
3SK318
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage VDS 6 V
Gate1 to source voltage V
Gate2 to source voltage V
Drain current ID 20 mA
Channel power dissipation Pch 100 mW
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
±6 V
G1S
±6 V
G2S
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown voltage V
Gate1 to source breakdown voltage V
Gate2 to source breakdown
(BR)DSS
(BR)G1SS
V
(BR)G2SS
voltage
Gate1 to source cutoff current I
Gate2 to source cutoff current I
Gate1 to source cutoff voltage V
Gate2 to source cutoff voltage V
Drain current I
G1SS
G2SS
G1S(off)
G2S(off)
DS(op)
Forward transfer admittance |yfs| 18 24 32 mS
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
1.3 1.6 1.9 pF
iss
0.9 1.2 1.5 pF
oss
— 0.019 0.03 pF
rss
Power gain PG 18 21 — dB
Noise figure NF — 1.4 2.2 dB
6 — — V ID = 200 µA, V
±6 — — V IG1 = ±10 µA, V
±6 — — V IG2 = ±10 µA, V
— — ±100 nA V
— — ±100 nA V
0.5 0.7 1.0 V
0.5 0.7 1.0 V
0.5 4 10 mA
= V
G1S
= VDS = 0
G2S
= VDS = 0
G1S
= ±5 V, V
G1S
= ±5 V, V
G2S
= 5 V, V
V
DS
= 100µA
I
D
= 5 V, V
V
DS
= 100 µA
I
D
= 3.5 V, V
V
DS
= 3 V
V
G2S
= 3.5 V, V
V
DS
= 10 mA , f = 1 kHz
I
D
VDS = 3.5 V, V
= 10 mA , f= 1 MHz
I
D
VDS = 3.5 V, V
= 10 mA , f = 900 MHz
I
D
G2S
G1S
G2S
G1S
= 3 V
= 3 V
G1S
G2S
G2S
G2S
= VDS = 0
= VDS = 0
= 1.1 V
= 3 V
= 3 V
= 3 V
G2S
= 0
Rev.2.00 Aug 10, 2005 page 2 of 7

3SK318
Maximum Channel Power
Dissipation Curve
200
150
100
50
Channel Power Dissipation Pch (mW)
0
50 100 150
Ambient Temperature Ta (°C)
Drain Current vs.
Gate1 to Source Voltage
20
VDS = 3.5 V
16
2.5 V
2.0 V
200
Typical Output Characteristics
20
16
(mA)
12
D
8
4
Drain Current I
0
Drain to Source Voltage VDS (V)
Gate2 to Source Voltage
20
V
DS
16
V
= 1.7 V
G1S
1.6 V
1.5 V
1.4 V
1.3 V
1.2 V
1.1 V
1.0 V
0.9 V
V
= 3 V
G2S
0.8 V
2468
Drain Current vs.
= 3.5 V
2.0 V
1.8 V
1.6 V
10
(mA)
D
12
8
4
Drain Current I
0
1.5 V
V
= 1.0 V
G2S
12 345
Gate1 to Source Voltage V
Forward Transfer Admittance
vs. Gate1 Voltage
30
| (mS)
fS
Forward Transfer Admittance |y
VDS = 3.5 V
24
18
12
6
0
1 V
0.4 0.8 1.2 1.6 2.0
V
G2S
1.5 V
G1S
= 3 V
2.5 V
2 V
(V)
(mA)
D
12
8
4
Drain Current I
0
12345
Gate2 to Source Voltage V
Power Gain vs. Drain Current
25
20
15
10
5
Power Gain PG (dB)
0
5101520
1.2 V
V
G1S
1.4 V
= 1.0 V
VDS = 3.5 V
V
f = 900 MHz
G2S
G2S
= 3 V
(V)
25
Gate1 to Source Voltage V
Rev.2.00 Aug 10, 2005 page 3 of 7
G1S
(V)
Drain Current ID (mA)

3SK318
Noise Figure vs. Drain Current Power Gain vs. Drain to Source Voltage
5
4
3
2
Noise Figure NF (dB)
1
0
5101520
VDS = 3.5 V
V
= 3 V
G2S
f = 900 MHz
Drain Current ID (mA)
Noise Figure vs. Drain to Source Voltage
5
V
= 3 V
G2S
I
= 10 mA
4
3
D
f = 900 MHz
25
25
20
15
10
V
Power Gain PG (dB)
5
0
246810
= 3 V
G2S
I
= 10 mA
D
f = 900 MHz
Drain to Source Voltage VDS (V)
Power Gain vs. Gate2 to Source Voltage
25
VDS = 3.5 V
f = 900MHz
20
15
2
1
Noise Figure NF (dB)
0
2468
Drain to Source Voltage V
Noise Figure vs. Gate2 to Source Voltage
5
VDS = 3.5 V
4
3
2
1
Noise Figure NF (dB)
f = 900MHz
DS
(V)
10
10
5
Power Gain PG (dB)
012345
Gate2 to Source Voltage V
G2S
(V)
01
23
Gate2 to Source Voltage V
Rev.2.00 Aug 10, 2005 page 4 of 7
4
G2S
(V)
5

3SK318
.4
.2
0
–.2
–.4
Test Condition :
150°
180°
–150°
Test Condition :
S11 Parameter vs. Frequency
1
.8
.6
–.6
.6
.4
.8
–.8
–1
V
= 3.5 V , V
DS
I
= 10mA
D
.2
1.5
2
1.5
234
1
–2
–1.5
= 3 V
G2S
50 to 1000 MHz (50 MHz step)
S12 Parameter vs. Frequency
Scale: 0.002 / div.
90°
120°
–120°
–90°
V
= 3.5 V , V
DS
I
= 10mA
D
50 to 1000 MHz (50 MHz step)
60°
–60°
G2S
= 3 V
S21 Parameter vs. Frequency
Scale: 1 / div.
90°
120°
3
4
5
10
10
5
–10
–5
–4
–3
150°
180°
–150°
Test Condition :
–120°
–90°
V
= 3.5 V , V
DS
= 10mA
I
D
60°
–60°
G2S
30°
0°
–30°
= 3 V
50 to 1000 MHz (50 MHz step)
S22 Parameter vs. Frequency
1
30°
–30°
.8
.6
.4
.2
–.6
.4
–.8
.6
.8
–1
VDS = 3.5 V , V
= 10mA
I
D
0°
0
–.2
.2
–.4
Test Condition :
1.5
2
3
4
5
10
G2S
5
–2
= 3 V
10
–10
–5
–4
–3
1.5
234
1
–1.5
50 to 1000 MHz (50 MHz step)
Rev.2.00 Aug 10, 2005 page 5 of 7

3SK318
S Parameter
(VDS = 3.5V, V
S11 S21 S12 S22 Freq.
(MHz)
50 1.000 –2.8 2.41 176.3 0.00068 89.1 0.999 –2.2
100 0.998 –5.8 2.41 171.9 0.00176 88.5 0.996 –4.5
150 0.997 –9.1 2.39 167.6 0.00223 80.7 0.996 –6.7
200 0.994 –12.2 2.38 163.7 0.00303 76.6 0.994 –8.7
250 0.994 –15.1 2.37 159.8 0.00365 79.1 0.991 –11.0
300 0.986 –18.5 2.35 155.5 0.00414 75.4 0.988 –13.2
350 0.978 –21.3 2.30 151.4 0.00484 75.0 0.983 –15.3
400 0.972 –24.1 2.28 147.6 0.00533 78.0 0.980 –17.4
450 0.969 –27.0 2.26 143.6 0.00588 71.6 0.976 –19.6
500 0.954 –29.7 2.23 140.0 0.00617 69.5 0.971 –21.7
550 0.955 –32.8 2.19 135.9 0.00666 71.5 0.966 –23.7
600 0.941 –35.7 2.17 132.2 0.00672 70.6 0.960 –25.6
650 0.932 –38.3 2.14 128.6 0.00694 69.0 0.955 –27.8
700 0.924 –41.3 2.09 125.0 0.00709 71.4 0.948 –29.9
750 0.919 –44.1 2.07 121.5 0.00689 69.0 0.942 –31.8
800 0.905 –46.9 2.03 117.9 0.00699 68.9 0.937 –33.8
850 0.896 –49.2 2.00 114.7 0.00644 74.2 0.930 –35.8
900 0.884 –52.4 1.96 110.4 0.00633 75.5 0.923 –37.6
950 0.880 –54.7 1.93 107.1 0.00585 77.8 0.917 –39.8
1000 0.866 –57.7 1.89 103.8 0.00605 82.1 0.910 –41.9
MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG.
= 3V, ID = 10mA, Zo = 50Ω)
G2S
Rev.2.00 Aug 10, 2005 page 6 of 7

3SK318
Package Dimensions
SC-82A 0.006g
b
1
RENESAS CodeJEITA Package Code Package Name
D
ee
2
A
CMPAK-4(T) / CMPAK-4(T)VPTSP0004ZA-A
BB
EH
E
AA
c
x
y
b
b
2
A-A Section
AS
M
S
c
1
c
b
A
2
A
1
b
1
b
3
B-B Section
A
S
c
1
MASS[Typ.]
L
Q
c
L
P
L
1
A
3
e
e
2
l
1
b
5
l
1
b
4
Pattern of terminal position areas
A
A
1
A
2
A
3
b
b
1
b
2
b
3
c
c
1
D
E
e
e
2
H
E
L
L
1
L
P
x
y
b
4
b
5
e
1
l
1
Q
Dimension in Millimeters
Min Nom Max
0.8
0
0.8
0.9
0.25
0.25
0.32
0.35 0.42 0.5
0.3
0.4
0.15
0.13
0.1
0.11
2.0
1.8
1.25
0.65
0.6
2.1
1.5
0.2
1.35
0.05
0.05
0.45
0.55
1.15
1.8
0.3
0.1 0.5
0.2
1.1
0.1
1.0
0.4
2.2
2.4
0.7
0.6
0.9
Reference
Symbol
e
1
Ordering Information
Part Name Quantity Shipping Container
3SK318YB-TL-E 3000 φ 178 mm Reel, 8 mm Emboss Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of
production before ordering the product.
Rev.2.00 Aug 10, 2005 page 7 of 7

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
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circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
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Colophon .3.0