The QuickRAM family of ESPs (Embedded Standard Products) offers FPGA logic in
combination with Dual-Port SRAM modules. The QL4058 is a 58,000 usable PLD gate
member of the QuickRAM family of ESPs. QuickRAM ESPs are fabricated on a 0.35 µm
four-layer metal process using QuickLogic's patented ViaLink
unique combination of high performance, high density, low cost, and extreme ease-of-use.
The QL4058 contains 1,008 logic cells and 18 Dual Port RAM modules (see Figure 1). Each
RAM module has 1,152 RAM bits, for a total of 20,736 bits. RAM Modules are Dual Port
(one read port, one write port) and can be configured into one of four modes:
64 (deep) × 18 (wide), 128 × 9, 256 × 4, or 512 × 2 (see
252 I/Os, the QL4058 is available in 208-PQFP, 240-pin PQFP, and 456-pin PBGA
packages.
Designers can cascade multiple RAM modules to increase the depth or width allowed in
single modules by connecting corresponding address lines together and dividing the words
between modules (see
large as 16 bits wide in the smallest QuickRAM device and 44 bits wide in the largest device.
TM
technology to provide a
Figure 4). With a maximum of
Figure 2). This approach allows up to 512-deep configurations as
Software support for the complete QuickRAM family, including the QL4058, is available
through two basic packages. The turnkey QuickWorks
TM
package provides the most
complete ESP software solution from design entry to logic synthesis, to place and route, to
simulation. The QuickTools package provides a solution for designers who use Cadence,
Exemplar, Mentor, Synopsys, Synplicity, Viewlogic, Aldec, or other third-party tools for
design entry, synthesis, or simulation.
The QuickLogic
TM
variable grain logic cell features up to 16 simultaneous inputs and five
outputs within a cell that can be fragmented into five independent cells. Each cell has a fanin of 29 including register and control lines (see
• 244 bi-directional input/output pins, PCI-compliant for 5.0 V and 3.3 V buses for
-1/-2/-3/-4 speed grades
• 8 high-drive input/distributed network pins
Eight Low-Skew Distributed Networks
• Two array clock/control networks available to the logic cell flip-flop clock, set and reset
inputs—each driven by an input-only pin
• Six global clock/control networks available to the logic cell F1, clock, set and reset inputs
and the input and I/O register clock, reset and enable inputs as well as the output enable
control—each driven by an input-only or I/O pin, or any logic cell output or I/O cell
feedback
High Performance Silicon
• Input + logic cell + output total delays = under 6 ns
AC Characteristic s at VCC = 3.3 V, TA = 25°C (K = 1.00)
To calculate delays, multiply the appropriate K factor from Table 10: Operating Range by the
following numbers in the tables provided.
QS
A1
A2
A3
A4
A5
A6
QS
OP
B1
B2
C1
C2
MP
MS
D1
D2
E1
E2
NP
NS
F1
F2
F3
F4
F5
F6
QC
QR
AZ
OZ
QZ
NZ
FZ
Figure 3: QuickRAM Logic Cell
Table 1: Logic Cell
SymbolParameter
t
PD
t
SU
t
H
t
CLK
t
CWHI
t
CWLO
t
SET
t
RESET
t
SW
t
RW
Combinatorial Delay
Setup Time
a
Hold Time0.00.00.00.00.0
Clock to Q Delay0.71.01.21.52.5
Clock High Time1.21.21.21.21.2
Clock Low Time1.21.21.21.21.2
Set Delay1.01.31.51.82.8
Reset Delay0.81.11.31.62.6
Set Width1.91.91.91.91.9
Reset Width1.81.81.81.81.8
a
a. These limits are derived from a representative selection of the slowest paths through the
QuickRAM logic c ell incl uding ty pical ne t delays . Worst cas e delay values for spec ific path s should
be determined from timing analysis of your particular design.
a. The array dist ribu ted ne tw ork s co nsi st of 40 ha lf columns and the glo bal d is tributed networks con-
sist of 44 half columns, each driven by an independent buffer. The number of half columns used
does not affect clo ck buffer delay . The arra y clock has up to eight loads per ha lf column. The global
clock has up to 11 loads per half column.
a. Applies only to -1/-2/-3/-4 com mercial grade devices . These s peed gra des are also PCI-com plia nt. All
other devices have 8 mA IOL specifications.
b. Capacitance is sample tested only. Clock pins are 12 pF maximum.
c. Only one output at a time. Duration should not exceed 30 seconds.
d. For -1/-2/-3/-4 commerc ial gra de devices only. Ma xi mu m I CC is 3 m A for -0 commercial grade a nd all
industrial grade de vices and 5 m A for all mil itary grade d evices. For AC conditions, c ontact Qui ckLogic
customer applications group (see Contact Information)
Microprocessors and Application Specific Integrated Circuits (ASICs) pose many design
challenges. One of these challenges concerns the accessibility of test points. The Joint Test
Access Group (JTAG) formed in response to this challenge, resulting in IEEE standard
1149.1, the Standard Test Access Port and Boundary Scan Architecture.
The JTAG boundary scan test methodology allows complete observation and control of the
boundary pins of a JTAG-compatible device through JTAG software. A Test Access Port
(TAP) controller works in concert with the Instruction Register (IR); these allow users to run
three required tests, along with several user-defined tests.
JTAG tests allow users to reduce system debug time, reuse test platforms and tools, and reuse
subsystem tests for fuller verification of higher level system elements.
The JTAG 1149.1 standard requires the following three tests:
• Extest Instruction. The Extest instruction performs a PCB interconnect test. This test
places a device into an external boundary test mode, selecting the boundary scan
register to be connected between the TAP's Test Data In (TDI) and Test Data Out (TDO)
pins. Boundary scan cells are preloaded with test patterns (via the Sample/Preload
Instruction), and input boundary cells capture the input data for analysis.
• Sample/Preload Instruction. This instruction allows a device to remain in its
functional mode, while selecting the boundary scan register to be connected between
the TDI and TDO pins. For this test, the boundary scan register can be accessed via a
data scan operation, allowing users to sample the functional data entering and leaving
the device.
• Bypass Instruction. The Bypass instruction allows data to skip a device's boundary
scan entirely, so the data passes through the bypass register. The Bypass instruction
allows users to test a device without passing through other devices. The bypass register
connects the TDI and TDO pins, allowing serial data to be transferred through a device
without affecting the operation of the device.
The information contained in this product brief, and the accompanying software programs are protected by copyright. All rights are reserved by QuickLogic Corporation. QuickLogic Corporation
reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision. Copying, duplicating, selling, or otherwise distributing any part of this
product without the prior written consent of an authorized representative of QuickLogic is prohibited.
Added Kfactor, Power-up, JTAG and mechanical
drawing information. Reformatted.
QuickLogic, pASIC, and ViaLink are registered trademarks, and SpDE and QuickWorks are trademarks of QuickLogic Corporation.
Verilog is a registered trademark of Cadence Design Systems, Inc.