Philips PNP33N10 Datasheet

Philips Semiconductors Product specification
PowerMOS transistor PHP33N10
GENERAL DESCRIPTION QUICK REFERENCE DATA
N-channel enhancement mode SYMBOL PARAMETER MAX. UNIT field-effect power transistor in a plastic envelope featuring stable V
DS
Drain-source voltage 100 V
D
Drain current (DC) 34 A
high thermal cycling performance P
tot
Total power dissipation 175 W
withlowthermalresistance.Intended R
DS(ON)
Drain-source on-state resistance 0.057 for use in Switched Mode Power Supplies (SMPS), motor control circuits and general purpose switching applications.
PINNING - TO220AB PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 gate 2 drain 3 source
tab drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
D
Continuous drain current Tmb = 25 ˚C; VGS = 10 V - 34 A
Tmb = 100 ˚C; VGS = 10 V - 24 A
I
DM
Pulsed drain current Tmb = 25 ˚C - 136 A
P
D
Total dissipation Tmb = 25 ˚C - 150 W PD/TmbLinear derating factor Tmb > 25 ˚C - 1.167 W/K V
GS
Gate-source voltage - ± 30 V Tj, T
stg
Operating junction and - 55 175 ˚C
storage temperature range
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction to - - 1 K/W mounting base
R
th j-a
Thermal resistance junction to - 60 - K/W ambient
123
tab
d
g
s
April 1998 1 Rev 1.100
Philips Semiconductors Product specification
PowerMOS transistor PHP33N10
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown VGS = 0 V; ID = 0.25 mA 100 - - V voltage
V
(BR)DSS
/ Drain-source breakdown VDS = VGS; ID = 0.25 mA - 0.15 - V/K
T
j
voltage temperature coefficient
R
DS(ON)
Drain-source on resistance VGS = 10 V; ID = 17 A - 0.052 0.057
V
GS(TO)
Gate threshold voltage VDS = VGS; ID = 0.25 mA 2.0 3.0 4.0 V
g
fs
Forward transconductance VDS = 50 V; ID = 17 A 12 16 - S
I
DSS
Drain-source leakage current VDS = 100 V; VGS = 0 V - 1 25 µA
VDS = 80 V; VGS = 0 V; Tj = 150 ˚C - 100 250 µA
I
GSS
Gate-source leakage current VGS = ±30 V; VDS = 0 V - 10 100 nA
Q
g(tot)
Total gate charge ID = 17 A; V
DD
= 80 V; VGS = 10 V - 42 50 nC
Q
gs
Gate-source charge - 8 11 nC
Q
gd
Gate-drain (Miller) charge - 20 30 nC
t
d(on)
Turn-on delay time VDD = 50 V; ID = 17 A; - 18 - ns
t
r
Turn-on rise time RG = 9.1 ; RD = 2.9 -40-ns
t
d(off)
Turn-off delay time - 125 - ns
t
f
Turn-off fall time - 50 - ns
L
d
Internal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die
L
d
Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die
L
s
Internal source inductance Measured from source lead 6 mm - 7.5 - nH
from package to source bond pad
C
iss
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1500 - pF
C
oss
Output capacitance - 450 - pF
C
rss
Feedback capacitance - 130 - pF
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
Continuous source current Tmb = 25˚C - - 34 A (body diode)
I
SM
Pulsed source current (body Tmb = 25˚C - - 136 A diode)
V
SD
Diode forward voltage IS = 34 A; VGS = 0 V - - 1.5 V
t
rr
Reverse recovery time IS = 17 A; VGS = 0 V; - 200 - ns
dI/dt = 100 A/µs
Q
rr
Reverse recovery charge - 1.0 - µC
April 1998 2 Rev 1.100
Philips Semiconductors Product specification
PowerMOS transistor PHP33N10
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/P
D 25 ˚C
= f(Tmb)
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/I
D 25 ˚C
= f(Tmb); conditions: VGS ≥ 10 V
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter t
p
Fig.4. Transient thermal impedance.
Z
th j-mb
= f(t); parameter D = tp/T
Fig.5. Typical output characteristics
.
ID = f(VDS); parameter V
GS
Fig.6. Typical on-state resistance
.
R
DS(ON)
= f(ID); parameter V
GS
0 20 40 60 80 100 120 140 160 180
Tmb / C
PD%
Normalised Power Derating
120 110 100
90 80 70 60 50 40 30 20 10
0
1E-05 1E-03 1E-01 1E+01
t / s
Zth j-mb / (K/W)
10
1
0.1
0.01
0.001
0
0.5
0.2
0.1
0.05
0.02
BUKx56-lv
D =
D =
t
p
t
p
T
T
P
t
D
0 20 40 60 80 100 120 140 160 180
Tmb / C
ID%
Normalised Current Derating
120 110 100
90 80 70 60 50 40 30 20 10
0
0 2 4 6 8 10
BUK456-100A
VDS / V
70 60 50 40 30 20 10
0
4
5
6
7
8
10
15
20
ID / A
VGS / V =
1
10
100
1000
VDS / V
ID / A
1000
100
10
1
BUK456-100A,B
tp = 10 us
100 us
1 ms 10 ms
100 ms
DC
A B
RDS(ON) = VDS/ID
0 20 40 60 80
BUK456-100A
ID / A
0.2
0.1
0
4.5 5 5.5
6
6.5 7
7.5 8
10
20
RDS(ON) / Ohm
VGS / V =
April 1998 3 Rev 1.100
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