Philips PXT3906 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D109
PXT3906
PNP switching transistor
Product specification Supersedes data of 1997 May 05
1999 Apr 14
Philips Semiconductors Product specification
PNP switching transistor PXT3906
FEATURES
Low current (max. 100 mA)
PINNING
PIN DESCRIPTION
Low voltage (max. 40 V).
APPLICATIONS
High-speed saturated switching applications.
DESCRIPTION
handbook, halfpage
PNP switching transistor in a SOT89 plastic package. NPN complement: PXT3904.
MARKING
TYPE NUMBER MARKING CODE
PXT3906 p2A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1 emitter 2 collector 3 base
2
3
1
123
Bottom view
MAM297
Fig.1 Simplified outline (SOT89) and symbol.
SYMBOL P ARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter −−40 V collector-emitter voltage open base −−40 V emitter-base voltage open collector −−6V collector current (DC) −−100 mA peak collector current −−200 mA peak base current −−100 mA total power dissipation T
25 °C; note 1 1.2 W
amb
storage temperature 55 +150 °C junction temperature 150 °C operating ambient temperature 55 +150 °C
Note
2
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
.
1999 Apr 14 2
Philips Semiconductors Product specification
PNP switching transistor PXT3906
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
R
th j-s
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2. For other mounting conditions, see
CHARACTERISTICS
=25°C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
V
BEsat
C
c
C
e
f
T
F noise figure I
thermal resistance from junction to ambient note 1 104 K/W thermal resistance from junction to soldering point 24 K/W
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
collector cut-off current IE= 0; VCB= 30 V −−50 nA emitter cut-off current IC= 0; VEB= 6V −−50 nA DC current gain VCE= 1 V; (see Fig.2)
I
= 0.1 mA 60
C
= 1mA 80
I
C
I
=−10 mA 100 300
C
= 50 mA 60
I
C
I
= 100 mA 30
C
collector-emitter saturation voltage
IC= 10 mA; IB= 1mA −−250 mV
= 50 mA; IB= 5mA −−400 mV
I
C
base-emitter saturation voltage IC= 10 mA; IB= 1mA −650 850 mV
I
= 50 mA; IB= 5mA −−950 mV
C
collector capacitance IE=ie= 0; VCB= 5 V; f = 1 MHz 4.5 pF emitter capacitance IC=ic= 0; VEB= 500 mV; f = 1 MHz 10 pF transition frequency IC= 10 mA; VCE= 20 V; f = 100 MHz 250 MHz
= 100 µA; VCE= 5 V; RS=1kΩ;
C
4dB
f = 10 Hz to 15.7 kHz Switching times (between 10% and 90% levels); (see Fig.3) t
on
t
d
t
r
t
off
t
s
t
f
turn-on time I delay time 35 ns rise time 35 ns turn-off time 300 ns storage time 225 ns fall time 75 ns
= 10 mA; I
Con
1999 Apr 14 3
= 1 mA; I
Bon
=1mA 65 ns
Boff
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