INTEGRATED CIRCUITS
DATA SH EET
TDA8007B
Multiprotocol smart card interface
Objective specification
File under Integrated Circuits, IC02
1999 Nov 11
Philips Semiconductors Objective specification
Multiprotocol smart card interface TDA8007B
FEATURES
• 8-bit parallel interface for control and communication,
compatible with multiplexed or non-multiplexed
memory access
• Specific ISO UART with parallel access on I/O for
automatic convention processing, variable baud rate
through frequency or division ratio programming, error
management at character level for T = 0, extra guard
time register
• 1 to 8 characters FIFO in reception mode
• Parity error counter in reception mode
• Dual VCC generation (5 V ±5% or 3 V ±5%,
65 mA (max.) with controlled rise and fall times)
• Dual smart card clock generation (up to 10 MHz), with
two times synchronous frequency doubling
• Cards clock STOP HIGH, clock STOP LOW or
1.25 MHz (from internal oscillator) for cards
power-down mode
• Automatic activation and deactivation sequence
through an independent sequencer
• Supports asynchronous protocols T = 0 and T = 1, in
accordance with ISO 7816 and EMV
• Versatile 24-bit timeout counter for ATR (Answer To
Reset) and waiting times processing
• 22 ETU counter for Block Guard Time
• Supports synchronous cards
• Short-circuit current limitations
• Special circuit for killing spikes during power-on/-off
• Supply supervisor for power-on/-off reset
• Step-up converter (supply voltage from 2.5 to 6 V),
doubler, tripler or follower according to VCC and V
• Additional I/O pin, allowing use of the ISO UART for
another analog interface (I/OAUX)
• Additional interrupt pin, allowing detection of level
toggling on an external signal (INTAUX)
DD
• Fastandefficientswappingbetweencard 1,card 2and
athird card whose I/O is tiedto IOAUX, due to separate
buffering of parameters for each card
• Chip select input, allowing use of several devices in
parallel and memory space paging
• Enhanced ESD protections on card side (6 kV min.)
• Software library for easy integration within the
application
• Power-down mode, reducing current consumption
during periods of non-activity.
APPLICATIONS
• Multiple smart card readers for multiprotocol
applications (EMV banking, Digital pay TV, Access
control etc.).
GENERAL DESCRIPTION
The TDA8007B is a low cost card interface for dual smart
card readers. Controlled through a parallel bus, it takes
care of all ISO 7816, EMV and GSM11-11 requirements.
Itmay be interfaced to the P0/P2ports of an 80C51 family
microcontroller, and be addressed as a memory through
MOVX instructions. It may also be addressed on a
non-multiplexed 8-bit data bus, by means of register
addresses AD0, AD1, AD2 and AD3. The integrated ISO
UART and the timeout counters allow easy use, even at
high baud rates with no real time constraints. Due to its
chip select and external I/O and INT features, it greatly
simplifies the realization of any number of types of card
readers. It gives the cards and the mode a very high level
ofsecurity,due to its special hardware against ESD, short
circuits, power failure, etc. Its integrated step-up
converter allows operation within a supply voltage range
of 2.5 to 6 V.
A software library has been developed, taking care of all
actions required for T = 0, T = 1 and synchronous
protocols, see Application Reports.
1999 Nov 11 2
Philips Semiconductors Objective specification
Multiprotocol smart card interface TDA8007B
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DD
I
DD(pd)
I
DD(sm)
I
DD(om)
V
CC
I
CC
I
CC1+ICC2
SR slew rate on V
T
deact
T
act
f
xtal
f
op
T
amb
supply voltage 2.5 − 6V
supply current in inactive mode
(power-down)
VDD= 3.3 V; cards inactive;
XTAL oscillator stopped
= 3.3 V; cards active at
V
DD
−−350 µA
−−3mA
VCC= 5 V; CLK stopped;
XTAL oscillator stopped
supply current in sleep mode cards powered at 5 V but clock
−−5mA
stopped
supply current in operating mode VDD= 3.3 V; XTAL = 20 MHz
V
CC1=VCC2
I
CC1=ICC2
=5V;
=80mA
−−300 mA
card supply voltage including static loads (5 V card) 4.75 5.0 5.25 V
with 40 nAs dynamic loads on
4.6 5.4 V
200 nF capacitor (5 V card)
including static loads (3 V card) 2.80 3.20 V
with 40 nAs dynamic loads on
2.75 3.25 V
200 nF capacitor (3 V card)
card supply current operating −−65 mA
overload detection − 80 − mA
sum of both cards’ currents −−80 mA
(rise and fall) maximum load capacitor 300 nF 0.10 0.16 0.22 V/µs
CC
deactivation cycle time −−100 µs
activation cycle time −−225 µs
crystal frequency 4 − 25 MHz
operating frequency external frequency applied on
0 − 25 MHz
pin XTAL1
ambient temperature −25 − +85 °C
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA8007BHL LQFP48 plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4mm SOT313-2
1999 Nov 11 3
Philips Semiconductors Objective specification
Multiprotocol smart card interface TDA8007B
BLOCK DIAGRAM
handbook, full pagewidth
RSTOUT
DELAY
22 nF
INT
ALE
AD0
AD1
AD2
AD3
RD
WR
D0
D1
D2
D3
D4
D5
D6
D7
CS
I/OAUX
INTAUX
V
DD
100 nF
1
48
40
39
45
44
43
42
36
37
28
29
30
31
32
33
34
35
38
2
41
SUPPLY
AND
SUPERVISOR
ISO7816
UART
TIMEOUT
COUNTER
INTERFACE CONTROL
CLOCK
CIRCUIT
GND
V
DDA
220 nF
SAP SAM
STEP-UP
CONVERTER
ANALOG
DRIVERS
SEQUENCERS
AND
220 nF
SBP SBM
AGND
2524222621231927
20
6
4
8
10
9
3
5
7
14
12
16
18
17
11
13
15
V
UP
220 nF
C41
C81
CLK1
RST1
V
CC1
I/O1
PRES1
GNDC1
C42
C82
CLK2
RST2
V
CC2
I/O2
PRES2
GNDC2
TDA8007B
XTAL1 XTAL2
Fig.1 Block diagram.
1999 Nov 11 4
INT OSC
XTAL OSC
47 46
FCE534