Philips PXT3904 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D109
PXT3904
NPN switching transistor
Product specification Supersedes data of 1997 May 05
1999 Apr 14
Philips Semiconductors Product specification
NPN switching transistor PXT3904
FEATURES
Low current (max. 100 mA)
PINNING
PIN DESCRIPTION
Low voltage (max. 40 V).
APPLICATIONS
High-speed switching.
DESCRIPTION
handbook, halfpage
NPN switching transistor in a SOT89 plastic package. PNP complement: PXT3906.
MARKING
TYPE NUMBER MARKING CODE
PXT3904 p1A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1 emitter 2 collector 3 base
2
3
1
123
Bottom view
MAM296
Fig.1 Simplified outline (SOT89) and symbol.
SYMBOL P ARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter 60 V collector-emitter voltage open base 40 V emitter-base voltage open collector 6V collector current (DC) 100 mA peak collector current 200 mA peak base current 100 mA total power dissipation T
25 °C; note 1 1.2 W
amb
storage temperature 55 +150 °C junction temperature 150 °C operating ambient temperature 55 +150 °C
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
2
.
1999 Apr 14 2
Philips Semiconductors Product specification
NPN switching transistor PXT3904
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
R
th j-s
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2. For other mounting conditions, see
CHARACTERISTICS
=25°C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
V
BEsat
C
c
C
e
f
T
F noise figure I
thermal resistance from junction to ambient note 1 105 K/W thermal resistance from junction to soldering point 25 K/W
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
collector cut-off current IE= 0; VCB=30V 50 nA emitter cut-off current IC= 0; VEB=6V 50 nA DC current gain VCE= 1 V; (see Fig.2)
I
= 0.1 mA 60
C
= 1 mA 80
I
C
I
= 10 mA 100 300
C
=50mA 60
I
C
I
= 100 mA 30
C
collector-emitter saturation voltage IC= 10 mA; IB=1mA 200 mV
= 50 mA; IB=5mA 200 mV
I
C
base-emitter saturation voltage IC= 10 mA; IB= 1 mA 650 850 mV
I
= 50 mA; IB=5mA 950 mV
C
collector capacitance IE=ie= 0; VCB=5V; f=1MHz 4pF emitter capacitance IC=ic= 0; VEB= 500 mV; f = 1 MHz 8pF transition frequency IC= 10 mA; VCE= 20 V; f = 100 MHz 300 MHz
= 100 µA; VCE=5V; RS=1kΩ;
C
5dB
f = 10 Hz to 15.7 kHz Switching times (between 10% and 90% levels); (see Fig.3) t
on
t
d
t
r
t
off
t
s
t
f
turn-on time I delay time 35 ns rise time 35 ns turn-off time 240 ns storage time 200 ns fall time 50 ns
I
Con Boff
= 10 mA; I
= 1mA
1999 Apr 14 3
Bon
= 1 mA;
65 ns
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