RF12B
RF12B Universal ISM Band
FSK Transceiver
DESCRIPTION
Hope’s RF12B is a single chip, low power,
multi-channel FSK transceiver designed for use in
applications requiring FCC or ETSI conformance for
unlicensed use in the 433, 868 and 915 MHz bands. The
RF12B transceiver produces a flexible, low cost, and highly
integrated solution that does not require production
alignments. The chip is a complete analog RF and baseband
transceiver including a multi-band PLL synthesizer with PA,
LNA, I/Q down converter mixers, baseband filters and
amplifiers, and an I/Q demodulator. All required RF functions
are integrated. Only an external crystal and bypass filtering
are needed for operation.
The RF12B features a completely integrated PLL for easy RF design, and its rapid settling time
allows for fast frequency-hopping, bypassing multi-path fading and interference to achieve robust
wireless links. The PLL’s high resolution allows the usage of multiple channels in any of the bands. The
receiver baseband bandwidth (BW) is programmable to accommodate various deviation, data rate and
crystal tolerance requirements. The transceiver employs the Zero-IF approach with I/Q demodulation.
Consequently, no external components (except crystal and decoupling) are needed in most applications.
The RF12B dramatically reduces the load on the microcontroller with the integrated digital data
processing features: data filtering, clock recovery, data pattern recognition, integrated FIFO and TX data
register. The automatic frequency control (AFC) feature allows the use of a low accuracy (low cost)
crystal. To minimize the system cost, the RF12B can provide a clock signal for the microcontroller,
avoiding the need for two crystals.
For low power applications, the RF12B supports low duty cycle operation based on the internal
wake-up timer.
FUNCTIONAL BLOCK DIAGRAM
RF12B
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RF12B
FEATURES
z Fully integrated (low BOM, easy design-in)
z No alignment required in production
z Fast-settling, programmable, high-resolution PLL synthesizer
z Fast frequency-hopping capability
z High bit rate (up to 115.2 kbps in digital mode and 256 kbps
z in analog mode)
z Direct differential antenna input/output
z Integrated power amplifier
z Programmable TX frequency deviation (15 to 240 kHz)
z Programmable RX baseband bandwidth (67 to 400 kHz)
z Analog and digital RSSI outputs
z Automatic frequency control (AFC)
z Data quality detection (DQD)
z Internal data filtering and clock recovery
z RX synchron pattern recognition
z SPI compatible serial control interface
z Clock and reset signals for microcontroller
z 16 bit RX Data FIFO
z Two 8 bit TX data registers
z Low power duty cycle mode
z Standard 10 MHz crystal reference
z Wake-up timer
z 2.2 to 3.8 V supply voltage
z Low power consumption
z Low standby current (0.3 µA)
z Supports very short packets (down to 3 bytes)
z Excellent temperature stability of the RF parameters
TYPICAL APPLICATIONS
z Remote control
z Home security and alarm
z Wireless keyboard/mouse and other PC peripherals
z Toy controls
z Remote keyless entry
z Tire pressure monitoring
z Tel e me t ry
z Personal/patient data logging
z Remote automatic meter reading
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RF12B
DETAILED FEATURE-LEVEL DESCRIPTION
The RF12B FSK transceiver is designed to cover the unlicensed frequency bands at 433, 868 and
915 MHz. The device facilitates compliance with FCC and ETSI requirements.
The receiver block employs the Zero-IF approach with I/Q demodulation, allowing the use of a
minimal number of external components in a typical application. The RF12B incorporates a fully
integrated multi-band PLL synthesizer, PA with antenna tuning, an LNA with switch-able gain, I/Q down
converter mixers, baseband filters and amplifiers, and an I/Q demodulator followed by a data filter.
PLL
The programmable PLL synthesizer determines the operating frequency, while preserving accuracy
based on the on-chip crystal-controlled reference oscillator. The PLL’s high resolution allows the usage of
multiple channels in any of the bands.
RF Power Amplifier (PA)
The power amplifier has an open-collector differential output and can directly drive a loop antenna
with a programmable output power level. An automatic antenna tuning circuit is built in to avoid costly
trimming procedures and the so-called “hand effect”.
LNA
The LNA has approximately 250 Ohm input impedance, which functions well with the proposed
antennas.
If the RF input of the chip is connected to 50 Ohm devices, an external matching circuit is required to
provide the correct matching and to minimize the noise figure of the receiver.
The LNA gain can be selected in four steps (between 0 and -20dB relative to the highest gain)
according to RF signal strength. It can be useful in an environment with strong interferers.
Baseband Filters
The receiver bandwidth is selectable by
programming the bandwidth (BW) of the
baseband filters. This allows setting up the
receiver according to the characteristics of
the signal to be received.
An appropriate bandwidth can be
chosen to accommodate various FSK
deviation, data rate and crystal tolerance
requirements. The filter structure is 7th order
Butterworth low-pass with 40 dB suppression
at 2*BW frequency. Offset cancellation is
done by using a high-pass filter with a cut-off
frequency below 7 kHz.
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RF12B
Data Filtering and Clock Recovery
Output data filtering can be completed by an external capacitor or by using digital filtering according
to the final application.
Analog operation : The filter is an RC type low-pass filter followed by a Schmitt-trigger (St). The
resistor (10 kOhm) and the St are integrated on the chip. An (external) capacitor can be chosen
according to the actual bit rate. In this mode, the receiver can handle up to 256 kbps data rate. The FIFO
can not be used in this mode and clock is not provided for the demodulated data.
Digital operation : A digital filter is used with a clock frequency at 29 times the bit rate. In this mode
there is a clock recovery circuit (CR), which can provide synchronized clock to the data. Using this clock
the received data can fill a FIFO. The CR has three operation modes: fast, slow, and automatic. In slow
mode, its noise immunity is very high, but it has slower settling time and requires more accurate data
timing than in fast mode. In automatic mode the CR automatically changes between fast and slow mode.
The CR starts in fast mode, then after locking it automatically switches to slow mode.
(Only the digital data filter and the clock recovery use the bit rate clock. For analog operation, there
is no need for setting the correct bit rate.)
Data Validity Blocks
RSSI
A digital RSSI output is provided to monitor the input signal level. It goes high if the received signal
strength exceeds a given preprogrammed level. An analog RSSI signal is also available. The RSSI
settling time depends on the external filter capacitor. Pin 15 is used as analog RSSI output. The digital
RSSI can be monitored by reading the status register.
Analog RSSI Voltage vs. RF Input Power
P1 -65 dBm 1300 mV
P2 -65 dBm 1000 mV
P3 -100 dBm 600 mV
P4 -100 dBm 300 mV
DQD
The operation of the Data Quality Detector is based on counting the spikes on the unfiltered received
data. High output signal indicates an operating FSK transmitter within baseband filter bandwidth from the
local oscillator. DQD threshold parameter can be set by using the Data Filter Command.
AFC
By using an integrated Automatic Frequency Control (AFC) feature, the receiver can minimize the
TX/RX offset in discrete steps, allowing the use of:
z Narrower receiver bandwidth (i.e. increased sensitivity)
z Higher data rate
z Inexpensive crystals
Crystal Oscillator
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RF12B
The RF12B has a single-pin crystal oscillator circuit, which provides a 10 MHz reference signal for
the PLL. To reduce external parts and simplify design, the crystal load capacitor is internal and
programmable. Guidelines for selecting the appropriate crystal can be found later in this datasheet.
The transceiver can supply a clock signal for the microcontroller; so accurate timing is possible
without the need for a second crystal.
When the microcontroller turns the crystal oscillator off by clearing the appropriate bit using the
Configuration Setting Command , the chip provides a fixed number (196) of further clock pulses (“clock
tail”) for the microcontroller to let it go to idle or sleep mode. If this clock output is not used, turn the output
buffer off by the Power Management Command .
Low Battery Voltage Detector
The low battery detector circuit monitors the supply voltage and generates an interrupt if it falls below
a programmable threshold level. The detector circuit has 50mV hysteresis.
Wake-Up Timer
The wake-up timer has very low current consumption (1.5 µA typical) and can be programmed
from 1 ms to several days with an accuracy of ±5%.
It calibrates itself to the crystal oscillator at every startup, and then at every 30 seconds. When
the crystal oscillator is switched off, the calibration circuit switches it back on only long enough for a
quick calibration (a few milliseconds) to facilitate accurate wake-up timing even in case of changing
ambient temperature and supply voltage.
Event Handling
In order to minimize current consumption, the transceiver supports different power saving modes.
Active mode can be initiated by several wake-up events (negative logical pulse on nINT input, wake-up
timer timeout, low supply voltage detection, on-chip FIFO filled up or receiving a request through the
serial interface).
If any wake-up event occurs, the wake-up logic generates an interrupt signal, which can be used
to wake up the microcontroller, effectively reducing the period the microcontroller has to be active. The
source of the interrupt can be read out from the transceiver by the microcontroller through the SDO
pin.
Interface and Controller
An SPI compatible serial interface lets the user select the frequency band, center frequency of the
synthesizer, and the bandwidth of the baseband signal path. Division ratio for the microcontroller clock,
wake-up timer period, and low supply voltage detector threshold are also programmable. Any of these
auxiliary functions can be disabled when not needed. All parameters are set to default after power-on;
the programmed values are retained during sleep mode. The interface supports the read-out of a
status register, providing detailed information about the status of the transceiver and the received data.
The transmitter block is equipped with two 8 bit wide TX data registers. It is possible to write 8 bits
into the register in burst mode and the internal bit rate generator transmits the bits out with the
predefined rate. For further details, see the TX Register Buffered Data Transmission section.
It is also possible to store the received data bits into a FIFO register and read them out in a
buffered mode.
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RF12B
PACKAGE PIN DEFINITIONS
Pin type key: D=digital, A=analog, S=supply, I=input, O=output, IO=input/output
Pin Name Type Function
1 SDI DI Data input of the serial control interface (SPI compatible
2 SCK DI Clock input of the serial control interface
3 nSEL DI Chip select input of the serial control interface (active low
4 SDO DO Serial data output with bus hold
5 nIRQ DO Interrupt request output (active low
FSK DI Transmit FSK data input (internal pull up resistor 133 k
DATA DO Received data output (FIFO not used
6
nFFS DI
DLCK DO Received data clock output (Digital filter used, FIFO not used
CFIL AIO External data filter capacitor connection (Analog filter used
7
FFIT DO
8 CLK DO Microcontroller clock output
XTL AIO Crystal connection (the other terminal of crystal to VSS) or external reference input
9
REF
10 nRES DIO Open drain reset output with internal pull-up and input buffer (active low)
11 VSS S Ground reference voltage
12 RF2 AIO RF differential signal input/output
13 RF1 AIO RF differential signal input/output
14 VDD S Positive supply voltage
15
16
Note : The actual mode of the multipurpose pins (pin 6 and 7) is determined by the TX/RX data I/O
settings of the transceiver.
RSSI AO Analog RSSI output
nINT DI Interrupt input (active low
VDI DO Valid data indicator output
FIFO select input (active low) In FIFO mode, when bit ef is set in Configuration
FIFO interrupt (active high) Number of the bits in the RX FIFO has reached the
IO External reference input. Use 33 pF series coupling capacito
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RF12B
PIN6(FSK/DATA/nFFS) internal structure PIN10(nRES) internal structure
T ypical Application
Typical application with FIFO usage
Transmit mode
el=0 in Configuration Setting Command
Transmit mode
el=1 in Configuration Setting Command
Receive mode
ef=0 in Configuration Setting Command
Receive mode
ef=1 in Configuration Setting Command
Pin 6
TX Data input
nFFS input (TX Data register can be accessed)
RX Data output RX Data clock output
nFFS input (RX Data FIFO can be accessed) FFIT output
Pin 7
-
-
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RF12B
GENERAL DEVICE SPECIFICATION
All voltages are referenced to Vss, the potential on the ground reference pin VSS.
Absolute Maximum Ratings (non-operating)
Symbol Parameter Min Max Units
V
dd
V
V
oc
I
in
ESD Electrostatic discharge with human body model 1000 V
T
st
Recommended Operating Range
Symbol Parameter Min
V
dd
V
ocDC
V
ocAC
T
op
Positive supply voltage -0.5 6 V
Voltage on any pin (except RF1 and RF2) -0.5 Vdd+0.5 V
in
Voltage on open collector outputs (RF1, RF2) -0.5
+1.5
dd
Note 1)
Input current into any pin except VDD and VSS -25 25 mA
Storage temperature -55 125
Positive supply voltage 2.2
DC voltage on open collector outputs (RF1, RF2) V
AC peak voltage on open collector outputs (RF1, RF2)
Vdd-1.5
(Note 2)
Ambient operating temperature -40
V
℃
Max Units
3.8 V
+1.5
dd
V
+1 .5
dd
85
V
V
℃
Note 1: Cannot be higher than 7 V.
Note 2: Cannot be lower than 1.2 V.
ELECTRICAL SPECIFICATION
(Min/max values are valid over the whole recommended operating range. Typical conditions: Top= 27℃ ; Vdd=Voc=2.7V)
DC Characteristics
Symbol Parameter Conditions/Notes Min Typ Max Units
433 MHz band 15 17
868 MHz band 16 18
915 MHz band
17 19
mA
433 MHz band 22 24
868 MHz band 23 25 I
mA
915 MHz band 24 26
433 MHz band 11 13
868 MHz band 12 14 I
915 MHz band
13 15
mA
0.5 µA
Crystal oscillator on
(Note 3)
0.62 1.2 mA
I
dd_TX_0
dd_TX_PMAX
dd_RX
I
pd
I
lb
I
wt
I
x
Supply current
(TX mode, P
= 0 dBm)
out
Supply current
(TX mode, P
out
= P
max
)
Supply current
(RX mode)
Standby current (Sleep mode) All blocks disabled 0.3 µA
Low battery voltage detector current
consumption
Wake-up timer current consumption 1.5 µA
Idle current
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RF12B
V
lb
V
lba
V
il
V
ih
I
il
I
ih
V
ol
V
oh
Low battery detect threshold
Low battery detection accuracy 0 5 %
Digital input low level voltage 0.3*V
Digital input high level voltage 0.7*Vdd V
Digital input current Vil = 0 V -1 1 µA
Digital input current Vih = Vdd, Vdd = 3.8 V -1 1 µA
Digital output low level Iol = 2 mA 0.4 V
Digital output high level Ioh = -2 mA Vdd-0.4 V
Programmable in 0.1V
steps
2.2 3.7 V
dd
V
AC Characteristics (PLL parameters)
Symbol Parameter Conditions/Notes Min Typ Max Units
f
PLL reference frequency (Note 1) 9 10 11 MHz
ref
Receiver LO/Transmitter
f
o
carrier frequency
PLL lock time
t
lock
t
PLL startup time With a running crystal oscillator 200 300 us
st, P
433 MHz band, 2.5 kHz resolution 430.24 439.75
868 MHz band, 5.0 kHz resolution 860.48 879.51
915 MHz band, 7.5 kHz resolution 900.72
Frequency error < 1kHz
30 us
929.27
MHz
AC Characteristics (Receiver)
Symbol Parameter Conditions/Notes Min Typ Max Units
mode 0 60 67 75
mode 1 120 134 150
BW Receiver bandwidth
BR
BRA
FC
IIP3
IIP3
IIP3
IIP3
FSK bit rate With internal digital filters 0.6 115.2 kbps
RX
FSK bit rate With analog filter 256 kbps
RX
Receiver Sensitivity BER 10-3, BW=67 kHz, BR=1.2 kbps (Note 2) -109 -103 dBm
P
min
AFC locking range
range
Input IP3 In band interferers in high bands (868, 915 MHz) -21 dBm
inh
Input IP3
outh
IIP3 (LNA –6 dB
inl
gain)
IIP3 (LNA –6 dB
outl
gain)
Maximum input
P
max
power
RF input
C
in
capacitance
RSSI accuracy +/-5 dB
RS
a
RSSI range 46 dB
RS
r
mode 2 180 200 225
mode 3 240 270 300
mode 4 300 340 380
mode 5 360 400 450
df
: FSK deviation in the received signal
FSK
Out of band interferers
l f-fo l > 4 MHz
In band interferers in low band (433 MHz) -15 dBm
Out of band interferers
l f-fo l > 4 MHz
LNA: high gain 0 dBm
1 pF
0.8*df
FSK
-18 dBm
-12 dBm
kHz
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RF12B
C
RS
RS
P
Filter capacitor for
ARSSI
ARSSI
RSSI programmable
step
level steps
DRSSI response
resp
time
Receiver spurious
sp_rx
emission
1 nF
6 dB
Until the RSSI signal goes high after the input signal
exceeds the preprogrammed limit
-60 dBm
AC Characteristics (Transmitter)
Symbol
I
OUT
P
max_50
P
max_ant
P
P
P
C
Q
L
BR
BRA
df
Parameter
Open collector output DC current Programmable
Max. output power delivered to 50
Ohm load over a suitable matching
network (Note 4)
Max. EIRP with suitable selected
PCB antenna. (Note 6, 7)
Typical output power Selectable in 3 dB steps (Note 8)
out
Spurious emission
sp
l f-f
l > 1 MHz
sp
Harmonic suppression
harm
Output capacitance (set by the
o
automatic antenna tuning circuit)
Quality factor of the output
o
capacitance
Output phase noise
out
FSK bit rate Via internal TX data register
TX
FSK bit rate TX data connected to the FSK input
TX
FSK frequency deviation Programmable in 15 kHz steps
fsk
Conditions/Notes Min Typ Max Units
In 433 MHz band
In 868 / 915 MHz bands
In 433 MHz band with monopole
antenna with matching network (Note 4)
In 868 / 915 MHz bands (Note 5)
At max power 50 Ohm load (Note 4)
With PCB antenna (Note 5)
At max power 50 Ohm load (Note 4)
With PCB antenna (Note 5)
In 433 MHz band
In 868 / 915 MHz bands
In 433 MHz band
In 868 / 915 MHz bands
100 kHz from carrier, in 868 MHz band
1 MHz from carrier, in 868 MHz band
C
ARRSI
= 4.7 nF
500 us
0.5 6 mA
7
dBm
5
7
dBm
7
P
-21 P
max
max
dBm
-55 dBc
-60 dBc
-35 dBc
-42 dBc
2 2.6 3.2
pF
2.1 2.7 3.3
13 15 17
8 10 12
-80
dBc/Hz
-103
172 kbps
256 kbps
15 240 kHz
AC Characteristics (Turn-on/Turnaround timings)
Symbol Parameter Conditions/Notes Min Typ MaxUnits
t
sx
Crystal oscillator startup time
Transmitter turn-on time
T
tx_XTAL_ON
Receiver turn-on time
T
rx_XTAL_ON
Transmitter – Receiver turnover time
T
tx_rx_SYNT_ON
Receiver – Transmitter turnover time
T
rx_tx_SYNT_ON
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Crystal ESR < 100 Ohm
Synthesizer off, crystal oscillator on with
10 MHz step
Synthesizer off, crystal oscillator on with
10 MHz step
Synthesizer and crystal oscillator on
during TX/RX change with 10 MHz step
Synthesizer and crystal oscillator on
during RX/TX change with 10 MHz step
1 5 ms
250 us
250 us
150 us
150 us
RF12B
AC Characteristics (Others)
Symbol Parameter Conditions/Notes Min Typ Max Units
Programmable in 0.5 pF steps, tolerance
+/- 10%
fter Vdd has reached 90% of final value
(Note 9)
8.5 16 pF
100 ms
C
t
Crystal load capacitance,
xl
see crystal selection guide
Internal POR timeout
POR
t
Wake-up timer clock period
PBt
C
Digital input capacitance
in, D
t
Digital output rise/fall time
r, f
Calibrated every 30 seconds
15 pF pure capacitive load
0.95 1.05 ms
2 pF
10 ns
AC Characteristics (continued)
Note 1: Not using a 10 MHz crystal is allowed but not recommended because all crystal referred timing
and frequency parameters will change accordingly.
Note 2: See the BER diagrams in the measurement results section for detailed information.
Note 3: Measured with disabled clock output buffer. This current can be decreased by enabling the low
power mode of the crystal oscillator. See PLL Setting Command and Power Management Command for
details.
Note 4: See Reference design with 50 Ohm matching network for details.
Note 5: See Reference design with resonant PCB antenna (BIFA) for details.
Note 6: Supposing identical antenna with RF12B in RX mode, the outdoor RF link range will be
approximately 120 meters indoor and 450 meters outdoor.
Note 7: Optimal antenna admittance/impedance:
RF12B Yantenna [S] Zantenna [Ohm] Lantenna [nH]
433 MHz 1.4E-3 - j7.1E-3 27 + j136 52.00
868 MHz 2E-3 - j1.5E-2 8.7 + j66 12.50
915 MHz 2.2E-3 - j1.55E-2 9 + j63 11.20
Note 8: Adjustable in 8 steps.
Note 9: During this period, commands are not accepted by the chip.
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