Raytek MI3 Operating Manual

MI3

Miniature Infrared Sensor

Operating Instructions

Rev. G Nov/2015

55201

Contacts

Raytek Corporation
Worldwide Headquarters
Santa Cruz, CA USA
Tel:	+1 800 227 – 8074
	(USA and Canada only)
+1 831 458 – 3900
solutions@raytek.com
European Headquarters		France	United Kingdom
Berlin, Germany
Tel: +49 30 4 78 00 80		info@raytek.fr	ukinfo@raytek.com
raytek@raytek.de
Fluke Service Center
Beijing, China
Tel:	+86 10 6438 4691

info@raytek.com.cn

Internet: http://www.raytek.com/

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WARRANTY

The manufacturer warrants this product to be free from defects in material and workmanship under normal use and service for the period of two years from date of purchase, except as hereinafter provided. This warranty extends only to the original purchaser (a purchase from the manufacturer or a licensed distributor of the manufacturer is an original purchase). This warranty shall not apply to fuses, batteries, or any product which has been subject to misuse, neglect, accident, or abnormal conditions of operation.

In the event of failure of a product covered by this warranty, the manufacturer will repair the instrument when it is returned by the purchaser, freight prepaid, to an authorized Service Facility within the applicable warranty period, provided manufacturer’s examination discloses to its satisfaction that the product was defective. The manufacturer may, at its option, replace the product in lieu of repair. With regard to any covered product returned within the applicable warranty period, repairs or replacement will be made without charge and with return freight paid by the manufacturer, unless the failure was caused by misuse, neglect, accident, or abnormal conditions of operation or storage, in which case repairs will be billed at a reasonable cost. In such a case, an estimate will be submitted before work is started, if requested.

THE FOREGOING WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS, OR ADEQUACY FOR ANY PARTICULAR PURPOSE OR USE. THE MANUFACTURER SHALL NOT BE LIABLE FOR ANY SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER IN CONTRACT, TORT, OR OTHERWISE.

SOFTWARE WARRANTY

The manufacturer does not warrant that the software described herein will function properly in every hardware and software environment. This software may not work in combination with modified or emulated versions of Windows operating environments, memory-resident software, or on computers with inadequate memory. The manufacturer warrants that the program disk is free from defects in material and workmanship, assuming normal use, for a period of one year. Except for this warranty, the manufacturer makes no warranty or representation, either expressed or implied, with respect to this software or documentation, including its quality, performance, merchantability, or fitness for a particular purpose. As a result, this software and documentation are licensed “as is,” and the licensee (i.e., the user) assumes the entire risk as to its quality and performance. The liability of the manufacturer under this warranty shall be limited to the amount paid by the User. In no event shall the manufacturer be liable for any costs including but not limited to those incurred as a result of lost profits or revenue, loss of use of the computer software, loss of data, the cost of substitute software, claims by third parties, or for other similar costs. The manufacturer’s software and documentation are copyrighted with all rights reserved. It is illegal to make copies for another person.

Specifications subject to change without notice.

The device complies with the requirements of the European Directives.

EC – Directive 2004/108/EC (EMC)

EC – Directive 2006/95/EC (low voltage)

	Content
CONTENT.............................................................................................................................................................	5
1 SAFETY INSTRUCTIONS............................................................................................................................	10
2 DESCRIPTION................................................................................................................................................	13
2.1 OVERVIEW COMM BOXES ··························································································································· 14
3 TECHNICAL DATA.......................................................................................................................................	15
3.1 MEASUREMENT SPECIFICATION ················································································································· 15
3.1.1 Sensing Heads .....................................................................................................................................	15
3.1.2 Comm Box ...........................................................................................................................................	16
3.1.2.1 Comm Box (metal) .....................................................................................................................................	16
3.1.2.2 Comm Box (DIN)........................................................................................................................................	16

3.2OPTICAL CHARTS ······································································································································· 17

3.3ELECTRICAL SPECIFICATION······················································································································· 18

3.3.1 Comm Box, all models .........................................................................................................................	18
3.3.2 Comm Box (metal) ..............................................................................................................................	18
3.3.3 Comm Box (DIN 6TE, analog) ...........................................................................................................	18
3.4 ENVIRONMENTAL SPECIFICATION ············································································································· 19
3.4.1 Sensing Head.......................................................................................................................................	19
3.4.2 Comm Box (metal) ..............................................................................................................................	19
3.4.3 Comm Box (DIN)................................................................................................................................	20
3.4.4 LTH Electronics ..................................................................................................................................	20
3.5 DIMENSIONS ··············································································································································· 21
3.5.1 Sensing Head LT, G5 ..........................................................................................................................	21
3.5.2 Sensing Head LTH ..............................................................................................................................	21
3.5.3 Sensing Head 1M, 2M ........................................................................................................................	21
3.5.4 Comm Box (metal) ..............................................................................................................................	21
3.5.5 Comm Box (DIN)................................................................................................................................	22
3.6 SCOPE OF DELIVERY···································································································································· 22
3.6.1 Sensing Head.......................................................................................................................................	22
3.6.2 Comm Box ...........................................................................................................................................	23
4 BASICS .............................................................................................................................................................	24

4.1MEASUREMENT OF INFRARED TEMPERATURE ··························································································· 24

4.2EMISSIVITY OF TARGET OBJECT ·················································································································· 24

4.3AMBIENT TEMPERATURE ···························································································································· 24

4.4ATMOSPHERIC QUALITY····························································································································· 24

4.5ELECTRICAL INTERFERENCE ······················································································································· 24


5 INSTALLATION ............................................................................................................................................		26
5.1	POSITIONING··············································································································································· 26
5.1.1 Distance to Object ...............................................................................................................................		26
5.2	INSTALLATION SCHEMES···························································································································· 26
5.2.1 Comm Box (metal) ..............................................................................................................................		26
5.2.2 Comm Box (DIN)................................................................................................................................		27
5.3	WIRING, HEAD CABLE ······························································································································· 27
5.3.1 Comm Box (metal) ..............................................................................................................................		28
5.3.2 Comm Box (DIN)................................................................................................................................		29

5.4 WIRING, TERMINAL ··································································································································· 29
5.4.1 Comm Box (metal) ..............................................................................................................................	29
5.4.2 Comm Box (DIN 3TE) .......................................................................................................................	30
5.4.3 Comm Box (DIN 4 TE) ......................................................................................................................	31
5.4.4 Comm Box (DIN 6 TE) ......................................................................................................................	32
5.4.5 EMI Resistance for Comm Box (DIN)................................................................................................	35
5.5 POWER ON PROCEDURE ···························································································································· 36
5.5.1 One Head System ...............................................................................................................................	36
5.5.2 Multiple Heads – Random Address Assignment ...............................................................................	36
5.5.3 Multiple Heads – User Controlled Address Assignment ...................................................................	36

5.6USB····························································································································································· 37

5.7FIELDBUS ···················································································································································· 39

5.7.1 Addressing ..........................................................................................................................................	39
5.7.2 RS485 based Installations...................................................................................................................	39
6 OUTPUTS ........................................................................................................................................................	40

6.1ANALOG OUTPUT OUT1 ··························································································································· 40

6.2ANALOG OUTPUT OUT2 ··························································································································· 40

6.3ANALOG OUTPUTS OUT1 - OUT4············································································································ 41

6.4ALARM OUTPUT RELAY··························································································································· 41

6.5THERMOCOUPLE OUTPUT TC···················································································································· 42

7 INPUTS ............................................................................................................................................................

7.1EMISSIVITY (ANALOG)································································································································ 43

7.2EMISSIVITY (DIGITAL) ································································································································· 44

7.3AMBIENT TEMPERATURE COMPENSATION································································································ 44

7.4TRIGGER/HOLD ·········································································································································· 46

7.5LASER SWITCHING ····································································································································· 47

8 OPERATION...................................................................................................................................................

8.1CONTROL PANEL ······································································································································· 48

8.2<HEAD> PAGE ············································································································································ 50

8.3<BOX SETUP> PAGE ···································································································································· 51

8.4<BOX INFO> PAGE ······································································································································ 53

8.5POST PROCESSING ······································································································································ 53

8.5.1 Averaging ...........................................................................................................................................	53
8.5.2 Peak Hold............................................................................................................................................	54
8.5.3 Valley Hold .........................................................................................................................................	54
8.5.4 Advanced Peak Hold...........................................................................................................................	55
8.5.5 Advanced Valley Hold ........................................................................................................................	56
8.5.6 Advanced Peak Hold with Averaging.................................................................................................	56
8.5.7 Advanced Valley Hold with Averaging ..............................................................................................	56
9 OPTIONS.........................................................................................................................................................	57
9.1 WATER COOLED HOUSING (1M, 2M HEADS)··························································································· 57
9.1.1 Avoidance of Condensation ................................................................................................................	58
9.2 INTRINSIC SAFETY ······································································································································ 59
9.2.1 Sensing Heads ....................................................................................................................................	59
9.2.2 Ex Power Supply RAYMI3ACISx .....................................................................................................	59
9.2.3 Installation..........................................................................................................................................	60

9.2.4 Mains Supply ......................................................................................................................................	61
9.2.5 Ex Power Supply 115MI3ACIS / 230MI3ACIS ................................................................................	63
10 ACCESSORIES..............................................................................................................................................	64
10.1 ACCESSORIES (ALL MODELS) ···················································································································· 64
10.1.1 Multi-Channel Box ...........................................................................................................................	64
10.1.2 USB/RS485 Adapter .........................................................................................................................	67
10.2 ACCESSORIES (LT, G5 HEADS)················································································································· 68
10.2.1 Adjustable Mounting Bracket ...........................................................................................................	69
10.2.2 Fixed Mounting Bracket ...................................................................................................................	70
10.2.3 Air Purge Jacket ................................................................................................................................	70
10.2.4 Air Cooling System ...........................................................................................................................	71
10.2.5 Right Angle Mirror...........................................................................................................................	75
10.2.6 Protective Windows ..........................................................................................................................	76
10.2.7 Close Focus Lens ...............................................................................................................................	76
10.3 ACCESSORIES (1M, 2M HEADS) ··············································································································· 78
10.3.1 Fixed Mounting Bracket ...................................................................................................................	79
10.3.2 Adjustable Mounting Bracket ...........................................................................................................	80
10.3.3 Isolation Kit.......................................................................................................................................	81
10.3.4 Air Purge Collar................................................................................................................................	81
10.3.5 Right Angle Mirror...........................................................................................................................	82
10.3.6 Protective Window ............................................................................................................................	83
11 MAINTENANCE ..........................................................................................................................................	84

11.1TROUBLESHOOTING MINOR PROBLEMS··································································································· 84

11.2FAIL-SAFE OPERATION ····························································································································· 84

11.3CLEANING THE LENS ································································································································ 85

11.4SENSING HEAD EXCHANGE······················································································································ 86

12 DATATEMP MULTIDROP SOFTWARE ................................................................................................

12.1SOFTWARE FEATURES ······························································································································· 87

12.2PC REQUIREMENTS··································································································································· 87

12.3USB DRIVER INSTALLATION ···················································································································· 87

12.4SOFTWARE LAUNCH ································································································································· 87

13 RS485 ...............................................................................................................................................................	88
13.1 WIRING ····················································································································································· 88
13.1.1 Comm Box (metal).............................................................................................................................	88
13.1.2 Comm Box (DIN)..............................................................................................................................	88
13.2 ASCII PROGRAMMING ····························································································································· 88
14 PROFIBUS......................................................................................................................................................	89
14.1 WIRING ····················································································································································· 89
14.1.1 Comm Box (metal).............................................................................................................................	89
14.1.2 Comm Box (DIN)..............................................................................................................................	91
14.2 PROGRAMMING ········································································································································ 92
14.2.1 Parameter Data .................................................................................................................................	92
14.2.2 Input Data.........................................................................................................................................	93
14.2.3 Output Data......................................................................................................................................	94
14.2.4 Diagnose Data...................................................................................................................................	94
15 MODBUS .......................................................................................................................................................	97

15.1 WIRING····················································································································································· 97
15.1.1 Comm Box (metal) ............................................................................................................................	97
15.1.2 Comm Box (DIN) .............................................................................................................................	98
15.2 PROGRAMMING ········································································································································ 99
15.2.1 Supported Functions ........................................................................................................................	99
15.2.2 Parameter Data.................................................................................................................................	99
15.2.2.1 Box Parameter...........................................................................................................................................	99
15.2.2.2 Head Parameter......................................................................................................................................	101
16 ETHERNET..................................................................................................................................................	103
16.1 WIRING··················································································································································· 103
16.1.1 Comm Box (metal) ..........................................................................................................................	103
16.1.2 Comm Box (DIN) ...........................................................................................................................	103
16.2 ADDRESSING··········································································································································· 104
16.2.1 MI3 .................................................................................................................................................	104
16.2.2 PC Network Adapter ......................................................................................................................	105

16.3ASCII PROGRAMMING··························································································································· 106

16.4HTTP SERVER ·········································································································································· 107

16.4.1 Data Logging ..................................................................................................................................	107
17 PROFINET ...................................................................................................................................................	109
17.1 WIRING··················································································································································· 109
17.1.1 Status LED .....................................................................................................................................	109
17.2 PROGRAMMING ······································································································································ 110
17.2.1 I/O Device Configuration ...............................................................................................................	110
17.2.1.1 GSD File...................................................................................................................................................	110
17.2.1.2 Configuration..........................................................................................................................................	110
17.2.2 Parameter Setting ...........................................................................................................................	110
17.2.2.1 Parameters of the Fieldbus Communicator ........................................................................................	111
17.2.2.2 Parameters of the Pyrometer Module..................................................................................................	113
17.2.3 Input Data Structure......................................................................................................................	114
17.2.3.1 Input Data of Fieldbus Communicator ...............................................................................................	114
17.2.3.2 Input Data of Pyrometer Module.........................................................................................................	114
17.2.4 Output Data Structure...................................................................................................................	114
17.2.5 Diagnostics .....................................................................................................................................	114
18 ASCII PROGRAMMING .........................................................................................................................	116

18.1TRANSFER MODES·································································································································· 116

18.2COMMAND STRUCTURE ························································································································· 116

18.3ADDRESSING··········································································································································· 117

18.4DEVICE INFORMATION··························································································································· 118

18.5DEVICE SETUP ········································································································································ 118

18.5.1 Temperature Calculation ................................................................................................................	118
18.5.2 Temperature Pre-Processing...........................................................................................................	118
18.5.3 Emissivity Setting and Alarm Set points .......................................................................................	119
18.5.4 Post Processing ...............................................................................................................................	119

18.6DYNAMIC DATA····································································································································· 120

18.7DEVICE CONTROL ·································································································································· 120

18.7.1 Output for the Target Temperature................................................................................................	120
18.7.2 Analog Output, Scaling .................................................................................................................	120
18.7.3 Alarm Output.................................................................................................................................	120

18.7.4 Factory default values .....................................................................................................................	121
18.7.5 Lock Mode .......................................................................................................................................	121
18.7.6 Mode Setting for the Digital Input FTC3 .......................................................................................	121
18.7.7 Ambient Background Temperature Compensation .........................................................................	121
18.8 COMMAND SET ······································································································································· 121
18.8.1 ASCII Commands for Ethernet and Profinet ..................................................................................	127
19 APPENDIX ...................................................................................................................................................	128

19.1DETERMINATION OF EMISSIVITY ············································································································ 128

19.2TYPICAL EMISSIVITY VALUES ················································································································· 128

19.3ATEX CERTIFICATE OF CONFORMITY FOR SENSING HEADS································································· 132

19.4ATEX CERTIFICATE OF CONFORMITY FOR EX POWER SUPPLY ····························································· 135

19.5IECEX CERTIFICATE OF CONFORMITY FOR SENSING HEADS ································································ 138

19.6IECEX CERTIFICATE OF CONFORMITY FOR POWER SUPPLY·································································· 142

20 NOTES ..........................................................................................................................................................

146

Safety Instructions

1 Safety Instructions

This document contains important information, which should be kept at all times with the instrument during its operational life. Other users of this instrument should be given these instructions with the instrument. Eventual updates to this information must be added to the original document. The instrument should only be operated by trained personnel in accordance with these instructions and local safety regulations.

Acceptable Operation

This instrument is intended only for the measurement of temperature. The instrument is appropriate for continuous use. The instrument operates reliably in demanding conditions, such as in high environmental temperatures, as long as the documented technical specifications for all instrument components are adhered to. Compliance with the operating instructions is necessary to ensure the expected results.

Unacceptable Operation

The instrument should not be used for medical diagnosis.

Replacement Parts and Accessories

Use only original parts and accessories approved by the manufacturer. The use of other products can compromise the operational safety and functionality of the instrument.

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MI3

Safety Instructions

Safety Symbols

AC (Alternating Current)

DC (Direct Current)

Risk of danger. Important information. See manual.

Hazardous voltage. Risk of electrical shock.

Helpful information regarding the optimal use of the instrument.

Earth ground

Protective ground

Fuse

Normally-open (NO) relay

Normally-closed (NC) relay

Switch or relay contact

DC power supply

Conforms to European Union directive.

Disposal of old instruments should be handled according to professional and environmental regulations as electronic waste.

Conforms to relevant South Korean EMC Standards.

MI3

Rev. G Nov/2015

Safety Instructions

The instrument can be equipped with a Class 2 laser. Class 2 lasers shine only within the visible spectrum at an intensity of 1 mW. Looking directly into the laser beam can produce a slight, temporary blinding effect, but does not result in physical injury or damage to the eyes, even when the beam is magnified by optical aids. At any rate, closing the eye lids is encouraged when eye contact is made with the laser beam. Pay attention to possible reflections of the laser beam. The laser functions only to locate and mark surface measurement targets. Do not aim the laser at people or animals.

To prevent possible electrical shock, fire, or personal injury follow these guidelines:

Read all safety Information before you use the product.

Use the product only as specified, or the protection supplied by the product can be compromised.

Carefully read all instructions.

Do not use and disable the product if it is damaged.

Do not use the product if it operates incorrectly.

Make sure the ground conductor in the mains power cord is connected to a protective earth ground. Disruption of the protective earth could put voltage on the chassis that could cause death.

Replace the mains power cord if the insulation is damaged or if the insulation shows signs of wear.

Use in 110/230 VAC electrical systems can result in electrical hazards and personal injury, if not properly protected. All instrument parts supplied by electricity must be covered to prevent physical contact and other hazards at all times.

The system integrator is responsible for the final safety of the system.

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MI3

Description

2 Description

The MI3 sensor series is the next generation of the well-established “MI class” sensor platform. It will be capable of covering a broad range of applications. The MI3 sensor series introduces various network communications, an externally accessible user interface, improved temperature measurement specifications and capabilities at an economic price.

The MI3 series comes with the following highlights:

Rugged sensing heads survive ambient temperatures to 120°C (248°F) including optimized performance due to ambient temperature calibration across full ambient temperature range

Special high ambient temperature heads available withstanding up to 180°C (356°F) without any cooling (LTH models)

Multi head system architecture to allow multiple sensing heads to be multiplexed from a single communication box

Stand-alone OEM sensing head operation

Intrinsically safe sensing head with Ex Power Supply for installation in hazardous areas (ATEX)

Precision high resolution optics up to 100:1

Up to 10 ms response time

Alarm status indicator

Standard USB 2.0 digital interface

Analog outputs with galvanic isolation

Alarm relay output

Serial RS485 communication interface with the protocols: ASCII, Profibus, Modbus®1

Ethernet communication interface with the protocols: ASCII, http, Profinet IO

Automatic sensing head identification

Includes DataTemp® Multidrop software for sensor configuration and monitoring

Field calibration software

1 Modbus is a registered trademark of Modbus Organization, Inc.

MI3

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Description

2.1 Overview Comm Boxes

MI3COMM

MI3MCOMMN

MI3MCOMM

MI3MCOMM…

metal box

DIN 3TE

DIN 4TE

DIN 6TE

Part number

MI3COMM…

MI3MCOMMN

MI3MCOMM

MI3MCOMM…

Spectral Heads1

LT, G5, 1M, 2M

Head Support

by firmware

8 heads

by terminal

1 head

4 heads

Control panel

Display



–



Buttons



–



Outputs

mA/V

–

4x (optional …A)

–

Relay

Inputs

Emissivity (analog)



–

Emissivity (digital)



–

Ambient Temp. Compensation



–

Trigger/Hold Function



Laser Switching



Interfaces

USB

Standard

RS485

Option (…4)

–

Standard

–

Protocols

ASCII

Standard

Profibus

Option (…P1, …P2)

–

Option (…P)

Modbus

Option (…M)

–

Option (…M)

Profinet

Option (…PN)

–

Option (…PN)

Ethernet

Option (…E)

–

Option (…E)

Table 1: Capabilities of Communication Boxes

1 1M, 2M spectral heads require box firmware revision 2.11 or higher

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MI3

Technical Data

3 Technical Data

3.1 Measurement Specification

3.1.1 Sensing Heads

Temperature Range

LTS02, LTS10, LTH10	-40 to 600°C (-40 to 1112°F)
LTS20, LTF, LTH20	0 to 1000°C (32 to 1832°F)
G5	250 to 1650°C (482 to 3002°F)
2M	250 to 1400°C (482 to 2552°F)
1M	500 to 1800°C (932 to 3272°F)
Spectral Response
LT	8 to 14 µm
G5	5 µm
2M	1.6 µm
1M	1 µm
Optical Resolution D:S1
LTS	2:1, 10:1, 22:1 typ. (21:1 guaranteed)
LTF	10:1
LTH	10:1, 22:1 typ. (21:1 guaranteed)
G5	10:1
1M, 2M	100:1
	SF1 optics: 2 mm spot @ 200 mm distance (0.08 in @ 7.9 in)
	SF3 optics: 22 mm spot @ 2200 mm distance (0.87 in @ (8.7 in)
Response Time2
LTS (standard), LTH	130 ms
LTF (fast)	20 ms
G5	130 ms
1M, 2M	10 ms3
Accuracy4
LT, G5	± (1% of reading or 1°C), whichever is greater
	± 2°C (± 4°F) for target temp. < 20°C (68°F)
1M, 2M	± (0.5% of reading + 2°C)
Repeatability
LT, G5	± 0.5% of reading or ± 0.5°C, whichever is greater
1M, 2M	± 0.25% of reading + 1°C
Temperature Coefficient5
LT, G5	± 0.05 K / K or ± 0.05% of reading / K, whichever is greater
1M, 2M	0.01% of reading / K

1at 90% energy in minimum and distance 400 mm (15.7 in.)

290% response

330 ms – if more than one sensing head drives an analog output of the communication box

4at ambient temperature 23°C ±5°C (73°F ±9°F), ε = 1.0, and calibration geometry

5ambient temperature deviations related to 23°C

MI3

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Technical Data

3.1.2 Comm Box

Accuracy
mA/V output	± 1°C
	(corresponds to ± 0.015 mA for the current output at 0-20 mA
	or ± 0.015 mA for the current output at 4-20 mA
	or 4 mV for the voltage output at 0-5 V
	or 8 mV for the voltage output at 0-10 V)
TC output	± 1.5°C
Temperature Resolution
mA/V Output	± 0.1°C (± 0.2°F)1 / 12 bit, for Comm Box (metal)
mA/V Output	± 0.02°C (± 0.04°F) / 16 bit, for Comm Box (DIN 6TE, analog)
Temperature Coefficient
mA/V Output	± 0.02 K / K
TC Output	± 0.05 K / K
Emissivity
All models	0.100 to 1.100
Transmission
All models	0.100 to 1.000
3.1.2.1 Comm Box (metal)
Loop Time
mA/V Output
LTS, G5	8 ms
LTF, 1M, 2M	4 ms
digital	18 ms * number of connected heads
3.1.2.2 Comm Box (DIN)
Loop Time
digital
LTS, G5	8 ms2 * number of connected heads
LTF, 1M, 2M	4 ms3 * number of connected heads

1for a zoomed temperature span of < 500°C (932°F)

2per bus channel

3per bus channel

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MI3

Technical Data

3.2 Optical Charts

Figure 1: Spot Size Charts

MI3

Rev. G Nov/2015

Technical Data

3.3 Electrical Specification

For an overview to the capabilities of the communication boxes, see section 2.1 Overview Comm Boxes, page 14.

3.3.1 Comm Box, all models

Voltage Supply	8 to 32 VDC
Power Consumption	max. 6 W

Alarm Output

1 potential-free relay output, 48 V / 300 mA

Relay with wear-free contacts (solid state relay) for target temperature or head ambient temperature, electrically isolated from power supply

USB Interface

Version: 2.0

Connector on the board: type Mini-B

3.3.2 Comm Box (metal)

Analog Outputs
Output 1	0 to 5/10 V output for head ambient temperature and object temperature
	electrically not isolated from power supply
Thermocouple	J: -40 to 600°C (-40 to 1112°F)
	K: -40 to 800°C (-40 to 1472°F)
	R/S: 250 to 1800°C (482 to 3272°F)
Output 2	0 to 20 mA (active), or
	4 to 20 mA (active), or
	0 to 5 V, or
	0 to 10 V
	electrically not isolated from power supply

External Inputs

3 inputs are available useable in different modes:

FTC1-3	Emissivity control: 3 bit digital coded, 0 to VSS
FTC1	Emissivity control: analog, 0 to 5 VDC
FTC2	Ambient temperature compensation analog: 0 to 5 VDC
FTC3	for trigger/hold/laser functions, 0 to VSS
3.3.3 Comm Box (DIN 6TE, analog)
Analog Outputs
Output 1 to 4	0 to 20 mA (active), or
	4 to 20 mA (active), or
	0 to 5 V, or

0 to 10 V

Each output is galvanically isolated from the other and from power supply!

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MI3

Technical Data

3.4 Environmental Specification

3.4.1 Sensing Head

Ambient Temperature
LT, G5	-10 to 120°C (14 to 248°F)
LTH	-10 to 180°C (14 to 356°F)
1M, 2M	0 to 120°C (32 to 248°F)
Laser (1M, 2M)	automatic switch off at 65°C (149°F)
Storage Temperature
LTH	-20 to 180°C (-4 to 356°F)
all other models	-20 to 120°C (-4 to 248°F)
Rating	IP65 (NEMA-4) / IEC 60529
Relative Humidity	10% to 95% non-condensing
EMC	EN 61326-1:2006
KCC	Electromagnetic Compatibility Applies to use in Korea only. Class A
	Equipment (Industrial Broadcasting & Communication Equipment)
	This product meets requirements for industrial (Class A) electromagnetic wave equipment and
	the seller or user should take notice of it. This equipment is intended for use in business
	environments and is not to be used in homes.
Vibration	11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock	50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
Weight
LT, G5	50 g (1.8 oz)
1M, 2M	233 g (8.2 oz)
Material
Head	Stainless steel
Head Cable
LTH	Teflon®
all other models	PUR (Polyurethane), Halogen free, Silicone free

Teflon develops poisonous gasses when it comes into contact with flames!

3.4.2 Comm Box (metal)

Ambient Temperature	-10 to 65°C (14 to 149°F)
Storage Temperature	-20 to 85°C (-4 to 185°F)
Rating	IP65 (NEMA-4) / IEC 60529
Relative Humidity	10% to 95% non-condensing
EMC	EN 61326-1:2006

MI3

Rev. G Nov/2015

Technical Data

KCC	Electromagnetic Compatibility Applies to use in Korea only. Class A
	Equipment (Industrial Broadcasting & Communication Equipment)
	This product meets requirements for industrial (Class A) electromagnetic
	wave equipment and the seller or user should take notice of it. This
	equipment is intended for use in business environments and is not to be
	used in homes.
Vibration	11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock	50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
Weight	370 g (13 oz)
Material	die-cast zinc enclosure

3.4.3 Comm Box (DIN)

Ambient Temperature	-10 to 65°C (14 to 149°F)
Storage Temperature	-20 to 85°C (-4 to 185°F)
Relative Humidity	10% to 95% non-condensing
EMC	EN 61326-1:2006
KCC	Electromagnetic Compatibility Applies to use in Korea only. Class A
	Equipment (Industrial Broadcasting & Communication Equipment)
	This product meets requirements for industrial (Class A) electromagnetic
	wave equipment and the seller or user should take notice of it. This
	equipment is intended for use in business environments and is not to be
	used in homes.
Vibration	11 to 200 Hz, 3 g above 25 Hz operating, 3 axes / IEC 60068-2-6
Shock	50 g, 11 ms, operating, 3 axes / IEC 60068-2-27
Weight	125 g (4.4 oz)
Material	molded plastic

3.4.4 LTH Electronics

Ambient Temperature	-10 to 65°C (14 to 149°F)
Storage Temperature	-20 to 85°C (-4 to 185°F)
Rating	IP65 (NEMA-4) / IEC 60529

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MI3

Technical Data

3.5 Dimensions

3.5.1 Sensing Head LT, G5

Standard cable length 1 m (3 ft.)

Ø 5 mm (0.2 in)

Figure 2: Dimensions of LT, G5 Sensing Heads

3.5.2 Sensing Head LTH

Figure 3: Dimensions of LTH Sensing Head with separated Electronics

3.5.3 Sensing Head 1M, 2M

Standard cable length 1 m (3 ft)

Ø 5 mm (0.2 in)

Figure 4: Dimensions of 1M, 2M Sensing Heads

3.5.4 Comm Box (metal)

The box is equipped with three cable feed-through ports – two with IP65 compatible sealing glands, a third sealing gland comes for boxes with fieldbus communications (RS485, Profibus etc.). Boxes without fieldbus have a plugged expansion feed-through port instead (M12x1.5 thread).

MI3

Rev. G Nov/2015

Technical Data

Figure 5: Dimensions of Communication Box

3.5.5 Comm Box (DIN)

The boxes come in a standard DIN rail size in accordance to EN 50022-35x7.5 (DIN 43880).


Width	MI3MCOMMN	MI3MCOMM	MI3MCOMM…
X	DIN 3TE:	DIN 4TE:	DIN 6TE:
	53.6 mm (2.1 in)	71.6 mm (2.8 in)	107.6 mm (4.2 in)

Figure 6: Dimensions for Comm Boxes (DIN)

3.6 Scope of Delivery

3.6.1 Sensing Head

Sensing head with cable

Integrated Laser (1M, 2M heads only)

Mounting nut

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MI3

Technical Data

3.6.2 Comm Box

Communication box

for Comm Box (DIN) only - XXXMI3MCOMMSET: ferrite cores (4 pcs), shield tapes (4 pcs)

Software DVD

Quickstart guide

MI3

Rev. G Nov/2015

Basics

4 Basics

4.1 Measurement of Infrared Temperature

All surfaces emit infrared radiation. The intensity of this infrared radiation changes according to the temperature of the object. Depending on the material and surface properties, the emitted radiation lies in a wavelength spectrum of approximately 1 to 20 µm. The intensity of the infrared radiation (heat radiation) is dependent on the material. For many substances, this material-dependent constant is known. This constant is referred to as the ”emissivity value”.

Infrared thermometers are optical-electronic sensors. These sensors are sensitive to the emitted radiation. Infrared thermometers are made up of a lens, a spectral filter, a sensor, and an electronic signal processing unit. The task of the spectral filter is to select the wavelength spectrum of interest. The sensor converts the infrared radiation into an electrical signal. The signal processing electronics analyze the electrical signal and convert it into a temperature measurement. As the intensity of the emitted infrared radiation is dependent on the material, the required emissivity can be selected on the sensor.

The biggest advantage of the infrared thermometer is its ability to measure temperature without touching an object. Consequently, surface temperatures of moving or hard to reach objects can easily be measured.

4.2 Emissivity of Target Object

To determine the emissivity of the target object see section 19.1 Determination of Emissivity, page 128. If emissivity is low, measured results could be falsified by interfering infrared radiation from background objects (such as heating systems, flames, fireclay bricks, etc. located close beside or behind the target object). This type of problem can occur when measuring reflective surfaces and very thin materials, such as plastic film and glass.

This measurement error can be reduced to a minimum, if particular care is taken during installation and the sensing head is shielded from these reflecting radiation sources.

4.3 Ambient Temperature

The sensing head is suited for the ambient temperatures up to 120°C (248°F) for the standard heads and up to 180°C (356°F) for the LTH heads. The sensing head can operate in ambient temperatures up to 200°C (392°F) with the air-cooling accessory.

4.4 Atmospheric Quality

If the lens gets dirty, infrared energy will be blocked and the instrument will not measure accurately. It is good practice to always keep the lens clean. The Air Purge Jacket helps keep contaminants from building up on the lens. If you use air purging, make sure a filtered air supply with clean dry air at the correct air pressure is installed before proceeding with the sensor installation.

4.5 Electrical Interference

To minimize electrical or electromagnetic interference or “noise”, please be aware of the following:

Mount the unit as far away as possible from potential sources of electrical interference, such as motorized equipment, which can produce large step load changes.

Use shielded wire for all input and output connections.

To avoid current equalizations, make sure that a sufficient potential equalization is realized between the sensing head and metal housing of the communication box.

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MI3

Basics

To avoid ground loops, make sure that only one point is earth grounded, either via the sensing head, the Comm Box, or power.

Please note that:

The metal housings of the sensing head and the MI3 communication box are electrically connected to the shield of the head cable.

All inputs and outputs (except the alarm output and the outputs of the Comm Box (DIN 6TE, analog)) use the same ground and are electrically connected to the power supply.

Figure 7: Shield Run for Comm Box (metal)

Figure 8: Shield Run for Comm Box (DIN)

Head

Box

Power

Shield

Figure 9: Only one point is earth grounded either via sensing head, via Comm Box, or via Power

MI3

Rev. G Nov/2015

Installation

5 Installation

5.1 Positioning

Sensor location depends on the application. Before deciding on a location, you need to be aware of the ambient temperature of the location, the atmospheric quality of the location, and the possible electromagnetic interference in that location. If you plan to use air purging, you need to have an air connection available. Wiring and conduit runs must be considered, including computer wiring and connections, if used.

5.1.1 Distance to Object

The desired spot size on the target will determine the maximum measurement distance. To avoid erroneous readings, the target spot size must completely fill the entire field of view of the sensor. Consequently, the sensor must be positioned so the field of view is the same as or smaller than the desired target size. For a list indicating the available optics, see section 3.2 Optical Charts, page 17.

The actual spot size for any distance can be calculated by using the following formula. Divide the distance D by your model’s D:S number. For example, for a unit with D:S = 10:1, if the sensor is

400 mm (15.7 in.) from the target, divide 400 by 10 (15.7 by 10), which gives you a target spot size of approximately 40 mm (1.57 in.).

best

critical

incorrect

Sensor

Background

Target greater than spot size

Target equal to spot

Targets smaller than spot size

Figure 10: Proper Sensor Placement

5.2 Installation Schemes

5.2.1 Comm Box (metal)

The basic stand-alone configuration consists of one sensing head interfaced to one metallic communications box. The sensing head provides all IR measurement functionality. The communications box provides an externally accessibly user interface and display, advanced signal processing capability, field wiring terminations and fieldbus functionality with optional RS485 communication interface.

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MI3

		Installation
Power supply,	Comm Box
2 analog	(RAYMI3COMM)	Head 1
outputs,		(RAYMI3…)
3 inputs
Fieldbus

Figure 11: Single Head Configuration with Comm Box

To increase the number of supported sensing heads, you can use a dedicated accessory, see section 10.1.1 Multi-Channel Box, page 64.

5.2.2 Comm Box (DIN)

The multiple sensing head configuration consists of a modular communication box provided in a DIN rail mountable plastic enclosure for supporting 4 sensing heads simultaneously. The DIN rail communication box provides an externally accessibly user interface. The terminal strip connectors are

used to simplify the field wiring.

Power supply 1 alarm output, 1 trigger input

Fieldbus or

4x analog

DIN Rail Comm Box

(RAYMI3MCOMM)

Total length:	max. 30 m (98 ft)
Total length:	max. 30 m (98 ft)

Max. 8 Sensing Heads

(RAYMI3…)

Figure 12: Multiple Head Configuration with DIN Rail Comm Box

5.3 Wiring, Head Cable

The user has to install the sensor cable on the communication box. It may be shortened, if necessary, but keep a minimal length of 20 cm (7.9 in).

Do not bend the sensing head cable tighter than a radius of 25 mm (1 in.) for the standard heads (PUR cable) and 15 mm (0.6 in.) for the high ambient temperature heads (Teflon cable) respectively!

To prevent possible fluctuating temperature readings or damages to the device make sure that the sensor head is grounded before use!

MI3

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Installation

The total sensing head cable length for all networked sensing heads must not exceed 30 m (98 ft) for MI3 and 2x30 m (2x98 ft) for MI3M!

Do not add a third party cable to extend the length of the sensing head cable!

5.3.1Comm Box (metal)

1.Cut about 40 mm (1.5 in) of the cable sheath from the end of the sensing head cable . Caution: Do not cut into the shield!

2.Cut the shield so about 5 mm (0.2 in) remains exposed from under the cable sheath. Separate the shield and spread the strands out.

3.Strip 3 mm (0.12 in) of insulation from the wires !

4.Open the communication box by removing the four Phillips head screws and pulling off the

lid. Unscrew the pressure screw , and remove the first metal washer , the rubber washer , and the second and the third metal washers .

5.Put the following on the cable: the pressure screw , the first metal washer , the rubber washer and the second metal washers , see the following figure.

6.Spread the cable shield and then slip the third metal washer onto the cable. Note that the shield must make good contact to both metal washers.

7.Slip the wires into the communication box far enough to connect to the terminal.

8.Screw the pressure screw into the communication box. Tighten snuggly. Do not over tighten.

9.Connect the wires to the terminal on the printed circuit board.

Cable and sensing head

Figure 13: Sensing Head Cable to the Comm Box

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MI3

Installation

5.3.2 Comm Box (DIN)

The wiring of the sensing head cable is color coded, see section 5.4.3 Comm Box (DIN 4 TE), page 31.

5.4 Wiring, Terminal

You need to connect the power supply and possibly the signal input/output wires. Use only cable with outside diameter from 4 to 6 mm (0.16 to 0.24 in), wire size: 0.14 to 0.75 mm² (AWG 19 to 26).

The cable must include shielded wires. It should not be used as a strain relief!

5.4.1 Comm Box (metal)

Sensing Head

Emissivity Control

Ambient Compensation

Trigger/Hold

Tobj Thead Tobj/Thead

Alarm: Tobj / Thead

Power Supply

Figure 14: Terminal Wiring for the Comm Box

MI3

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Installation

5.4.2 Comm Box (DIN 3TE)

Sensing

Heads

white

yellow

green

brown

shield

white

yellow

green

brown

shield

USB Connector, Mini-B

Shield

GND

V 32 - 8

RELAY

FTC3

GND

Figure 15: Terminal Wiring for the Comm Box DIN 3TE

Rev. G Nov/2015

MI3

+ 116 hidden pages

Raytek MI3 Operating Manual

Specifications and Main Features

Frequently Asked Questions

User Manual