mobile Station (MS) conformance specification; Part 4: Subscriber
Identity Module (SIM) application toolkit conformance test specification
3GPP TS 31.124 : Mobile Equipment (ME) conformance test specification; Universal
Subscriber Interface Module Application Toolkit (USAT) conformance test specification
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Base Stations (BS),
CE – only for HiLo3G-900 variant
RF: 2G EN301511
(refer to PTCRB/GCF
RF report)
RF: 3GEN301908-2
(refer to PTCRB/GCF
RF report)
RF: 3G EN301908-1
EMC: EN301489-1,-7,24
ETSI EN 301 511 Global System for Mobile Communications (GSM); Harmonized EN
for Mobile Stations in the GSM 900 and GSM 1800 Bands Covering Essential
Requirements Under Article 3.2 of the R&TTE Directive (1999/5/EC)
ETSI EN 301 908-2 Electromagnetic compatibility and Radio spectrum Matters (ERM);
Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 ThirdGeneration cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct
Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE
Directive
EN 301908-1
Electromagnetic compatibility and Radio spectrum Matters (ERM) Repeaters and User Equipment (UE) for IMT-2000 Third-Generation cellular networks Part 1: Harmonized EN for IMT-2000, introduction and common requirements, covering
essential requirements of article 3.2 of the R&T
ETSI EN 301 489-1
Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic
Compatibility (EMC) standard for radio equipment and services; Part 1: Common
technical requirements
ETSI EN 301 489-7
ElectroMagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic
Compatibility (EMC) Standard for Radio Equipment and Services; Part 7: Specific
Conditions for Mobile and Portable Radio and Ancillary Equipment of Digital Cellular
Radio Telecommunications Systems (GSM and DCS)
ETSI EN 301 489-24
Electromagnetic Compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic
Compatibility (EMC) Standard for Radio Equipment and Services; Part 24: Specific
Conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and Portable (UE)
Radio and Ancillary Equipment
EN 62311:2008
SAR (MPE) : EN62311
Safety: EN60950-1
FCC
RF : FCC Part 22H (850
MHz Band )
FCC Part 24E (for 1900
MHz Band)
EMI: FCC Part 15B Subpart B - Radio frequency devices subpart B – Unintentional Radiators
SAR (MPE) : OET65C
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Assessment of electronic and electrical equipment related to human exposure
restrictions for electromagnetic fields (0 Hz - 300 GHz)
EN60950-1:
Information technology equipment. Safety. General requirements
FCC Part 22 Subpart H: Cellular Radiotelephone Service;
Subpart I: Offshore Radiotelephone Service;
FCC Part 24 E: Personal Communications Service;Subpart E: Broadband PCS.
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IC
RF 2G : RSS-132
RF 3G: RSS-133 RSS-133 - 2 GHz Personal Communications Services
EMI: ICES-003 ICES-003: Digital Apparatus
SAR: RSS-102
A-Tick – only for HiLo3G-900 variant
AS/ACIF S042.1
AS/ACIF S042.3
Requirements of quality
IEC 60068-2 Environmental testing
ISO TS 16959 Hilo3G module is manufactured in accordance with ISO TS 16959 in certified factory
RSS-132 - Cellular Telephones Employing New Technologies Operating in the Bands
824-849 MHz and 869-894 MHz
RSS-102 - Radio Frequency Exposure Compliance of Radio communication Apparatus
(All Frequency Bands)
AS/ACIF S042.1: Requirements for connection to an air interface of a
telecommunications network – Part 1
AS/ACIF S042.3: Requirements for connection to an air interface of a
Telecommunications Network - Part 3: GSM Customer Equipment
1.3 TERMS AND ABBREVIATION
ADC Analog to Digital Converter
CODEC Coder-Decoder
CLIP Calling Line Identification Presentation
COLP Connected Line Identification Presentation
CLIR Calling Line Identification Restriction
COLR Connected Line Identification Restriction
CTS Clear To Send
CSD Circuit Switched Data
CS Codec Scheme
DCS Digital Communications System
DSR Data Set Ready
DTR Data Terminal Ready
EDGE Enhanced Data Rate for GSM Evolution
EGSM Enhanced GSM
ENS Enhanced network selection
EONS Enhanced operator name string
ESD Electrostatic Discharge
ETS European Telecommunication Standard
GSM Global System for Mobile communication
GPRS General Packet Radio Services
HSCSD High Speed Circuit Switched Data
HSDPA High Speed Downlink Packet Access
IC Integrated Circuit or Industry Canada (depends on the context)
I/O Input / Output
ISO International Standards Organization
ITU International Telecommunication Union
JTAG Joint Test Action Group
Kbps or kbit/s kilobit per second
LCD Liquid Crystal Display
LED Light Emitting Diode
Mbps or Mbit/s Megabit per second
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PBCCH Packet Broadcast Channel
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCS Personal Communication System
PWM Pulse Width Modulation
RAM Random Access Memory
RF Radio Frequency
RI Ring Indication
RMS Root Mean Square
RTS Ready To Send
RX Reception
SIM Subscriber Identification Module
SMS Short Message Service
TBC To Be Confirmed
TBD To Be Defined
TX Transmission
UART Universal Asynchronous Receiver and Transmitter
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
USSD Unstructured Supplementary Service Data
1.4 CONVENTIONS
Throughout this document, DTE (Data Terminal equipment) indicates the equipment which masters and controls
the module device HiLo 3G by sending AT commands via its serial interface.
DCE (Data Communication Equipment) indicates the module device HiLo 3G.
1.5 PRODUCT FEATURES OVERVIEW
Temperature range Normal range: -20°C to +85°C (fully compliant)
Extended range: -40°C to +85°C (fully functional)
Storage: -40°C to +105°C
Weight (in g) 6.6 g (typical)
ESD ESD protection < 2 kV
Physical dimensions 27x27x4.8 mm (typical)
Connection 40 pins connector + 1 RF UFL connector + 1 pair of antenna pad
Power supply 3.2V to 4.4V range, 3.7V nominal
Power consumption* Off mode: 50 µA typical
Registered idle mode:
• WCDMA: 1.3 mA (DRX=9)
• GSM: 1.4 mA (paging rate=9)
Peak Current
• WCDMA: up to 700 mA
• GSM: up to 1.75A
EDGE DATA: 4 Down + 1 Up Class 10
• GSM 850/900: 450mA
• DCS 1800: 350mA
WCDMA: HSDPA: up to 700mA
Battery charge management and
interface
No battery charge management is included.
*
The power consumption is highly dependent on customer’s product design and environment of the module
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Antenna No antenna is included in the module.
Frequency bands HiLo3G-900
• UMTS bands: I (2100 MHz), II (1900 MHz), VIII (900 MHz)
• GSM bands: GSM850, EGSM900, DCS1800, PCS 1900
HiLo3G-850
• UMTS bands: I (2100 MHz), II (1900 MHz), V (850 MHz)
• GSM bands: GSM850, EGSM900, DCS1800, PCS 1900
Voice codec Half Rate, Full Rate, Enhanced Full Rate, Adaptive Multi Rate
GSM class Small MS
Transmit power Class 4 (2W) for GSM850 / EGSM900
Class 1 (1W) for DCS1800 / PCS1900
Class E2 EDGE 900 / 1800
Class 3 for UMTS 900/1900/2100
Supported SIM card 3V and 1.8V SIM cards
SIM slot Signals for the management of the SIM card are provided on 40 pins
connector
PWM Signal for LED, vibrating device and Buzzer management is provided
on the PWM pin
Audio up-link 1 differential input is provided for microphone
Audio down-link 1 differential output is provided for non stereo earphone
Digital audio link Digital audio interface PCM bus is provided. Master mode with 16 bits
and 2048 KHz frequency.
UART interface with flow control Up to 4 Mbit/s for data transmission (no autobauding)
Full flow control signals (+2.9V) are provided on 40 pins connector.
A reference schematic to build the RS232 interface is provided in the
HiLo 3G application note.
USB Supported USB High speed 480Mbps and full speed 12Mbps, with 3
logical Channels
Data services HSDPA, GPRS, EDGE, CSD
Supplementary services
(supported via AT commands)
Power on pin Available
General purpose I/Os pin 3 GPIO + 1 ADC available
GSM release R99
UMTS/WCDMA release R5
GPRS SMG 31bis, Multi slot class 12, class B terminal, PBCCH support, 3
EDGE Multi slot class 12
UMTS/HSDPA Class E2, Voice and Data in parallel for UMTS/HSDPA, 4 logical
HSDPA DL: 3.6 Mbit/s
GSM/DCS certification GCF-CC GCF-CC v3.39.0
PTCRB l NAPRD.03 v5.4
Automatic answer, Internal Phonebook, Caller Line Identification:
CLIP / CLIR / COLP, Call Waiting, Call Hold, Call Forwarding,
Multiparty, Call Barring, Advice of Charge, USSD, CPHS, Fixed
Dialing Number, ENS, EONS.
PDP contexts, CS1 to CS4.
channels
UL: 0.384 Mbit/s
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2. BLOCK DIAGRAM & PINOUT
Figure 1: HiLo 3G block diagram
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VBAT Pin 1 Pin 40 VBAT
VBAT Pin 2 Pin 39 VBAT
GND Pin 3 Pin 38 GND
GND Pin 4 Pin 37 GND
USB_DP Pin 5 Pin 36 PCM_CLK
USB_DN Pin 6 Pin 35 PCM_SYNC
VUSB Pin 7 Pin 34 PCM_IN
GPIO3 Pin 8 Pin 33 PCM_OUT
GPIO2 Pin 9 Pin 32 GPIO1
VGPIO Pin 10 Pin 31 PWON
UART_DSR Pin 11 Pin 30 VBACKUP
UART_DCD Pin 12 Pin 29 UART_DTR
UART_TXD Pin 13 Pin 28 UART_RI
UART_CTS Pin 14 Pin 27 UART_RTS
SIM_RST Pin 15 Pin 26 UART_RXD
SIM_CLK Pin 16 Pin 25 SIM_DATA
ADC Pin 17 Pin 24 VSIM
RESET Pin 18 Pin 23 PWM
MIC_N Pin 19 Pin 22 HSET_N
MIC_P Pin 20 Pin 21 HSET_P
Figure 2: HiLo 3G Pinout*
*In blue HiLo 3G pin to pin compliant functions compared to HiLo version.
In red HiLo 3G new feature pins compared to HiLo,
In green HiLo 3G moved functions pins compared to HiLo.
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HiLo3G HiLO
VBAT VBAT Pin 1 Pin 40 VBAT VBAT
VBAT VBAT Pin 2 Pin 39 VBAT VBAT
GND GND Pin 3 Pin 38 GND GND
GND GND Pin 4 Pin 37 GND GND
USB_DP SPI_CLK Pin 5 Pin 36 SPI_SEL PCM_CLK
USB_DN SPI_IRQ Pin 6 Pin 35 SPI_IN PCM_SYNC
VUSB SPI_OUT Pin 7 Pin 34 GPIO5 PCM_IN
GPIO3 GPIO4 Pin 8 Pin 33 GPIO3 PCM_OUT
GPIO2 GPIO2 Pin 9 Pin 32 GPIO1 GPIO1
VGPIO VGPIO Pin 10 Pin 31 PWON PWON
UART_DSR UART_DSR Pin 11 Pin 30 VBACKUP VBACKUP
UART_DCD UART_DCD Pin 12 Pin 29 UART_DTR UART_DTR
UART_TXD UART_TXD Pin 13 Pin 28 UART_RI UART_RI
UART_CTS UART_CTS Pin 14 Pin 27 UART_RTS UART_RTS
SIM_RST SIM_RST Pin 15 Pin 26 UART_RXD UART_RXD
SIM_CLK SIM_CLK Pin 16 Pin 25 SIM_DATA SIM_DATA
ADC PWM0 Pin 17 Pin 24 VSIM VSIM
RESET PWM2 Pin 18 Pin 23 PWM PWM
MIC_N AUX_ADC0 Pin 19 Pin 22 HSET_N HSET_N
MIC_P MIC_P Pin 20 Pin 21 HSET_P HSET_P
HiLO HiLO3G
Figure 3: HiLo 3G & HiLo Pinout Definition
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3. FUNCTIONAL DESCRIPTION
3.1 SIM
3.1.1 SIM card interface
The SIM card interface is compatible with the ISO 7816-3 IC card standard on the issues required by the GSM
11.11 Phase 2+ standard and adapts to 3V and 1.8V SIM card.
To prevent SIM card’s damages, the power supply of the module has to be turned off before any manipulation
on SIM card.
The SIM card interface includes:
• Power supply output (VSIM)
• Bi-direction data signal (SIM_DATA),
• Clock output (SIM_CLK)
• Reset signal (SIM_RST)
Signal Pin N° Description
SIM_RST 15 SIM reset, provided by Base-band processor
SIM_CLK 16 SIM clock, provided by Base-band processor
VSIM 24 SIM supply voltage
SIM_DATA 25 SIM serial data line, input and output
3.1.2 SIM card connection
HiLo 3G
VSIM
SIM_DATA
SIM_RST
SIM_CLK
Figure 4: SIM connection
A reference schematic of the SIM card connection is given in the application note.
SIM card
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3.2 AUDIO
3.2.1 ANALOG AUDIO
The module supports the following voice codec:
• Half-Rate
• Full-Rate
• Enhanced Full Rate
• Adaptive Multi Rate
Signal Pin N° Description
MIC_N 19 Negative polarized input signal for microphone
MIC_P 20 Positive polarized signal for microphone
HSET_P 21 Positive polarized output signal for external speaker
HSET_N 22 Negative polarized output signal for external speaker
It manages an external microphone (MIC_P / MIC_N) in differential mode and an external earphone (32 Ohms
HSET_P/HSET_N) in differential mode.
MIC_P
MIC_N
HSET_P
HSET_N
Figure 5: Audio
To ensure proper operation of such sensitive signal, the audio signals should be isolated by ground on DTE
layout. Characteristics of microphone, speaker and reference schematic are given in the application notes.
HiLo 3G
Base-band
Amplifier+
Filter
3.2.2 DIGITAL AUDIO
The HiLo 3G M2M module features a PCM interface.
The PCM interface is a High speed full duplex interface that can be used to send and receive digital audio data
to external audio ICs.
PCM interface feature includes the following:
• PCM master mode
• Full duplex operation
• 16 bits PCM data word length
• Configurable PCM clock rate up to 2 MHz
Signal Pin N° Description
PCM_CLK 36 PCM clock signal
PCM_SYNC 35 PCM sync signal
PCM_IN 34 PCM data input
PCM_OUT 33 PCM data output
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