ROHM BU16006KV, BU16018KV, BU16024KV, BU16027KV Technical data

HDMI Switch ICs
No.10063EET01
Description These devices control are simple. It requires only 3.3V source and a few GPIO controls. Termination resistors (50) are integrated at all TMDS input port. When channel is not selected, TMDS input termination resistors are turned off and TMDS inputs are high impedance. These devices are also integrated equalizer circuit to adapt long cable and DDC active buffer function to isolate capacitance.
Features
1) Supports 2.25 Gbps signaling rate for 480i/p, 720p, and 1080i/p resolution to 12-bit color depth
2) Compatible with HDMI 1.3a
3) 5V tolerance to all DDC and HPD_SINK inputs
4) Integrated active DDC buffer
5) Integrated switchable 50 termination resistors
6) Integrated equalizer circuit to adapt long cable
7) HBM ESD protection exceeds 10kV
8) 3.3V fixed supply
9) RoHS compatible
Applications Digital TV, Audio Video Receiver, Digital Projector, DVI or HDMI Switch Box
Line up matrix
Part No.
BU16018KV 3 to 3.6 10 3 input 1 output 2.25 Yes Sync HPD GPIO Active Fixed Yes VQFP80 Yes BU16027KV 3 to 3.6 10 3 input 1 output 2.25 Yes Sync S1/S2 GPIO Active Fixed BU16006KV 3 to 3.6 10 2 input 1 output 2.25 Yes Sync HPD GPIO Active Fixed BU16024KV 3 to 3.6 10 1 input 1 output 2.25 Yes Sync HPD - Active Fixed Yes VQFP48C Yes
Other Line up
HDMI Switch adapted “Repeater” and “Source” Equipment
Part No.
BU16025MUV 3 to 3.6 10 1 input 1 output 2.70 Yes Sync OE - Active Selectable Yes VQFN48AV7070 Yes
Power Supply
(V)
Power Supply
(V)
ESD (KV)
ESD (KV)
Input and Output
Input and Output
Data rate
(Gbps)
Data rate
(Gbps)
Hot
Plug
Control
Control
Hot
Plug
Termination
Resistor switch
Control
Termination
Resistor switch
Control
Switching
Method
Switching
Method
DDC
Buffer type
DDC
Buffer type
Equalizer
Equalizer
High speed
mode
Yes
(Always ON)
Yes
(Always ON)
High speed
mode
Package RoHS
VQFP64 Yes VQFP64 Yes
Package RoHS
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.E
BU16006KV, BU16018KV, BU16024KV, BU16027KV
Technical Note
Absolute Maximum Rating Over operating free-air temperature range (unless otherwise noted)
Item Limits
BU16006KV BU16018KV BU16024KV BU16027KV
Unit
Power supply voltage(Vcc) -0.3+4.5 -0.3+4.5 -0.3+4.5 -0.3+4.5 V DDC, HPD_SINK input voltage -0.3+5.6 -0.3+5.6 -0.3+5.6 -0.3+5.6 V Differential input voltage +2.5+4.0 +2.5+4.0 +2.5+4.0 +2.5+4.0 V Control pin input voltage -0.3+4.0 -0.3+4.0 -0.3+4.0 -0.3+4.0 V Power dissipation 1000(*1) 1200(*2) 950(*3) 1000(*1) mW Strage temperture range -55+125 -55+125 -55+125 -55~+125
(*1-3) 70mm×70mm×1.6mm glass epoxy board mount.Reverse Cu occupation rate:15mm×15mm) (*1) When it’s used by than Ta=25, it’s reduced by 10.0mW/℃. (*2) When it’s used by than Ta=25, it’s reduced by 12.5mW/℃. (*3) When it’s used by than Ta=25, it’s reduced by 9.5mW/℃.
Recommended Operating Conditions
Symbol Parameter Min. Typ. Max. Unit
VCC Supply voltage 3 3.3 3.6 V TA Free-air temperature 0 - 70
TMDS Differential Pins
VIC Input common mode voltage, see Figure 2. VCC–0.6 - VCC+0.01 V V
Receiver peak-to-peak differential input voltage, see Figure 2. 150 - 1560 mVp-p
ID(pp)
R
Resistor for TMDS compliant voltage swing range 4.60 4.64 4.68 k
VSADJ
AVCC TMDS Output termination voltage, see Figure 1. 3 3.3 3.6 V RT Termination resistance, see Figure 1. 45 50 55 Signaling rate - - 2.25 Gbps Control Pins VIH LVTTL High-level input voltage 2 - VCC V VIL LVTTL Low-level input voltage GND - 0.8 V HPD_SINK VIH High-level input voltage 2.4 - 5.5 V VIL Low-level input voltage GND - 0.8 V RX (SDA[n],SCL[n]) VIH High-level input voltage 2.4 - 5.5 V VIL Low-level input voltage GND - 0.8 V TX (SCL_SINK, SDA_SINK) VIH High-level input voltage 1.5 - 5.5 V VIL Low-level input voltage GND - 0.35 V
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.E
BU16006KV, BU16018KV, BU16024KV, BU16027KV
Electrical Specifications Over recommended operating conditions (unless otherwise noted)
Symbol Parameter Test Condition
Icc Supply current
PD
Power Consumption
BU16006KV , BU16018KV BU16027KV
BU16024KV - 140 170 mA BU16006KV ,
BU16018KV BU16027KV
BU16024KV - 480 700 mW
= 400mV, R
V
ID
= 50, AVcc = Vcc, Am/Bm =
R
T
2.25 Gbps HDMI data pattern, A1,/B1 = 225 MHz clock See Figure 2
= 400mV, R
V
ID
= 50, AVcc = Vcc, Am/Bm =
R
T
2.25 Gbps HDMI data pattern, A1,/B1 = 225 MHz clock See Figure 2
VSADJ
VSADJ
= 4.64k
= 4.64k
Min. Typ.
- 120 150 mA
- 450 600 mW
TMDS Differential Pins (A/B;Y/Z)
BU16006KV , BU16027KV
VOH
Single-ended high-level output voltage
BU16018KV , BU16024KV BU16018KV , BU16024KV
VOL
Single-ended low-level output voltage
BU16006KV , BU16027KV
V
SWING
Single-ended low-level swing voltage
BU16018KV , BU16024KV BU16018KV , BU16024KV
Vod
Overshoot of output differential voltage See Figure 2 - 6% 15% 2xV
(O)
Vod
Undershoot of output differential voltage See Figure 2 - 12% 25% 2xV
(U)
R
Input termination resistance
INT
AVcc = Vcc, R AVcc = Vcc, PRE = Vcc, RT =
50 AVcc = Vcc, PRE = 0.0V, RT = 50
AVcc = Vcc, RT = 50 AVcc = Vcc, RT = 50, See
Figure 2, AVcc = Vcc, PRE = Vcc, RT = 50, See Figure 2, AVcc = Vcc, PRE = 0.0V, RT = 50, See Figure 2,
AVcc = Vcc = 3.3V, V Vcc-400mV, See Figure 2
= 50
T
= VB =
A
AVcc-
200
AVcc-
200
AVcc-
10
AVcc-
600 300 - 460 mV
300 - 460 mV
400 - 600 mV
45 50 55
Limit
-
-
-
-
Technical Note
(1)
Max.
Avcc-
50
AVcc
- 50
AVcc
+10
Avcc-
400
Unit
mV
mV
mV
mV
swing swing
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.E
BU16006KV, BU16018KV, BU16024KV, BU16027KV
Technical Note
Symbol Parameter Test Conditions
Min. Typ.
Limits
(1)
Max. DDC Input and output Tx
I
Input leak current VI=5.5V -10 - 10 μA
lKT1
I
Input leak current VI=Vcc -10 - 10 μA
lKT2
I
High-level output current VO=3.6V -10 - 10 μA
OHT
I
Low-level input current VI=GND -10 - 10 μA
ILT
BU16006KV BU16018KV
RL=4.7k 0.43 0.5 0.57 V
BU16027KV
V
Low-level output voltage
OLT
BU16024KV
RL=4.7k
SELREF = NC 0.43 - 0.57 SELREF = GND 0.58 - 0.72 SELREF =Vcc 0.73 - 0.87
BU16006KV
V
OLT-VIL
Low-level input voltage below output low-level voltage
BU16018KV BU16027KV
RL=4.7k 20 100 190 mV
SELREF = NC - 100 -
BU16024KV RL=4.7k
SELREF = Vcc - 400 -
Rx
I
Input leak current VI=5.5V -10 - 10 μA
lKR1
I
Input leak current VI=Vcc -10 - 10 μA
lKR2
I
High-level output current VO=3.6V -10 - 10 μA
OHR
I
Low-level input current VIL=GND -10 - 10 μA
ILR
V
Low-level output voltage Iout = 4mA - - 0.2 V
OLR
HPD 1, HPD 2, HPD 3
V
High level output voltage IOH = -8mA 2.4 - Vcc V
OH(TTL)
V
Low level output voltage IOL = 8mA 0 - 0.4 V
OL(TTL)
CONTROL PINS
IIH High l evel input current VIH = Vcc -10 - 10 μA
IIL Low level input current VIL = GND -10 - 10 μA
CONTROL PINS (I2CEN, SELREF,)
IIH High level input current VIH = Vcc -45 - 45 μA
IIL Low level input current VIL = GND -45 - 45 μA
HPD_SINK
= 5.5V 10 50 100 μA
V
IIH High l evel input current
IH
VIH = Vcc 5 30 80 μA
IIL Low –level input current VIL = GND -10 - 10 μA
Unit
V
mV SELREF= GND - 250 -
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.E
BU16006KV, BU16018KV, BU16024KV, BU16027KV
(1)
(
)
(
)
(
)
(
)
)
Symbol Parameter Test Condition
Min. Typ.
TMDS Differential Pins (Y/Z)
BU16006KV ,
t
PLH
Propagation delay time low to high level output
BU16018KV , BU16027KV
- 480 -
BU16024KV - 320 ­BU16006KV ,
t
PHL
Propagation delay time low to high level output
BU16018KV , BU16027KV
- 500 -
BU16024KV - 335 ­BU16006KV ,
tr
tf
Differential output signal rise time (20%-80%)
Differential output signal fall time (20%-80%)
BU16027KV , BU16018KV
= 3.3V,
AV
BU16024KV - 120 ­BU16006KV ,
= 50
R
T
CC
BU16018KV , BU16027KV
- 160 -
- 160 -
BU16024KV - 120 ­BU16006KV ,
t
sk(p)
Pulse skew
- t
(|t
PHL
PLH
|)
BU16018KV , BU16027KV
- 20 -
BU16024KV - 15 ­BU16006KV ,
t
sk(D)
Intra-pair differential skew, see Figure 3.
BU16018KV , BU16027KV
- 35 -
BU16024KV - 25 -
DDC I/O Pins (SCL, SCL_SINK, SDA, SDA_SINK) See Figure 4
Technical Note
Limits Unit
Max.
ps
ps
ps
ps
ps
ps
t
pdLHTR(DDC)
Propagation delay time, low to high level output Tx to Rx
= 4.7kΩ, CL = 100pF,
R
L
- 650 - ns
see Figure 5
t
pdHLTR(DDC)
t
pdLHRT(DDC)
t
pdHLRT(DDC)
tr Tx
DDC
tf Tx
DDC
tr Rx
DDC
tf Rx
DDC
Propagation delay time, high to low level output Tx to Rx Propagation delay time, low to high level output Rx to Tx Propagation delay time, high to low level
output Rx to Tx Tx output Rise time Tx output Fall time - 150 - ns
Rx output Rise time Rx output Fall time - 50 - ns
R
= 1.67kΩ, CL = 400pF,
L
see Figure 5 R
= 4.7kΩ, CL = 100pF,
L
see Figure 5 R
= 1.67k
L
C
= 400pF
L
- 200 - ns
- 500 - ns
- 350 - ns
- 800 - ns
- 950 - ns
tsx Select to switch output see Figure 4 - 8 - ns t
Disable time see Figure 4 - 5 - ns
dis
ten Enable time see Figure 4 - 7 - ns
t
Switch time from SCLn to SCL_SINK CL=10pF - 800 - ns
sx(DDC
CIO Input/output capacitance VI=0V - 15 - pF
Hot Plug Detect Pins
t
pdLH(HPD)
t
pdHL(HPD)
t
sx(HPD)
Propagation delay time, low to high level
output from HPD_SINK to HPDn(n=1,2,3)
Propagation delay time, high to low level
output from HPD_SINK to HPDn(n=1,2,3)
Switch time from port select to the latest
valid status of HPD
CL=10pF - 5 - ns CL=10pF - 5 - ns
=10pF - 8 - ns
C
L
Note: (1). All typical values are at 25 and with a 3.3V supply.
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.E
BU16006KV, BU16018KV, BU16024KV, BU16027KV
r
r
Measurement Symbol And Circuit
Technical Note
AVcc
T
R
Receive
TMDS
TMDS Drive
Zo = R Zo = R
T
R
T
T
Figure 1 TMDS Output Driver
Vcc
RINT
VY
RT
RT
AVCC
Y
A
B
TMDS Driver
TMDS
Receiver
Vswing = VY - VZVID = VA - VB
CL
0.5pF Z
VZ
VA
RINT
VID
VB
VA
VB
Vcc V
Vcc-0.4 V
0.4 V
VIC
VID(pp)
0 V
-0.4 V
tPLH
80%
Vswing
tPLH
100%
VOD(O)
0V Differential
20%
tf
VOD(U)
tr
0%
Figure 2 Test Circuit and Definitions
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© 2010 ROHM Co., Ltd. All rights reserved.
2010.05 - Rev.E
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