Philips TDA8002CG-C1, TDA8002CT-C-C1, TDA8002CT-B-C1, TDA8002CT-A-C1 Datasheet

INTEGRATED CIRCUITS

DATA SH EET

TDA8002C

IC card interface

Product specification
Supersedes data of 1999 Feb 24
File under Integrated Circuits, IC02

1999 Oct 12

Philips Semiconductors Product specification

IC card interface TDA8002C

FEATURES

• Single supply voltageinterface(3.3 or 5 V environment)

• Low-power sleep mode

• Three specific protected half-duplex bidirectional

buffered I/O lines

• VCC regulation 5 V ±5% or 3 V ±5%, ICC<55mAfor
VDD= 3.0 to 6.5 V, with controlled rise and fall times

• Thermal and short-circuit protections with current
limitations

• Automatic ISO 7816 activation and deactivation
sequences

• Enhanced ESD protections on card side (>6 kV)

• Clock generation for the card up to 12 MHz with

synchronous frequency changes

• Clock generation up to 20 MHz (external clock)

• Synchronous and asynchronous cards (memory and

smart cards)

• ISO 7816, GSM11.11 compatibility and EMV
(Europay, MasterCard and Visa) compliant

• Step-up converter for VCC generation

• Supplysupervisor for spikes eliminationand emergency

deactivation

• Chip select input for easy use of several TDA8002Cs in
parallel.

APPLICATIONS

IC card readers for:

• GSM applications

• Banking

• Electronic payment

• Identification

• Pay TV

• Road tolling.

GENERAL DESCRIPTION

The TDA8002C is a complete low-power analog interface
forasynchronous and synchronous cards.Itcan be placed
between the card and the microcontroller. It performs all
supply, protection and control functions. It is directly
compatible with ISO 7816, GSM11.11 and EMV
specifications.

ORDERING INFORMATION

TYPE NUMBER

TDA8002CT/A/C1 TDA8002CT/A SO28 plastic small outline package; 28 leads; body width
TDA8002CT/B/C1 TDA8002CT/B
TDA8002CT/C/C1 TDA8002CT/C
TDA8002CG/C1 TDA8002C LQFP32 plastic low profile quad flat package; 32 leads;

MARKING NAME DESCRIPTION VERSION

7.5 mm

body 5 × 5 × 1.4 mm

PACKAGE

SOT136-1

SOT401-1

1999 Oct 12 2

Philips Semiconductors Product specification

IC card interface TDA8002C

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

DD

I

DD(lp)

I

DD(idle)

I

DD(active)

Card supply

V

CC(O)

General

f

CLK

t

de

P

tot

T

amb

supply voltage 3.0 − 6.5 V
supply current low-power −−150 µA
supply current Idle mode; f

CLKOUT

supply current active mode; V

f

CLKOUT

=10MHz

= LOW; ICC= 100 µA −−8mA

f

CLK

f

= 5 MHz; ICC=10mA −−50 mA

CLK

f

= 5 MHz; ICC=55mA −−140 mA

CLK

active mode; V
f

CLKOUT

=10MHz

f

= LOW; ICC= 100 µA −−8mA

CLK

f

= 5 MHz; ICC=10mA −−50 mA

CLK

f

= 5 MHz; ICC=55mA −−140 mA

CLK

= 10 MHz −−5mA

=5V;

CC(O)

=3V;

CC(O)

output voltage active mode for VCC=5V

I

< 55 mA; DC load 4.6 − 5.4 V

CC

= 40 nAs; AC load 4.6 − 5.4 V

I

CC

active mode for V

I

< 55 mA; DC load 2.76 − 3.24 V

CC

= 40 nAs; AC load 2.76 − 3.24 V

I

CC

CC

=3V

card clock frequency 0 − 12 MHz
deactivation sequence duration 60 80 100 µs
continuous total power dissipation

TDA8002CT/x T
TDA8002CG T

= −25 to +85 °C −−0.56 W

amb

= −25 to +85 °C −−0.46 W

amb

ambient temperature −25 − +85 °C

1999 Oct 12 3

Philips Semiconductors Product specification

IC card interface TDA8002C

BLOCK DIAGRAM

handbook, full pagewidth

ALARM

CS

OFF

RSTIN

CMDVCC

MODE
CV/TV

CLKDIV1

CLKDIV2

CLKSEL

STROBE

V

DDD

100 nF

28

SUPPLY

INTERNAL

4

3

26

25
24
27
19

6
7
5

8

REFERENCE

VOLTAGE SENSE

ALARM

LATCH

CLOCK

CIRCUITRY

V

V

ref

SEQUENCER

DDA

S1 S2
14 12

2.5 MHz

EN2

PV

CC

EN5

EN4

470 nF

GENERATOR

100 nF

13

STEP-UP CONVERTER

INTERNAL OSCILLATOR

EN1 CLKUP

V

CC

RST

BUFFER

CLOCK

BUFFER

AGND

11

VUP

15

470 nF

V

100

nF

CC

23

100

nF

22

21

18

RST

CLK

PRES

CLKOUT

XTAL1

XTAL2

AUX1UC

9

CLK

30
31

1

OSCILLATOR

EN3

TDA8002CG

AUX2UC

I/OUC

2

32

10

DGND1

29

DGND2

Fig.1 Block diagram.

1999 Oct 12 4

THERMAL

PROTECTION

TRANSCEIVER

TRANSCEIVER

TRANSCEIVER

I/O

I/O

I/O

20

17

16

FCE246

AUX1

AUX2

I/O

Philips Semiconductors Product specification

IC card interface TDA8002C

PINNING

PIN

SYMBOL

TYPE

CT/A

TYPE

CT/B

TYPE

CT/C

TYPE

CG

XTAL1 1 1 1 30 I crystal connection or input for external clock
XTAL2 2 2 2 31 O crystal connection
I/OUC 3 3 3 32 I/O data I/O line to and from microcontroller
AUX1UC 4441I/Oauxiliary line 1 to and from microcontroller for synchronous

AUX2UC 5 −−2 I/O auxiliary line 2 to and from microcontroller for synchronous

CS − 5 5 3 I chip select control input for enabling pins I/OUC, AUX1UC,

ALARM 6664Oopen drain PMOS reset output for microcontroller (active

CLKSEL 7775Icontrol input signal for CLK (LOW = XTAL oscillator;

CLKDIV1 8886Icontrol input with CLKDIV2 for choosing CLK frequency
CLKDIV2 9997Icontrol input with CLKDIV1 for choosing CLK frequency
STROBE 10 10 10 8 I external clock input for synchronous applications
CLKOUT 11 11 11 9 O clock output (see Table 1)
DGND1 12 12 12 10 supply digital ground 1
AGND 13 13 13 11 supply analog ground
S2 14 14 14 12 I/O capacitance connection for voltage doubler
V

DDA

15 15 15 13 supply analog supply voltage
S1 16 16 16 14 I/O capacitance connection for voltage doubler
VUP 17 17 17 15 I/O output of voltage doubler
I/O 18 18 18 16 I/O data I/O line to and from card
AUX2 19 −−17 I/O auxiliary I/O line to and from card
PRES 20 19 19 18 I card input presence contact (active LOW)
PRES − 20 −−I active HIGH card input presence contact
CV/

TV −−20 19 I card voltage selection input line (high = 5 V, low = 3 V); note 1
AUX1 21 21 21 20 I/O auxiliary I/O line to and from card
CLK 22 22 22 21 O clock to card output (C3I) (see Table 1)
RST 23 23 23 22 O card reset output (C2I)
V

CC

24 24 24 23 O supply for card (C1I)

CMDVCC 25 25 25 24 I start activation sequence input from microcontroller (active

RSTIN 26 26 26 25 I card reset input from microcontroller
OFF 27 27 27 26 O open-drain NMOS interrupt output to microcontroller (active

I/O DESCRIPTION

applications

applications

AUX2UC, CLKSEL, CLKDIV1, CLKDIV2, STROBE, CV/
CMDVCC, RSTIN, OFF and MODE; note 1

HIGH)

HIGH = STROBE input)

LOW)

LOW)

TV,

1999 Oct 12 5

Philips Semiconductors Product specification

IC card interface TDA8002C

PIN

SYMBOL

TYPE

CT/A

TYPE

CT/B

TYPE

CT/C

TYPE

CG

MODE 28 28 28 27 I operating mode selection input (HIGH = normal; LOW = sleep)
V

DDD

−−−28 supply digital supply voltage

DGND2 −−−29 supply digital ground 2

Note

1. A pull-up resistor of 100 kΩ connected to VDD is integrated.

I/O DESCRIPTION

handbook, halfpage

AUX1UC
AUX2UC

CLKSEL
CLKDIV1
CLKDIV2

STROBE
CLKOUT

Fig.2 Pin configuration (TDA8002CT/A).

XTAL1
XTAL2

I/OUC

ALARM

DGND1

AGND

S2

1
2
3
4
5
6
7

TDA8002CT/A

8

9
10
11
12
13

FCE247

28
27
26
25
24
23
22
21
20
19
18
17
16
1514

MODE
OFF
RSTIN
CMDVCC
V

CC

RST
CLK
AUX1
PRES
AUX2
I/O
VUP
S1
V

DDA

handbook, halfpage

AUX1UC

CLKSEL
CLKDIV1
CLKDIV2
STROBE

CLKOUT

Fig.3 Pin configuration (TDA8002CT/B).

XTAL1
XTAL2

I/OUC

CS

ALARM

DGND1

AGND

S2

1
2
3
4
5
6
7

TDA8002CT/B

8

9
10
11
12
13

FCE248

28
27
26
25
24
23
22
21
20
19
18
17
16
1514

MODE
OFF
RSTIN
CMDVCC
V

CC

RST
CLK
AUX1
PRES
PRES
I/O
VUP
S1
V

DDA

1999 Oct 12 6

Philips Semiconductors Product specification

IC card interface TDA8002C

handbook, halfpage

AUX1UC

CLKSEL
CLKDIV1
CLKDIV2

STROBE
CLKOUT

Fig.4 Pin configuration (TDA8002CT/C).

Fig.4 Pin configuration (TDA8002CT/C).

XTAL1
XTAL2

I/OUC

CS

ALARM

DGND1

AGND

S2

1
2
3
4
5
6
7

TDA8002CT/C

8

9
10
11
12
13

FCE249

28
27
26
25
24
23
22
21
20
19
18
17
16
1514

MODE
OFF
RSTIN
CMDVCC
V

CC

RST
CLK
AUX1
CV/TV
PRES
I/O
VUP
S1
V

DDA

handbook, full pagewidth

AUX1UC
AUX2UC

CS

ALARM

CLKSEL
CLKDIV1
CLKDIV2

STROBE

XTAL2

I/OUC
32

1
2
3
4

XTAL1

31

30

V

DGND2
29

DDD

28

MODE

27

OFF
26

TDA8002CG

5
6
7
8

9

CLKOUT

10

DGND1

11

AGND

12
S2

13

DDA

V

14
S1

15

VUP

Fig.5 Pin configuration (TDA8002CG).

RSTIN

25

16

I/O

24
23
22
21
20
19
18
17

FCE250

CMDVCC
V

CC

RST
CLK
AUX1
CV/TV
PRES
AUX2

1999 Oct 12 7

Philips Semiconductors Product specification

IC card interface TDA8002C

FUNCTIONAL DESCRIPTION
Power supply

The supply pins for the chip are V
DGND1 and DGND2. V

DDA

and V

, V

DDA

DDD

, AGND,

DDD

(i.e. VDD) should be
in the range of 3.0 to 6.5 V. All card contacts remain
inactive during power-up or power-down.

On power-up, the logic is reset by an internal signal.
The sequencer is not activated until VDD reaches
V

th2+Vhys2

(see Fig.6). When VDD falls below V

th2

, an
automatic deactivation sequence of the contacts is
performed.

Chip selection

The chip select pin (CS) allows the use of several
TDA8002Cs in parallel.

When CS is HIGH, the pins RSTN, CMDVCC, MODE,
CV/TV, CLKDIV1, CLKDIV2, CLKSEL and STROBE
control the chip, pins I/OUC, AUX1UC and AUX2UC are
the copy of I/O, AUX1 and AUX2 when enabled (with
integrated 20 kΩ pull-up resistors connected to VDD) and
OFF is enabled.

When CS goes LOW, the levels on pins RSTIN,
CMDVCC, MODE, CV/TV, CLKDIV1, CLKDIV2 and
STROBE are internally latched, I/OUC, AUX1UC and
AUX2UC go to high-impedance with respect to I/O, AUX1
and AUX2 (with integrated 100 kΩ pull-up resistors
connected to VDD) and OFF is high-impedance.

Clock circuitry

The TDA8002C supports both synchronous and
asynchronouscards. There arethree methods to clockthe
circuitry:

• Apply a clock signal to pin STROBE

• Use of an internal RC oscillator

• Use of a quartz oscillator which should be connected

between pins XTAL1 and XTAL2 or an external clock
applied on XTAL1.

When CLKSEL is HIGH, the clock should be applied to the
STROBE pin. When CLKSEL is LOW, the internal
oscillators is used.

When an internal clock is used, the clock output is
availableon pin CLKOUT.The RC oscillator is selectedby
making CLKDIV1 HIGH and CLKDIV2 LOW. The clock
output to the card is available on pin CLK. The frequency
of the card clock can be the input frequency divided by
2 or 4, STOP low or 1.25 MHz, depending onthe states of
CLKDIV1 or CLKDIV2 (see Table 1).

When STROBE is used for entering the clock to a
synchronous card, STROBE should remain stable during
activation sequence otherwise the first pulse may be
omitted.

Do not change CLKSEL during activation. When in
low-power (sleep) mode, the internal oscillator frequency
which is available on pin CLKOUT is lowered to
approximately 16 kHz for power economy purposes.

Supply voltage supervisor (VDD)

This block surveys the V

supply. A defined retriggerable

DD

pulse of 10 ms minimum (tW) is delivered on the ALARM
output during power-up or power-down of VDD(see Fig.6).
This signal is also used for eliminating the spikes on card
contacts during power-up or power-down.

When VDD reaches V

th2+Vhys2

, an internal delay (tW) is
started. The ALARM output is active until this delay has
expired. When VDD falls below V

, ALARM is activated

th2

and a deactivation sequence of the contacts is performed.

1999 Oct 12 8

Philips Semiconductors Product specification

IC card interface TDA8002C

handbook, full pagewidth

V

+ V

th2

V

DD

hys2

V

th2

handbook, full pagewidth

OFF, I/OUC
AUX1UC, AUX2UC

ALARM

t

W

t

W

FCE272

Fig.6 ALARM as a function of VDD (tWpulse width minimum of 10 ms).

CS

t

SL

CS

INPUTS

t

t

IS

SI

Fig.7 Chip select.

1999 Oct 12 9

t

DZ

t

t

ID

DI

FCE245