Philips TE3.1E CA Schematic
Colour Television Chassis
TE3.1E
CA
Contents Page Contents Page
1. Technical Specifications, Connections and Chassis
Overview 2
2. Safety Instructions, Warnings, and Notes 4
3. Directions for Use 6
4. Mechanical Instructions 7
5. Service Modes, Error Codes and Fault Finding 8
6. Block Diagrams, Test Point Overviews, and
Waveforms
Wiring Diagram 11
Block Diagram Main 12
Block Diagram Power Supply 13
I2C Diagram 14
7. Circuit Diagrams and PWB Layouts Diagram PWB
Main Panel: Tuner (A1) 15 24-25
Main Panel: EEPROM and MCU (A2 - A6) 16 24-25
Main Panel: Sound (A3) 17 24-25
Main Panel: Deflection (A4 - A10) 18 24-25
Main Panel: Video (A5) 19 24-25
Side AV Panel (A7) 20 26Main Panel: Power (A8) 21 24-25
Main Panel: Scart (A9) 22 24-25
Main Panel: CRT (A11) 23 24-25
8. Electrical Alignments 27
9. Circuit Description and Abbreviation List 30
10. SpareParts List 40
11. Revision List 43
©
Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Published by JH 0568 Service PaCE Printed in the Netherlands Subject to modification EN 3122 785 15850
EN 2 TE3.1E CA1.
Technical Specifications, Connections and Chassis Overview
1. Technical Specifications, Connections and Chassis Overview
1.1 Technical Specifications
Index of this chapter:
1.1 Technical Specifications
1.2 Connections / Control Facilities
1.3 Chassis Overview
Notes:
• Figures can deviate due to the different set executions.
• Specifications are indicative (subject to change).
1.1.1 Reception
Tuning system : PLL
Colour systems : PAL B/G, D/K, I
: SECAM B/G, L/L'
Sound systems : FM/FM (5.5 - 5.74)
(B/G)
: NICAM B/G
(5.5 - 5.85),
NICAM D/K
: NICAM I (6.0 - 6.52),
NICAM L (6.5 (AM) -
5.85)
A/V connections : NTSC 3.58
: NTSC 4.43
Channel selections : 100 channels
: UVSH
IF frequency : 38.9 MHz
Aerial input : 75 :, Coax
Audio / Video In
1 -Video CVBS (1 Vpp / 75 :) jq
2 -Audio L (0.5 Vrms / 10 k:) jq
3 -Audio R (0.5 Vrms / 10 k:) jq
4 -Headphone 3.5 mm (8 - 600 : /
<100 mW) rt
1.2.2 Rear Connections
75 Ohm
EXT1
Figure 1-3 Rear Connections
TV Aerial In
Aerial input : 75 :, Coax
(IEC-type)
External 1: RGB in + CVBS in/out
20
2
F_15850_002.eps
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1.1.2 Miscellaneous
Audio output (RMS) : 2 x 3 W stereo
Mains voltage : 220 - 240V
Mains frequency : 50 / 60 Hz (r 5 %)
Ambient temperature : + 5 to + 45 deg. C
Maximum humidity : 90%
Power consumption : 55W r 10%
Standby Power consumption : < 3W
1.2 Connections / Control Facilities
1.2.1 Side Connections and Front Control
-
+
SK1
IR - VOLUME +
LIGHT SENSOR LENS
RED
Figure 1-1 Front Control
Video
- PROGRAM +
Audio
R
L
F_15850_001.eps
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21
E_06532_001.eps
1
050404
Figure 1-4 SCART connector
1 -Audio R (0.5 Vrms 1 k:) k
2 -Audio R (0.5 Vrms 10 k:) j
3 -Audio L (0.5 Vrms 1 k:) k
4 - GND H
5 - GND H
6 -Audio L (0.5 Vrms 10 k:) j
7 -Blue (0.7 Vpp / 75 :) j
8 -CVBS-status 0 - 2.0 V: INT
4.5 - 12 V: EXT 4:3
9 - GND H
10 -
11 - Green (0.7 Vpp / 75 :) j
12 -
13 - GND H
14 - GND H
15 - Red (0.7 Vpp / 75 :) j
16 - RGB-status 0 - 0.4 V: INT
1 - 3 V: EXT / 75 :
17 - GND H
18 - GND H
19 - CVBS (1 Vpp / 75 :) k
20 - CVBS (1 Vpp / 75 :) j
21 - Earth GND vj
F_15160_002.eps
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Figure 1-2 Side AV
Technical Specifications, Connections and Chassis Overview
1.3 Chassis Overview
CRT PANEL
A11
EN 3TE3.1E CA 1.
SIDE AV PANEL
A7
Figure 1-5 Chassis Overview
MAIN
CHASSIS
PANEL
TUNER
EEPROM
AUDIO
VERTICAL
VIDEO PROCESSOR
µ-CONTROLLER
POWER BLOCK
SCART
HORIZONTAL
F_15850_003.eps
A1
A2
A3
A4
A5
A6
A8
A9
A10
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EN 4 TE3.1E CA2.
Safety Instructions, Warnings, and Notes
2. Safety Instructions, Warnings, and Notes
Index of this chapter:
2.1 Safety Instructions
2.2 Warnings
2.3 Notes
2.1 Safety Instructions
Safety regulations require the following during a repair:
• Connect the set to the Mains (AC Power) via an isolation
transformer (> 800 VA).
• Replace safety components, indicated by the symbol h,
only by components identical to the original ones. Any
other component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, the set must be
returned in its original condition. Pay in particular attention to
the following points:
• Route the wire trees correctly and fix them with the
mounted cable clamps.
• Check the insulation of the Mains (AC Power) lead for
external damage.
• Check the strain relief of the Mains (AC Power) cord for
proper function.
• Check the electrical DC resistance between the Mains (AC
Power) plug and the secondary side (only for sets that have
a Mains (AC Power) isolated power supply):
1. Unplug the Mains (AC Power) cord and connect a wire
between the two pins of the Mains (AC Power) plug.
2. Set the Mains (AC Power) switch to the "on" position
(keep the Mains (AC Power) cord unplugged!).
3. Measure the resistance value between the pins of the
Mains (AC Power) plug and the metal shielding of the
tuner or the aerial connection on the set. The reading
should be between 4.5 Mohm and 12 Mohm.
4. Switch "off" the set, and remove the wire between the
two pins of the Mains (AC Power) plug.
• Check the cabinet for defects, to prevent touching of any
inner parts by the customer.
2.3 Notes
2.3.1 General
• Measure the voltages and waveforms with regard to the
chassis (= tuner) ground (H), or hot ground (I), depending
on the tested area of circuitry. The voltages and waveforms
shown in the diagrams are indicative. Measure them in the
Service Default Mode (see chapter 5) with a colour bar
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
• Where necessary, measure the waveforms and voltages
with (D) and without (E) aerial signal. Measure the
voltages in the power supply section both in normal
operation (G) and in stand-by (F). These values are
indicated by means of the appropriate symbols.
• The semiconductors indicated in the circuit diagram and in
the parts lists, are interchangeable per position with the
semiconductors in the unit, irrespective of the type
indication on these semiconductors.
2.3.2 Schematic Notes
• All resistor values are in ohms, and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 kohm).
• Resistor values with no multiplier may be indicated with
either an "E" or an "R" (e.g. 220E or 220R indicates 220
ohm).
• All capacitor values are given in micro-farads (P x10
nano-farads (n= x10
• Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
• An "asterisk" (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
• The correct component values are listed in the Spare Parts
List. Therefore, always check this list when there is any
doubt.
-9
), or pico-farads (p= x10
-12
-6
),
).
2.2 Warnings
• All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD w). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. Available
ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822
310 10671.
– Wristband tester 4822 344 13999.
• Be careful during measurements in the high voltage
section.
• Never replace modules or other components while the unit
is switched "on".
• When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a
circuit becoming unstable.
2.3.3 Rework on BGA (Ball Grid Array) ICs
General
Although (LF)BGA assembly yields are very high, there may
still be a requirement for component rework. By rework, we
mean the process of removing the component from the PWB
and replacing it with a new component. If an (LF)BGA is
removed from a PWB, the solder balls of the component are
deformed drastically so the removed (LF)BGA has to be
discarded.
Device Removal
As is the case with any component that, is being removed, it is
essential when removing an (LF)BGA, that the board, tracks,
solder lands, or surrounding components are not damaged. To
remove an (LF)BGA, the board must be uniformly heated to a
temperature close to the reflow soldering temperature.
A uniform temperature reduces the risk of warping the PWB. To
do this, we recommend that the board is heated until it is certain
that all the joints are molten. Then carefully pull the component
off the board with a vacuum nozzle. For the appropriate
temperature profiles, see the IC data sheet.
Area Preparation
When the component has been removed, the vacant IC area
must be cleaned before replacing the (LF)BGA.
Removing an IC often leaves varying amounts of solder on the
mounting lands. This excessive solder can be removed with
either a solder sucker or solder wick. The remaining flux can be
removed with a brush and cleaning agent.
Safety Instructions, Warnings, and Notes
EN 5TE3.1E CA 2.
After the board is properly cleaned and inspected, apply flux on
the solder lands and on the connection balls of the (LF)BGA.
Note: Do not apply solder paste, as this has been shown to
result in problems during re-soldering.
Device Replacement
The last step in the repair process is to solder the new
component on the board. Ideally, the (LF)BGA should be
aligned under a microscope or magnifying glass. If this is not
possible, try to align the (LF)BGA with any board markers.
So as not to damage neighbouring components, it may be
necessary to reduce some temperatures and times.
More Information
For more information on how to handle BGA devices, visit this
URL: www.atyourservice.ce.philips.com (needs subscription,
not available for all regions). After login, select “Magazine”,
then go to “Workshop Information”. Here you will find
Information on how to deal with BGA-ICs.
2.3.4 Lead-free Solder
Philips CE is producing lead-free sets (PBF) from 1.1.2005
onwards.
Identification: The bottom line of a type plate gives a 14-digit
serial number. Digits 5 and 6 refer to the production year, digits
7 and 8 refer to production week (in example below it is 1991
week 18).
To avoid wear-out of tips, switch “off” unused equipment or
reduce heat.
• Mix of lead-free soldering tin/parts with leaded soldering
tin/parts is possible but PHILIPS recommends strongly to
avoid mixed regimes. If this cannot be avoided, carefully
clear the solder-joint from old tin and re-solder with new tin.
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard material (commodities) has to be
purchased at external companies.
• Special information for lead-free BGA ICs: these ICs will be
delivered in so-called "dry-packaging" to protect the IC
against moisture. This packaging may only be opened
shortly before it is used (soldered). Otherwise the body of
the IC gets "wet" inside and during the heating time the
structure of the IC will be destroyed due to high (steam-)
pressure inside the body. If the packaging was opened
before usage, the IC has to be heated up for some hours
(around 90°C) for drying (think of ESD-protection!).
Do not re-use BGAs at all!
• For sets produced before 1.1.2005, containing leaded
soldering tin and components, all needed spare parts will
be available till the end of the service period. For the repair
of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with
mixed technologies), you can use the following method:
• Always use the highest temperature to solder, when using
SAC305 (see also instructions below).
• De-solder thoroughly (clean solder joints to avoid the
mixing of two alloys).
E_06532_024.eps
230205
Figure 2-1 Serial number example
Regardless of the special lead-free logo (which is not always
indicated), one must treat all sets from this date onwards
according to the rules as described below.
P
b
Figure 2-2 Lead-free logo
Due to lead-free technology some rules have to be respected
by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order
code 0622 149 00106. If lead-free solder paste is required,
please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
workshops should be avoided because paste is not easy to
store and to handle.
• Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
– To reach a solder-tip temperature of at least 400°C.
– To stabilise the adjusted temperature at the solder-tip.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilised at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
Caution: For BGA-ICs, you must use the correct temperature
profile, which is coupled to the 12NC. For an overview of these
profiles, visit the website www.atyourservice.ce.philips.com
(needs subscription, but is not available for all regions).
You will find this and more technical information within the
"Magazine", chapter "Workshop information".
For additional questions please contact your local repair help
desk.
2.3.5 Practical Service Precautions
• It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
• Always respect voltages. While some may not be
dangerous in themselves, they can cause unexpected
reactions that are best avoided. Before reaching into a
powered TV set, it is best to test the high voltage insulation.
It is easy to do, and is a good service precaution.
EN 6 TE3.1E CA3.
3. Directions for Use
You can download this information from the following websites:
http://www.philips.com/support
http://www.p4c.philips.com
Directions for Use
4. Mechanical Instructions
Index of this chapter:
4.1 Exploded view
4.2 Rear Cover Removal
4.3 Service Position Main Panel
4.4 Side I/O Panel Removal
4.5 Rear Cover Mounting
4.1 Exploded View
Mechanical Instructions
EN 7TE3.1E CA 4.
4.2 Rear Cover Removal
1. Remove all fixation screws (9x) of the rear cover.
2. Pull the rear cover a little backwards.
3. Now pull the rear cover backwards to remove it.
4.3 Service Position Main Panel
1. Remove the main panel [1]. At the same time, pull the
panel away from the CRT [2].
2. Turn the panel 90 degrees clockwise [3].
3. Flip the panel 90 degrees [4], with the components towards
the CRT
4.4 Side I/O Panel Removal
Remove the side I/O panel after unscrewing the screws (2x) at
the bottom of the set.
4.5 Rear Cover Mounting
Figure 4-1 Exploded view
F_15850_028.eps
20050824
To reassemble the set, perform all described processes in
reverse order.
Be sure that, before the rear cover is mounted:
• The mains cord is mounted correctly in its guiding bracket.
• All wires/cables are returned in their original position
EN 8 TE3.1E CA5.
Service Modes, Error Codes and Fault Finding
5. Service Modes, Error Codes and Fault Finding
Index of this chapter
1. Service Modes
2. Fault Finding
5.1 Service Modes
The Service Mode offers features, which the service technician
can use to repair a set. Any feature change, made via the
Service Menu, will respond at the same time. All displayed text
strings in the Service Modes are in English.
5.1.1 TV Service Mode
Purpose
• To perform alignments (e.g. colour adjustment and
geometry alignments)
• To change option settings
Specifications
All service unfriendly modes (if present) are disabled, like:
• Auto switch 'off' (when there is no 'ident' signal)
• Timer switch to a channel
• Automatic user menu time-out
• The NVM is unprotected
• AV functions are not working
How to enter the Service Mode
Screen menu's must be 'off', when you enter the Service Mode.
Use a standard customer RC transmitter and key in the code
062596 directly followed by the MENU button in 10 seconds.
The following screen is visible when you enter the Service
Mode:
How to navigate
• Select menu items with the CURSOR UP/DOWN keys.
• With the CURSOR LEFT/RIGHT keys, it is possible to
change the value of the first item (Program)
• With the CURSOR RIGHT and OK keys, activate the
selected menu item.
• When you press the MENU key in a sub menu, you will
return to the previous menu.
• When you press the MENU key in the Service Mode menu,
you will return to the Main menu.
How to exit
• With the STANDBY command, the set switches to
Standby.
• With the MENU key, the set returns to the Main menu.
Switching the set 'off' and 'on' with the mains switch, brings
the set into normal operation again. All changes in the
Service Mode are stored immediately.
F_15850_005.eps
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Figure 5-1 TV Service Mode Menu
• LLLLLLL. This is the used IC type.
• PAB#-XX. This is the software identification.
– P = Philips.
– A = the region (W = West Europe, E = East Europe).
– B = sound specification (M = Mono, S = Stereo).
– # = number of TXT pages.
– XX = the software version number (the first X is the
main software version number and the second X is the
sub software version number).
• PROGRAM. .......
• OPTIONS. Three codes possible.
• GEOMETRY. To align the geometry (see chapter 8.x for a
detailed description).
• G2A. To align the G2 (see chapter 8.x for a detailed
description).
• VIDEO. To adjust RGB, R_cut-off and G_cut-off.
• TUNER/IF. To align the tuner.
Service Modes, Error Codes and Fault Finding
5.2 Fault Finding
5.2.1 Fault Tracing Diagram for Power Supply
D101-04
C101-04
C106, T101
YES
Fuse
F1
Defective
NO
EN 9TE3.1E CA 5.
Switched mode
Power Supply defective,
+123V is missing or
level is wrong
R107, R105
open
circuit
R104
R111, D107
D116,
NO
YES
YES
Voltage at
drain of
T101
YES
Voltage at
I101 pin 3
< 1V
NO
start-up
voltage pin
8
< 8V
NO
I101
NO
Measure
V102, R159
NO
Figure 5-2 Fault Tracing
adjustable with
Control range of
switched-mode
Power Supply
+123V
V101
YES
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EN 10 TE3.1E CA5.
Service Modes, Error Codes and Fault Finding
Block Diagrams, Test Point Overviews, and Waveforms
6. Block Diagrams, Test Point Overviews, and Waveforms
Wiring Diagram
11TE3.1E CA 6.
U_MCU
MCU.Sch
AV_STATUS
AV1/ AV2
A2-A7
SCL
SDA
U_S OUND
SOUND.Sch
AV2_
AUDL
AV2_ AUDR
LDVD/SC2L
RDVD/ SC2 R
SCL
SDA
L1 OUT
R1OUT
L1IN
R1I N
L2IN
R2I N
L2
OUT
R2OUT
A3
STDBY
DVD_SB
DVD_ S TB
BRST_ON/
FF
V
_OSD
HOSD
L/L A
CVBS_ TXT
B_ OSD
G_OSD
R_ OSD
U_PO WE R
POWER.Sch
STDBY
DVD_SB
O
DVD_ S TB
BRST_ ON/OFF
A9
U_C RT
CRT.S ch
A13
U_M ISP ART
MISPART.Sch
U_SCART
SCART.Sch
U_TUNER
TUNER.S ch
A1
A10
CVBS_TXT
R
G
DVD/SC2-SEL
CVBSOUT
FBEXT
CVBSEXT
BRST_ ON/OFF
SCL
SDA
AGC
IF1
IF2
A8
U_V IDEO
VIDEO.Sch
R
B
G
B
CVBSOUT
FBEXT
CVBSEXT
A5
U_D EFLE CTIO N
DEFLECTION.S ch
V_ O S D
A4-A12
SCL
SDA
AGC
IF1
IF2
BCLG
V_AMP
HOSD
HOUT
VE R T
BCLG
V_AMP
HOSD
HOUT
VE R T
F_15850_013.eps
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Block Diagrams, Test Point Overviews, and Waveforms
Block Diagram Main
12TE3.1E CA 6.
F_15850_011.eps
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Block Diagrams, Test Point Overviews, and Waveforms
Block Diagram Power Supply
13TE3.1E CA 6.
F_15850_014.eps
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