Philips TPF1.3A Schematic

Published by JH 661 TV Service Printed in the Netherlands Subject to modification EN 3122 785 16060

rieval system or transmitted, in any form or by any means, electronic,

mecha

nical, photocopying, or otherwise without the prior permission of Philips.

Colour Television Chassis

TPF1.

3A LA

TPF1.3A LA

1. Technical Specifications and Connections

Index of this chapter:

1.1 Technical Specifications

1.2 Connections

Note: Figures below can deviate slightly from the actual

situation, due to the different set executions.

1.1 Technical specifications

1.vision Type NR. :A201SN02 (AUO) Display area(mm) : 408(H) x 306(V) (20.1-inch diagonal) Display mode : TN type, Normal white + SWV film Number of Pixels : 800(H) x 600(V) Pitch ( mm ) : 0.51(H) x 0.51(V) Color pixel arrangement : RGB vertical stripes Display mode : normally white TN Number of color : 16.7M ( 8 bits) Brightness (cd/m^2) : 450nit(typ.) Viewing angle : -80 Response time : 16ms typ. (Tr+Tf) Surface treatment : Hard Coating + AR Electrical interface : TTL (1 port) Total module power(W) : 35W(typ.) Contrast ratio : Typical 500 : 1 Overall dimension (mm) : 448(W) x 347(H) x 23(D)(max.) Module weight (g) : 3500 Backlight : 6 CCFL

2.Following table is the detail TV System list.

TV system

N 4.5 BTSC-stereo+SAP PAL Argentina B/G

L 6.5/5.85 AM-Mono/

I 6.0/6.552 FM-Mono/

D/K

Position of sound carrier (MHz)

4.5/4.724212 FM-Stereo(A2) NTSC Korea

4.5 FM-FM(EIA-J) NTSC Japan

4.5 BTSC-stereo+SAP NTSC USA

5.5/5.7421875 FM-stereo(A2) PAL Germany, Austria,

5.5/5.85 FM-Mono/

6.5/6.2578125 FM-Stereo

6.5/6.7421875 FM-Stereo

6.5/5.7421875 FM-Stereo

6.5/5.85 FM-Mono/

Sound system Color system Country

NICAM

(A2,D/K1)

(A2,D/K2)

(A2,D/K3)

NICAM(D/K,NICAM )

3.Miscellaneous

Power supply

~80(H),-60~60(V)(Typ.)

Switzerland, Italy,

PAL Belgium, Spain,

SECAM-L France

PAL Great Britain, Hong

SECAM-East Slovak. Rep.

PAL None

SECAM-East Poland

PAL China, Hungary

Netherlands,

Denmark, Finland, Norway, Sweden.

Kong, Ireland

1.2 Connections: please refer to the DFU for details

1.2.1 PC input connectors Input ana

log D-sub connector pin assignment:

PIN No. SIGNAL

1Red

2 Green

3Blue

4GND

5GND

6RedGND

7 Green GND

8BlueGND

9 +5V (Supply from PC)

10 Sync GND

11 GND

12 Bi-directional data

13 H-sync

14 V-sync

15 Data clock

Sync polarity :

-Hori.sync positive/negative

-Vert.syncpositive/negative

1.PC Signal type Analog Video: 0.7 Vp-p Linear , positive polarity

Sync : TTL level , separate , positive or negative polarity

2.TV signal type RF signal : Aerial input

Video signal : S-video input

CVBS

YPbPr

3.Audio signal : S-video L/R ,YPbPr L/R audio input

PC line in

Power consumption : Operating 55 W (typical) Power cord length : 1.8M Power cord type : USA type Power indicator : LED (On: Green ,Sleeping mode: Am ber ) Auto power saving : EPA

Operati ng

-Temperature C : 0°cto35°c

-Humidity : 20% ~ 80 %

-Altitude : 0-3658m

-Air pressure : 600-1100mBAR

Storage

-Temperature C : -20 to 60°

-Humidity : 95% max ( < 40

)

-Altitude : 0-12192m

-Air pressure : 300-1100mBAR

Note: Recommend at 0 to 35°C, Humidity less than 60 %

2. Safety Instructions, Warnings and Notes

TPF1.3A LA

index of this chapter:

2.1 Safety Instructions

2.2 Warnings

2.3 Notes

2.1 Safety Instructions

Safety regulations require that during a repair:

Connect the set to the AC Power via an isolation transformer (> 800 VA).

Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.

Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points:

Route the wire trees correctly and fix them with the mounted cable clamps.

Check the insulation of the AC Power lead for external damage.

Check the strain relief of the AC Power cord for proper function.

Check the electrical DC resistance between the AC Power plug and the secondary side (only for sets which have a AC

Power isolated power supply):

1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.

2. Set the AC Power switch to the "on" position (keep the

AC Power cord unplugged!).

3. Measure the resistance value between the pins of the

AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm.

4. Switch "off" the set, and remove the wire between the two pins of the AC Power plug.

Check the cabinet for defects, to avoid touching of any inner parts by the customer.

2.2 Warnings

All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential.

Be careful during measurements in the high voltage section.

Never replace modules or other components while the unit is switched "on".

When you align the set, use plastic rather than metal tools. This will prevent any short circuits and the danger of a circuit becoming unstable.

2.3 Notes

2.3.1 General

1. Measure the voltages and waveforms with regard to the chassis (= tuner) ground ( ), or hot ground ( ), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the Service Default Mode (see chapter 5) with a color bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or

61.25 MHz for NTSC (channel 3).

2. Where necessary, measure the waveforms and voltages with ( ) and without ( ) aerial signal. Measure the voltages in the power supply section both in normal operation ( ) and in stand-by ( ). These values are indicated by means of the appropriate symbols.

3. The semiconductors indicated in the circuit diagram and in

the parts lists, are interchangeable per position with the semiconductors in the unit, irrespective of the type indication on these semiconductors.

4. Manufactured under license from Dolby Laboratories. "Dolby" and the "double-D symbol", are trademarks of Dolby Laboratories.

2.3.2 Schematic Notes

1. All resistor values are in ohms and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm).

2. Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).

3. All capacitor values are given in micro-farads (u= x10 ), nano-farads (n= x10 ), or pico-farads (p= x10 ).

4. Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).

5. An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.

6. The correct component values are listed in the Electrical Replacement Parts List. Therefore, always check this list when there is any doubt.

-9

-12

-6

2.3.3 Rework on BGA (Ball Grid Array) Ics

General Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.

Device Removal As is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an(LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB.To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.

Area Preparation When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA.Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent.After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.

Device Replacement

The last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGA should be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. To reflow the solder, apply a

temperature profile according to the IC data sheet. So as not to damage neighbouring components, it may be necessary to reduce some temperatures and times.

More Information

For more information on how to handle BGA devices, visit this

URL: (needs subscription,

www.atyourservice.ce.philips.com

not available for all regions). After login, "select Magazine", then go to "Workshop Information". Here you will find Information on how to deal with BGA-ICs.

TPF1.3A LA

2. Safety Instructions, Warnings and Notes

2.3.4 Lead Free Solder

Philips CE is going to produce lead-free sets (PBF) from

1.1.2005 onwards. Lead-free sets will be indicated by the PHILIPS-lead-free logo on the Printed Wiring Boards (PWB):

Fig 2-1 Lead-free logo

This sign normally has a diameter of 6 mm, but if there is less space on a board also 3 mm is possible. In case of doubt wether the board is lead-free or not (or with mixed technologies), you can use the following method:

1. Always use the highest temperature to solder, when using SAC305 (see also instructions below).

2. De-solder thoroughly (clean solder joints to avoid mix of two alloys).

Caution

which is coupled to the 12NC. For an overview of these profiles, visit the website (needs subscription, but is not available for all regions) You will find this and more technical information within the "Magazine", chapter "Workshop information". For additional questions please contact your local repairhelpdesk.

: For BGA-ICs, you must use the correct temperatureprofile,

www.atyourservice.ce.philips.com

2.3.5 Practical Service Precautions

It makes sense to avoid exposure to electrical shock.

While some sources are expected to have a possible dangerous impact, others of quite high potential are of limited current and are sometimes held in less regard.

2. While some may not be

Always respect voltages.

dangerous in themselves, they can cause unexpected reactions - reactions that are best avoided. Before reaching into a powered TV set, it is best to test the high voltage insulation. It is easy to do, and is a good service precaution.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

1. Use only lead-free soldering tin . If lead-free solder paste is required,please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.

2. Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able

-To reach at least a solder-tip temperature of 400 C.

-To stabilise the adjusted temperature at the solder-tip.

-To exchange solder-tips for different applications.

3. Adjust your solder tool so that a temperature around 360 C

- 380 C is reached and stabilised at the solder joint. Heating time of the solder-joint should not exceed~4sec. Avoid temperatures above 400 C, otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch "off" unused equipment or reduce heat.

4. Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If not to avoid, clean carefully the solder-joint from old tin and re-solder with new tin.

5. Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies.

6. Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against moisture. This packaging may only be opened short before it is used (soldered). Otherwise the body of the IC gets "wet" inside and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90 C ) for drying (think of ESD-protection !).

Do not re-use BGAs at all!

7. For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the end of the service period. For the repair of such sets nothing changes.

3. Directions for Use

You can download this information from the following websites:

http://www.philips.com/support

http://www.p4c.philips.com

TPF1.3A LA

4. Mechanical Instructions

Index of this chapter:

4.1 Assy/Panel Removal

4.2 Set Re-assembly

4.1 Assy/Panel Removal

Front view

Back view

4. Mechanical Instructions

Fig.6

Fig.7

Fig.1

Fig.2

Step 1. Remove the stand.

Remove the three screws as Fig.2,Fig.3

Fig.3

Step 2. Remove the Back cover as Fig.4~7.

Remove the 4 screws on the back cover as Fig.4

a. b. Use thin "I" type screwdriver to push 2 clicks on bottom

side and use thin type screwdriver to open the bottom side as Fig.5

Use thin "I" type screwdriver to push 2 clicks on top side and use thin "I" type screwdriver to open the top side as Fig.6

d. Remove the back cover as Fig.7.

"I"

Step 3: Remove the shielding a. Remove the 4 screws as Fig.8 Fig.9 b. Remove the shielding as Fig.10

Fig.8

Fig.9

Fig. 10

Fig.5

Fig.4

Step 4. Remove the YPbPr-IN,Scaler, KEY ,IR and inverter board.

a).Remove the 2 screws and disconnect the 10 cables as Fig. 10

to remove the YPbPr-IN board.

b).Remove the 4 screws and disconnect the connector as Fig.11

to remove the scaler board.

c).Remove the 2 screws and disconnect the connector as Fig.12

to remove the inverter board.

d).Remove the screw and disconnect the connector as Fig.13 to

remove the IR board.

4. Mechanical Instructions

e). Remove the control board and open the click ,disconnect the connector as Fig.14-Fig.15

TPF1.3A LA

Fig.11

Fig.12

Fig.15

Step 5. Remove the 4 screws as Fig.16 to remove the speaker

Fig. 16

Fig.17

Fig. 14

Fig. 13

Set Re-assembly

To re-assemble the whole set, execute all processes in reverse order.

Notes:

a. While re-assembling, make sure that all cables are placed

and connected in their original position.

b. Pay special attention not to damage the EMC foams at the

SSB shielding. Check that EMC foams are put correctly on their places.

In warranty, it is not allowed to disassembly the LCD panel, even the

backlight unit defect.

Out of warranty, the replacment of backlight unit is a correct way

when the defect is cused by backlight (CCFL,Lamp).

TPF1.3A LA

5. Aging and Factory Mode

index of this chapter:

5.1 Access Aging Mode

5.2 Access Factory Mode

Top Control

Volume

Left

Right

Channel

UpDown

Front Control

Power SW

<A>

LED

RC sensor

5.1 Access Aging Mode

Step 1 : D Step 2 :

quickly push " + "and "-"ofVolume,and hold this two buttons

comes out " AGING screen"] => then release all buttons. Bring up:

isconnect Interface Cable between Monitor and PC.

Turn off LCD monitor.Then press power " " button.Then

AGING...

untill

5.2 Access Factory Mode

1). Turn off monitor.

2).

Press power " " button.Then quickly push " + " and " - "of

Volume ,and hold this two buttons , then the screen comes out

"Waiting For Automatic Adjustment ",then the screen will be black

for one second untill comes out "Windows screen"] => then

release this two buttons.

3). Press "MENU" button, wait until the OSD menu with Characters "CHINA MAGNAVOX32 V0.2.0 051012 CLAA320WA01" (below OSD menu) come on the Screen of the monitor.

Factory Mode indicator

Factory Menu Cursor can move on gray color area Hot key function: at factory mode , press "MENU" button,then press "+"and"-"ofChannel to the factory mode indicator ,then press " + " of Volume .Press the " + " and "-"ofChannel to "exit " and press "MENU" to exit factory adjust menu.

After 52 seconds, bring up:

AGING...

After 60 seconds, bring up:

AGING...

After 52 seconds, bring up:

----------

---------repeatly Connect Signal cable again=> go back to normal display

TPF1.4A LA

6. Block Diagram

Index of this chapter:

6.1

Wiring Diagram

6.2 Block Diagram

6.1 Wiring Diagram

6. Block Diagram

6.2 Main board block diagram

TPF1.3A LA

S-L

TPA3005D2

Audio AMP

S-G

6. Block Diagram

IR and key pad

Control Board

S-H

Panel

LVDS

SCALER

MST51502

MSP_OUT_L/R

S-K

EEPROM

MSP3415G

Sound decoder

PC audio

S-G

S-I

MCU

NT68F632

SDRAM

IIC

DDC

512Kx16x2

PC analog

...

VY[0… 7]

YPbPr (HD)

S-E

SAA7119E/V2

Video Decoder

audio

Tuner

video

SC -audio

S_Audio

Tuner CVBS

SVHC_YC

AV CVBS

YPbPr_RGB_SC

INVERTER BLOCK DIAGRAM

6. Block Diagram

TPF1.3A LA

12VDC

TPF1.3A LA

INVERTER FUNCTION BLOCK DIAGRAM

6. Block Diagram

Scalar board

Panel

TPF1.3A LA

Speakers

AMP

Audio

Output

TPA3005

LVDS

1Mx16

SDRAMÁ 2

DDC

Scaler

MST51512

BL controller

PC Analog

24C32

Eeprom

Sound

Decoder

Tuner

MSP3415

PC audio

FQ1256/I

MUX

AV / S -Video audio

YPbPr(HD) audio

OFF/ON

Tuner CVBS

MCU

NT68F632A(128KB)

Board

Control

SAA7119

Video Decoder

YPbPr(HD)

S-video

TPF1.4A LA

FFC

6. Block Diagram

S-Video

Sound

Decoder

AV L/R

Panel

Audio

Decoder

Scaler IC

YPbPr L/R

PC Audio

DSub

DC in

Inverter

Adapter

Index of this chapter:

7.1 Chassis Overview

7.2 Exploded View

7.3 Scaler Schematic Diagram & Layouts

7.4 Power Schematic Diagram & Layouts

7.5 Key PCB Schematic Diagram & Layouts

7.6 IR PCB Schematic Diagram & Layouts

7.7 YPbPr-IN PCB Schematic Diagram & Layouts

7.1 Chassi Overview

7.Circuit Diagram & PWB Layouts

TPF1.3A LA

Innverter Board

IR Board

Key Board

YPbPr-IN Board

Scaler Board

TPF1.3A LA

7.2 Exploded View

7. Circuit Diagrams and PWB Layouts

0011 BEZEL ASSY

0040 BACK COVER

0041 DOOR-CABLE

0091 CONTROL BUTTON

0093 SHIELD - SCALER

0109 NUT-AUDIO JACK

1050 TFT-LCD A201SN02V4 (AUOP) B

1051 SCALER ASSY(CHINA 20 AUO)

1053 KEY BOARD ASSY

1054 IR PCB ASSY

1183 PSU OPENFR INV BL6 (DAC-16T003

1185 LSP BOX 8R 3W - R (P 150CR)

1186 LSP BOX 8R 3W - R ( P150CL)

7.3.1 Scaler Schematic Diagram - power

7.Circuit Diagrams and PWB Layouts

S-

TPF 1.3A LA

7.3.2 Scaler Schematic Diagram - PC IN

7. Circuit Diagrams and PWB Layouts

7.3.3 Scaler Schematic Diagram - SCART

7. Circuit Diagrams and PWB Layouts

TPF 1.3A LA

S-

7.3.4 Scaler Schematic Diagram - VIDEO IN

TPF 1.3A LA

S-

7. Circuit Diagrams and PWB Layouts

7.3.5 Scaler Schematic Diagram - VIDEO DECODER

S-

7. Circuit Diagrams and PWB Layouts

TPF 1.3A LA

7.3.6 Scaler Schematic Diagram - T/T DECODER

TPF 1.3A LA

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7.Circuit Diagrams and PWB Layouts

7.3.7 Scaler Schematic Diagram - MCU

S-

7. Circuit Diagrams and PWB Layouts

TPF 1.3A LA

7.3.8 Scaler Schematic Diagram - SCALER

TPF 1.3A LA

7. Circuit Diagrams and PWB Layouts

S-

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