Renesas R-IN32M4-CL2 TESSERA Application Note

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APPLICATION NOTE

R18AN0032EJ0270

Rev.2.70

Dec 27, 2018

R-IN32M4-CL2

Driver/Middleware Set for R-IN32M4-CL2 TESSERA Board V2.7.0 Release Note

Summary

Thank you for using Driver/Middleware Set for R-IN32M4-CL2 board manufactured by Tessera Technology Inc.

This document describes the package contents and operating environment of this product.

Please be sure to read before use.

For details on how to use each sample software, middleware etc, please refer to the related documents below.

1. Introduction

Driver/Middleware Set for R-IN32M4-CL2 board manufactured by Tessera Technology Inc. is a software package that collects various sample applications, libraries, middleware, peripheral function drivers that can be used for developing applications using R-IN32M4-CL2.

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R-IN32M4-CL2 Driver/Middleware Set for R-IN32M4-CL2 TESSERA Board V2.7.0 Release Note

No.

Sample application name

CC-Link Ver.1 sample

CC-Link Ver.2 sample

CC-Link IE Field (intelligent device)

CC-Link IE Field (remote device)

Interval timer sample

OS sample

OS-less sample

TCP/IP BSD Socket API sample

TCP/IP MAC Control sample

TCP/IP nonblock API sample

TCP/IP Network App sample

TCP/IP SNMP sample

Version get sample

No.

Library name

HW-RTOS library

EtherPHY library

TCP/IP stack library

No.

Middleware name

Parallel flash ROM control

Serial flash ROM control

TCP/IP stack control

No.

Driver name

ADC

CSI 3 DMAC

IIC 5 Serial Flash MEMC

Timer (32bit timer TAUJ2)

TAUD (16bit timer TAUD)

UART

WDT

Ether Switch

2. Package Contents

The sample applications, libraries, middleware, and peripheral function drivers included in this package are shown below.

 Sample application

 Library

 Middleware

 Peripheral function driver

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R-IN32M4-CL2 Driver/Middleware Set for R-IN32M4-CL2 TESSERA Board V2.7.0 Release Note

3. Folder structure

Folder structure of this package is shown below.

TOP

+-- CMSIS << Cortex Microcontroller Software Interface Standard >>

| +-- include

+-- Device << Device dependent files >>

+-- Renesas

+-- RIN32M4 << R-IN32M4 dependent files >>

+-- Include << Include directory >>

+-- Library << Library directory >>

+-- Source << Source directory >>

+-- Driver << Driver directory >>

+-- Middleware << Middleware directory >>

+-- Project << Project directory >>

| |

| +-- TS-R-IN32M4-CL2

| +-- CCSV1

| +-- CCSV2

| +-- cie_intelligent_device

| +-- cie_remote_device

| +-- interval_timer

| +-- os_sample

| +-- osless_sample

| +-- uNet3_bsd

| +-- uNet3_mac

| +-- uNet3_nonblock

| +-- uNet3_sample

| +-- uNet3_snmp

| +-- version_get_sample

+-- Templates << Startup file and others >>

+-- ARM << Arm compiler dependent files >>

+-- GCC << GCC compiler dependent files >>

+-- IAR << IAR compiler dependent files >>

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R-IN32M4-CL2 Driver/Middleware Set for R-IN32M4-CL2 TESSERA Board V2.7.0 Release Note

4. Operating environment

The operating environment of this package is shown below.

 Target device

R-IN32M4-CL2

 Target board

TS-R-IN32M4-CL2 (Tessera Technology Inc.)

 Development environment

 Compiler

IAR Embedded Workbench for Arm 7.80.4 (IAR Systems)

 Debugger

IAR Embedded Workbench for Arm 7.80.4 (IAR Systems)

 ICE

I-jet / JTAGjet-Trace (IAR Systems)

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R-IN32M4-CL2 Driver/Middleware Set for R-IN32M4-CL2 TESSERA Board V2.7.0 Release Note

5. Website and Support

Renesas Electronics Website

http://www.renesas.com/

Inquiries

http://www.renesas.com/contact/

All trademarks and registered trademarks are the property of their respective owners.

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Version

Changes

V2.7.0

[Changes-1]

- Update CC-Link IE Field intelligent device sample driver.

V2.6.0 (Jul 11, 2018)

[Changes]

- Modify TCP/IP stack middleware.

V2.5.0 (Apr 26, 2018)

[Changes]

- Modify TCP/IP stack sample programs and drivers.

V2.4.0 (Dec 7, 2017)

[Changes]

- Add CC-link Project for TS-R-IN32M4-CL2 board

V2.3.0

[Changes-1]

Modify initial setting of I2C

V2.2.0

[Changes-1]

- Add CC-Link IE Field remote device sample programs and drivers.

V2.1.1

[Changes-1]

V2.1.0

[Changes-1]

- Update Interval Timer Sample

V1.1.2

[Changes-1]

- Update of HW-RTOS Library (V2.0.3)

V1.1.1

[Changes-1]

V1.1.0

[Changes-1]

/Middleware/sflash/sflash.h

Change history

(Nov 22, 2018)

(Jul 14, 2017)

(Apr 28, 2017)

- Update CC-Link sample programs. IOTENSU changed to low fixed. "Number of I/O points fixed to 32 points" can not be used.

[Changes-2]

- Update CC-Link IE Field sample programs and drivers. Add Fast-Link UP function for CC-Link IE Field(Default disable) Modify Status of Master Station in case of non-receive cyclic transmission

[Changes-2]

- Update I2C drivers.

- Update CC-Link IE Field intelligent device sample programs and drivers. Fix "MyStatus Counter" Bug Fix "Baton Pass Error" Add a Loop-back function. To use this function, enable the compile switch

"LOOPBACK_FUNCTION".

(Feb 28, 2017)

(Nov 30, 2016)

(Oct 31, 2016)

(Jul 26, 2016)

(Mar 18, 2016)

- Modify TCP/IP stack sample programs (Technical Update TN-RIN-A016A/E,J support)

[Changes-2] /Middleware/sflash/sflash.h

- Add TCP/IP stack sample programs and drivers.(3.1.8)

[Changes-2]

- Update ADC Driver

- Update WDT Driver



- Update of EtherPHY Library

/CMSIS/*

- Update of CMSIS for V4.5

[Changes-2] /Include/sromc/sromc.h /Driver/sromc/sromc.c /Middleware/sflash/sflash.c

- Add Dual I/O mode initialize function.

- Modify setting of iic_init()

V1.0.0 (Jan 29, 2016)

First release

- Add Quad I/O mode initialize function.

[Changes-3] /Driver/iic/iic.c

1. Handling of Unused Pins

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products

The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.

Handle unused pins in accordance with the directions given under Handling of Unused Pins in the manual.

 The input pins of CMOS products are generally in the high-impedance state. In operation with an

unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal become possible. Unused pins should be handled as described under Handling of Unused Pins in the manual.

2. Processing at Power-on

The state of the product is undefined at the moment when power is supplied.

 The states of internal circuits in the LSI are indeterminate and the states of register settings and

pins are undefined at the moment when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins

3. Prohibition of Access to Reserved Addresses

4. Clock Signals

5. Differences between Products

are not guaranteed from the moment when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified.

Access to reserved addresses is prohibited.

 The reserved addresses are provided for the possible future expansion of functions. Do not access

these addresses; the correct operation of LSI is not guaranteed if they are accessed.

After applying a reset, only release the reset line after the operating clock signal has become stable. When switching the clock signal during program execution, wait until the target clock signal has stabilized.

 When the clock signal is generated with an external resonator (or from an external oscillator)

during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable.

Before changing from one product to another, i.e. to a product with a different part number, confirm that the change will not lead to problems.

 The characteristics of Microprocessing unit or Microcontroller unit products in the same group but

having a different part number may differ in terms of the internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a system-evaluation test for the given product.

Renesas R-IN32M4-CL2 TESSERA Application Note

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Introduction

2. Package Contents

3. Folder structure

4. Operating environment

5. Website and Support