
2SK3069
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current ID 75 A
Drain peak current I
Body-drain diode reverse drain current IDR 75 A
Avalanche current I
Avalanche energy E
Channel dissipation Pch
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at Tc = 25
3. Value at Tch = 25
°C
°C, Rg ≥ 50 Ω
60 V
DSS
±20 V
GSS
Note 1
D(pulse)
AP
AR
300 A
Note 3
50 A
Note 3
214 mJ
Note 2
100 W
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source leak current I
Zero gate voltage drain current I
Gate to source cutoff voltage V
Static drain to source on state
resistance
Forward transfer admittance |yfs| 50 80 — S ID = 40 A, VDS = 10 V
Input capacitance Ciss — 7100 — pF
Output capacitance Coss — 1000 — pF
Reverse transfer capacitance Crss — 280 — pF
Total gate charge Qg — 125 — nC
Gate to source charge Qgs — 25 — nC
Gate to drain charge Qgd — 25 — nC
Turn-on delay time t
Rise time tr — 300 — ns
Turn-off delay time t
Fall time tf — 330 — ns
Body–drain diode forward voltage VDF — 1.05 — V IF = 75A, VGS = 0
Body–drain diode reverse recovery
time
Note: 4. Pulse test
60 — — V ID = 10 mA, VGS = 0
(BR)DSS
— — ±0.1 µA VGS = ±20 V, VDS = 0
GSS
— — 10 µA VDS = 60 V, VGS = 0
DSS
1.0 — 2.5 V ID = 1 mA, VDS = 10 V
GS(off)
— 6.0 7.5 mΩ ID = 40 A, VGS = 10 V
R
DS(on)
— 8.0 12 mΩ ID = 40 A, VGS = 4 V
= 10 V, VGS = 0,
V
DS
f = 1 MHz
= 25 V, VGS = 10 V,
V
DD
= 75 A
I
D
— 60 — ns
d(on)
— 520 — ns
d(off)
— 90 — ns
t
rr
= 10 V, ID = 40 A,
V
GS
= 0.75 Ω
R
L
= 75A, VGS = 0
I
F
/ dt = 50 A/ µs
di
F
Note 4
Note 4
Note 4
Note 4
Rev.11.00 Sep 07, 2005 page 2 of 7

2SK3069
Main Characteristics
Power vs. Temperature Derating
200
150
100
50
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature T
Typical Output Characteristics
(A)
D
100
80
60
5 V
4 V
VGS
= 10 V
(°C)
C
Pulse Test
3.5 V
Maximum Safe Operation Area
1000
300
100
(A)
D
30
10
Operation in
3
this area is
limited by R
1
Drain Current I
0.3
Ta = 25°C
0.1
0.1 0.3 1
Drain to Source Voltage V
Typical Transfer Characteristics
100
V
= 10 V
DS
Pulse Test
80
(A)
D
60
PW = 10 ms (1 shot)
DC Operation
(Tc = 25°C)
DS(on)
3
10
100 µs
1 ms
10 µs
30
DS
(V)
100
40
Drain Current I
20
0
246810
Drain to Source Voltage V
Drain to Source Saturation Voltage
vs. Gate to Source Voltage
2.0
(V)
1.6
DS (on)
1.2
0.8
0.4
V
Drain to Source Saturation Voltage
10 A
0
48
ID = 50 A
Pulse Test
20 A
12
Gate to Source Voltage V
3 V
2.5 V
(V)
DS
16 20
(V)
GS
40
Drain Current I
20
0
Gate to Source Voltage V
75°C
12345
25°C
Tc = –25°C
(V)
GS
Static Drain to Source on State
Resistance vs. Drain Current
100
(mΩ)
50
DS (on)
20
10
5
2
1
Static Drain to Source on State Resistance
1
R
VGS
= 4 V
10 V
2
10
Drain Current I
Pulse Test
20 100
505
(A)
D
200
Rev.11.00 Sep 07, 2005 page 3 of 7

2SK3069
Static Drain to Source on State
Resistance vs. Temperature
20
(mΩ)
DS (on)
Static Drain to Source on State Resistance
R
Pulse Test
16
12
8
4
0
–50 0 50 100 150 200
ID = 50 A
4 V
VGS = 10 V
Case Temperature T
20 A
10 A
10, 20, 50 A
(°C)
C
Body to Drain Diode Reverse
Recovery Time
1000
500
(ns)
rr
Forward Transfer Admittance
vs. Drain Current
500
(S)
fs
Forward Transfer Admittance y
V
= 10 V
DS
200
Pulse Test
100
50
20
10
5
2
1
0.5
0.1 0.3 1 3 10 30 100
Tc = –25°C
25°C
75°C
Drain Current I
D
(A)
Typical Capacitance
vs. Drain to Source Voltage
30000
10000
Ciss
VGS = 0
f = 1 MHz
200
100
50
20
Reverse Recovery Time t
10
0.1 0.3 1 3 10 30 100
di / dt = 50 A / µs
VGS = 0, Ta = 25°C
Reverse Drain Current I
Dynamic Input Characteristics
100
80
60
40
20
0
ID = 75 A
VGS
V
V
DS
V
DD
80 160 240 320 400
DD
= 50 V
25 V
10 V
(V)
DS
Drain to Source Voltage V
Gate Charge Qg (nc)
DR
= 50 V
25 V
10 V
(A)
Capacitance C (pF)
20
(V)
GS
16
12
8
4
Gate to Source Voltage V
0
Switching Time t (ns)
3000
1000
300
100
01020304050
Drain to Source Voltage V
Coss
Crss
DS
(V)
Switching Characteristics
1000
500
200
100
50
20
10
0.1 0.2
VGS = 10 V, V
PW = 5 µs, duty < 1 %
1
0.5
Drain Current I
t
d(off)
t
f
t
r
t
d(on)
= 30 V
DD
20
10 100
5
2
D
50
(A)
Rev.11.00 Sep 07, 2005 page 4 of 7

2SK3069
Reverse Drain Current vs.
Source to Drain Voltage
100
(A)
DR
80
10 V
5 V
60
40
20
Reverse Drain Current I
0
0.4 0.8 1.2 1.6 2.0
Source to Drain Voltage V
3
(t)
s
1
Maximum Avalanche Energy vs.
Channel Temperature Derating
250
(mJ)
AR
200
150
VGS
= 0, –5 V
100
50
Pulse Test
SD
(V)
0
25 50 75 100 125 150
Repetitive Avalanche Energy E
Channel Temperature Tch (°C)
Normalized Transient Thermal Impedance vs. Pulse Width
D = 1
I
= 50 A
AP
V
= 25 V
DD
duty < 0.1 %
Rg > 50 Ω
Tc = 25°C
Vin
15 V
0.5
0.3
0.2
θ γ θ
0.1
0.1
ch – c(t) = s (t) • ch – c
θ
ch – c = 1.25°C/W, Tc = 25°C
0.05
P
0.03
0.02
0.01
1shot pulse
Normalized Transient Thermal Impedance γ
0.01
10 µ
100 µ 1 m 10 m
DM
PW
T
100 m 1 10
D =
Pulse Width PW (S)
Avalanche Test Circuit Avalanche Waveform
V
DS
Monitor
Rg
50 Ω
I
AP
Monitor
D. U. T
L
V
DD
V
DD
0
E
= • L • I
AR
I
AP
1
2
2
•
AP
I
D
V
PW
DSS
T
V
DSS
– V
DD
V
(BR)DSS
V
DS
Rev.11.00 Sep 07, 2005 page 5 of 7

2SK3069
Package Dimensions
RENESAS CodeJEITA Package Code
PRSS0004AC-A TO-220AB / TO-220ABV
2.79 ± 0.218.5 ± 0.57.8 ± 0.5
1.27
2.54 ± 0.5
Package Name
11.5 Max
10.16 ± 0.2
9.5
8.0
2.54 ± 0.5
MASS[Typ.]
φ 3.6
–0.08
1.5 Max
0.76 ± 0.1
1.8gSC-46
+0.2
6.4
–0.1
+0.1
Unit: mm
4.44 ± 0.2
1.26 ± 0.15
2.7 Max
14.0 ± 0.5 15.0 ± 0.3
0.5 ± 0.1
Ordering Information
Part Name Quantity Shipping Container
2SK3069-E 500 pcs Box (Sack)
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of
production before ordering the product.
Rev.11.00 Sep 07, 2005 page 7 of 7

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0