Philips ne5018, se5018 DATASHEETS
Philips Semiconductors Linear Products Product specification
NE/SE5018/50198-Bit µp-compatible D/A converter
751
August 31, 1994 853-0845 13721
DESCRIPTION
The NE/SE5018/19 is a complete 8-bit digital-to-analog converter
subsystem on one monolithic chip. The data inputs have input
latches which are controlled by a latch enable pin. The data and
latch enable inputs are ultra-low loading for easy interfacing with all
logic systems. The latches appear transparent when the LE
input is
in the low state. When LE
goes high, the input data present at the
moment of transition is latched and retained until LE
again goes low.
This feature allows easy compatibility with most microprocessors.
The chip also comprises a stable voltage reference (5V nominal)
and high slew rate buffer amplifier. The voltage reference may be
externally trimmed with a potentiometer for easy adjustment of
full-scale while maintaining a low temperature coefficient.
The output of the buffer amplifier may be offset so as to provide
bipolar as well as unipolar operation.
FEATURES
•8-bit resolution
•Input latches
•Low-loading data inputs
•On-chip voltage reference
•Output buffer amplifier
•Accurate to ± LSB (0.19%)
•Monotonic to 8 bits
•Amplifier and reference both short-circuit protected
•Compatible with 8085, 6800 and many other µPs
APPLICATIONS
•Precision 8-bit D/A converters
•A/D converters
•Programmable power supplies
•Test equipment
•Measuring instruments
•Analog-digital multiplication
PIN CONFIGURATIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
13
14
15
16
22
21
20
19
18
17
F, N Packages
D Package
1
NOTE:
1. SOL and
non-standard pinout
11
12
DIGITAL GND
DB0(LSB)
DB1
DB2
DB3
DB4
DB5
DB6
DB7(MSB)
NC
ANALOG GND
AMP COMP
SUM MODE
DAC COMP
BIPOLAR
OFFSET R
LE
V
CC+
V
OUT
V
CC–
V
REF
IN
V
REF
OUT
V
REF
ADJ
DIGITAL GND
DB0(LSB)
DB1
DB2
DB3
DB4
DB5
DB6
DB7(MSB)
NC
ANALOG GND
AMP COMP
SUM MODE
DAC COMP
BIPOLAR
OFFSET
LE
V
CC+
V
OUT
V
CC–
V
REF
IN
V
REF
OUT
V
REF
ADJ
NC
NC
ORDERING INFORMATION
DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG #
22-Pin Ceramic Dual In-Line Package (CERDIP) 0 to +70°C NE5018/5019F 0585B
22-Pin Ceramic Dual In-Line Package (CERDIP) -55°C to +125°C SE5018/5019F 0585B
22-Pin Plastic Dual In-Line Package (DIP) 0 to +70°C NE5018/5019N 0409B
22-Pin Plastic Dual In-Line Package (DIP) -55°C to +125°C SE5018/5019N 0409B
24-Pin Small Outline Large (SOL) Package 0 to +70°C NE5018/5019D 0173D
Philips Semiconductors Linear Products Product specification
NE/SE5018/50198-Bit µp-compatible D/A converter
August 31, 1994
752
BLOCK DIAGRAM
(13)
(12)
(20)
(18)
(21)
(22)
(14)
(15)
BIPOLAR
OFFSET
V
REF
IN
ANALOG
GND
AMP
COMP
SUM
NODE
DAC CURRENT
OUTPUT
LATCHES AND
SWITCH DRIVERS
DAC SWITCHES
5k
5k
15k
(19)
(10)
MSB LSB
(1)
DIGITAL
GND5k
V
CC+
INT
V
REF
(9)
DB7
(8)
DB6
(7)
DB5
(6)
DB4
(5)
DB3
(4)
DB2
(3)
DB1
(2)
DB0
LE
V
CC–
(16)
V
OUT
5k
5k
+
–
+
–
+
–
DAC
COMP
V
REF
OUT
V
REF
ADJ
(17)
ABSOLUTE MAXIMUM RATINGS
SYMBOL PARAMETER RATING UNIT
VCC+ Positive supply voltage 18 V
VCC- Negative supply voltage -18 V
V
IN
Logic input voltage 0 to 18 V
V
REF IN
Voltage at V
REF
input 12 V
V
REF
ADJ Voltage at V
REF
adjust 0 to V
REF
V
V
SUM
Voltage at sum node 12 V
I
REF SC
Short-circuit current to ground at V
REF OUT
Continuous
I
OUTSC
Short-circuit current to ground or either supply at V
OUT
Continuous
P
D
Maximum power dissipation, TA=25°C (still-air)
1
F package 1740 mW
N package 2190 mW
D package 1600 mW
T
A
Operating temperature range
SE5018 -55 to +125 °C
NE5018 0 to +70 °C
T
STG
Storage temperature range -65 to +150 °C
T
SOLD
Lead soldering temperature
(10 seconds) 300 °C
NOTES:
1. Derate above 25°C at the following rates:
F package at 13.9mW/°C
N package at 17.5mW/°C
D package at 12.8mW/°C
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