The TDA1023 is a bipolar integrated circuit for controlling
triacs in a proportional time or burst firing mode. Permitting
precise temperature control of heating equipment it is
especially suited to the control of panel heaters.
It generates positive-going trigger pulses but complies with
regulations regarding mains waveform distortion and RF
interference.
QUICK REFERENCE DATA
SYMBOLPARAMETERMIN. TYP.MAX.UNIT
V
CC
V
Z
I
16(AV)
t
w
T
b
(1)
-I
OH
T
amb
supply voltage (derived from mains voltage)−13.7−V
stabilized supply voltage for temperature bridge−8−V
supply current (average value)−10−mA
trigger pulse width−200−µs
firing burst repetition time at CT = 68 µF−41−s
output current−−150mA
operating ambient temperature range−20−+75°C
Note
1. Negative current is defined as conventional current flow out of a device. A negative output current is suited for
positive triac triggering.
n.c.2not connected
Q3output
HYS4hysteresis control input
PR5proportional range control input
CI6control input
UR7unbuffered reference input
QR8output of reference buffer
BR9buffered reference input
PW10pulse width control input
V
The TDA1023 generates pulses to trigger a triac. These
pulses coincide with the zero excursions of the mains
voltage, thus minimizing RF interference and mains supply
transients. In order to gate the load on and off, the trigger
pulses occur in bursts thus further reducing mains supply
pollution. The average power in the load is varied by
modifying the duration of the trigger pulse burst in
accordance with the voltage difference between the
control input CI and the reference input, either UR or BR.
Power supply: V
, RX and Vz (pins 14, 16 and 11)
CC
The TDA1023 is supplied from the AC mains via a resistor
R
to the RX connection (pin 16); the VEE connection (pin
D
13) is linked to the neutral line (see Fig.4a). A smoothing
capacitor CS should be coupled between the VCC and V
EE
connections.
A rectifier diode is included between the RX and V
CC
connections whilst the DC supply voltage is limited by a
chain of stabilizer diodes between the RX and V
EE
connections (see Fig.3).
A stabilized reference voltage (VZ) is available at pin 11 to
power an external temperature sensing bridge.
Supply operation
During the positive mains half-cycles the current through
the external voltage dropping resistor R
charges the
D
external smoothing capacitor CS until RX attains the
stabilizing potential of the internal stabilizing diodes. R
D
should be selected to be capable of supplying the current
ICC for the TDA1023, the average output current I
3(AV)
,
recharge the smoothing capacitor CS and provide the
supply for an external temperature bridge. (see Figs 9 to
12). Any excess current is by-passed by the internal
stabilizer diodes. The maximum rated supply current,
however, must not be exceeded.
During the negative mains half-cycles external smoothing
capacitor CS supplies the sum of the current demand
described above. Its capacitance must be sufficiently high
to maintain the supply voltage above the specified
minimum.
Dissipation in resistor RD is halved by connecting a diode
in series (see Fig.4b and 9 to 12). A further reduction in
dissipation is possible by using a high quality dropping
capacitor CD in series with a resistor RSD (see Figs 4c and
14). Protection of the TDA1023 and the triac against
mains-borne transients can be provided by connecting a
suitable VDR across the mains input.
Control and reference inputs CI, BR and UR
(pins 6, 9 and 7)
For the control of room temperature (5 °C to 30 °C)
optimum performance is obtained by using the translation
circuit. The buffered reference input BR (pin 9) is used as
a reference input whilst the output reference buffer QR (pin
8) is connected to the unbuffered reference input UR
(pin 7). This ensures that the range of room temperature is
encompassed in most of the rotation of the potentiometer
to give a linear temperature scale with accurate setting.
Should the translation circuit not be required, the
unbuffered reference input UR (pin 7) is used as a
reference input. The buffered reference input BR (pin 9)
must then be connected to the reference supply output V
(pin 11).
For proportional power control the unbuffered reference
input UR (pin 7) must be connected to the firing burst
repetition time control input TB (pin 12).The buffered
reference input BR (pin 9), which is in this instance
inactive, must then be connected to the reference supply
output VZ (pin 11).
Proportional range control input PR (pin 5)
The output duty factor changes from 0% to 100% by a
variation of 80 mV at the control input CI (pin 6) with the
proportional range control input PR open. For temperature
control this corresponds to a temperature difference of 1 K.
By connecting the proportional range control input PR
(pin 5) to ground the range may be increased to 400 mV,
i.e. 5 K. Intermediate values may be obtained by
connecting the PR input to ground via a resistor R5
(see Table 1).
Hysteresis control input HYS (pin 4)
With the hysteresis control input HYS (pin 4) open, the
device has a built-in hysteresis of 20 mV. For temperature
control this corresponds with 0.25 K.
Hysteresis is increased to 320 mV, corresponding to 4 K,
by grounding HYS (pin 4). Intermediate values are
obtained by connecting pin 4 via resistor R4 to ground.
Table 1 provides a set of values for R4 and R5 giving a
fixed ratio between hysteresis and proportional range.
The width of the trigger pulse may be adjusted to the value
required for the triac by choosing the value of the external
synchronization resistor RS between the trigger pulse
width control input PW (pin 10) and the AC mains.
The pulse width is inversely proportional to the input
current (see Fig.13).
Output Q (pin 3)
Since the circuit has an open-emitter output it is capable of
sourcing current. It is thus suited for generating
positive-going trigger pulses. The output is current-limited
and short-circuit protected. The maximum output current is
150 mA and the output pulses are stabilized at 10 V for
output currents up to that value.
To minimize the total supply current and power dissipation,
a gate resistor R
Q and the triac gate to limit the output current to the
minimum required by the triac (see Figs 5 to 8).
must be connected between the output
G
Pull-down resistor R
The TDA1023 includes a 1.75 kΩ pull-down resistor R
(pin 1)
pd
pd
between pins 1 and 13 (VEE, ground connection) intended
for use with sensitive triacs.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOLPARAMETERMIN.MAX.UNIT
V
CC
DC supply voltage−16V
Supply current
I
16(AV)
I
16(RM)
I
16(SM)
V
I
I
6, 7, 9, 10
V
1
V
3, 8, 11
average−30mA
repetitive peak−100mA
non-repetitive peak (tp < 50 µs)−2A
input voltage, all inputs−16V
input current−10mA
voltage on Rpd connection−16V
output voltage, Q, QR, V
Z
−16V
Output current
-I
OH(AV)
-I
OH(M)
P
tot
T
stg
T
amb
average−30mA
peak max. 300 µs−700mA
total power dissipation−500mW
storage temperature range−55+150°C
operating ambient temperature range−20+75°C
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 199119
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