PNI MS2100 User Manual

Name

Part #

MOQ

Package

MS2100

12913

416

Tray

MS2100

12913P

1

Unsealed
Partial Tray

MS2100 on
Carrier Board

11900

1

Each

MS2100
Evaluation Kit

90028

1

Each

Revised January 2011

MS2100 2-Axis Magnetic Sensor

Specifications and User Instructions

General Description

The MS2100 is an integrated surface mount
technology (SMT) module designed for 2-axis
magnetic field sensing. The MS2100 combines
PNI Corporation’s patented magneto-inductive
(MI) sensors and measurement circuit
technology into a surface mount package for
unparalleled performance. The MI sensors
change inductance by 100% over their field
measurement range. This variable inductance
property is used in the cost and space efficient
MS2100, which incorporates a patented
temperature, and noise stabilized oscillator/
counter circuit with a SPI interface. The
microprocessor-compatible SPI interface allows

easy access to the MS2100’s measurement

parameters and resulting field measurement
data. The module also includes pins to support
the connection of a third MI sensor axis for
higher performance applications.

Advantages include 3V operation for
compatibility with new systems, low power
consumption, small surface mount packaging,
large signal noise immunity under all conditions,
and a large dynamic range. Resolution and field
measurement range are software configurable
for a variety of applications. The measurement
is very stable over temperature and inherently
free from offset drift.

These advantages make PNI Corporation's
MS2100 the choice for high volume applications
where small size and low power requirements
are paramount.

Features

 Low power: draws < 1 mA at 3VDC
 Size: 7 x 7 x 1.35 mm
 Large dynamic range: ± 1100 µT

(± 11 Gauss)

 High resolution field measurement:

0.060 T at 2048 period

 Operation: 3.0 VDC
 Surface mount package: 20 pads (QFN)
 Fully digital interface: SPI protocol at 3 V

 Optional Carrier Board available for easy

prototyping and evaluation

 RoHS Compliant

Applications

 Handheld battery-powered devices with built-in

compass feature where space is at a premium

 High-performance magnetic field sensing
 High-performance solid state navigation

equipment for automotive, marine, and
aeronautic applications

 Direction-finding features for any device with

bearing or attitude indicators

Ordering Information

Table 1: Ordering Information

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MS2100

Specifications & Instructions

SPECIFICATIONS

Symbol

Parameter

Maximum

VDD

DC supply voltage

5.25 VDC

VIN

Input pin voltage

VDD+ 0.3 VDC

IIN

Input pin current

10 mA at 25 ºC

T

STRG

Storage temperature

-40 to 125 ºC

Parameter

Minimum

Maximum

Typical

Current (3 VDC)a

1.0 mA RMS

0.7 mA RMS

Peak Current

5.0 mA peak

3.5 mA peak

Field measurement rangeb (3 VDC)

± 1100 µT

Gainc (3 VDC)

14 counts/µT

28 counts/µT

19 count/µT

Linearity
(Error from best fit straight line at ±200 µT)

3%

0.5%
Resolution (in µT)

0.055

Sensor Frequency (3 VDC)
Within free Earth’s magnetic field

approx. 300 kHz
Operating Temperature

-20ºC

70ºC

Storage Temperature

-40º

125 ºC

a. At period select 2048 and 8Hz sample rate
b. Field measurement range is defined as the monotonic region of the output characteristic curve.
c. Gain is defined as the change in the number of counts from the MS2100, when the period select is set to 2048, per

change in the magnetic field in uT. For situations requiring less gain and more field measurement range, the gain
and resolution can be decreased by a factor of 2 by setting the MS2100 period select to 1024. In practical
magnetometer applications, a sensor gain calibration is normally performed when the sensor module is in the host
system.

CAUTION:

Stresses beyond those listed under Table 2 may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

Table 2: Absolute Maximum Ratings

Table 3: MS2100 General Characteristics at 2048

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MS2100

Specifications & Instructions

Period
Select

Ratio

Typical Gain

(Counts/µT)

Resolution*

(µT)

Typical Operating Current

(mA RMS)

0

/32

0.30

3.33

0.01

1

/64

0.59

1.69

0.02

2

/128

1.2

0.83

0.05

3

/256

2.4

0.42

0.09

4

/512

4.8

0.21

0.17

5

/1024

9.5

0.11

0.35

6

/2048

19

0.05

0.70

7

/4096

38

0.03

1.50

Table 4: MS2100 Continuous Sampling (3 V) at 8 Hz

*Resolution is calculated as 1/Gain. Noise may limit usable resolution at period select values of 6 and 7.

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MS2100

Specifications & Instructions

Typical Operating Characteristics: MS2100 (3 VDC)

-6000

-4000

-2000

0

2000

4000

6000

-300 -200 -100 0 100 200 300

Magnetic Field(uT)

Output Counts(PS=2048)

Figure 1: Typical Sensor Characteristic (± 300 µT, PS=2048)

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MS2100

Specifications & Instructions

Host Processor Interface

Pad

MS2100 Name

Function

1

N.C.

Not connected

2

RESET

Reset input

3

REXT

External timing resistor for higher speed clock

4

DRDY

Data ready

5

DHST

High speed oscillator output. Output is 1/2 clock speed. Used for diagnostics.

6

REXT_GND

Connect the pin to ground.

7

APZDRV

Optional Z sensor drive output (+)

8

APZIN

Optional Z sensor input (+)

9

ANZIN

Optional Z sensor input (–)

10

ANZDRV

Optional Z sensor drive output (–)

11

SSNOT

Active low chip select for SPI port

12

MOSI

Master Out, Slave In for the module SPI port

13

N.C

Not connected

14

MISO

Master In, Slave Out for the module SPI port

15

SCLK

Serial clock input for SPI port. 1 MHz maximum.

16

VDD

Supply Voltage (digital)

17

VDD

Supply Voltage (analog)

18

VSTBY

Input protection clamp diode common

19

VSS

Ground (analog)

20

VSS

Ground (digital)

All accesses to and from the MS2100 are through a hardware handshaking, synchronous serial interface
that adheres to the Motorola SPI protocol. The interface consists of six signals; SCLK, MOSI, MISO,
SSNOT, RESET, and DRDY.

Table 5: MS2100 Pad Descriptions

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MS2100

Specifications & Instructions

SPI Port Line Descriptions

MOSI – Master Out Slave In

The data sent to the MS2100. Data is transferred most significant bit first. The MOSI line will
accept data once the SPI is enabled by taking SSNOT low. Valid data must be presented at least
100 nS before the rising edge of the clock, and remain valid for 100 nS after the edge. New data
may be presented to the MOSI pin on the falling edge of SCLK.

SSNOT – Slave Select Line

Selects the MS2100 as the operating slave device. The SSNOT line must be low prior to data
transfer and must stay low during the entire transfer. Once the command byte is received by the
MS2100, and the MS2100 begins to execute the command, the SSNOT line can be deselected
until the next SPI transfer.

SCLK – Serial Clock

Used to synchronize both the data in and out through the MISO and MOSI lines. SCLK is gener­ated by a master device. SCLK should be 1 MHz or less. The MS2100 is configured to run as a
slave device, making it an input. One byte of data is exchanged over eight clock cycles. Data is
captured by the master device on the rising edge of SCLK. Data is shifted out and presented to
the MS2100 on the MOSI pin on the falling edge of SCLK.

MISO – Master In Slave Out

The data sent from the MS2100 to the master. Data is transferred most significant bit first. The
MISO line is placed in a high impedance state if the slave is not selected (SSNOT = 1).

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MS2100

Specifications & Instructions

Hardware Handshaking Line Descriptions

Period Select

Typical Delay (msec)a

/32

0.32

/64

0.53

/128

0.96

/256

1.8

/512

3.5

/1024

6.9

/2048

13.8

/4096

27.4

a. Calculated from (1/sensor frequency x (period

select) x 2 [Forward & reverse measurement]

RESET

RESET is usually low. RESET must be toggled from low-high-low.

DRDY - Data Ready

DRDY is low after a RESET; after a command has been received and the data is ready, DRDY
will be high. It is recommended that the DRDY line always be used to ensure that the data is
clocked out of the MS2100 only when it is available. If it is determined that the DRDY line can­not be used due to lack of I/O lines to the host processor, then the times listed in Table 6 can be
used to set open-loop wait times. The values listed are the maximum delays from the end of the
SCLK command until the rise of the DRDY at each period select setting. The maximum delay
occurs when the sensor being sampled is in a zero field.

Table 6: Typical Delay for DRDY

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MS2100

Specifications & Instructions

OPERATION

Basic operation will follow these steps. Refer to Figure 2 and Figure 3.

1. SSNOT is brought low.

2. Pulse RESET high (return to low state). You must RESET the MS2100 before every

measurement.

3. Data is clocked in on the MOSI line. Once eight bits are read in, the MS2100 will execute the

command.

4. The MS2100 will make the measurement. A measurement consists of forward biasing the sensor

and making period count; then reverse biasing the sensor and counting again; and finally, taking
the difference between the two bias directions.

5. At the end of the measurement, the DRDY line is set to high indicating that the data is ready. In

response to the next 16 SCLK pulses, data is shifted out on the MISO line.

If you need to make another measurement, go to Step 2. You can send another command after the reset. In
this case, keep SSNOT low. If you will not be using the MS2100, set SSNOT to high to disable the SPI
port.

Figure 2: SPI Port Full Timing Sequence (cpol=0)

Figure 3: SPI Port Timing Parameters (cpol = 0)

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MS2100

Specifications & Instructions

SPI Port Usage Tips

A SPI port can be implemented using different clock polarity options. The clock polarity used with the
MS2100 must be normally low, (cpol = 0). Figure 3 graphically shows the timing sequence (cpol = 0).
Data is always considered valid while the SCLK is high (t
SCLK is low, the data is in transition (t

= Time, Data Before SCLK High).

DBSH

= Time, Data After SCLK High). When

DASH

When implementing a SPI port, whether it is a dedicated hardware peripheral port, or a software
implemented port using general purpose I/O (also known as Bit-Banging) the timing parameters given in

Figure 3 must be met to ensure reliable communications. The clock set-up and hold times, t
t

must be greater than 100 nS.

DASH

DBSH

and

Idle Mode

The MS2100 does not initialize in the idle mode at power-up. The MS2100 must be in a data­ready state for the idle mode to occur. After power-up the MS2100 can be brought to the data­ready state by following these steps for sending a read command to the MS2100.

1. Set SSNOT low.

2. Pulse the RESET line.

3. Send a command to the MS2100 to measure one of the sensors.

4. Once the SSNOT pin is set to high again the MS2100 will go into the low power idle

mode.

5. The DRDY pin will eventually go high signifying that the MS2100 is in the data-ready

state. The resultant data does not have to be read from the MS2100.

Magnetic Measurements

The MS2100 magnetic sensor operates as an oscillator circuit composed of the internal sensors, bias
resistors, digital gates and a comparator. Only one sensor can be measured at a time. The user sends a
command byte to the MS2100 through the SPI port specifying the sensor axis to be measured. After
dividing by the ratio set by PS2-PS0, the MS2100 will return the result of a complete forward - reverse
measurement of the sensor in a 16-bit 2’s complement format (Range: -32768 to 32767)

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MS2100

Specifications & Instructions

Command Byte

Position

7 6 5 4 3 2 1

0

Bit

DHST

PS2

PS1

PS0

ODIR

MOT

ASI

ASO

RESET

0 0 0 0 0 0 0

0

PS2

PS1

PS0

Ratio

0 0 0

/32 0 0 1 /64

0 1 0

/128

0 1 1

/256

1 0 0

/512

1 0 1

/1024

1 1 0

/2048

1 1 1

/4096

The operation of the MS2100 is controlled by the data received into the SPI port. The command byte
syntax is as follows:

Table 7: Command Byte Syntax

DHST – High Speed Oscillator Test

When high, the internal high speed clock is set to drive the DHST pad at ½ the clock speed.
When low, the DHST pad is set to DVDD. This is used for debug purposes only, and will not be

set in normal operation.

PS0, PS1, and PS2 – Period Select

Selects the division ratio applied to the L/R oscillator output to set the period being measured.

Table 8: Period Select Division Ration

ODIR – Oscillator Direction

Determines the magnetic oscillator direction if MOT is set to 1. It has no effect on direction when
the MOT bit is set to zero. This is used for debug purposes only, and will not be set in normal

operation.

MOT – Magnetic Oscillator Test

When set, causes the magnetic oscillator selected by AS0 and AS1 in the directions
selected by ODIR to run continuously until MS2100 is reset.

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MS2100

Specifications & Instructions

ASO and AS1 – Axis Select

Function

AS1

AS0

X axis 0 1

Y axis 1 0

Z axis* 1 1

Determines which axis is being measured.

Table 9: Axis Select

*Available when Sen-Z sensor is externally added.

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MS2100

Specifications & Instructions

Reference Block Diagram MS2100 & Carrier Board

Slave Clock from µP

Data to µP

Data from µP

Slave Select Not

Module RESET

End of Conversion

Pad1& Pad13: Not Connected.
*Rext: A 39kΩ resistor can be added in parallel to the internal 100 kΩ resistor for a faster clock speed, however the stability

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Figure 4: Reference Block Diagram for the MS2100

over temperature will be degraded.

MS2100

Specifications & Instructions

MS2100 Package Information

Figure 5: Top and Side Views

Figure 6: Bottom View

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MS2100

Specifications & Instructions

Table 10: MS2100 Dimensions

Symbol

Minimum

Nominal

Maximum

Units

A

1.29

1.34

1.39

mm

A3

0.10

0.13

0.16

mm b 0.28

0.33

0.38

mm D 6.90

7.00

7.10

mm E 6.90

7.00

7.10

mm e 0.75

0.80

0.85

mm l 0.50

0.60

0.70

mm

Direction of Travel

Packaging

Sealed tray of 416 pieces.

Figure 7: Top View – Markings

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MS2100

Specifications & Instructions

MS2100 PCB Layout

MS2100 Carrier Board

Figure 8: PCB Layout

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Figure 9: MS2100 Carrier Board Mechanical Drawing

MS2100

Specifications & Instructions

Recommended Processing Parameters

Reflow Parameter

Temperature

Time

Max Peak Temperature

240ºC

Soak Time at Peak Temperature

10-20 seconds

Ramp Down Rate

4°C/second max

Solder Melting Point

>218ºC

Moisture Sensitivity Level: Refer to handling instructions below.

Figure 10: MS2100 Solder Profile

Table 11: Recommended Processing Parameters

Instructions for baking of PNI MS2100 Components prior to SMT

The MS2100 is shipped in a moisture resistant sealed tray containing 416 pcs (p/n 12913) or in
partial trays or smaller packages of 415 or fewer pcs (p/n 12913P) which are not sealed.

To mitigate the risk of moisture damage, PNI recommends the following procedure for all
MS2100s:

1) Peak package body temperature: 240 C

2) After the moisture seal is opened, MS2100s must be baked at 125 C (+/- 5 C) for 24

hours prior to being subjected to reflow solder or other high-temperature processes. After
this bake process is complete, the MS2100 must be mounted within 8 hours (assuming
factory conditions of temperature < 30ºC and humidity (RH) < 60% are not exceeded).

3) Unused MS2100s are to be stored in their trays and sealed. Bake as stipulated in step #2

above before use.

Note: Temperature and humidity defined by IPC/JEDEC J-STD-020

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