1999 Jun 17 2
Philips Semiconductors Product specification
Digital servo processor and Compact Disc decoder
with integrated DAC for video CD (CD7 II)
SAA7327
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 QUICK REFERENCE DATA
5 BLOCK DIAGRAM
6 PINNING
7 FUNCTIONAL DESCRIPTION
7.1 Decoder part
7.1.1 Principal operational modes of the decoder
7.1.2 Decoding speed and crystal frequency
7.1.3 Lock-to-disc mode
7.1.4 Standby modes
7.2 Crystal oscillator
7.3 Data slicer and clock regenerator
7.4 Demodulator
7.4.1 Frame sync protection
7.4.2 EFM demodulation
7.5 Subcode data processing
7.5.1 Q-channel processing
7.5.2 EIAJ 3 and 4-wire subcode (CD graphics)
interfaces
7.5.3 V4 subcode interface
7.6 FIFO and error corrector
7.6.1 Flags output (CFLG)
7.7 Audio functions
7.7.1 De-emphasis and phase linearity
7.7.2 Digital oversampling filter
7.7.3 Concealment
7.7.4 Mute, full-scale, attenuation and fade
7.7.5 Peak detector
7.8 DAC interface
7.8.1 Internal bitstream Digital-to-Analog Converter
(DAC)
7.8.2 External DAC interface
7.9 EBU interface
7.9.1 Format
7.10 KILL circuit
7.11 Audio features off
7.12 The VIA interface
7.13 Spindle motor control
7.13.1 Motor output modes
7.13.2 Spindle motor operating modes
7.13.3 Loop characteristics
7.13.4 FIFO overflow
7.14 Servo part
7.14.1 Diode signal processing
7.14.2 Signal conditioning
7.14.3 Focus servo system
7.14.4 Radial servo system
7.14.5 Off-track counting
7.14.6 Defect detection
7.14.7 Off-track detection
7.14.8 High-level features
7.14.9 Driver interface
7.14.10 Laser interface
7.14.11 Radial shock detector
7.15 Microcontroller interface
7.15.1 Microcontroller interface (4-wire bus mode)
7.15.2 Microcontroller interface (I2C-bus mode)
7.15.3 Decoder registers and shadow registers
7.15.4 Summary of functions controlled by decoder
registers 0 to F
7.15.5 Summary of functions controlled by shadow
registers
7.15.6 Summary of servo commands
7.15.7 Summary of servo command parameters
8 LIMITING VALUES
9 CHARACTERISTICS
10 OPERATING CHARACTERISTICS
(SUBCODE INTERFACE TIMING)
11 OPERATING CHARACTERISTICS (I2S-BUS
TIMING)
12 OPERATING CHARACTERISTICS
(MICROCONTROLLER INTERFACE TIMING)
13 APPLICATION INFORMATION
14 PACKAGE OUTLINE
15 SOLDERING
15.1 Introduction to soldering surface mount
packages
15.2 Reflow soldering
15.3 Wave soldering
15.4 Manual soldering
15.5 Suitability of surface mount IC packages for
wave and reflow soldering methods
16 DEFINITIONS
17 LIFE SUPPORT APPLICATIONS
18 PURCHASE OF PHILIPS I2C COMPONENTS