Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Published by JH 0664 BG CD Customer ServicePrinted in The NetherlandsSubject to modificationEN 3122 785 16011
EN 2TE3.2E CA1.
Technical Specifications, Connections and Chassis Overview
1.Technical Specifications, Connections and Chassis Overview
Index of this chapter:
1.1 Technical Specifications
1.2 Connections / Control Facilities
1.3 Chassis Overview
1.1Technical Specifications
1.1.1Reception
Tuning system: PLL
Colour systems: PAL B/G, D/K, I
: SECAM B/G, L/L'
Sound systems 14”: Mono
Sound systems 21”: Mono
: 2x 3 W Mono
Mains voltage: 220 - 240 V
Mains frequency: 50 Hz
Ambient temperature: + 5 to + 45 deg. C
Maximum humidity: 90 %
Power consumption: 50 W (10 %)
Standby Power consumption: < 2 W
1.2Connections / Control Facilities
1.2.1Front Connections and Front Control
1.2.2Rear Connections 14” & 21”
75 Ohm
EXT1
Figure 1-3 Rear Connections
TV Aerial In
Aerial input: 75 Ω, Coax (IEC-
type)
External 1: RGB in + CVBS in/out
20
21
2
E_06532_001.eps
050404
1
Figure 1-4 SCART connector
1-Audio R (0.5 V
2-Audio R (0.5 V
3 - Audio L (0.5 V
4 - GND H
1 kΩ) k
rms
10 kΩ) j
rms
1 kΩ) k
rms
5 - GND H
6 - Audio L (0.5 V
7 - Blue (0.7 Vpp / 75 Ω) j
10 kΩ) j
rms
8 - CVBS-status 0 - 2.0 V: INT
4.5 - 12 V: EXT 4:3
9 - GND H
10 -
F_15850_002.eps
160805
SK1RED
IR
HEADPHONE
- VOLUME +
- PROGRAM +
G_16010_013.eps
Figure 1-1 Front Control without AV Input (xxPT1501)
SK1
RED
VIDEO
- VOLUME + AUDIO
- PROGRAM +HEADPHONE
G_16010_014.eps
130206
IR
Figure 1-2 Front Control with AV Input (xxPT1521)
Audio / Video In (Only for 14PT1521)
1-Video CVBS (1 V
2-Audio (MONO) (0.5 V
3-Headphone 3.5 mm (8 - 600 Ω/ <100 mW) rt
/ 75 Ω) jq
pp
/ 10 k Ω) jq
rms
130206
11 - Green (0.7 V
12 -
/ 75 Ω) j
pp
13 - GND H
14 - GND H
15 - Red (0.7 V
16 - RGB-status 0 - 0.4 V: INT
/ 75 Ω) j
PP
1 - 3 V: EXT / 75 Ω
17 - GND H
18 - GND H
19 - CVBS (1 V
20 - CVBS (1 V
21 - Earth GND vj
/ 75 Ω) k
pp
/ 75 Ω) j
pp
Technical Specifications, Connections and Chassis Overview
EN 3TE3.2E CA1.
1.2.3Rear Connections 21PT5421 only
75 Ohm
Figure 1-5 Rear Connections
TV Aerial In
Aerial input: 75 Ω, Coax (IEC-
External 1: RGB/YUV - In and CVBS - In/Out
20
21
2
E_06532_001.eps
050404
1
type)
G_16010_040.eps
260406
8 - CVBS - status 0 - 2 V: INT
4.5 - 7 V: EXT 16:9
9.5 - 12 V: EXT 4:3
9 - Green - gnd Ground H
10 - n.c.
11 - n.c.
12 - n.c.
13 - Red - gnd Ground H
14 - FBL - gnd Ground H
15 - YC-C - in 0.7 V_pp / 75 ohm j
16 - n.c.
17 - Video Ground H
18 - Video Ground H
19 - CVBS - out 1 V_pp / 75 ohm k
20 - Y/CVBS - in 1 V_pp / 75 ohm j
21 - Shielding Ground H
1.2.4Side Connections 21PT5421 only
Figure 1-6 SCART connector
1 - Audio - R 0.5 V_rms / 1 kohm k
2 - Audio - R 0.5 V_rms / 10 kohm j
3 - Audio - L 0.5 V_rms / 1 kohm k
4 - Audio - gnd Ground H
5 - Blue - gnd Ground H
6 - Audio - L 0.5 V_rms / 10 kohm j
7 - Blue/U - in 0.7 V_pp / 75 ohm j
8 - CVBS - status 0 - 2 V: INT
4.5 - 7 V: EXT 16:9
9.5 - 12 V: EXT 4:3
9 - Green - gnd Ground H
10 - n.c.
11 - Green/Y - in 0.7 V_pp / 75 ohm j
12 - n.c.
13 - Red - gnd Ground H
14 - FBL - gnd Ground H
15 - Red/V - in 0.7 V_pp / 75 ohm j
16 - Status/FBL 0 - 0.4 V: INT
1 - 3 V: EXT / 75 ohm j
17 - Video Ground H
18 - Video Ground H
19 - CVBS - out 1 V_pp / 75 ohm k
20 - CVBS - in 1 V_pp / 75 ohm j
21 - Shielding Ground H
External 2: CVBS- In and SVHS - In
20
2
G_16010_041.eps
260406
Audio / Video In
Ye - Video (CVBS) 1 V_pp / 75 ohm jq
Wh - Audio - L 0.5 V_rms / 10 kohm jq
Rd - Audio - R 0.5 V_rms / 10 kohm jq
Bk - Headphone 8 - 600 Ohm / 4 mW ot
21
E_06532_001.eps
050404
1
Figure 1-7 SCART connector
1 - Audio - R 0.5 V_rms / 1 kohm k
2 - Audio - R 0.5 V_rms / 10 kohm j
3 - Audio - L 0.5 V_rms / 1 kohm k
4 - Audio - gnd Ground H
5 - Blue - gnd Ground H
6 - Audio - L 0.5 V_rms / 10 kohm j
7-n.c.
EN 4TE3.2E CA1.
1.3Chassis Overview
CRT PANEL
A6
Technical Specifications, Connections and Chassis Overview
CRT PANEL
A6
SIDE I/O PANEL
A8
Figure 1-8 Chassis Overview 14” & 21”
MAIN
CHASSIS
PANEL
MCU
VIDEO
SOUND
POWER
DEFLECTION
SCART
MCU
A1
A2
A3
A4
A5
A7
G_16010_042.eps
260406
A1
Figure 1-9 Chassis Overview 21PT5421
MAIN
CHASSIS
PANEL
VIDEO
SOUND
POWER
DEFLECTION
SCART
A2
A3
A4
A5
A7
G_16010_043.eps
260406
Safety Instructions, Warnings, and Notes
2.Safety Instructions, Warnings, and Notes
EN 5TE3.2E CA2.
Index of this chapter:
2.1 Safety Instructions
2.2 Maintenance Instructions
2.3 Warnings
2.4 Notes
2.1Safety Instructions
Safety regulations require the following during a repair:
•Connect the set to the Mains/AC Power via an isolation
transformer (> 800 VA).
•Replace safety components, indicated by the symbol h,
only by components identical to the original ones. Any
other component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
•Wear safety goggles when you replace the CRT.
Safety regulations require that after a repair, the set must be
returned in its original condition. Pay in particular attention to
the following points:
•General repair instruction: as a strict precaution, we advise
you to re-solder the solder connections through which the
horizontal deflection current flows. In particular this is valid
for the:
1. Pins of the line output transformer (LOT).
2. Fly-back capacitor(s).
3. S-correction capacitor(s).
4. Line output transistor.
5. Pins of the connector with wires to the deflection coil.
6. Other components through which the deflection current
flows.
Note: This re-soldering is advised to prevent bad connections
due to metal fatigue in solder connections, and is therefore only
necessary for television sets more than two years old.
•Route the wire trees and EHT cable correctly and secure
them with the mounted cable clamps.
•Check the insulation of the Mains/AC Power lead for
external damage.
•Check the strain relief of the Mains/AC Power cord for
proper function, to prevent the cord from touching the CRT,
hot components, or heat sinks.
•Check the electrical DC resistance between the Mains/AC
Power plug and the secondary side (only for sets that have
a Mains/AC Power isolated power supply):
1. Unplug the Mains/AC Power cord and connect a wire
between the two pins of the Mains/AC Power plug.
2. Set the Mains/AC Power switch to the "on" position
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the
Mains/AC Power plug and the metal shielding of the
tuner or the aerial connection on the set. The reading
should be between 4.5 Mohm and 12 Mohm.
4. Switch "off" the set, and remove the wire between the
two pins of the Mains/AC Power plug.
•Check the cabinet for defects, to prevent touching of any
inner parts by the customer.
2.2Maintenance Instructions
We recommend a maintenance inspection carried out by
qualified service personnel. The interval depends on the usage
conditions:
•When a customer uses the set under normal
circumstances, for example in a living room, the
recommended interval is three to five years.
•When a customer uses the set in an environment with
higher dust, grease, or moisture levels, for example in a
kitchen, the recommended interval is one year.
•The maintenance inspection includes the following actions:
1. Perform the “general repair instruction” noted above.
2. Clean the power supply and deflection circuitry on the
chassis.
3. Clean the picture tube panel and the neck of the picture
tube.
2.3Warnings
•In order to prevent damage to ICs and transistors, avoid all
high voltage flashovers. In order to prevent damage to the
picture tube, use the method shown in figure “Discharge
picture tube”, to discharge the picture tube. Use a high
voltage probe and a multi-meter (position V
until the meter reading is 0 V (after approx. 30 s).
V
Figure 2-1 Discharge picture tube
•All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD w). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. Available
ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822
310 10671.
– Wristband tester 4822 344 13999.
•Be careful during measurements in the high voltage
section.
•Never replace modules or other components while the unit
is switched "on".
•When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and prevents circuits
from becoming unstable.
2.4Notes
2.4.1General
•Measure the voltages and waveforms with regard to the
chassis (= tuner) ground (H), or hot ground (I), depending
on the tested area of circuitry. The voltages and waveforms
shown in the diagrams are indicative. Measure them in the
Service Default Mode (see chapter 5) with a colour bar
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
•Where necessary, measure the waveforms and voltages
with (D) and without (E) aerial signal. Measure the
voltages in the power supply section both in normal
operation (G) and in stand-by (F). These values are
indicated by means of the appropriate symbols.
•The semiconductors indicated in the circuit diagram and in
the parts lists, are interchangeable per position with the
). Discharge
DC
E_06532_007.eps
250304
EN 6TE3.2E CA2.
Safety Instructions, Warnings, and Notes
semiconductors in the unit, irrespective of the type
indication on these semiconductors.
2.4.2Schematic Notes
•All resistor values are in ohms, and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 kohm).
•Resistor values with no multiplier may be indicated with
either an "E" or an "R" (e.g. 220E or 220R indicates 220
ohm).
•All capacitor values are given in micro-farads (µ= x10
nano-farads (n= x10
•Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
•An "asterisk" (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
•The correct component values are listed in the Spare Parts
List. Therefore, always check this list when there is any
doubt.
2.4.3Rework on BGA (Ball Grid Array) ICs
General
Although (LF)BGA assembly yields are very high, there may
still be a requirement for component rework. By rework, we
mean the process of removing the component from the PWB
and replacing it with a new component. If an (LF)BGA is
removed from a PWB, the solder balls of the component are
deformed drastically so the removed (LF)BGA has to be
discarded.
-9
), or pico-farads (p= x10
-12
2.4.4Lead-free Solder
Philips CE is producing lead-free sets (PBF) from 1.1.2005
onwards.
Identification: The bottom line of a type plate gives a 14-digit
serial number. Digits 5 and 6 refer to the production year, digits
7 and 8 refer to production week (in example below it is 1991
week 18).
-6
),
).
E_06532_024.eps
230205
Figure 2-2 Serial number example
Regardless of the special lead-free logo (which is not always
indicated), one must treat all sets from this date onwards
according to the rules as described below.
P
b
Device Removal
As is the case with any component that is being removed, it is
essential when removing an (LF)BGA, that the board, tracks,
solder lands, or surrounding components are not damaged. To
remove an (LF)BGA, the board must be uniformly heated to a
temperature close to the reflow soldering temperature. A
uniform temperature reduces the risk of warping the PWB.
To do this, we recommend that the board is heated until it is
certain that all the joints are molten. Then carefully pull the
component off the board with a vacuum nozzle. For the
appropriate temperature profiles, see the IC data sheet.
Area Preparation
When the component has been removed, the vacant IC area
must be cleaned before replacing the (LF)BGA.
Removing an IC often leaves varying amounts of solder on the
mounting lands. This excessive solder can be removed with
either a solder sucker or solder wick. The remaining flux can be
removed with a brush and cleaning agent.
After the board is properly cleaned and inspected, apply flux on
the solder lands and on the connection balls of the (LF)BGA.
Note: Do not apply solder paste, as this has been shown to
result in problems during re-soldering.
Device Replacement
The last step in the repair process is to solder the new
component on the board. Ideally, the (LF)BGA should be
aligned under a microscope or magnifying glass. If this is not
possible, try to align the (LF)BGA with any board markers.
So as not to damage neighbouring components, it may be
necessary to reduce some temperatures and times.
More Information
For more information on how to handle BGA devices, visit this
URL: www.atyourservice.ce.philips.com (needs subscription,
not available for all regions). After login, select “Magazine”,
then go to “Repair downloads”. Here you will find Information
on how to deal with BGA-ICs.
Figure 2-3 Lead-free logo
Due to lead-free technology some rules have to be respected
by the workshop during a repair:
•Use only lead-free soldering tin Philips SAC305 with order
code 0622 149 00106. If lead-free solder paste is required,
please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
workshops should be avoided because paste is not easy to
store and to handle.
•Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
– To reach a solder-tip temperature of at least 400°C.
– To stabilise the adjusted temperature at the solder-tip.
– To exchange solder-tips for different applications.
•Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilised at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
reduce heat.
•Mix of lead-free soldering tin/parts with leaded soldering
tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If this cannot be avoided, carefully
clean the solder-joint from old tin and re-solder with new
tin.
•Use only original spare-parts listed in the Service-Manuals.
Not listed standard material (commodities) has to be
purchased at external companies.
•Special information for lead-free BGA ICs: these ICs will be
delivered in so-called "dry-packaging" to protect the IC
against moisture. This packaging may only be opened
shortly before it is used (soldered). Otherwise the body of
the IC gets "wet" inside and during the heating time the
structure of the IC will be destroyed due to high (steam-)
pressure inside the body. If the packaging was opened
before usage, the IC has to be heated up for some hours
(around 90°C) for drying (think of ESD-protection!).
Do not re-use BGAs at all!
Directions for Use
EN 7TE3.2E CA3.
•For sets produced before 1.1.2005, containing leaded
soldering tin and components, all needed spare parts will
be available till the end of the service period. For the repair
of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with
mixed technologies), you can use the following method:
•Always use the highest temperature to solder, when using
SAC305 (see also instructions below).
•De-solder thoroughly (clean solder joints to avoid mix of
two alloys).
Caution: For BGA-ICs, you must use the correct temperatureprofile, which is coupled to the 12NC. For an overview of these
profiles, visit the website www.atyourservice.ce.philips.com
(needs subscription, but is not available for all regions)
3.Directions for Use
You can download this information from the following websites:
You will find this and more technical information within the
"Magazine", chapter "Repair downloads".
For additional questions please contact your local repair help
desk.
2.4.5Practical Service Precautions
•It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
•Always respect voltages. While some may not be
dangerous in themselves, they can cause unexpected
reactions that are best avoided. Before reaching into a
powered TV set, it is best to test the high voltage insulation.
It is easy to do, and is a good service precaution.
EN 8TE3.2E CA4.
Mechanical Instructions
4.Mechanical Instructions
Index of this chapter:
4.1 Rear Cover Removal
4.2 Service Position Main Panel
4.3 Rear Cover Mounting
Note: Figures below can deviate slightly from the actual
situation, due to the different set executions.
4.1Rear Cover Removal
•Remove all (ten) fixation screws of the rear cover: two at
the top, two at each side, three at the bottom and one in
the middle of the rear cover. The 14" set has only four
fixation screws: two at the top and two at the bottom.
•Now pull the rear cover backward to remove it.
4.2Service Position Main Panel
•Disconnect the strain relief of the Mains cord.
•Remove the main panel, by pushing the two centre clips
outward [1]. At the same time, pull the panel away from the
CRT [2].
•Disconnect the degaussing coil by removing the cable from
connector KP02.
•Move the panel somewhat to the left and flip it 90 degrees
[3], with the components towards the CRT.
4.3Rear Cover Mounting
Before you mount the rear cover:
•Place the mains cord correctly in its guiding brackets
(strain relief).
•Place all cables in their original position.
1
2
A
B
Figure 4-1 Mechanical Service Position
3
G_16010_010.eps
1
130206
Service Modes, Error Codes and Fault Finding
5.Service Modes, Error Codes and Fault Finding
EN 9TE3.2E CA5.
Index of this chapter:
5.1 Service Modes
5.2 Fault Tracing Diagram for Power Supply
5.1Service Modes
The Service Mode offers features, which the service technician
can use to repair a set. Any feature change, made via the
Service Menu, will respond at the same time. All displayed text
strings in the Service Modes are in English.
5.1.1 TV Service Mode
Purpose
•To perform alignments (e.g. colour adjustment and
geometry alignments)
•To change option settings
Specifications
All service unfriendly modes (if present) are disabled, like:
•Auto switch 'off' (when there is no 'ident' signal)
•Timer switch to a channel
•Automatic user menu time-out
•The NVM is unprotected
•AV functions are not working
How to enter the Service Mode
Screen menu's must be 'off', when you enter the Service Mode.
Use a standard customer RC transmitter and key in the code
062596 directly followed by the MENU button in 10 seconds.
The following screen is visible when you enter the Service
Mode:
How to navigate
•Select menu items with the CURSOR UP/DOWN keys.
•With the CURSOR LEFT/RIGHT keys, it is possible to
change the value of the first item (Program)
•With the CURSOR RIGHT and OK keys, activate the
selected menu item.
•When you press the MENU key in a sub menu, you will
return to the previous menu.
•When you press the MENU key in the Service Mode menu,
you will return to the Main menu.
How to exit
•With the STANDBY command, the set switches to
Standby.
•With the MENU key, the set returns to the Main menu.
Switching the set 'off' and 'on' with the mains switch, brings
the set into normal operation again. All changes in the
Service Mode are stored immediately.
ST92195PSC7-V5 XX.XX.XX
Program06
OPTIONS
GEOMETRY
G2A
VIDEO
TUNER/IF
G_16010_011.eps
130206
Figure 5-1 TV Service Mode Menu
1. LLLLLLL. This is the used IC type.
2. PAB#-XX. This is the software identification.
•P = Philips.
•A = the region (W = West Europe, E = East Europe).
•B = sound specification (M = Mono, S = Stereo).
•# = number of TXT pages.
•XX = the software version number (the first X is the
main software version number and the second X is the
sub software version number).
3. PROGRAM.
4. OPTIONS. Three codes possible.
5. GEOMETRY. To align the geometry (see chapter 8.2.2 for
a detailed description).
6. G2A. To align the G2 (see chapter 8.2.3 for a detailed
description).
7. VIDEO. To adjust RGB, R_cut-off and G_cut-off.
8. TUNER/IF. To align the tuner.
EN 10TE3.2E CA5.
Service Modes, Error Codes and Fault Finding
5.2Fault Tracing Diagram for Power Supply
D100,101
D102,103
C106,
R100,
G_16010_013.eps
130206
YES
Fuse
F100
Defective
NO
Switched mode
Power Supply defective,
+110V is missing or level
is wrong
R107, R115
Open
circuit
R112
R110, D107
D106,R114
NO
YES
YES
Voltage at
drain of
T101
YES
Voltage at
I100 pin3
<1V
NO
Start-up
Voltage pin 8
<8V
NO
I101
NO
D116
NO
Control range of
switched-mode
Power Supply
Figure 5-2 Fault Tracing
Measure
+110V
adjustable
with V100
YES
G_16010_012.eps
130206
Service Modes, Error Codes and Fault Finding
EN 11TE3.2E CA5.
Table 5-1 Diversity between Main Board 05TA085-5 and 05TA085-6
Component Pos.NoType/ValueReason for ModificationSchematic Location ActionComponent
J8478MMRemoved (D125 Will Be Used)A1 MCUremovedjumper