Serial-in-parallel-out driver incorporates a built-in shift register and a latch circuit to control a maximum of 24 LED by a 4-line
interface, linked to a microcontroller.
A single external resistor can set the output current value of the constant current up to a maximum of 50mA. (BD7851FP only)
CMOS open drain output type products can drive the maximum current of 25mA.
●Features
1) LED can be driven directly.
2) Parallel output of a maximum of 24 bit
3) Operational on low voltage (2.7V to 5.5V)
4) Cascade connection is possible (BU2050F and BU2092F,BU2092FV are not acceptable)
●Application
For AV equipment such as, audio stereo sets, videos and TV sets, PCs, control microcontroller mounted equipment.
●Product line-up
Parameter BU2050F BU2092F BU2092FVBU2099FVBD7851FP BU2152FS Unit
Power Supply Voltage VDD-0.3 to +7.0 -0.3 to +7.0 V
Power dissipation 1 Pd1 450 *1 450 (SOP) *2 400 (SSOPB) *3 mW
Power dissipation 2 Pd2 - 550 (SOP) *4 650 (SSOPB) *5 mW
Input Voltage VIN VSS-0.3 to VDD+0.5 VSS-0.3 to VDD+0.3 V
Output Voltage Vo VSS-0.3 to VDD+0.5 VSS to +25.0 V
Operating Temperature Topr -40 to +85 -25 to +75 ℃
Storage Temperature Tstg -55 to +125 -55 to +125 ℃
*1 Reduced by 4.5mW/℃ over 25℃
*2 Reduced by 4.5mW/℃ over 25℃
*3 Reduced by 4.0mW/℃ over 25℃
*4 Reduced by 5.5mW/℃ for each increase in Ta of 1℃ over 25℃ (When mounted on a board 50mm×50mm×1.6mm Glass-epoxy PCB).
*5 Reduced by 6.5mW/℃ for each increase in Ta of 1℃ over 25℃ (When mounted on a board 70mm×70mm×1.6mm Glass-epoxy PCB).
Parameter Symbol
BU2099FV BD7851FP BU2152FS
Limits
Unit
Power Supply Voltage VDD-0.3 to +7.0 0 to +7.0 -0.3 to +7.0 V
Power dissipation 1 Pd1 400 (SSOPB) *6 1450 *7 800 *8 mW
Power dissipation 2 Pd2 650 (SSOPB) *9 - - mW
Input Voltage VIN VSS-0.3 to VDD+0.3 -0.3 to VCC+0.3 VSS-0.3 to VDD+0.3 V
Output Voltage Vo VSS to +25.0 0 to +10 VSS-0.3 to VDD+0.3 V
Operating Temperature Topr -40 to +85 -30 to +85 -25 to +85 ℃
Storage Temperature Tstg -55 to +125 -55 to +150 -55 to +125 ℃
*6 Reduced by 4.5mW/℃ over 25℃
*7 Reduced by 11.6mW/℃ over 25℃
*8 Reduced by 8.0mW/℃ over 25℃
*9 Reduced by 6.5mW/℃ for each increase in Ta of 1℃ over 25℃ (When mounted on a board 70mm×70mm×1.6mm Glass-epoxy PCB).
●Electrical characteristics
BU2050F (Unless otherwise noted, Ta=25℃, VDD=4.5 to 5.5V)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 4.5 - 5.5 V
Input high-level Voltage VIH 0.7VDD - VDD V
Input low-level Voltage VIL VSS - 0.3VDD V
Input Hysteresis VHYS - 0.5 - V
V
DD-1.5 - VDD
Output high-level Voltage VOHD
VDD-1.0 - VDD
V
VDD-0.5 - VDD
V
SS - 1.5
Output low-level Voltage VOLD
VSS - 0.8
V
VSS - 0.4
Quiescent Current IDD - - 0.1 mA
BU2092F/BU2092FV (Unless otherwise noted, Ta=25℃, V
=0V, VDD=5.0V/3.0V)
SS
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 2.7 - 5.5 V
Input high-level Voltage VIH
3.5 / 2.5
- - V
Input low-level Voltage VIL- - 1.5 / 0.4 V
Output low-level Voltage VOL- - 2.0 / 1.0 V
Output high-level disable Current IOZH - - 10.0 μA
Output low-level disable Current IOZL - - -5.0 μA
Quiescent Current IDD- - 5.0 / 3.0 μA
BU2099FV (Unless otherwise noted, Ta=25℃, V
=0V, VDD=5.0V/3.0V)
SS
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 2.7 - 5.5 V
Input high-level Voltage VIH3.5 / 2.1 - - V
Input low-level Voltage VIL- - 1.5 / 0.9 V
Output high-level Voltage (SO) VOH
V
/ V
DD-0.3
- - V
DD-0.5
- - 1.0
Output low-level Voltage 1 (Qx) VOL1
- - 1.5
V
- - 2.0
Output low-level Voltage 2 (SO) VOL2- - 0.4 / 0.3 V
Output high-level disable Current
(Qx)
Output low-level disable Current
(Qx)
IPULLDOWN (OE)
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 4.5 - 5.5 V
Input high-level Voltage VIH
0.8×VCC
- - V
Input low-level Voltage VIL - - 0.2×VCC V
Output high-level Voltage VOH VCC-0.5 - - V
Output low-level Voltage VOL - - 0.5 V
- 0.7 1.0 mA
- 1.8 3.0 mA
Quiescent Current ICC
- 4.0 6.5 mA
- 30 40 mA
Reference Current Output Current
(including the equation between
each bit)
Equation between each bit of
Reference Current Output Current
Change rate of reference current
output current for output voltage
Iolc1 48 55 62 mA
Iolc2 5.0 5.9 6.8 mA VOUT=2.0V, R=13kΩ
Δiolc - ±1 ±6 %
CC - ±1 ±6 %/V
IΔV
Output Leak Current IOH - 0.01 0.8 μA
BU2152FS (Unless otherwise noted, Ta=25℃, V
=2.7 to 5.5V)
DD
Parameter Symbol Min. Typ. Max. Unit Condition
Power Supply Voltage VDD 2.7 - 5.5 V
Input high-level Voltage VIH
2.0
- - V
Input low-level Voltage VIL - - 0.6 V
VDD-1.5 - -
Output high-level Voltage VOH
VDD-1.0 - -
V
VDD-0.5 - -
- - 1.5
Output low-level Voltage VOL
- - 1.0
V
- - 0.8
Quiescent Current IDDST - - 5 μA
Input high-level Current IIH
When the reset terminal (CLR, CLB) is set to “L”, the content of all latch circuits are set to “H”, and all parallel outputs are
initialised. (For model with reset terminal only)
(2) Data transfer
Serial data is sequentially input to the shift register during the rise of the clock time (strobe signal is not active). When
the strobe signal is active, the content of the shift register are transferred to the latch circuit.
(3) Cascade connection
Serial input data is output from the serial output through the shift register, regardless of the strobe signal.
(except for BU2050F,
BU2092F/BU2092FV)
●Application circuit
VDD
MPU
VSS
C1
(*)
VDD
Serial data input
Clock input
Strobe input
Latch input
P1 P2 Pn-2 Pn-1 Pn
VSS
Serial data outpu
VDD
Serial data input
Clock input
Strobe input
Latch input
P1 P2 Pn-2 Pn-1 Pn
VSS
Serial data outpu
(*C1 must be placed as close to the terminal as possible.)
3 CLOCK I Shift clock of DATA (Rising Edge Trigger)
4 LCK I Latch clock of DATA (Rising Edge Trigger)
Technical Note
5~11,
14~18
Q0~Q11 O
12, 13 N.C. - Non connected
17 OE I Output Enable (“H” level : output FET is OFF)
18 VDD - Power Supply
●Timing chart
CLOCK
DATA
DATA11 DATA10 DATA9 DATA1 DATA0
LCK
OE
Qx
“H”
Previous DAT
1. After the power is turned on and the voltage is stabilized, LCK should be activated, after clocking 12 data bits into
the DATA terminal.
2. Qx parallel output data of the shift register is set after the 12
3. Since the LCK is a label latch, data is retained in the “L” section and renewed in the “H” section of the LCK.
4. Data retained in the internal latch circuit is output when the OE is in the “L” section.
[Truth Table]
Input
CLOCK DATA LCK OE
× × × H Output (Q0~Q11) Disable
× × × L Output (Q0~Q11) Enable
L × ×
H × ×
× × × The data of shift register has no change.
× × × The data of shift register is transferred to the storage register.
× × × The data of storage register has no change.
Parallel Data Output (Nch Open Drain FET)
Latch Data L H
Output FET ON OFF
DATA11~0
Note) Diagram shows a status where a pull-up resistor is connected to output.
Fig. 4
th
clock by the LCK.
Function
Store “L” in the first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
Store “H” in the first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
1 VSS - GND
2 N.C. - Non connected
3 DATA I Serial Data Input
4 CLOCK I Shift clock of Shift register (Rising Edge Trigger)
5 LCK I Latch clock of Storage register (Rising Edge Trigger)
Technical Note
Parallel Data Output (Nch Open Drain FET)
Latch Data L H
Output FET ON OFF
6~17
Q0
~Q11
(Qx)
O
18 SO O Serial Data Output
19 OE I Output Enable Control Input *OE pin is pulled down to Vss.
20 VDD - Power Supply
●Timing chart
CLOCK
DATA
DATA12 DATA11 DATA10 DATA2 DATA1
LCK
OE
Qx
“H”
Previous DATA DATA
SO
Previous
DATA 11
Previous
DATA 11
Fig. 7
1. After the power is turned on and the voltage is stabilized, LCK should be activates, after clocking 12 data bits into
the DATA terminal.
2. Qx parallel output data of the shift register is set after the 12
th
clock by the LCK.
3. Since the LCK is a label latch, data is retained in the “L” section and renewed in the “H” section of the LCK.
4. Data retained in the internal latch circuit is output when the OE is in the “L” section.
5. The final stage data of the shift register is output to the SO by synchronizing with the rise time of the CLOCK.
[Truth Table]
Input
CLOCK DATA LCK
OE
Function
× × × H All the output data output “H” with pull-up.
× × × L The Q0~Q11 output can be enable and output the data of storage register.
L × ×
H × ×
× × ×
Store “L” in the first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
Store “H” in the first stage data of shift register, the previous stage data in the
others. (The conditions of storage register and output have no change.)
The data of shift register has no change.
SO outputs the final stage data of shift register with synchronized falling
edge of CLOCK, not controlled by OE.
× ×
× ×
*The Q0~Q11 output have a Nch open drain Tr. The Tr is ON when data from shift register is “L”, and Tr is OFF when data is “H”.
× The data of shift register is transferred to the storage register.
× The data of storage register has no change.
1. After the power is turned on and the voltage is stabilized, LATCH should be activated, after clocking 16 data bits
into the S_IN terminal.
2. OUTn parallel output data of the shift register is set after the 16
3. The final stage data of the shift register is outputted to the SOUT by synchronizing with the rise time of the
CLOCK.
4. Since the LATCH is a label latch, data is retained in the “L” section and renewed in the “H” section of the LATCH.
5. Data retained in the internal latch circuit is outputted when the ENABLE is in the “L” section. When the ENABLE
is in the “H” section, data is fixed in the “H” section.
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to
ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit,
not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure.
Use similar precaution when transporting or storing the IC.
9. Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing
a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused
by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern
of any external components, either.
10. Unused input terminals
Connect all unused input terminals to VDD or VSS in order to prevent excessive current or oscillation.
Insertion of a resistor (100kΩ approx.) is also recommended.
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"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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use of such technical information.
Notice
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
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Please be sure to implement in your equipment using the Products safety measures to guard
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