Philips TDA5051AT, TDA5051 Datasheet

INTEGRATED CIRCUITS
DATA SH EET
TDA5051A
Home automation modem
Product specification Supersedes data of 1997 Sep 19 File under Integrated Circuits, IC11
1999 May 31
Philips Semiconductors Product specification
Home automation modem TDA5051A
FEATURES
Full digital carrier generation and shaping
Modulation/demodulation frequency set by clock
adjustment, from microcontroller or on-chip oscillator
High clock rate of 6-bit A/D (Digital to Analog) converter for rejection of aliasing components
APPLICATIONS
Home appliance control (air conditioning, shutters, lighting, alarms and so on)
Energy/heating control
Amplitude Shift Keying (ASK) data transmission using
the home power network.
Fully integrated output power stage with overload protection
Automatic Gain Control (AGC) at receiver input
8-bit A/D (Analog to Analog) converter and narrow
digital filtering
Digital demodulation delivering baseband data
GENERAL DESCRIPTION
The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 or 1200 baud data rate. It operates from a single 5 V supply.
Easy compliance with EN50065-1 with simple coupling network
Few external components for low cost applications
SO16 plastic package.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DD
I
DD(tot)
supply voltage 4.75 5.0 5.25 V total supply current f
= 8.48 MHz
osc
reception mode 28 38 mA transmission mode (
DATAIN=0) ZL=30Ω−47 68 mA
power-down mode 19 25 mA
f
cr
f
osc
V
o(rms)
carrier frequency note 1 95 132.5 148.5 kHz oscillator frequency 6.08 8.48 9.504 MHz output carrier signal on CISPR16 load
120 122 dBµV
(RMS value)
V
i(rms)
THD total harmonic distortion on CISPR16
input signal (RMS value) note 2 82 122 dBµV
−−55 dB
load with coupling network
Z
L
load impedance 1 30 −Ω BR baud rate 600 1200 bits/s T
amb
ambient temperature 0 70 °C
Notes
1. Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency.
2. The minimum value can be improved by using an external amplifier, see application diagrams Figs 22 and 23.
Philips Semiconductors Product specification
Home automation modem TDA5051A
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA5051AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
BLOCK DIAGRAM
handbook, full pagewidth
DATA
IN
CLK
OUT
DGND
1
4
AGND12V
5
CONTROL LOGIC
ROM
10
DDA
13
V
DDD
311
modulated
6
DAC clock
D/A
filter clock
carrier
V
DDAP
POWER
DRIVE
WITH
PROTECTION
TDA5051A
10
9
15
TX
OUT
APGND
PD
7
OSCILLATOR
8
2
DIGITAL
DEMODULATOR
16
TEST1 SCANTEST
2
÷
DIGITAL
BAND-PASS
FILTER
DETECT
6
DATA
OSC1
OSC2
OUT
Fig.1 Block diagram.
PEAK
14
A/D
8
H
L
U D
COUNT
5
U/D
MGK832
RX
IN
Philips Semiconductors Product specification
Home automation modem TDA5051A
PINNING
SYMBOL PIN DESCRIPTION
DATA
IN
DATA
OUT
V
DDD
CLK
OUT
DGND 5 digital ground SCANTEST 6 test input (LOW in application) OSC1 7 oscillator input OSC2 8 oscillator output APGND 9 analog ground for power amplifier TX
OUT
V
DDAP
AGND 12 analog ground V
DDA
RX
IN
PD 15 power-down input (active HIGH) TEST1 16 test input (HIGH in application)
1 digital data input (active LOW) 2 digital data output (active LOW) 3 digital supply voltage 4 clock output
10 analog signal output 11 analog supply voltage for power
amplifier
13 analog supply voltage 14 analog signal input
handbook, halfpage
DATA
SCANTEST
DATA
CLK
OUT
V
DDD OUT
DGND
OSC1 OSC2
IN
1 2 3 4
TDA5051AT
5 6 7 8
Fig.2 Pin configuration.
MGK833
16 15 14 13 12 11 10
9
TEST1 PD RX
IN
V
DDA
AGND V
DDAP
TX
OUT
APGND
FUNCTIONAL DESCRIPTION
Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on.
The interface with the power network is made by means of an LC network (see Fig.18). The device includes a power output stage that feeds a 120 dBµV (RMS) signal on a typical 30 load.
To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLK
. For low-power operation in
OUT
reception mode, this pin can be dynamically controlled by the microcontroller, see Section “Power-down mode”.
When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit. Fig.7 shows the use of the on-chip clock circuit.
All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection to a standard microcontroller I/O port.
The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open-circuit in functional mode (correct levels are internally defined by pull-up or pull-down resistors).
Transmission mode
To provide strict stability with respect to environmental conditions, the carrier frequency is generated by scanning the ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied through pin DATAIN and smoothly applied by specific digital circuits to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A 55 dB Total Harmonic Distortion (TDH) is reached when the typical LC coupling network (or an equivalent filter) is used.
Philips Semiconductors Product specification
Home automation modem TDA5051A
The DAC and the power stage are set in order to provide a maximum signal level of 122 dBµV (RMS) at the output.
The output of the power stage (TX
) must always be
OUT
connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the device is not transmitting. This pin must also be protected against overvoltage and negative transient signals. The DC level of TX
can be used to bias a unipolar
OUT
transient suppressor, as shown in the application diagram; see Fig.18.
Direct connection to the mains is done through an LC network for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed.
CAUTION
In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to 6dB as long as DATA
IN
is LOW. Then, the old gain setting is automatically
restored.
Reception mode
After digital demodulation, the baseband data signal is made available after pulse shaping.
The signal pin (RXIN) is a high-impedance input which has to be protected and DC decoupled for the same reasons as with pin TX
. The high sensitivity (82 dBµV) of this
OUT
input requires an efficient 50 Hz rejection filter (realized by the LC coupling network), which also acts as an anti-aliasing filter for the internal digital processing; see Fig.18.
Data format
T
RANSMISSION MODE
The data input (DATAIN) is active LOW: this means that a burst is generated on the line (pin TX
) when DATA
OUT
IN
pin is LOW. Pin TX
is in a high-impedance state as long as the
OUT
device is not transmitting. Successive logic 1s are treated in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in Figs 8 and 9.
R
ECEPTION MODE
The data output (pin DATA
) is active LOW; this means
OUT
that the data output is LOW when a burst is received. Pin DATA
remains LOW as long as a burst is received.
OUT
The input signal received by the modem is applied to a wide range input amplifier with AGC (6 to +30 dB). This is basically for noise performance improvement and signal level adjustment, which ensures a maximum sensitivity of the ADC. An 8-bit conversion is then performed, followed
Power-down mode
Power-down input (pin PD) is active HIGH; this means that the power consumption is minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation.
by digital band-pass filtering, to meet the CISPR normalization and to comply with some additional limitations met in current applications.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V f T T T
DD
osc
stg amb j
supply voltage 4.5 5.5 V oscillator frequency 12 MHz storage temperature 50 +150 °C ambient temperature 10 +80 °C junction temperature 125 °C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices.
Philips Semiconductors Product specification
Home automation modem TDA5051A
CHARACTERISTICS
V
DDD=VDDA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
DD
I
DD(RX/TX)(tot)
I
DD(PD)(tot)
I
DD(PAMP)
I
DD(PAMP)(max)
=5V±5%; T
= 0 to 70 °C; V
amb
connected to V
DDD
; DGND connected to AGND.
DDA
supply voltage 4.75 5 5.25 V total analog + digital
supply current total analog + digital
supply current;
VDD=5V±5% TX or RX mode
VDD=5V±5%; PD = HIGH
28 38 mA
19 25 mA
Power-down mode
power amplifier supply current
VDD=5V±5%; ZL=30Ω;
19 30 mA
DATAIN= LOW in transmission mode
maximum power amplifier supply current
VDD=5V±5%; ZL=1Ω;
76 mA
DATAIN= LOW in transmission mode
DATAIN and PD inputs: DATA
V
IH
V
IL
V
OH
V
OL
HIGH-level input voltage 0.2VDD+ 0.9 VDD+ 0.5 V LOW-level input voltage 0.5 0.2VDD− 0.1 V HIGH-level output voltage IOH= 1.6 mA 2.4 −− V LOW-level output voltage IOL= 1.6 mA −−0.45 V
and CLK
OUT
OUT
outputs
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when using an external clock generator)
V
IH
V
IL
V
OH
V
OL
HIGH-level input voltage 0.7V
DD
VDD+ 0.5 V LOW-level input voltage 0.5 0.2VDD− 0.1 V HIGH-level output voltage IOH= 1.6 mA 2.4 −− V LOW-level output voltage IOL= 1.6 mA −−0.45 V
Clock
f
osc
f
osc
-------­f
cr
f
osc
---------------------
f
CLKOUT
oscillator frequency 6.080 9.504 MHz ratio between oscillator
64
and carrier frequency
ratio between oscillator
2
and clock output frequency
Transmission mode
f
cr
t
su
t
h
carrier frequency f set-up time of the shaped
burst hold time of the shaped
burst
= 8.48 MHz 132.5 kHz
osc
f
= 8.48 MHz;
osc
170 −µs
see Fig.8 f
= 8.48 MHz;
osc
170 −µs
see Fig.8
Philips Semiconductors Product specification
Home automation modem TDA5051A
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
t
W(DI)(min)
V
o(rms)
I
o(max)
Z
o
V
O
THD total harmonic distortion on
B
20dB
minimum pulse width of DATAIN signal
output carrier signal (RMS value)
power amplifier maximum output current (peak value)
output impedance of the power amplifier
output DC level at pin TX
OUT
CISPR16 load with the coupling network (measured on the first ten harmonics)
bandwidth of the shaped output signal (at 20 dB) on CISPR16 load with the coupling network
f
= 8.48 MHz;
osc
see Fig.8 ZL= CISPR16;
DATAIN= LOW ZL=1Ω;
DATAIN= LOW
V
= 121 dBµV on
o(rms)
CISPR16 load; f
= 8.48 MHz;
osc
DATAIN= LOW (no modulation); see Figs 3 and 16
V
= 121 dBµV on
o(rms)
CISPR16 load; f
= 8.48 MHz;
osc
DATAIN= 300 Hz; duty factor = 50%; see Fig.4
190 −µs
120 122 dBµV
160 mA
5 −Ω
2.5 V
−−55 dB
3000 Hz
Reception mode
V
i(rms)
analog input signal (RMS value)
V
I
Z
i
R
AGC
t
c(AGC)
t
d(dem)(su)
DC level at pin RX
IN
RXIN input impedance 50 k AGC range 36 dB AGC time constant f
demodulation delay set-up time
t
d(dem)(h)
demodulation delay hold time
B
det
detection bandwidth f
BER bit error rate f
82 122 dBµV
2.5 V
= 8.48 MHz;
osc
296 −µs
see Fig.5 f
= 8.48 MHz;
osc
350 400 µs
see Fig.15 f
= 8.48 MHz;
osc
420 470 µs
see Fig.15
= 8.48 MHz 3 kHz
osc
= 8.48 MHz;
osc
1 1 × 10 600 baud; S/N = 35 dB; signal 76 dBµV; see Fig.17
4
Philips Semiconductors Product specification
Home automation modem TDA5051A
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Power-up timing
t
d(pu)(TX)
delay between power-up and DATAIN in transmission mode
t
d(pu)(RX)
delay between power-up and DATA mode
Power-down timing
t
d(pd)(TX)
delay between PD = 0 and DA TAIN in transmission mode
t
d(pd)(RX)
delay between PD = 0 and DA TA mode
t
active(min)
minimum active time with T = 10 ms power-down period in reception mode
OUT
in reception
OUT
in reception
XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp= 2.2 M; see Fig.10
XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp= 2.2 M; f
= 132.5 kHz;
RXIN
120 dBµV sine wave; see Fig.11
f
= 8.48 MHz;
osc
see Fig.12
f
= 8.48 MHz;
osc
f
= 132.5 kHz;
RXIN
120 dBµV sine wave; see Fig.13
f
= 8.48 MHz;
osc
f
= 132.5 kHz;
RXIN
120 dBµV sine wave; see Fig.14
1 −µs
1 −µs
10 −µs
500 −µs
1 −µs
book, full pagewidth
0
V
o(rms)
(dBV)
100
5
10
Resolution bandwidth =9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at 5 dBV (RMS) = 115 dBµV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS).
132.5 kHz
Fig.3 Carrier spectrum.
f (Hz)
MGK834
6
10
Philips Semiconductors Product specification
Home automation modem TDA5051A
handbook, full pagewidth
10
dBV
(RMS)
60
117.5 132.5
Resolution bandwidth = 100 Hz; B
= 3000 Hz (2 × 1500 Hz).
20dB
1500 Hz
20 dB
Fig.4 Shaped signal spectrum.
f (kHz)
MBH664
147.5
handbook, full pagewidth
V
RXIN
V
G
AGC
+30 dB
6 dB
(I)
0
(AGC time constant)
modulated sine wave 122 dBµV amplitude
t
c(AGC)
Fig.5 AGC time constant definition (not to scale).
t
8.68 dB AGC range
MGK011
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