Note 2. Regulation is measured at constant junction temperature, using pulsed ON time.
Note 3. Current Limit is measured at constant junction temperature, using pulsed ON time.
Note 4. The dropout voltage is defined as V
is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JA
JEDEC 51-3 thermal measurement standard.
= 10μF, unless otherwise specified.)
OUT
ΔV
I
OUT
= 1mA, V
L
= 5V −2 -- 2 %
IN
-- 50 150
ΔV
IL = 1mA, VIN= 4.5 to 12V
LINE
ΔV
IL = 1m A to 300/500mA, VIN = 5V
LOAD
-- 2 3
-- 1 30/50 mV
RT9161 350 580 --
RT9161A
VIN = 5V, V
I
LIM
V
IL = 300/500mA
DROP
I
STANDBY IL
= 0, VIN = 12V
− V
IN
, which is measured when V
OUT
OUT
= 0V
500 900 --
-- 450/750 600/1000 mV
-- 110 180
is V
OUT
OUT(NORMAL)
− 100mV.
PPM/°C
%V
OUT
mA
μA
DS9161/A-35 April 2011www.richtek.com
3
RT9161/A
>2 >
)
(
)
>2 >
)
(
)
Typical Operating Characteristics
Temperature Stability
3.4
V
= 3.3V
(°C)
OUT
V
OUT
OUT
125°C
= 2.5V
)
25°C
3.2
3
2.8
Output Voltage (V)
2.6
2.4
-50-250 255075100125
Temperature
Dropout Voltage (VIN-V
1
0.8
0.6
0.14
0.12
0.10
0.08
0.06
0.04
Quiescient Current (mA)
0.02
0.00
-300306090120
Temperature
(°C)
Short Circuit Current
1.4
Quiescient Current vs. Temperature
1.2
1
0.8
125°C
25°C
VIN = 5V
0.4
Dropout Voltage (V)
0.2
V
= 3.3V
0
0100200300400500
I
(mA)
Load
7
V
6
5
Input Voltage
Deviation
4
100
0
1
-100
Deviation (mV)
Output Voltage
-200
Line Transient Response
C
= 10μF Electrolytic
OUT
I
= 0.1A
OUT
T
≈
T
Time(100μS/Div
Time (100μs/Div)
OUT
V
OUT
= 25°C
T
A
= 3.3V
0.6
0.4
Short Circuit Current (A)
0.2
0
0246810
Input/Output Differential (V)
7
V
6
5
Input Voltage
Deviation
4
Line Transient Response
C
= 10μF Electrolytic
OUT
I
= 0.1A
OUT
T
V
OUT
T
= 25°C
A
= 2.5V
≈
T
Time (100μS/Div
Time (100μs/Div)
Output Voltage
Deviation (mV)
100
-100
-200
0
1
DS9161/A-35 April 2011www.richtek.com
4
RT9161/A
>
>
(
)
(
)
(
)
(
)
60
40
20
2
Deviation (mV)
Output Voltage
0
-20
≈
100
50
mA
1
1
Load Current
-50
60
40
20
Deviation (mV)
Output Voltage
0
2 >
Load Transient Response
CIN = 1μF
C
= 10μF
OUT
TA = 25°C
T
T
Time (100μs/Div)
Time (100μS/Div)
Load Transient Response
CIN = 1μF
= 10μF
C
OUT
TA = 25°C
T
VIN = 5V
V
= 3.3V
OUT
VIN = 5V
= 2.5V
V
OUT
≈
Output Voltage
Load Current
Output Voltage
Deviation (mV)
mA
Deviation (mV)
150
100
50
-50
200
100
10
-100
150
100
50
2 >
0
≈
1 >
2 >
0
Load Transient Response
CIN = 1μF
= 10μF
C
OUT
TA = 25°C
T
T
Time (100μS/Div)
Time (100μs/Div)
Load Transient Response
CIN = 1μF
= 10μF
C
OUT
TA = 25°C
T
VIN = 5V
V
= 3.3V
OUT
VIN = 5V
= 2.5V
V
OUT
≈
-20
≈
100
50
mA
1 >
1
Load Current
-50
T
Time (100μS/Div)
Time (100μs/Div)
PSRR
0
CIN = 1uF
C
= 10uF Tantalum
OUT
-10
V
= 5V
IN
V
= 3.3V
OUT
T
= 25°C
A
-20
-30
PSRR (dB)
-40
-50
-60
10100100010000100000 1000000
Frequency (Hz)
100mA
10mA
-50
≈
≈
200
100
mA
1 >
10
Load Current
-100
T
Time (100μS/Div)
Time (100μs/Div)
≈
PSRR
0
CIN = 1uF
C
= 10uF Tantalum
OUT
-10
V
= 5V
IN
V
= 2.5V
OUT
T
= 25°C
A
-20
-30
PSRR (dB)
-40
-50
-60
1M100K10K1K
101001000100001000001000000
Frequency (Hz)
100mA
10mA
1M100K10K1K
DS9161/A-35 April 2011www.richtek.com
5
RT9161/A
Application Information
A 10uF capacitor with 200mΩ or higher ESR, connecting
between VOUT and GND pins, is recommended for
stability. A capacitor with ESR smaller than 200 mΩ may
cause VOUT oscillation as shown in Figure 1. Operating
temperature should be well considered to ensure that the
capacitance is no less than 10uF over the operating
temperature range. Please take the notice that Aluminum
electrolytic capacitors may cause VOUT oscillation when
operating below −25°C. The capacitance can be increased
without limit for better transient response.
A 1uF or higher capacitor should be placed between VIN
and GND to filter out input noise and ensure stable output
voltage.
Region of Stable C
100
V
= 3.3V
IN
C
= 1uF
IN
C
= 10uF
OUT
10
1
ESR (Ω)
OUT
C
0.1
ESR vs. Load Current
OUT
Stable
Instable
P
Where T
temperature 125°C, T
θ
= ( T
D(MAX)
J(MAX)
is the junction to ambient thermal resistance.
JA
− TA ) / θ
J(MAX)
JA
is the maximum operation junction
is the ambient temperature and the
A
For recommended operating conditions specification of
RT9161/A, where T
is the maximum junction
J(MAX)
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-223 packages,
the thermal resistance θJA is 135°C/W on the standard
JEDEC 51-3 single-layer 1S thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
P
= ( 125°C − 25°C ) / 250 = 0.400 W for
D(MAX)
SOT-23-3 packages
P
= ( 125°C − 25°C ) / 175 = 0.571 W for
D(MAX)
SOT-89 packages
P
= ( 125°C − 25°C ) / 135 = 0.741 W for
D(MAX)
SOT-223 packages
P
= ( 125°C − 25°C ) / 160 = 0.625 W for
D(MAX)
TO-92 packages
0.01
0100200300400500
Load Current (mA)
Figure 1
Thermal protection limits power dissipation in RT9161/A.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
PD = (V
IN
− V
OUT
) x I
+ VIN x I
OUT
Q
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
The maximum power dissipation depends on operating
ambient temperature for fixed T
and thermal
J(MAX)
resistance θJA. For RT9161/A packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
800
700
600
500
400
300
SOT-23-3 package
200
100
Maximum Power Dissipation (mW)
0
0 153045607590105120
SOT-223 package
TO-29 package
SOT-89 package
Ambient Temperature
(°C)
Figure 2. Derating Curves
DS9161/A-35 April 2011www.richtek.com
6
Outline Dimension
RT9161/A
D
E
L
b
e
D1
A1
A
C
Symbol
Dimensions In Millimeters Dimensions In Inches
Min Max Min Max
A 3.175 4.191
0.125 0.165
A1 1.143 1.372 0.045 0.054
b 0.406 0.533
C 0.406 0.533
0.016 0.021
0.016 0.021
D 4.445 5.207 0.175 0.205
D1 3.429 5.029
E 4.318 5.334
e 1.143 1.397
L
12.700
3-Lead TO-92 Plastic Package
0.135 0.198
0.170 0.210
0.045 0.055
0.500
DS9161/A-35 April 2011www.richtek.com
7
RT9161/A
D
C
e
A
b
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 0.889 1.295 0.035 0.051
A1 0.000 0.152 0.000 0.006
B
A1
H
L
B 1.397 1.803 0.055 0.071
b 0.356 0.508 0.014 0.020
C 2.591 2.997 0.102 0.118
D 2.692 3.099 0.106 0.122
e 1.803 2.007 0.071 0.079
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
SOT-23-3 Surface Mount Package
DS9161/A-35 April 2011www.richtek.com
8
D
D1
RT9161/A
A
C
b1
e
b
e
A
b
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 1.397 1.600 0.055 0.063
b 0.356 0.483 0.014 0.019
B 2.388 2.591 0.094 0.102
b1 0.406 0.533 0.016 0.021
B
C1
H
C 3.937 4.242 0.155 0.167
C1 0.787 1.194 0.031 0.047
D 4.394 4.597 0.173 0.181
D1 1.397 1.753 0.055 0.069
e 1.448 1.549 0.057 0.061
H 0.356 0.432 0.014 0.017
3-Lead SOT-89 Surface Mount Package
DS9161/A-35 April 2011www.richtek.com
9
RT9161/A
Symbol
Dimensions In Millimeters Dimensions In Inches
Min Max Min Max
A 1.400 1.800 0.055 0.071
A1 0.020 0.100
0.001
0.004
b 0.600 0.840 0.024 0.033
B 3.300 3.700 0.130 0.146
C 6.700 7.300 0.264 0.287
D 6.300 6.700 0.248 0.264
b1 2.900 3.100 0.114 0.122
e 2.300 0.091
H 0.230 0.350 0.009 0.014
L 1.500 2.000 0.059 0.079
L1 0.800 1.100 0.031 0.043
3-Lead SOT-223 Surface Mount Package
Richtek Technology Corporation
Headquarter
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
10
Richtek Technology Corporation
Taipei Office (Marketing)
5F, No. 95, Minchiuan Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com
DS9161/A-35 April 2011www.richtek.com
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